CN212529513U - Modular high-shock-resistance-level vehicle-mounted computer - Google Patents
Modular high-shock-resistance-level vehicle-mounted computer Download PDFInfo
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- CN212529513U CN212529513U CN202021091531.3U CN202021091531U CN212529513U CN 212529513 U CN212529513 U CN 212529513U CN 202021091531 U CN202021091531 U CN 202021091531U CN 212529513 U CN212529513 U CN 212529513U
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Abstract
The utility model provides a high antidetonation grade vehicle-mounted computer of modularization belongs to vehicle-mounted computer structure field. The utility model discloses a casing, base and setting are at the inside circuit board of casing and base, still include the board to the board connector, the board is equipped with a plurality of interface on to the board connector, the board to the board connector with circuit board to board electric connection. The utility model has the advantages that: the anti-seismic performance between product boards is improved, and the equal-strength vibration scene of vehicle-mounted products is met.
Description
Technical Field
The utility model relates to an on-vehicle computer especially relates to a high antidetonation grade on-vehicle computer of modularization.
Background
With the publication of a new round of infrastructure construction content in China, the projects related to traffic have the most investment, and especially the proportion of key construction projects in intercity high-speed railways and urban rail traffic is the largest; in the construction of the rail transit project, the application of the PIS system and the CCTV monitoring system is indispensable and is also a necessary means for ensuring the riding safety of passengers and improving the travel experience; also in foreign rail transit project applications, the requirements of the two applications mentioned above are also necessary.
In order to ensure that the rail transit train can normally and stably run in a running environment, products used on the rail transit train are required to have high reliability and shock resistance and meet the EN50155 industrial standard of railways, and the industrial personal computer for rail transit application at present has few manufacturers and is relatively expensive due to relatively high threshold, so that a user can design a stable and reliable rail transit train, and products meeting the iron standard and cost performance can be used as a first opportunity in the market for rail transit application.
SUMMERY OF THE UTILITY MODEL
For solving the problem among the prior art, the utility model provides a high antidetonation grade vehicle-mounted computer of modularization.
The utility model discloses a casing, base and setting are at the inside circuit board of casing and base, still include the board to the board connector, the board is equipped with a plurality of interface on to the board connector, the board to the board connector with circuit board to board electric connection.
The utility model discloses make further improvement, be equipped with storage module, more than 1 memory granule and heat-conducting plate on the circuit board, the memory granule adopts board-mounted memory.
The utility model discloses make further improvement, the heat conduction interface material of heat-conducting plate adopts carbon fiber class Thermal Pad TIM.
The utility model discloses make further improvement, storage module includes the mSATA storage module.
The utility model discloses make further improvement, electronic components surface on the circuit board is equipped with consolidates sealed glue.
The utility model discloses do further improvement, still including the installation the installing support of the high antidetonation grade vehicle-mounted computer of modularization, one side and base fixed connection of installing support, the opposite side be equipped with the mounting structure on the car is installed to the high antidetonation grade vehicle-mounted computer of modularization.
The utility model discloses make further improvement, installing support, base and casing are through resistant combination screw fixed connection that falls.
The utility model discloses make further improvement, mounting structure be with installation screw complex mounting hole.
The utility model discloses make further improvement, the installing support below still is equipped with the support the shock attenuation stabilizer blade of the on-vehicle computer of the high antidetonation grade of modularization.
The utility model discloses make further improvement, the shock attenuation stabilizer blade includes and is in with installing support fixed connection's screw and setting the silica gel cover of the silica gel pad of screw bottom or parcel screw.
Compared with the prior art, the beneficial effects of the utility model are that: the interior of the PC is connected in a modularized mode, and multiple damping methods are used in combination, so that the anti-seismic reliability of the whole PC is guaranteed.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
As shown in fig. 1, the structure scheme of the present invention is a high reliability scheme applicable to high-speed rail projects, and passes the certification of the electronic device standard-european union EN 50155; the interior of the PC is connected in a modularized mode, and multiple damping methods are used in combination, so that the anti-seismic reliability of the whole PC is guaranteed. This will be described in detail below.
