TW202121965A - Anti-vibration and heat dissipation structure of memory slot for easily checking and repairing memory modules for Small Outline Dual In-Line Memory module (SO-DIMM) socket - Google Patents

Abstract

The present invention provides an anti-vibration and heat dissipation structure for memory slot, which includes a circuit board, heat dissipation pads, and a heat dissipation shell. The surface of the circuit board is configured with a plurality of memory slots for insertion of a plurality of memory modules. The plurality of heat dissipation pads are disposed on the upper and lower surfaces of the memory modules, so the heat generated by the memory modules may be upwardly transmitted through the heat dissipation pads and conducted to the uppermost heat dissipation pad through the structure cross-stacked by the plurality of memory modules and the heat dissipation pads. The heat dissipation shell is provided with a maintenance window and a cover plate disposed on the maintenance window. The bottom of the cover plate is abutted against the uppermost heat dissipation pad to form a vertically position-limiting and anti-vibration structure and conduct the heat generated by the memory modules to the heat dissipation shell through the cover plate for heat dissipation. Furthermore, the maintenance window may be used for easily checking and repairing the memory modules.

Description

Anti-vibration and heat dissipation structure of memory slot

The present invention provides an anti-vibration and heat dissipation structure for a memory slot, in particular, a heat generated by a plurality of memory modules is conducted to a heat dissipation shell through a cover plate for heat dissipation, and at the same time, the memory module can be easily inspected and repaired through a maintenance window. The purpose.

According to the fact that the current electronic technology is growing at a rapid rate of innovation, and various types of computer equipment such as personal computers (PC), notebook computers or tablet computers exist in every corner, moving towards the direction of strong computing power and compact size. With the open architecture of computer equipment and the standardization of software and hardware, supplemented by the continuous expansion and upgrade of functions, industrial computers suitable for various patent fields were born. The main applications of industrial computers include industrial control/automation equipment, and networks. And communication equipment, image detection and identification and intelligent transportation system. Going to a higher level, it can also be used in military, transportation, and aerospace fields that require high reliability and stability. Industrial computers must meet specific specifications and perform various high-efficiency in harsh environments. Requirements for operation.

Furthermore, industrial computers still include single board computers (SBC), embedded computer modules (Computer On Module, COM), and backplane modules (Back Plane Module, BPM), among which embedded computer modules (COM) is equipped with heat source components (CPU), chipset (Chipset), input/output ports (I/O Port) and built-in power input (Power Supply), and integrates all system interfaces through memory modules and hard disk drives And design functions, providing a plug-and-play (PNP) hardware platform and additional function expansion slots, and the size is smaller than the personal computer motherboard, so that the embedded computer module can be used in a variety of fixed and mobile embedded systems and It is more flexible in industrial applications. However, due to the small size and fast operating speed of the embedded computer module, the heat accumulated is more than that of a normal motherboard, and a good heat dissipation structure is required.

Generally, the Small Outline Dual In-line Memory Module Socket (SO-DIMM Socket) is often used in industrial computers or military-regulated computers with limited space. The environmental shock resistance and heat dissipation requirements are more stringent than the general computer usage conditions. How to develop a structural design for the SO-DIMM Socket structure for shock resistance and heat dissipation, and easy maintenance when the memory module fails. This is the subject of the invention.

Therefore, in view of the above-mentioned conventional problems and deficiencies, the inventor collected relevant information through multiple evaluations and considerations, and used years of research and development experience engaged in this industry to make continuous trials and modifications. The invention patent for heat dissipation structure was born.

The main purpose of the present invention is to provide a memory slot anti-vibration and heat dissipation structure, which includes a circuit board, a heat dissipating pad and a heat dissipating shell. The surface of the circuit board is provided with a plurality of memory slots for inserting a plurality of memory modules; The plurality of heat-dissipating pads are arranged on the upper and lower surfaces of the memory modules, so that the heat generated by the heat-generating chip and the memory modules go upwards through the heat-dissipating pads Transfer through a plurality of layers of the memory module and the heat-dissipating gasket overlapping structure to the heat-dissipating gasket of the uppermost layer. The heat-dissipating shell has a maintenance window and a cover plate arranged on the maintenance window, and the bottom surface of the cover plate is against The heat dissipating gasket held on the uppermost layer forms a vertical limit and anti-vibration structure, and conducts the heat generated by the memory modules to the heat dissipating shell through the cover plate for heat dissipation, and at the same time reaches the memory through the maintenance window The body module is easy for overhaul purposes.

The secondary objective of the present invention is to extend downwards on two opposite sides of the cover plate with a limit cantilever, and the limit cantilevers are used to resist and limit the outer side of a rotating arm provided on the two sides of the memory slots. A horizontal limit structure for the memory modules and the heat dissipation pads is formed.

