TWM626442U - Shock-proof heat-conductive structure and heat-dissipating device thereof - Google Patents

Abstract

This creation is a shock-proof heat-conducting structure and its heat-dissipating device. The heat dissipation device includes a thermal conductive base, a thermal diffusion plate and a thermal interface material. The heat-conducting base has opposite heat-absorbing sides and heat-releasing sides, and the heat-absorbing side is concavely provided with an accommodating groove. The heat diffusion plate is movably arranged in the accommodating groove, the heat diffusion plate has opposite inner and outer conducting surfaces, and the inner conducting surface is thermally connected to the heat-conducting base and is kept in direct contact with the inner wall surface of the accommodating groove. Toward the gap, the outer conductive junction is thermally conductive and connected to the heating element. The thermal interface material is filled in the vertical gap between the inner conducting surface and the accommodating groove, so that the thermal interface material will not collide between the thermal diffusion plate and the thermally conductive base under the action of external force. In this way, damage caused by external vibration is avoided, so as to maintain the normal operation and reliability of the system.

Description

Shock-proof heat-conducting structure and its heat-dissipating device

This work is about thermally conductive structures, especially an anti-vibration thermally conductive structure.

With the rapid development of the computer industry, electronic heating elements such as microprocessor chips will generate a large amount of heat energy during operation. If the heating electronic components or semiconductor components are not cooled in time, the electronic components will be damaged or their service life will be shortened. . In this regard, radiators are usually installed inside most electronic products to cool down the heat-generating electronic components.

In particular, in special-purpose systems such as industrial computers or military computers, electronic components such as microprocessor chips usually require a more stable operating environment and heat dissipation performance to avoid external vibrations that affect the operation of the computer's internal electronic circuits or cause overheating. So that damage occurs, and then maintain the normal operation and reliability of the system, and prolong the service life.

In view of this, the creator of the present invention has devoted himself to the research and application of the theory, and tried his best to solve the above-mentioned problems, which is the goal of the creator's improvement.

One of the purposes of this creation is to provide a shock-proof heat-conducting structure and a heat-dissipating device thereof, in which the thermal interface material is provided between the heat-diffusion plate and the heat-conducting base to prevent collision under the action of external force. Therefore, it has an anti-vibration effect, which can avoid damage caused by external vibration, thereby maintaining the normal operation and reliability of the system.

In order to achieve the above purpose, the present invention is an anti-vibration thermal conduction structure, which includes a thermal conduction base, a thermal diffusion plate and a thermal interface material. The heat-conducting base has opposite heat-absorbing sides and heat-releasing sides, and the heat-absorbing side is concavely provided with an accommodating groove. The heat diffusion plate is movably arranged in the accommodating groove, the heat diffusion plate has opposite inner and outer conducting surfaces, and the inner conducting surface is thermally connected to the heat-conducting base and is kept in direct contact with the inner wall surface of the accommodating groove. Toward the gap, the outer conductive junction is thermally conductive and connected to the heating element. The thermal interface material is filled in the vertical gap between the inner conducting surface and the accommodating groove, so that the thermal interface material will not collide between the thermal diffusion plate and the thermally conductive base under the action of external force.

One objective of the present invention is to provide a heat dissipation device with an anti-vibration and heat-conducting structure, including the anti-vibration and heat-conducting structure and a thermal conductor. The thermal conductor is thermally conductively connected to the heat release side and combined with the thermally conductive base.

Compared with the prior art, the heat-conducting structure of the present invention has a concave accommodating groove in the heat-conducting base, and the inner conducting surface of the heat diffusion plate is thermally conductively connected to the heat-conducting base and maintains a space with the inner wall surface of the accommodating groove. The thermal interface material is filled in the vertical gap, so that the thermal interface material is buffered between the thermal diffusion plate and the thermal conductive base, so that there is no impact under the action of external force, thereby achieving the purpose of shock resistance. In addition, since the thermal interface material can reduce the thermal resistance between the thermal diffusion plate and the thermally conductive base, the heat conducted to the thermally diffused plate can be efficiently transferred to the thermally conductive base and dissipated, thereby achieving the purpose of heat dissipation.

1: heat sink

2: heating element

10: Shockproof and thermally conductive structure

11: Thermal base

110: accommodating slot

111: Endothermic side

112: Exothermic side

12: Thermal diffusion plate

121: Inner guide junction

122: External lead junction

13: Thermal Interface Materials

20: Thermal conductor

30: Deformation Space

40: Elastic element

41: Screw elements

42: Spring

V: vertical clearance

FIG. 1 is a combined cross-sectional view of the heat dissipation device with the shock-proof and heat-conducting structure of the present invention.