Improvement of internal structure
The utility model discloses a casing 1, base 8 and setting still include the board to board connector 9 at the inside circuit board 12 of casing 1 and base 8, the board is equipped with a plurality of interface on to board connector 9, the board to board connector 9 with circuit board 12 board is to board electric connection. The internal Board cards are connected by adopting a Board to Board (Board to Board), so that the possibility of failure caused by loosening of the connector during line connection is avoided, and the anti-vibration performance is improved. The anti-seismic performance between the product boards is improved through the integrated modularization, and the equal-strength vibration scene of the vehicle-mounted product is met.
Second, improvement of circuit main board
The circuit main board is provided with a storage module 10, more than 1 memory particle 3 and a heat conducting plate 2, the memory particle 3 adopts onboard memory, the connection is reliable, and the possibility of connection failure is eliminated.
The material of the heat conducting interface of the heat conducting plate 2 of the circuit main board 12 adopts carbon fiber Thermal Pad TIM. Thermal pad is a form of pad in the PCB wiring, so called "cross bridge" or "line bridge". TIM, an abbreviation for Thermal Interface Material, is a thermally conductive Interface Material, commonly known as silica gel, used in computers to spread on CPUs, display chips, and north-south bridges for heat dissipation. When the conducting hole and the inner layer large copper surface are not required to be communicated and interconnected in the wiring of the multilayer board, the isolating ring can be used for isolating. When the via needs to be interconnected with the inner large copper surface, a "cross bridge" or a "straight bridge" can be used for communication. The purpose of the method is to prevent the impact of severe expansion caused by high-temperature molten tin entering holes on the periphery, and avoid four gaps which are intentionally left between the bonding pads for generating delamination and reducing the effect of thermal shock, so the method is called as a heat insulation plate. The expansion joint acts as an expansion joint of a bridge or a rail, and can keep overall safety at high temperature. The heat conduction materials are all made of the carbon fiber Thermal Pad TIM with the ultrahigh heat conduction coefficient and the small hardness, so that high shock resistance and high heat conduction performance are guaranteed, and the reliability is high.
The storage module 10 of this embodiment adopts an mSATA storage module to replace a conventional hard disk, so as to ensure the reliability of data transmission. The surface of the electronic component on the circuit main board 12 of the embodiment is provided with 3M high temperature resistant glue 11 for reinforcement treatment 11. The anti-seismic performance of the reinforcing plate achieves high reliability in a long-term vibration environment.
Connecting structure
The vehicle-mounted computer system further comprises a mounting bracket 5 for mounting the modular high-earthquake-resistance vehicle-mounted computer, wherein one side of the mounting bracket 5 is fixedly connected with a base 8, and the other side of the mounting bracket 5 is provided with a mounting structure for mounting the modular high-earthquake-resistance vehicle-mounted computer on an automobile. The mounting structure of this example is a mounting hole that mates with a mounting screw 4.
The mounting bracket 5, the base 8 and the housing 1 of this example are fixedly connected by a drop-resistant combination screw 7. The anti-falling combined screws 7 are all anti-loosening by adopting combined screws and anti-falling treatment, and the reliability of product connection is ensured.
Four, integral shock absorption
The utility model discloses still be equipped with the support in 5 below of installing support the high antidetonation grade vehicle-mounted computer's of modularization shock attenuation stabilizer blade 6. The shock absorption support legs 6 comprise screws fixedly connected with the mounting support and silica gel pads arranged at the bottoms of the screws or silica gel sleeves wrapping the screws, so that the purposes of firm shock absorption and improvement of shock absorption grade of the whole machine are achieved.