Another object of the present invention is that the heat dissipation housing is recessed with at least one positioning groove on the periphery of the maintenance window, the positioning groove is provided with at least one fixing hole, and the positioning groove is used for fixing a corresponding one of the cover plates. The convex piece is positioned, and the fixing convex piece is provided with at least one through hole for a fixing member to pass through and be fixed in the fixing hole of the positioning groove to form a fixing structure of the cover plate and the heat dissipation housing.

Another object of the present invention is that the memory slots are arranged on the circuit board in an obliquely stacked structure.

1.‧‧Circuit board

11‧‧‧Memory Module

12‧‧‧Memory slot

121‧‧‧Swivel arm

13‧‧‧Heating chip

2‧‧‧Thermal Gasket

3‧‧‧Radiating shell

30‧‧‧Maintenance window

31‧‧‧Cover plate

310‧‧‧Perforation

311‧‧‧Limiting Cantilever

312‧‧‧Fixed tab

313‧‧‧Fixture

32‧‧‧Locating slot

320‧‧‧Fixed hole

33‧‧‧Thermal element

34‧‧‧Thermal paste

The first figure is a perspective view of the present invention.

The second figure is a three-dimensional exploded structure diagram of the present invention.

The third figure is another three-dimensional exploded structural view of the present invention.

The fourth figure is a three-dimensional cross-sectional structure diagram of the present invention.

In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are illustrated in detail below to illustrate the structure and function of the preferred embodiment of the present invention for a complete understanding.

Please refer to Figures 1 to 4, each of which is a three-dimensional appearance view, a three-dimensional exploded structure view, another three-dimensional exploded structure view, and a three-dimensional cross-sectional structure view of the present invention. From the figures, it can be seen that the memory slot of the present invention is shock-resistant The heat dissipation structure includes a circuit board 1, a heat dissipation pad 2 and a heat dissipation housing 3. The detailed structure and connection relationship of each component are explained as follows:

The surface of the circuit board 1 is provided with a plurality of memory slots 12 for inserting a plurality of memory modules 11, the memory slots 12 are in a stacked structure, and the memory module 11 refers to a small double In-line memory module (Small Outline Dual In-line Memory Module, SO-DIMM), and the circuit board 1 is provided with at least one heating chip 13 on one side of the memory slots 12.

The memory slots 12 are arranged on the circuit board 1 in an obliquely stacked structure.

The heat-dissipating pads 2 are provided on the upper surfaces of the memory modules 11 and the heating chip 13, so that the heat generated by the memory modules 11 is transferred upwards through the heat-dissipating pads 2 and through multiple layers of the memory The overlapping structure of the module 11 and the heat dissipation pad 2 is conducted to the uppermost heat dissipation pad 2, and the heat dissipation pad 2 is made of a material with cushioning and shock absorption.

The heat dissipation housing 3 is assembled above the circuit board 1, the heat dissipation housing 3 is provided with a maintenance window 30 corresponding to the memory modules 11, and the heat dissipation housing 3 corresponds to the The maintenance window 30 is assembled with a cover plate 31. The bottom surface of the cover plate 31 abuts the heat dissipation pad 2 of the uppermost layer to form a vertical limit and shock-proof structure, and the heat generated by the memory modules 11 is passed through the cover plate 31 Conducted to the heat dissipation housing 3 for heat dissipation.

Two opposite sides of the cover plate 31 each extend downwards with a limit cantilever 311, the limit cantilevers 311 are used to resist and limit the outer side of a rotating arm 121 provided on the two sides of the memory slots 12 to form a pair of The horizontal limit structure of the memory modules 11 and the heat dissipation pads 2.

The heat dissipation housing 3 is recessed with at least one positioning groove 32 at the periphery of the maintenance window 30. The positioning groove 32 is provided with at least one fixing hole 320, and the positioning groove 32 is used for fixing a corresponding one of the cover plate 31 The protrusion 312 is positioned, and the fixing protrusion 312 is provided with at least one through hole 310 for a fixing member 313 to pass through and to be fixed in the fixing hole 320 of the positioning groove 32 to form the cover plate 31 and the heat sink. The fixed structure of the housing 3.

A heat-conducting element 33 is further provided on the bottom surface of the heat-dissipating housing 3 where the heat-generating chip 13 is supposed to be. The heat-conducting element 33 is made of a metal block that is easy to conduct heat. A heat dissipating paste 34 or a phase change material (PCM) above 13 is used to form a thermal conduction and anti-vibration structure between the heating chip 13 and the heat dissipating shell 3.

