CN101980100A - Centralized communication control device for embedded computer - Google Patents
Centralized communication control device for embedded computer Download PDFInfo
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- CN101980100A CN101980100A CN 201010531778 CN201010531778A CN101980100A CN 101980100 A CN101980100 A CN 101980100A CN 201010531778 CN201010531778 CN 201010531778 CN 201010531778 A CN201010531778 A CN 201010531778A CN 101980100 A CN101980100 A CN 101980100A
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Abstract
The invention discloses a centralized communication control device for an embedded computer. The device comprises a main system board, an expansion board, a first functional board, a second functional board and a power module, wherein the expansion board is connected with the main system board and is provided with a peripheral component interconnect (PCI) bus; and the first and second functional boards are connected with the expansion board respectively. Heat of a main chip is conducted to a radiator on the side wall of a case by copper pipe heat conducting technology, so that the temperature of the main chip is lowered and the device is particularly suitable for severe environments in the industrial field; simultaneously, the processing capability and performance of a system are enhanced and system stability is improved.
Description
Technical field
The present invention relates to a kind of embedded computer and concentrate communication control unit, the embedded computer that relates in particular to the high-performance that is applied in electric power, colliery, telecommunications, the military industry field, many communication interfaces pattern, high reliability is concentrated communication control unit.
Background technology
Modern electric and colliery robotization high-speed development of science and technology, need to concentrate the data-handling capacity of communication control unit to increase substantially, and conventional at present industrial computer can not reach such high request, and is for this reason, just particularly necessary based on the research and development of high-performance, multiple communication port.A power automatic system is a typical hierarchical structure, just high more to the upper strata more to the requirement of communication communication port of Centralized Controller and traffic handling capability, also high more to the requirement of reliability simultaneously, the difference in functionality module is inequality to the processing requirements of computing machine, and the amount of data information exchange is also different.At present conventional product is in single port, and the telecommunication management aspect of low rate has possessed than the proven technique deposit, and aspect high-performance and the high communication data processing power and international most advanced level also have tangible gap.Can not steady operation under the environment of abominable high temperature.
Summary of the invention
The present invention seeks to: provide a kind of embedded computer to concentrate communication control unit,, increase system stability to improve wide temperature work, system performance, many communication port real-time Communication for Power and the communication data processing power under the condition of passive heat radiation of single system.
A technical scheme of the present invention is: a kind of embedded computer is concentrated communication control unit, it is characterized in that it comprises: main system board, link to each other with main system board and adopt the expansion board of pci bus, first and second feature board and the power module that is installed in hard disk expansion board on the main system board, links to each other respectively with expansion board.
The present invention further comprises front panel, rear panel, covers the top panel of front and back panels top and the case radiation device that is positioned at top panel one side and links to each other with rear panel, and wherein said main system board, expansion board and first and second feature board are all within the scope that is defined by front panel, rear panel, top panel.
Main system board described in the present invention includes a master chip, the heat pipe between the master chip heating radiator above the master chip and connection master chip heating radiator and case radiation device.
Heating radiator of master chip described in the present invention and case radiation device all are many wings type shape, and adopt aluminum, and heat pipe adopts the red copper material.
Rear panel described in the present invention comprises the main link that links to each other with main system board, first link that links to each other with second feature board, second link that links to each other with first feature board and the power connector end that links to each other with power module.
Main link described in the present invention comprises 1 VGA video simulation output socket, 2 serial line interfaces, 2 Fast Ethernet interfaces at least, first link comprises several Fast Ethernet interfaces or some serial line interfaces at least, second link comprises several Fast Ethernet interfaces or some serial line interfaces, and power connector end comprises the AC and DC input interface.
Another technical scheme of the present invention is: be positioned at the main system board of cabinet, and comprise a master chip, be positioned at the master chip heating radiator of master chip top; Be positioned at cabinet and with the expansion board that links to each other with main system board; At least one feature board that is positioned at cabinet and links to each other respectively with expansion board; Be positioned at the power module of cabinet; Be positioned at the outer case radiation device of cabinet; And the heat pipe that connects master chip heating radiator and case radiation device.