To sum up, the utility model discloses structural scheme compares with like product and has following advantage:
1) the interior of the machine is connected in a modularized way, namely, the connection between the plates is adopted, so that the anti-seismic performance is enhanced;
2) the screws of the product are all treated by adopting combined screws and drop resistance, so that the anti-seismic performance is further enhanced;
3) the external mounting bracket adopts specially designed silica gel and a specially-made stainless steel screw for damping;
4) the product meets EN50155 railway vibration impact EN 613731 grade B standard.
Therefore, the utility model discloses embedded computer more laminates the demand that some anti-seismic required higher scene (like on-vehicle application), also has good market competition. Through the design of the structural scheme of the modularized high-earthquake-resistant-level vehicle-mounted computer, the vacancy of product application in the rail transit market of I can be made up. Through the modular design, the anti-seismic performance of the product is improved, the EN50155 related railway certification is met, the market competitiveness of high-volume products is greatly improved, the product line of our department on the rail transit market is expanded, and the method has a wide market prospect in key construction projects in intercity high-speed railways and urban rail transit.
The above-mentioned embodiments are the preferred embodiments of the present invention, and the scope of the present invention is not limited to the above-mentioned embodiments, and the scope of the present invention includes and is not limited to the above-mentioned embodiments, and all equivalent changes made according to the present invention are within the protection scope of the present invention.
Claims (10)
1. The utility model provides a high antidetonation grade of modularization vehicle-mounted computer, includes casing, base and sets up at the inside circuit mainboard of casing and base, its characterized in that: still include the board to the board connector, be equipped with a plurality of interface on the board to the board connector, the board to the board connector with circuit mainboard board is to board electric connection.
2. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 1, wherein: the circuit board is provided with a storage module, more than 1 memory particle and a heat conducting plate, and the memory particles adopt onboard memories.
3. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 2, wherein: the heat conducting interface material of the heat conducting plate is carbon fiber Thermal Pad TIM.
4. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 2, wherein: the storage module comprises a mSATA storage module.
5. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 1, wherein: and a reinforcing sealant is arranged on the surface of the electronic component on the circuit main board.
6. The modular high earthquake resistant level vehicle-mounted computer according to any one of claims 1 to 5, wherein: the automobile anti-seismic device is characterized by further comprising a mounting bracket for mounting the modular high anti-seismic grade vehicle-mounted computer, wherein one side of the mounting bracket is fixedly connected with the base, and the other side of the mounting bracket is provided with a mounting structure for mounting the modular high anti-seismic grade vehicle-mounted computer on an automobile.
7. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 6, wherein: the mounting bracket, the base and the shell are fixedly connected through a drop-resistant combined screw.
8. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 6, wherein: the mounting structure is a mounting hole matched with the mounting screw.
9. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 6, wherein: and a damping support leg for supporting the modularized high-earthquake-resistance-level vehicle-mounted computer is further arranged below the mounting bracket.
10. The modular high-earthquake-resistance-level vehicle-mounted computer according to claim 9, wherein: the shock absorption support leg comprises a screw fixedly connected with the mounting bracket and a silica gel pad arranged at the bottom of the screw or a silica gel sleeve wrapping the screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021091531.3U CN212529513U (en) | 2020-06-12 | 2020-06-12 | Modular high-shock-resistance-level vehicle-mounted computer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021091531.3U CN212529513U (en) | 2020-06-12 | 2020-06-12 | Modular high-shock-resistance-level vehicle-mounted computer |
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| CN212529513U true CN212529513U (en) | 2021-02-12 |
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| CN202021091531.3U Active CN212529513U (en) | 2020-06-12 | 2020-06-12 | Modular high-shock-resistance-level vehicle-mounted computer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI785919B (en) * | 2021-12-07 | 2022-12-01 | 索士亞科技股份有限公司 | Anti-vibration heat conduction structure and heat dissipation device thereof |
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2020
- 2020-06-12 CN CN202021091531.3U patent/CN212529513U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI785919B (en) * | 2021-12-07 | 2022-12-01 | 索士亞科技股份有限公司 | Anti-vibration heat conduction structure and heat dissipation device thereof |
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