CN101364134B - Reinforcement computer - Google Patents
Reinforcement computer Download PDFInfo
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- CN101364134B CN101364134B CN 200810156080 CN200810156080A CN101364134B CN 101364134 B CN101364134 B CN 101364134B CN 200810156080 CN200810156080 CN 200810156080 CN 200810156080 A CN200810156080 A CN 200810156080A CN 101364134 B CN101364134 B CN 101364134B
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Abstract
The invention discloses a reinforced computer, which comprises a case, a computer motherboard and a computer module arranged in the case, and a heat source element integrated on the computer module. The computer motherboard, the computer module and the heat source element are superposed from bottom to top in sequence. The computer motherboard is suspended on the top surface of the case via a suspending device. A heat-transfer conduit and a press plate are arranged on the inner side of the top surface of the case. The top surface of the press plate is attached to the heat-transfer conduit and the bottom surface of the press plate is attached to the heat source element. The reinforced computer adopts the aluminum case, in which the heat pipe is embedded, thereby realizing the design of top-surface high-efficiency heat transfer and heat dissipation. The circuit board and the heating element are mounted in a suspending manner so as to meet the shock-resistant requirement.
Description
Technical field
The present invention relates to a kind of ruggedized computer, particularly a kind of ruggedized computer that comprises housing, computer motherboard, computer module and thermal source components and parts.
Background technology
Along with the raising of Computing processing power, its chip thermal value is also increasing with surprising rapidity.Nowadays heating radiator emerges in an endless stream, and more common radiating mode is the wind-cooling heat dissipating mode that heating radiator adds fan.Fan is the very high equipment of failure rate in the electronic equipment.At some special occasions, for example weapon equipment, banking equipment or the like require the occasion of high reliability or to the noise occasion of having relatively high expectations, should adopt the air-cooled radiating mode of fan less as far as possible.Kind of natural radiation heating radiator is arranged at present owing to there is not fan air-cooled, so need bigger heat loss through radiation area, the heating radiator volume is also just big more simultaneously.Existing heating radiator is mostly to be to be directly installed on by computer motherboard on the heater members such as CPU.And a little less than computer motherboard was highly brittle, the pressure that often can't bear heating radiator bore the impact shock of external environment simultaneously again.Heating radiator can not provide the protective effect of electronics thermal source device, has brought bigger potential danger to computer equipment simultaneously.Also have some electronic equipments now, hot-fluid is opposite with heat dissipation direction, because the heat conductivility of casing own, radiating efficiency is not high, can't realize the heat radiation of high power device.
Summary of the invention
Goal of the invention: technical matters to be solved by this invention is the ruggedized computer heat radiation used at special occasions at prior art and the deficiency of impact resistance, and a kind of ruggedized computer is provided.
Technical scheme: the invention discloses a kind of ruggedized computer, housing one side to the computer motherboard in outconnector and the housing, computer module and be integrated in thermal source components and parts on the computer module, described computer motherboard, computer module and thermal source components and parts add up from the bottom to top successively, and computer motherboard is hung on the end face of housing by suspender; The housing inside top surface also is provided with the pressing plate that heat transfer tube and end face and heat transfer tube are fitted, and the bottom surface of pressing plate and thermal source components and parts are fitted.
Among the present invention; the thermal source components and parts are integrated in computer module topmost and with pressing plate fits; can utilize whole computer case as the media that conducts heat; simultaneously with regard to the double equipment of doing cooling; device is hung on the casing top board; make upwards conduction more smoothly of hot-fluid; on the housing top board, embed by the heat transfer tube of heater members to radiation all around; make heat conduction rapidly in housing; can't use fan and to the demanding use occasion of anti-seismic performance; as use under the situation of reinforced computing machine, can guarantee good heat radiation, can protect the components and parts in the computing machine not to be damaged again.