Advantage of the present invention is:
The present invention conducts to the heat of master chip by heat pipe and is positioned on the extraneous case radiation device, thereby reduces the temperature of master chip, guarantees that the wide temperature of system is worked, and makes this device be applicable to rugged surroundings in any industrial circle thus.Also improve many communication port real-time Communication for Power and the communication data processing power and the performance of system simultaneously, and increased system stability.
Description of drawings
Below in conjunction with drawings and Examples the present invention is further described:
Fig. 1 is a perspective view of the present invention;
Fig. 2 is the perspective view under another angle of the present invention;
Fig. 3 is a schematic top plan view of the present invention, and top panel is removed;
Fig. 4 is a high-level schematic functional block diagram of the present invention.
Embodiment
Embodiment: shown in figure 1-4, the invention provides a kind of embedded computer and concentrate a specific embodiment of communication control unit, its be a cabinet and comprise front panel 10, rear panel 30, the top panel 20 of (10,30) top that covers front and back panels and the case radiation device 40 that is positioned at top panel 20 1 sides and links to each other with rear panel 30.Case radiation device 40 adopts many wings type shapes, effectively raises cooling surface area, thus more effectively with temperature conduction to air.In this cabinet, also be provided with main system board 100, link to each other with main system board 100 and adopt the expansion board 200 of pci bus, be installed in the hard disk expansion board 108 on the main system board 100, with expansion board 200 link to each other respectively first, two feature boards (300,302), and power module 400, wherein between main system board 100 and the expansion board 200, and the interface between expansion board 200 and the feature board is all taked DIN 41612 mechanical interfaces, DIN41612 is the connector that is widely used in industrial circle, plurality of specifications is arranged, what adopted in the present embodiment is 96 stitch connectors, and specification is 94mmX85.2mm.Wherein expansion board 200 adopts female connectors 500, and main system board 100 and feature board adopt public connector.Pci bus is the interconnected meaning of peripherals, becomes commercial PC bus standard very soon by the Intel issue in 1992.PCI is a kind of data bus that is independent of processor, and bus speed can reach 66MHZ, the gross data processing power: 32 is 264MB/s, and 64 is 528MB/s, therefore is highly suitable in supercomputing and the data communication field and uses.And the present invention adopts above-mentioned interface and bussing technique, be bus-structured design of DIN-PCI and restructural technology, expand 8 pci buss by two feature boards, 4 independently PCI passages are arranged on each feature board, can guarantee that each feature board uses a minimum pci bus, and use 4 pci buss at most.And the connection of existing P CI plate all is to be with a pci bus, and DIN interface of the present invention then can be with 4 pci buss, more helps the transmission of data.For ease of 4 pci bus work, need DIN-PCI is done unique definition, promptly redefine signal, existing P CI connector all has only one group of CLK, IDSEL, GNT, the REQ signal, and DIN interface of the present invention has 4 groups of CLK, IDSEL, GNT, the REQ signal, to support 4 groups of PCI equipment simultaneously, and one group of string and shared bus (SPB) on DIN, have been realized, SPB comprises following signal SPB_AD[3..0], SPB_CS1, SPB_CS2, SPB_RESET#, SPB_WD, SPB_RD, SPB_CLK, SPB_DATA, thus the DIN interface bearing 4 groups of pci buss, one group of SPB bus, can be used for feature board (300 by the SPB bus, 302) with expansion board 200 and front panel 10 between communicate by letter, the user can understand the duty of feature board (300,302) by the warning lamp of front panel 10.Adopt the DIN interface, can allow this connection adapt to harsh industrial environment and use, connect fastening, be difficult for being subjected to dust to influence, and technically used the signal consistent, but the line preface is revised with pci bus, the integrality of signal is improved, further satisfies industrial environment and use.
Certainly the foregoing description only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the people who is familiar with this technology can understand content of the present invention and enforcement according to this, can not limit protection scope of the present invention with this.The all spirit of main technical schemes is done according to the present invention equivalent transformation or modification all should be encompassed within protection scope of the present invention.
Claims (7)
1. an embedded computer is concentrated communication control unit, it is characterized in that it comprises: main system board (100), link to each other with main system board (100) and adopt the expansion board (200) of pci bus, first and second feature board (300,302) and the power module (400) that is installed in hard disk expansion board (108) on the main system board (100), links to each other respectively with expansion board (200).
