TWI785919B - Anti-vibration heat conduction structure and heat dissipation device thereof - Google Patents

Abstract

An anti-vibration heat conduction structure and heat dissipation device thereof. The heat dissipation device includes a heat conduction structure and a heat sink. The heat conduction structure includes a heat conduction base, a thermal diffusion plate and a thermal interface material. The heat conduction base includes a heat-absorbing side and a heat-emitting side, and the heat-absorbing side is recessed with an accommodation space. The thermal diffusion plate is movably arranged in the accommodation space and includes an inner conductive surface for thermally connected to the heat conduction base, an outer conductive surface for thermally connected to a heating element, and an anti-vibration surface. The anti-vibration surface connects the inner and outer conductive surfaces and maintains a lateral gap with the accommodation space. The thermal interface material is filled in the lateral gap between the anti-vibration surface and the accommodation space to let the thermal diffusion plate and the heat conduction base without colliding under the action of external force.

Description

Anti-seismic heat conduction structure and heat dissipation device

The present invention relates to a heat conduction structure, especially a heat conduction structure with anti-vibration effect.

With the rapid development of the computer industry, electronic heating components such as microprocessor chips will generate a large amount of heat energy during operation. If the heating electronic components or semiconductor components are not cooled in time, the electronic parts will be damaged or the service life will be shortened. . In this regard, most electronic products are usually equipped with a radiator to cool down the heated electronic components.

In particular, in special systems such as industrial computers or military computers, electronic components such as microprocessor chips usually require a more stable operating environment and heat dissipation performance, so as to avoid external shocks affecting the operation of the electronic circuits inside the computer or damage due to overheating. Make damage occurs, thereby maintaining the normal operation and reliability of the system, and prolonging the service life.

In view of this, the inventor of the present invention aimed at the above-mentioned prior art, devoted himself to research and combined with the application of theories, and tried his best to solve the above-mentioned problems, which became the goal of the inventor's improvement.

One object of the present invention is to provide a shock-resistant heat-conducting structure and its heat dissipation device. The thermal diffusion plate and the heat-conducting base are provided with a thermal interface material so that there is no damage caused by external forces. Collision occurs, so it has a shockproof effect, which can avoid damage caused by external vibration, and then maintain the normal operation and reliability of the system.

In order to achieve the above purpose, the present invention is an anti-vibration heat conduction structure, including a heat conduction base, a thermal diffusion plate and a thermal interface material. The heat conduction base has opposite heat absorption side and heat release side, and the heat absorption side is concavely provided with accommodating groove. The thermal diffusion plate is movably arranged in the accommodating groove. The thermal diffusion plate has an inner conducting surface for thermally conducting heat conducting base, an outer conducting surface for thermally conducting heating element and at least one anti-vibration surface, and the anti-vibration surface is respectively connected to the inner The guide surface and the outer guide surface maintain a lateral gap with the inner wall of the accommodating tank. The thermal interface material is filled in the lateral gap between the anti-vibration surface and the accommodation groove, so that the thermal diffusion plate and the heat conduction base will not collide under the action of external force through the arrangement of the thermal interface material.

An object of the present invention is to provide a heat dissipation device with an anti-vibration heat conduction structure, including an anti-vibration heat conduction structure and a heat conductor. The heat conductor is thermally connected to the heat release side and combined with the heat conduction base.

Compared with the conventional technology, the heat conduction structure of the present invention has a recessed accommodation groove in the heat conduction base, and a thermal diffusion plate with an anti-vibration surface, wherein a lateral gap is maintained between the anti-seismic surface and the inner wall surface of the accommodation groove , and the thermal interface material is filled in the lateral gap, so that the buffer between the thermal diffusion plate and the heat conduction base will not be impacted by the external force through the buffer of the thermal interface material, so as to achieve the purpose of shock resistance. In addition, since the thermal interface material can reduce the thermal resistance between the thermal diffusion plate and the thermal conduction base, the heat conducted to the thermal diffusion plate can be effectively transferred to the thermal conduction base and dissipated, thereby achieving the purpose of heat dissipation.

1: Cooling device

2: heating element

10: Thermal conduction structure

11: Thermal base

110: storage tank

111: endothermic side

112: heat release side

12, 12': thermal diffusion plate

121: Inner guide surface

122: Outer conductor interface

123: Anti-seismic surface

13: Thermal interface material

20: heat conductor

H: side clearance

V: Vertical clearance

30: sealing ring

40: elastic element

41: screwing element

42: Spring

50, 50': deformation space

51: Lateral deformation space

52: Vertical deformation space

Fig. 1 is a combined cross-sectional view of a heat sink with an anti-shock heat conduction structure of the present invention.

Fig. 2 is the bottom view of the heat sink with anti-shock and heat conduction structure of the present invention.

Fig. 3 is a schematic diagram of the application of the heat dissipation device with an anti-shock heat conduction structure of the present invention.

Fig. 4 is a combined cross-sectional view of another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention.

Fig. 5 is a bottom view of another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention.

Fig. 6 is an application schematic diagram of another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention.