FIG. 2 is a schematic diagram of the application of the heat dissipation device with the shock-proof and heat-conducting structure of the present invention.

FIG. 3 is a combined cross-sectional view of another embodiment of the heat dissipation device with an anti-vibration and heat-conducting structure of the present invention.

FIG. 4 is a combined cross-sectional view of another embodiment of the heat dissipation device with an anti-vibration and heat-conducting structure of the present invention.

The detailed description and technical content of this creation are described as follows with the drawings, but the attached drawings are only for reference and description, and are not intended to limit this creation.

Please refer to FIG. 1 and FIG. 2 , which are a combined cross-sectional view and an application schematic diagram of the heat dissipation device with the shock-proof and heat-conducting structure of the present invention, respectively. The present invention is a heat dissipation device 1 with an anti-vibration heat-conducting structure, including a shock-proof heat-conducting structure 10 and a heat-conducting body 20 . The shock-proof and thermally conductive structure 10 includes a thermally conductive base 11 , a thermal diffusion plate 12 and a thermal interface material 13 . The heat-conducting body 20 is combined with the anti-vibration heat-conducting structure 10 to form the heat-dissipating device 1 , so as to dissipate heat from a heating element 2 . It should be noted that the heating element 2 is not particularly limited, and can be set as a central processing unit (CPU, Central Processing Unit), a microprocessor (MPU, Microprocessor Unit), or a graphics processing unit (Graphics Processing Unit; GPU), etc. Electronic component.

The heat-conducting base 11 has a heat-absorbing side 111 and a heat-releasing side 112 opposite to each other, and the heat-absorbing side 111 is recessed with an accommodating groove 110 . In addition, the thermal conductor 20 is thermally conductively connected to the heat dissipation side 112 and combined with the thermally conductive base 11 .

The heat diffusion plate 12 is movably disposed in the accommodating groove 110 . The heat diffusion plate 12 has an opposite inner conductive surface 121 and an outer conductive surface 122 . The inner conducting surface 121 is thermally connected to the thermally conductive base 11 and maintains a straight gap V with the inner wall surface of the accommodating groove 110 . In addition, the outer conductive contact surface 122 is thermally conductively connected to the heating element 2 .

Specifically, the heat-conducting base 11 and the heat-diffusion plate 12 are heat-conducting structures composed of solid copper plates, solid aluminum plates, temperature equalizing plates or flat heat pipes.

Furthermore, the thermal interface material 13 is filled in the vertical gap V between the inner conductive surface 121 and the accommodating groove 110 , so that the thermal diffusion plate 12 and the thermally conductive base 11 pass through the heat. The setting of the interface material 13 prevents collision under the action of an external force. Specifically, the size of the vertical gap V is 0.5 mm to 1.0 mm.

In other words, when an external force acts on the thermal diffusion plate 12 or the thermally conductive base 11 to cause relative displacement between the thermal diffusion plate 12 and the thermally conductive base 11 , the thermal interface material 13 can serve as the thermal diffusion plate Buffer medium between 12 and the thermally conductive base 11 . Accordingly, when the shock-proof and heat-conducting structure 10 is subjected to an external force, although the heat-diffusion plate 12 and the heat-conducting base 11 are displaced relative to each other, the heating element 2 will not be affected and shaken, so that the shock-proof heat-conducting structure 10 will not be shaken. It has a shock-proof effect to avoid damage due to vibration and maintain the normal operation and reliability of the heating element 2 .

It should be noted that the thermal interface material 13 must have good thermal conductivity, such as thermally conductive materials such as thermally conductive paste or thermally conductive silicone, so as to reduce the thermal resistance between the thermal diffusion plate 12 and the thermally conductive base 11 . Accordingly, the heat generated by the heating element 2 is firstly conducted to the thermal diffusion plate 12 , and then effectively transferred to the thermally conductive base 11 through the thermal interface material 13 .

Accordingly, the heat generated by the heating element 2 during operation will be conducted to the thermal diffusion plate 12 , and then transferred to the thermally conductive base 11 through the thermal interface material 13 , and then conducted from the thermally conductive base 11 to the thermally conductive base 11 . body 20 , and finally escape through the heat conducting body 20 . In addition, it should be noted that the implementation of the thermal conductor 20 is not particularly limited, and it can be configured as an aluminum extruded heat sink or a set of heat dissipation fins.

