CN218851035U - Multilayer combined type circuit board structure - Google Patents
Multilayer combined type circuit board structure Download PDFInfo
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- CN218851035U CN218851035U CN202222844204.6U CN202222844204U CN218851035U CN 218851035 U CN218851035 U CN 218851035U CN 202222844204 U CN202222844204 U CN 202222844204U CN 218851035 U CN218851035 U CN 218851035U
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- circuit board
- embedded
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- top surface
- heat
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The utility model relates to a circuit board technical field, concretely relates to multilayer combined type circuit board structure, include: the circuit board embedded part is fixedly installed on the bottom surface of the circuit board, the circuit board embedded part is embedded on the top surface and the bottom surface of the embedded structure, connecting seats are fixedly installed at four corners of the embedded structure, and the connecting seats are connected in a mutually overlapped mode through the bolt connecting structure. The circuit board is embedded on the top surface and the bottom surface of the embedded structure through the circuit board embedded structure, and the embedded structures are connected with each other at the four corners of the circuit board embedded structure through the connecting bolts. And the embedding structure is provided with an excessive heat dissipation plate, and heat generated on the surface of the circuit board is conducted to the embedding structure by utilizing the excessive heat dissipation plate, so that the heat is dissipated to the air through the embedding structure.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to multilayer combined type circuit board structure.
Background
The PCB circuit board is also called as a printed circuit board, is a provider of electrical connection of electronic components, the design of the PCB circuit board is mainly a layout design, the main advantage of adopting the circuit board is that the errors of wiring and assembly are greatly reduced, the automation level and the production labor rate are improved, in order to increase the area capable of wiring, a printed circuit board with a double-sided inner layer and two single-sided outer layers or two double-sided inner layers and two single-sided outer layers is used, the printed circuit board which is alternately arranged together through a positioning system and insulating bonding materials and is interconnected by conductive patterns according to the design requirements becomes a four-layer or six-layer printed circuit board, also called as a multilayer circuit board, the existing multilayer composite circuit board is easy to damage the circuit board when being installed, at present, a screw fixing mode is generally adopted for the installation of the multilayer circuit board, but the damage is easy to the circuit board due to overlarge screw connection pressure, and the looseness or shake between the circuit boards is easy to cause when the screw connection is looser, and the service life of the circuit board is influenced.
In view of the above, it is desirable to design a multi-layer composite circuit board structure, in which a circuit board is embedded on the top and bottom surfaces of an embedded structure through a circuit board embedded structure, and the embedded structures are connected to each other at four corners of the circuit board embedded structure through connection pins. And the embedding structure is provided with an excessive heat dissipation plate, and heat generated on the surface of the circuit board is conducted to the embedding structure by utilizing the excessive heat dissipation plate, so that the heat is dissipated to the air through the embedding structure.
SUMMERY OF THE UTILITY MODEL
In order to solve the defects of the prior art, the utility model aims to provide a multilayer composite circuit board structure, through circuit board gomphosis structure, with the circuit board gomphosis in the top surface and the bottom surface of gomphosis structure, through the connecting bolt with gomphosis structure interconnect in the four corners department of circuit board gomphosis structure. And the gomphosis structure is provided with excessive heating panel, utilizes excessive heating panel to lead the heat that produces on the circuit board face to the gomphosis structure on to through gomphosis structure with heat loss to in the air.
In order to realize the above object, the technical scheme of the utility model is that: a multi-layer composite circuit board structure comprising: the circuit board embedded part is fixedly installed on the bottom surface of the circuit board, the circuit board embedded part is embedded on the top surface and the bottom surface of the embedded structure, connecting seats are fixedly installed at four corners of the embedded structure, and the connecting seats are connected in a mutually overlapped mode through the bolt connecting structure.
Further, the chimeric structure comprises: the heat conducting plate is fixedly mounted at the center of the embedding groove, the inner diameter surface of the embedding groove is matched with the circuit board embedding piece, the limiting eaves are fixedly mounted on the top surface of the embedding groove, the limiting eaves are arranged on the top surface of the circuit board embedding piece, and the embedding grooves are formed in the top surface and the bottom surface of the heat conducting plate.