Fig. 7 is a combined cross-sectional view of another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention.

Fig. 8 and Fig. 9 are combined cross-sectional views of still another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention.

The detailed description and technical content of the present invention are described below with the drawings, but the attached drawings are only for reference and description, and are not used to limit the present invention.

Please refer to FIG. 1 to FIG. 3 , which are a combined cross-sectional view, a bottom view and an application schematic diagram of the heat dissipation device with an anti-seismic heat conduction structure of the present invention, respectively. The present invention is a heat dissipation device 1 with an anti-shock heat conduction structure, which includes an anti-shock heat conduction structure 10 and a heat conductor 20 . The heat conduction structure 10 includes a heat conduction base 11 , a thermal diffusion plate 12 and a thermal interface material 13 . The heat conductor 20 is combined with the heat conduction structure 10 to form the heat dissipation device 1 for dissipating heat from a heating element 2 . It should be noted that the heating element 2 is not particularly limited, and it can be configured as a central processing unit (CPU, Central Processing Unit), a microprocessor (MPU, Microprocessor Unit) or a graphics processing unit (Graphics Processing Unit; GPU), etc. Electronic component.

The heat conducting base 11 has a heat absorbing side 111 and a heat releasing side 112 opposite to each other, and a receiving groove 110 is recessed on the heat absorbing side 111 . In addition, the heat conductor 20 is thermally connected to the heat release side 112 and combined with the heat conduction base 11 .

The heat spreading plate 12 is movably disposed in the receiving groove 110 . Furthermore, the thermal diffusion plate 12 has an inner conductive surface 121 thermally connected to the heat conducting base 11 , an outer conductive surface 122 thermally connected to the heating element 2 , and at least one anti-vibration surface 123 . The anti-seismic surface is connected to the inner conducting surface 121 and the outer conducting surface 122 , and maintains a lateral gap H with the inner wall of the receiving groove 110 .

Specifically, the heat conduction base 11 and the heat diffusion plate 12 are heat conduction structures composed of a solid copper plate, a solid aluminum plate, a uniform temperature plate or a flat heat pipe.

Furthermore, the thermal interface material 13 is filled in the lateral gap H between the anti-vibration surface 123 and the accommodating groove 110 , so that the thermal interface material passes through between the thermal diffusion plate 12 and the heat conduction base 11 13 and under the action of an external force, no collision will occur.

In other words, when an external force acts on the heat spreading plate 12 or the heat conducting base 11 to cause a relative displacement between the heat spreading plate 12 and the heat conducting base 11, the thermal interface material 13 can act as the heat spreading plate 12 and the buffer medium between the heat conduction base 11. Accordingly, when the heat conduction structure 10 is subjected to an external force, although the thermal diffusion plate 12 and the heat conduction base 11 produce a relative displacement, it will not affect the heating element 2, so that the heat conduction structure 10 has a shockproof effect, and Avoid damage caused by external vibration, and maintain the normal operation and reliability of the heating element 2 .

It should be noted that the thermal interface material 13 must have good thermal conductivity, such as heat-conducting paste or heat-conducting silicon gel, etc., so as to reduce the thermal resistance between the thermal diffusion plate 12 and the heat-conducting base 11 . Accordingly, the heat generated by the heating element 2 is conducted to the thermal diffusion plate 12 , and then is effectively transferred to the heat conduction base 11 through the thermal interface material 13 .

Accordingly, the heat generated by the heating element 2 during operation will be conducted to the thermal diffusion plate 12, and then transferred to the heat conducting base 11 through the thermal interface material 13, and then conducted from the heat conducting base 11 to the heat conducting base 11. body 20, and finally escape through the heat conductor 20. In addition, it should be noted that the implementation of the heat conductor 20 is not particularly limited, and it can be configured as an aluminum extruded heat sink or a heat radiation fin group.

In an embodiment of the present invention, a vertical gap V is maintained between the inner conductive surface 121 of the thermal diffusion plate 12 and the inner wall surface of the accommodating groove 110 . Moreover, the thermal interface material 13 is filled in the vertical gap V between the inner conductive surface 121 and the heat conduction base 11 . Specifically, the size of the lateral gap H or the vertical gap V is 0.5 mm to 1.0 mm.

Please also refer to FIG. 4 to FIG. 6 , which are a combined cross-sectional view, a bottom view and an application schematic diagram of another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention. Compared with the previous embodiment, this embodiment is substantially the same, the difference is that in this embodiment, the heat conduction structure 10 further includes a sealing ring 30 . The seal ring 30 is disposed between the heat conduction base 11 and the heat diffusion plate 12' to seal the exposed part of the lateral gap H. In addition, in this implementation, the thermal diffusion plate 12' is set as a uniform temperature plate.

It is worth noting that the sealing ring 30 is flexible, so when the thermal diffusion plate 12' or the heat conduction base 11 is subjected to relative displacement due to external force, the sealing ring 30 can still tightly seal the lateral direction. Clearance H.