Please also refer to FIG. 3 , which is a combined cross-sectional view of another embodiment of the heat dissipation device with the shock-proof and heat-conducting structure of the present invention. Compared with the previous embodiment, the present embodiment is substantially the same, and the difference lies in In the shock-proof and heat-conducting structure 10 of this embodiment, at least one deformation space 30 connected to the vertical gap V is recessed on the inner wall surface of the accommodating groove 110 . The at least one deformation space 30 is used for accommodating excess thermal interface material 13 or deformed thermal interface material 13 .

In more detail, the deformation space 30 is provided as a plurality of grooves, and the deformation space 30 is provided on the inner wall surface of the accommodating groove 110 facing the inner conductive surface 121 of the thermal diffusion plate 12 .

Please refer to FIG. 4 again, which is a combined cross-sectional view of another embodiment of the heat dissipation device with the shock-proof and heat-conducting structure of the present invention. Compared with the embodiment of FIG. 1 , the present embodiment is substantially the same as the embodiment of FIG. 1 , except that the shock-proof heat-conducting structure 10 of the present embodiment further includes an elastic element 40 connected between the heat-conducting base 11 and the heat diffusion plate 12 . One end of the elastic element 40 is connected to the inner wall surface of the accommodating groove 110 , and the other end is connected to the inner conducting surface 121 of the thermal diffusion plate 12 .

Specifically, the elastic element 40 includes a screw element 41 and a spring 42 . The screw element 41 is a screw locked on the inner wall of the accommodating slot 110 . One end of the spring 42 is connected to the screw element 41 , and the other end is welded to the inner conductive surface 121 of the heat diffusion plate 12 . superior.

Accordingly, the shock-proof and heat-conducting structure 10 increases the buffer force between the heat-conducting base 11 and the heat-diffusion plate 12 through the arrangement of the elastic element 40 , so as to avoid external force between the heat-conducting base 11 and the heat-diffusion plate 12 . A large relative displacement is caused between, thereby increasing the shockproof effect of the thermally conductive structure 1 .

The above descriptions are only the preferred embodiments of this creation, and are not used to define the patent scope of this creation. Other equivalent changes using the patent spirit of this creation shall all belong to the patent scope of this creation.

1: heat sink

10: Shockproof and thermally conductive structure

11: Thermal base

110: accommodating slot

111: Endothermic side

112: Exothermic side

12: Thermal diffusion plate

121: Inner guide junction

122: External lead junction

13: Thermal Interface Materials

20: Thermal conductor

V: vertical clearance

Claims (9)

An anti-vibration heat-conducting structure, comprising: a heat-conducting base having a heat-absorbing side and a heat-releasing side opposite to each other, the heat-absorbing side is concavely provided with an accommodating groove; The heat diffusion plate has an opposite inner conductive surface and an outer conductive surface, the inner conductive surface is thermally conductively connected to the heat conduction base and maintains a straight gap with the inner wall surface of the accommodating groove, and the outer conductive surface is connected to the heat conduction base. The surface is thermally conductively connected to a heating element; and a thermal interface material is filled in the straight gap between the inner conductive surface and the accommodating groove, so that the thermal diffusion plate and the thermally conductive base can pass through The thermal interface material is arranged so as not to collide under the action of an external force. The shock-proof and heat-conducting structure according to claim 1, wherein the heat-conducting base and the heat-diffusion plate are composed of solid copper plate, solid aluminum plate, uniform temperature plate or flat heat pipe. The shockproof and thermally conductive structure according to claim 1, wherein the thermal interface material is thermally conductive paste or thermally conductive silicone. The shock-proof and heat-conducting structure according to claim 1, wherein the size of the vertical gap is 0.5mm to 1.0mm. The anti-vibration heat-conducting structure as claimed in claim 1, wherein the inner wall surface of the accommodating groove is concavely provided with at least one deformation space communicating with the vertical gap. The anti-vibration heat-conducting structure according to claim 1, further comprising an elastic element connected between the heat-conducting base and the heat diffusion plate, one end of the elastic element is connected to the inner wall surface of the accommodating groove, and the other end is connected to the The inner conductive surface of the thermal diffusion plate. The anti-vibration heat-conducting structure according to claim 6, wherein the elastic element comprises a screw element and a spring, the screw element is locked on the inner wall of the accommodating groove, one end of the spring is connected to the screw element, and the other end of the spring is connected to the screw element. One end is welded on the inner conducting surface of the heat diffusion plate. The anti-vibration heat-conducting structure according to claim 7, wherein the screw element is a screw. A heat dissipation device with an anti-vibration and heat-conducting structure, comprising: the anti-vibration and heat-conducting structure according to any one of claims 1 to 8;

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