Among the present invention, preferably, described suspender comprises self-clinching standoff, damping spring, screw assemblies, rubber washer and the damping rubber sleeve pipe that presses on the housing top board; Passing computer motherboard from the bottom to top behind nested damping spring of described screw assemblies and the rubber washer cooperates with self-clinching standoff; Described damping rubber sleeve pipe is nested in the part of screw assemblies between computer motherboard and self-clinching standoff.Thus, even under the situation of vibrations of very jolting, also can guarantee the safety of computer motherboard and corresponding component.
Among the present invention, preferably, described heat transfer tube has more than three, is dispersion shape and is arranged on the housing.
Among the present invention, preferably, described heat transfer tube has eight, is a meter font dispersion shape and is arranged on the housing, and pressing plate is positioned at the housing center, fits with an end of eight heat transfer tubes.Thus can be the fastest the heat on the pressing plate is passed to the whole top board of housing by heat transfer tube, improved radiating efficiency greatly.
Among the present invention, preferably, be provided with the heat-conducting silicone grease layer between described pressing plate and the thermal source components and parts.Thus can be more evenly and rapidly send the heat of thermal source components and parts to pressing plate.
Beneficial effect: ruggedized computer of the present invention adopts the aluminium matter casing end face efficient heat conducting and radiating design circuit plate of embedded heat pipe and mode that the heating components and parts adopt suspention to install can adapt to the high environment of shockproof requirements in that do not have under the situation of outside heat abstractor can quick heat radiating, the electronics integrated device is adequately protected in vibratory impulse and heat is in time conducted.Computer core CPU our experiments show that when being PM1.8G (31.7W), ambient temperature is a room temperature, at vibration frequency is that 5Hz～200Hz, three directions, acceleration are 1.5g, working environment under, computer system is with 100% load computing, after 2 hours, the temperature of software detection CPU and display chip is 45 ℃, and the thermometer measure skin temperature is 32 ℃.Equipment is that 5Hz～200Hz, three directions, acceleration are 1.5g 50 ℃ of environment temperatures at vibration frequency, working environment under, computer system is with 70% load computing, after 2 hours, the temperature of software detection CPU and display chip is 70 ℃, and the thermometer measure skin temperature is 55 ℃.Proof complete machine heat transfer property, and anti-seismic performance adheres to specification fully.
Description of drawings
Below in conjunction with the drawings and specific embodiments the present invention is done further and to specify.
Fig. 1 is a structural representation of the present invention.
Fig. 2 arranges synoptic diagram for middle shell inside surface heat transfer tube of the present invention.
Fig. 3 is a middle shell outside surface fin structure synoptic diagram of the present invention.
Embodiment
As shown in Figure 1, a kind of ruggedized computer of the present invention, comprise housing 12, housing 12 1 sides to computer motherboard 4, computer module 2 in outconnector 13 and the housing 12 and be integrated in thermal source components and parts 3 on the computer module, described computer motherboard 4, computer module 2 and thermal source components and parts 3 add by building successively on following, and computer motherboard 4 is hung on the end face of housing 12 by suspender; Housing 12 inside top surface also are provided with the pressing plate 5 that heat transfer tube 1 and end face and heat transfer tube 1 are fitted, and the bottom surface of pressing plate 5 and thermal source components and parts 3 are fitted.Described suspender comprises self-clinching standoff 7, damping spring 7, screw assemblies 9, rubber washer 10 and the damping rubber sleeve pipe 11 that presses on housing 12 top boards; Passing computer motherboard 4 from the bottom to top behind described screw assemblies 9 nested damping springs 8 and the rubber washer 10 is threaded with self-clinching standoff 7; Described damping rubber sleeve pipe 11 is nested in the part of screw assemblies 9 between computer motherboard 4 and self-clinching standoff 7.Be provided with heat-conducting silicone grease layer 6 between described pressing plate 5 and the thermal source components and parts 3.
In the present embodiment, described heat transfer tube 1 generally has more than three, is dispersion shape and is arranged on the housing 12.More excellent combination as shown in Figure 2, described heat transfer tube 1 has eight, is a meter font dispersion shape and is arranged on the housing 12, pressing plate is positioned at housing 12 centers, fits with an end of eight heat transfer tubes 1.