Please refer to FIG. 7 again, which is a combined cross-sectional view of another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention. Compared with the embodiment shown in FIG. 1 , this embodiment is substantially the same, except that the heat conduction structure 10 of this embodiment further includes an elastic element 40 connected between the heat conduction base 11 and the heat diffusion plate 12 . One end of the elastic element 40 is connected to the inner wall of the accommodating groove 110 , and the other end is connected to the inner conductive surface 121 of the heat diffusion plate 12 .

Specifically, the elastic element 40 includes a screw element 41 and a spring 42 . The threaded element 41 is a screw locked on the inner wall of the accommodating groove 110 , one end of the spring 42 is connected to the threaded element 41 , and the other end is welded to the inner conducting surface 121 of the thermal diffusion plate 12 superior.

Accordingly, the heat conduction structure 10 increases the buffer force between the heat conduction base 11 and the heat diffusion plate 12 through the arrangement of the elastic element 40, so as to avoid external force from exerting force on the space between the heat conduction base 11 and the heat spread plate 12. A large relative displacement is caused, thereby increasing the anti-vibration effect of the heat conduction structure 10 .

Please continue to refer to FIG. 8 and FIG. 9 , which are combined cross-sectional views of yet another embodiment of the heat dissipation device with an anti-shock heat conduction structure of the present invention. This embodiment is substantially the same as the embodiment shown in FIG. 1 , except that the heat conduction structure 10 of this embodiment is provided with at least one deformation space connected to the lateral gap H on the inner wall surface of the accommodating groove 110. 50. The at least one deformation space 50 is used to accommodate redundant thermal interface material 13 or deformed thermal interface material 13 .

As shown in Figure 8, the deformation space 50 is set as a plurality of grooves, including the lateral deformation space 51 facing the anti-vibration surface 123 of the thermal diffusion plate 12 and the vertical deformation facing the inner conductive surface 121 of the thermal diffusion plate 12 Space 52.

Furthermore, please refer to the heat conduction structure 10 shown in FIG. 9, which is recessed with at least one deformation space 50' communicating with the lateral gap H on the anti-vibration surface 123 of the thermal diffusion plate 12.

The above descriptions are only preferred embodiments of the present invention, and are not used to define the patent scope of the present invention. Other equivalent changes using the patent spirit of the present invention should all belong to the patent scope of the present invention.

1: Cooling device

10: Thermal conduction structure

11: Thermal base

110: storage tank

111: endothermic side

112: heat release side

12: Thermal diffusion plate

121: Inner guide surface

122: Outer conductor interface

123: Anti-seismic surface

13: Thermal interface material

20: heat conductor

H: side clearance

V: Vertical clearance

Claims (10)

An anti-vibration heat conduction structure, comprising: a heat conduction base having a heat-absorbing side and a heat-dissipating side opposite to each other, the heat-absorbing side is concavely provided with an accommodating groove; a thermal diffusion plate is movably arranged in the accommodating groove , the thermal diffusion plate has an inner conduction surface thermally connected to the heat conduction base, an outer conduction surface thermally connected to a heating element, and at least one anti-vibration surface, and the at least one anti-seismic surface is respectively connected to the inner conduction surface and the outer guide surface, and maintain a lateral gap with the inner wall surface of the receiving tank; and a thermal interface material, filled in the lateral gap between the at least one anti-vibration surface and the receiving tank, thereby The arrangement of the thermal interface material prevents collision between the thermal diffusion plate and the heat conduction base under an external force. The anti-shock heat conduction structure as described in Claim 1, wherein the heat conduction base and the heat diffusion plate are made of solid copper plate, solid aluminum plate, temperature chamber or flat heat pipe. The anti-vibration heat conduction structure as described in Claim 1, wherein the thermal interface material is heat conduction paste or heat conduction silicone. The anti-vibration heat conduction structure according to claim 1, wherein a straight gap is maintained between the inner conductive surface and the inner wall of the accommodating tank, and the thermal interface material is filled between the inner conductive surface and the heat conduction base in the vertical gap between them. The anti-vibration heat conduction structure according to claim 1, wherein the size of the lateral gap is 0.5 mm to 1.0 mm. The anti-vibration heat conduction structure according to Claim 1 further includes a sealing ring, which is arranged between the heat conduction base and the heat diffusion plate and seals the lateral gap. The anti-vibration heat conduction structure as described in claim 1 further includes an elastic element connected between the heat conduction base and the heat diffusion plate, one end of the elastic element is connected to the inner wall surface of the accommodating tank, and the other end Connect the inner conductive surface of the heat spreader. The anti-vibration heat conduction structure according to claim 1, wherein at least one deformation space communicating with the lateral gap is recessed on the inner wall of the accommodating groove. The anti-vibration heat conduction structure according to claim 1, wherein the anti-vibration surface of the thermal diffusion plate is concavely provided with at least one deformation space communicating with the lateral gap. A heat dissipation device with a shock-resistant heat-conducting structure, comprising: a shock-resistant heat-conducting structure as described in any one of Claims 1 to 9; and a heat conductor connected to the heat-dissipating side and combined with the heat-conducting base.

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