Furthermore, a buffering silica gel layer is fixedly mounted on the bottom surface of the limiting eave.
Furthermore, the connecting seat is fixedly arranged at four corners of the embedding structure, a bolt hole is formed in the center of the connecting seat, and the bolt hole is matched with the bolt connecting structure.
Further, the bolt connection structure includes: bolt, silica gel gasket and nut, the bolt with the bolt hole cooperatees, the silica gel gasket sets up between the connecting seat, the nut with the bolt cooperatees, nut detachably sets up bolted connection.
Has the advantages that:
the utility model provides a pair of multilayer combined type circuit board structure, through circuit board gomphosis structure, with circuit board gomphosis in the top surface and the bottom surface of gomphosis structure, through the connecting bolt with gomphosis structure interconnect in the four corners department of circuit board gomphosis structure. And the gomphosis structure is provided with excessive heating panel, utilizes excessive heating panel to lead the heat that produces on the circuit board face to the gomphosis structure on to through gomphosis structure with heat loss to in the air.
Drawings
Fig. 1 is a schematic cross-sectional view of a multilayer composite circuit board according to the present invention;
fig. 2 is a schematic top view of a multi-layer composite circuit board structure according to the present invention.
In the figure: 1-circuit board, 2-circuit board embedded part, 3-embedded structure, 4-bolt connection structure, 5-connecting seat, 31-embedded groove, 32-limiting brim, 33-heat conducting plate, 34-buffering silica gel layer, 41-bolt, 42-silica gel gasket, 43-nut and 51-bolt hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by a person skilled in the art based on the embodiments of the present invention belong to the protection scope of the present invention.
As shown in fig. 1-2, the utility model discloses a multilayer combined type circuit board structure, include: the circuit board comprises a circuit board 1, a circuit board embedded part 2, an embedded structure 3 and a bolt connecting structure 4, wherein the circuit board embedded part 2 is fixedly installed on the bottom surface of the circuit board 1, the circuit board embedded part 2 is embedded on the top surface and the bottom surface of the embedded structure 3, connecting seats 5 are fixedly installed at four corners of the embedded structure 3, and the connecting seats 5 are connected in a mutually overlapped mode through the bolt connecting structure 4.
Further, the fitting structure 3 includes: the heat conduction plate is fixedly installed at the center of the embedding groove 31, the inner diameter surface of the embedding groove 31 is matched with the circuit board embedded part 2, the limiting eaves 32 are fixedly installed on the top surface of the embedding groove 31, the limiting eaves 32 cover the top surface of the circuit board embedded part 2, and the embedding grooves 31 are formed in the top surface and the bottom surface of the heat conduction plate 33.
Further, a buffering silica gel layer 34 is fixedly mounted on the bottom surface of the limiting eave 32.
Further, the connecting base 5 is fixedly installed at four corners of the embedding structure 3, a bolt hole 51 is formed in the center of the connecting base 5, and the bolt hole 51 is matched with the bolt connecting structure 4.
Further, the bolt connection structure 4 includes: bolt 41, silica gel gasket 42 and nut 43, bolt 41 with bolt hole 51 cooperatees, silica gel gasket 42 sets up between the connecting seat 5, nut 43 with bolt 41 cooperatees, nut 43 detachably sets up bolt 41 connects.
The working principle is as follows:
first, the circuit board 1 is fixedly connected to the circuit board fitting 2, the fitting structure 3 is provided with a fitting groove 31, the circuit board fitting 2 is fitted into the fitting groove 31, a limit ledge 32 is provided on the top surface of the fitting groove 31, and the circuit board fitting 2 is fitted in the vertical direction by the limit ledge 32.
The bottom surface of the limiting brim 32 is fixedly provided with a buffering silica gel layer 34, and the buffering silica gel layer 34 is arranged on the top surface of the circuit board embedded part 2 in a propping manner. Since the fitting grooves 31 are provided on the top and bottom surfaces of the fitting structure 3, the circuit board fitting 2 is attached to both sides of the heat transfer plate 33, and heat on the circuit board fitting 2 is transferred by the heat transfer plate 33.