More particularly, conduction heat pipe 1 is a kind of heat conductor efficiently among the present invention.It is embedded in the large-area heating radiator of level, helps the level transmission of heat.Be that heat pipe is welded with lead welding technology and casing top board among the figure.Computer module 2 is integrated CPU, display chip and other high thermal source components and parts are in the computer core parts of one.Thermal source components and parts 3 are integrated on the computer module.Computer motherboard 4 is that the substrate of computer module provides peripheral circuit and external interface for computing machine.Pressing plate 5 is the rebounds between thermal source components and parts and heat pipe and the housing, adopts the good copper material of heat-transfer effect.Heat-conducting silicone grease layer 6 is articulamentums of thermal source components and parts and rebound.Self-clinching stud 7 is to press on the housing top board, and there is screw thread on the top.Shock-absorbing spring 8 is spring steel wires, can provide pretightning force after the compression.Rubber washer 10 is a high-density wear-resistant rubber, for printed board provides protection.Damping rubber sleeve pipe 11 is corrosion-resistant flexible rubber material.As shown in Figure 3, mill out some grooves 14 at the outside surface of housing 12 and form fins, can increase the radiating effect of whole housing.Housing and fin are the device housings that adopts aluminium alloy to process.Installation steps: after one, radiating machine casing 12 and fin aluminium alloy process, adopt electro-coppering to handle.Then self-clinching standoff 7 being pressed is embedded in the copper heat pipe of preprepared crust in the groove that processes on the casing top board again, and pressing plate 5 is installed on the heat pipe, combines closely with casing base heat pipe surface.By the high temperature lead welding three is welded as a whole at last, it is fully contacted.Two, damping rubber sleeve pipe 11 is enclosed within on the self-clinching standoff 7.Heat-conducting silicone grease 6 on the heater members exterior view is installed in computer module and the computer motherboard that Denso is good on the casing more then.Allow self-clinching standoff pass the mounting hole that computer motherboard is reserved, thermal source components and parts 3 are fully contacted with pressing plate 5.Next with rubber washer 10, shock-absorbing spring 8, be enclosed within on the self-clinching standoff 7 successively.Screw assemblies 9 is installed on the top screw thread of self-clinching standoff at last.Make the screw in compression self-clinching standoff after the installation, provide certain pretightning force for shock-absorbing spring simultaneously.
The present invention is a suspension type computing machine communicating terminal, has the radiating efficiency height, and electron device is had the shock proof protective effect of vibration isolation, and printed board such as is not born at characteristics.The housing that adopts big surface is as radiator material, can increase the speed of distributing of heat.In casing, inlay simultaneously and welded the high heat pipe of heat transfer efficiency, reduced the casing surface resistance of heat transfer.Pressing plate and the welding of casing inner face by the processing of the good copper of heat-transfer effect (heat transfer coefficient 33W/ (m. ℃)) material are enclosed in heat pipe in the case material, make the more uniform heat pipe evaporation ends that is transmitted to each root to radiation all around of device heat.And adopt the flexible suspension connected mode that electron device is protected to greatest extent.Avoided simultaneously the much lower heat conductive rubber that conduction efficiency is wanted than metal is installed between electronics thermal source components and parts and heating radiator, improved heat transfer efficiency.
The invention provides a kind of thinking and method of ruggedized computer; the method and the approach of this technical scheme of specific implementation are a lot; the above only is a preferred implementation of the present invention; should be understood that; for those skilled in the art; under the prerequisite that does not break away from the principle of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.The all available prior art of each component part not clear and definite in the present embodiment is realized.
Claims (6)
1. ruggedized computer, comprise housing (12), housing (12) one sides to computer motherboard (4), computer module (2) in outconnector and the housing (12) and be integrated in thermal source components and parts (3) on the computer module, it is characterized in that, described computer motherboard (4), computer module (2) and thermal source components and parts (3) set gradually from the bottom to top, and computer motherboard (4) is hung on the end face of housing (12) by suspender; Housing (12) inside top surface also is provided with the pressing plate (5) that heat transfer tube (1) and end face and heat transfer tube (1) are fitted, and the bottom surface of pressing plate (5) and thermal source components and parts (3) are fitted.