2. embedded computer according to claim 1 is concentrated communication control unit, it is characterized in that: it further comprises front panel (10), rear panel (30), covers the top panel (20) of front and back panels (10,30) top and the case radiation device (40) that is positioned at top panel (20) one sides and links to each other with rear panel (30), and wherein said main system board (100), expansion board (200) and first and second feature board (300,302) are all within the scope that is defined by front panel (10), rear panel (30), top panel (20).
3. embedded computer according to claim 2 is concentrated communication control unit, it is characterized in that: described main system board (100) includes a master chip, is positioned at the master chip heating radiator (102) of master chip top and the heat pipe (104) between connection master chip heating radiator (102) and the case radiation device (40).
4. embedded computer according to claim 3 is concentrated communication control unit, it is characterized in that: described master chip heating radiator (102) and case radiation device (40) all are many wings type shape, and adopt aluminum, and heat pipe (104) adopts the red copper material.
5. concentrate communication control unit according to claim 2 or 3 or 4 described embedded computers, it is characterized in that: described rear panel (30) comprises the main link (32) that links to each other with main system board (100), first link (34) that links to each other with second feature board (302), second link (38) that links to each other with first feature board (300) and the power connector end (36) that links to each other with power module (400).
6. embedded computer according to claim 5 is concentrated communication control unit, it is characterized in that: described main link (32) comprises 1 VGA video simulation output socket, 2 serial line interfaces, 2 Fast Ethernet interfaces at least, first link (34) comprises several Fast Ethernet interfaces or some serial line interfaces at least, second link (38) comprises several Fast Ethernet interfaces or some serial line interfaces, and power connector end (36) comprises the AC and DC input interface.
7. an embedded computer is concentrated communication control unit, and it comprises a cabinet, it is characterized in that it comprises:
Be positioned at the main system board (100) of cabinet, and comprise a master chip, be positioned at the master chip heating radiator (102) of master chip top;
Be positioned at cabinet and with the expansion board (200) that links to each other with main system board (100);
At least one feature board that is positioned at cabinet and links to each other respectively (300,302) with expansion board (200);
Be positioned at the power module (400) of cabinet;
Be positioned at the outer case radiation device (40) of cabinet; And
The heat pipe (104) that connects master chip heating radiator (102) and case radiation device (40).
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CN 201010531778 CN101980100A (en) | 2010-11-04 | 2010-11-04 | Centralized communication control device for embedded computer |
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CN 201010531778 CN101980100A (en) | 2010-11-04 | 2010-11-04 | Centralized communication control device for embedded computer |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109542180A (en) * | 2018-11-20 | 2019-03-29 | 合肥泾渭信息通讯有限公司 | A kind of system configuration device and electronic equipment based on hardware platform |
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EP0898220B1 (en) * | 1997-08-19 | 2003-01-15 | Hewlett-Packard Company, A Delaware Corporation | Electronic apparatus with improved heatsink arrangement |
US7394653B2 (en) * | 2005-10-25 | 2008-07-01 | Shuttle Inc. | Heat dissipating system of multi-media computer |
CN101364134A (en) * | 2008-09-27 | 2009-02-11 | 南京莱斯大型电子系统工程有限公司 | Reinforcement computer |
CN201867719U (en) * | 2010-11-04 | 2011-06-15 | 南京畅洋科技有限公司 | Centralized communication control device for embedded computer |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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EP0898220B1 (en) * | 1997-08-19 | 2003-01-15 | Hewlett-Packard Company, A Delaware Corporation | Electronic apparatus with improved heatsink arrangement |
US7394653B2 (en) * | 2005-10-25 | 2008-07-01 | Shuttle Inc. | Heat dissipating system of multi-media computer |
CN101364134A (en) * | 2008-09-27 | 2009-02-11 | 南京莱斯大型电子系统工程有限公司 | Reinforcement computer |
CN201867719U (en) * | 2010-11-04 | 2011-06-15 | 南京畅洋科技有限公司 | Centralized communication control device for embedded computer |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109542180A (en) * | 2018-11-20 | 2019-03-29 | 合肥泾渭信息通讯有限公司 | A kind of system configuration device and electronic equipment based on hardware platform |
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Application publication date: 20110223 |