Because the circuit board 1 is fixedly mounted on the top surface of the circuit board embedded part 2, the circuit board 1 is exposed out of a groove body formed by the limit eaves 32, and the circuit board embedded part 2 conducts heat on the circuit board 1 to the heat conducting plate 33 and radiates the heat to the outside.
Wherein, because gomphosis structure 3's four corners department fixed mounting has connecting seat 5, connecting seat 5 center department has seted up bolt hole 51, and bolt connection structure 4's bolt 41 and bolt hole 51 cooperate, and bolt 41 passes bolt hole 51 with between the connecting seat 5 cross-under each other to be provided with silica gel gasket 42 between the connecting seat 5, silica gel electricity links mutual pressure between the buffering connecting seat 5, and the bolt 41 bottom is through nut 43 with bolt 41 fixed between connecting seat 5.
The utility model provides a pair of multilayer combined type circuit board structure, through 1 gomphosis structure 3 of circuit board, with 1 gomphosis of circuit board in the top surface and the bottom surface of gomphosis structure 3, through the connecting bolt with 3 interconnect of gomphosis structure in 1 gomphosis structure 3's of circuit board four corners department. And the embedding structure 3 is provided with an excessive heat dissipation plate, and heat generated on the surface of the circuit board 1 is conducted to the embedding structure 3 by the excessive heat dissipation plate, so that the heat is dissipated to the air through the embedding structure 3.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and all modifications, equivalents, improvements and the like that fall within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (5)
1. A multi-layer composite circuit board structure comprising: the circuit board comprises a circuit board (1), a circuit board embedded piece (2), an embedded structure (3) and a bolt connecting structure (4), and is characterized in that the circuit board embedded piece (2) is fixedly installed on the bottom surface of the circuit board (1), the circuit board embedded piece (2) is embedded in the top surface and the bottom surface of the embedded structure (3), connecting seats (5) are fixedly installed at four corners of the embedded structure (3), and the connecting seats (5) are connected in a mutually overlapped mode through the bolt connecting structure (4).
2. The multilayer composite circuit board structure of claim 1, wherein said jogged structure (3) comprises: the heat-conducting plate is characterized by comprising a fitting groove (31), a limiting eave (32) and a heat-conducting plate (33), wherein the heat-conducting plate (33) is fixedly mounted at the center of the fitting groove (31), the inner diameter surface of the fitting groove (31) is matched with the circuit board fitting piece (2), the limiting eave (32) is fixedly mounted on the top surface of the fitting groove (31), the limiting eave (32) covers the top surface of the circuit board fitting piece (2), and the fitting groove (31) is formed in the top surface and the bottom surface of the heat-conducting plate (33).
3. The multi-layer composite circuit board structure of claim 2, wherein the bottom surface of the limiting eaves (32) is fixedly provided with a buffer silica gel layer (34).
4. The structure of claim 2, wherein the connecting base (5) is fixedly installed at four corners of the engaging structure (3), a bolt hole (51) is formed at the center of the connecting base (5), and the bolt hole (51) is matched with the bolt connecting structure (4).
5. A multilayer composite circuit board structure according to claim 3, characterized in that said bolt connection structure (4) comprises: bolt (41), silica gel gasket (42) and nut (43), bolt (41) with bolt hole (51) cooperate, silica gel gasket (42) set up between connecting seat (5), nut (43) with bolt (41) cooperate, nut (43) detachably sets up bolt (41) are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222844204.6U CN218851035U (en) | 2022-10-27 | 2022-10-27 | Multilayer combined type circuit board structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222844204.6U CN218851035U (en) | 2022-10-27 | 2022-10-27 | Multilayer combined type circuit board structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218851035U true CN218851035U (en) | 2023-04-11 |
Family
ID=87306553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222844204.6U Active CN218851035U (en) | 2022-10-27 | 2022-10-27 | Multilayer combined type circuit board structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218851035U (en) |
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2022
- 2022-10-27 CN CN202222844204.6U patent/CN218851035U/en active Active
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