2. ruggedized computer according to claim 1, it is characterized in that described suspender comprises self-clinching standoff (7), damping spring (7), screw assemblies (9), rubber washer (10) and the damping rubber sleeve pipe (11) that presses on housing (12) top board; Passing computer motherboard (4) behind nested damping spring of described screw assemblies (9) (8) and the rubber washer (10) from the bottom to top cooperates with self-clinching standoff (7); Described damping rubber sleeve pipe (11) is nested in screw assemblies (9) and is positioned at part between computer motherboard (4) and the self-clinching standoff (7).
3. ruggedized computer according to claim 1 and 2 is characterized in that, described heat transfer tube (1) has more than three, is dispersion shape and is arranged on the housing (12).
4. ruggedized computer according to claim 3 is characterized in that, described heat transfer tube (1) has eight, is a meter font dispersion shape and is arranged on the housing (12), and pressing plate is positioned at housing (12) center, fits with an end of eight heat transfer tubes (1).
5. ruggedized computer according to claim 4 is characterized in that, is provided with heat-conducting silicone grease layer (6) between described pressing plate (5) and the thermal source components and parts (3).
6. ruggedized computer according to claim 4 is characterized in that, described housing (12) outside surface is provided with many parallel strip grooves (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810156080 CN101364134B (en) | 2008-09-27 | 2008-09-27 | Reinforcement computer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810156080 CN101364134B (en) | 2008-09-27 | 2008-09-27 | Reinforcement computer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101364134A CN101364134A (en) | 2009-02-11 |
| CN101364134B true CN101364134B (en) | 2010-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810156080 Active CN101364134B (en) | 2008-09-27 | 2008-09-27 | Reinforcement computer |
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| CN (1) | CN101364134B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980100A (en) * | 2010-11-04 | 2011-02-23 | 南京畅洋科技有限公司 | Centralized communication control device for embedded computer |
| CN107765793B (en) * | 2017-11-01 | 2019-12-03 | 福州市仓山区亚尔曼知识产权服务有限公司 | A kind of computer having suspended fixing mechanism |
| CN108163121A (en) * | 2017-11-14 | 2018-06-15 | 天津市爱轮德自行车有限公司 | A kind of built-in lithium ion battery power-assisted electric vehicle with wireless blue tooth communication system |
| CN113741664A (en) * | 2021-08-04 | 2021-12-03 | 武汉造悟科技有限公司 | Protective heat dissipation device for Internet system equipment and use method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2329032Y (en) * | 1997-09-23 | 1999-07-14 | 大原武芳 | Drawer type computer casing |
| CN2768073Y (en) * | 2005-01-14 | 2006-03-29 | 方植宁 | Computer case |
| EP1918801A1 (en) * | 2006-11-06 | 2008-05-07 | MAGNETI MARELLI SISTEMI ELETTRONICI S.p.A. | Integrated circuit electronic device comprising an improved cooling system |
| CN201270018Y (en) * | 2008-09-27 | 2009-07-08 | 南京莱斯大型电子系统工程有限公司 | Reinforced computer |
-
2008
- 2008-09-27 CN CN 200810156080 patent/CN101364134B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2329032Y (en) * | 1997-09-23 | 1999-07-14 | 大原武芳 | Drawer type computer casing |
| CN2768073Y (en) * | 2005-01-14 | 2006-03-29 | 方植宁 | Computer case |
| EP1918801A1 (en) * | 2006-11-06 | 2008-05-07 | MAGNETI MARELLI SISTEMI ELETTRONICI S.p.A. | Integrated circuit electronic device comprising an improved cooling system |
| CN201270018Y (en) * | 2008-09-27 | 2009-07-08 | 南京莱斯大型电子系统工程有限公司 | Reinforced computer |
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| Publication number | Publication date |
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| CN101364134A (en) | 2009-02-11 |
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