To assemble and use the anti-vibration and heat dissipation structure of the memory slot of the present invention, firstly, a plurality of heat dissipation pads 2 are pasted on the upper and lower surfaces of the plurality of memory modules 11, and then the memory modules 11 are inserted. After placing the memory sockets 12 on the circuit board 1, rotate the arms on both sides of the memory socket 12 from a vertical position to a horizontal position to form the memory modules 11 and the The fixing structure of the memory slots 12, at this time the memory modules The upper surface of 11 is a stepped structure with an upward slope, and the heat dissipation pad 2 above the lowermost memory module 11 is close to the lower surface of the upper adjacent memory module 11. This structure can be used to fill the The gaps between the memory modules 11 achieve a structure that closely conducts heat, and the heat generated by the memory modules 11 is transferred upwards through the heat dissipation pad 2, through a plurality of layers of the memory modules 11 and the heat dissipation The overlapped structure of the gasket 2 is conducted to the heat-dissipating gasket 2 of the uppermost layer, and then the heat-dissipating shell 3 is assembled above the circuit board 1. The bottom surface of the cover plate 31 of the heat-dissipating shell 3 abuts against the uppermost layer of the heat dissipation gasket 2. The heat dissipation gasket 2 forms a vertical limit and anti-vibration structure, and conducts the heat generated by the memory modules 11 to the heat dissipation housing 3 through the cover plate 31 for heat dissipation, and utilizes the two limit cantilevers of the cover plate 31 The 311 resisting limit is located outside the two rotating arms 121 of the memory slots 12 to form a horizontal limit structure for the memory modules 11 and the heat dissipation pads 2 and at the same time pass through the heat dissipation shell 3 The maintenance window 30 achieves the purpose of easy maintenance of the memory module 11, and the heat-generating chip 13 arranged on the circuit board 1 is dissipated by the heat-conducting element 33 on the bottom surface of the heat-dissipating housing 3 and resisting the heat-generating chip 13 The paste 34 or a phase change material is used to form the heat conduction and anti-vibration structure between the heating chip 13 and the heat dissipation shell 3.

From the disclosure of the first to fourth figures above, it can be understood that the present invention is an anti-vibration and heat dissipation structure of a memory slot, which mainly includes a circuit board, a heat dissipation pad and a heat dissipation shell. The surface of the circuit board is provided with a plurality of A plurality of memory slots into which a memory module is inserted; the plurality of heat dissipation pads are arranged on the upper and lower surfaces of the memory modules, so that the heat generated by the memory modules is transferred upward through the heat dissipation pads, Through the overlap structure of the memory module and the heat dissipating pad, the heat dissipating shell is provided with a maintenance window and a cover plate arranged on the maintenance window, and the bottom surface of the cover plate is against The heat dissipation gasket on the top layer forms a vertical limit and anti-vibration junction The heat generated by the memory modules is transferred to the heat dissipation shell through the cover plate to dissipate heat, and at the same time, the memory module can be easily inspected and repaired through the repair window. However, it has excellent practicability in the field of industrial computers or military-regulated computers, so a patent application is filed to seek patent protection.

The above detailed description is only for a preferred and feasible embodiment of the present invention, but the embodiment is not intended to limit the scope of the patent application of the present invention. All other equal changes and modifications made without departing from the spirit of the technique disclosed in the present invention All changes shall be included in the scope of patent covered by the present invention.

In summary, the above-mentioned anti-vibration and heat dissipation structure of the memory slot of the present invention can indeed achieve its effects and purposes when in use. Therefore, the present invention is truly an invention with excellent practicability and meets the requirements of an invention patent application. The application is filed in accordance with the law, and I hope that the review committee will grant this case as soon as possible to protect the inventor's hard-working invention. If the Bureau has any doubts, please feel free to write instructions. The inventor will do his best to cooperate and feel good.

1.‧‧Circuit board

11‧‧‧Memory Module

12‧‧‧Memory slot

121‧‧‧Swivel arm

13‧‧‧Heating chip

2‧‧‧Thermal Gasket

3‧‧‧Radiating shell

30‧‧‧Maintenance window

31‧‧‧Cover plate

310‧‧‧Perforation

311‧‧‧Limiting Cantilever

312‧‧‧Fixed tab

313‧‧‧Fixture

32‧‧‧Locating slot

320‧‧‧Fixed hole

Claims (7)

An anti-vibration and heat dissipation structure for a memory slot, including: A circuit board, on the surface of which is provided with a plurality of memory slots for inserting a plurality of memory modules, and the memory slots are in a stacked structure; A plurality of heat dissipating pads are arranged on the upper and lower surfaces of the memory modules so that the heat generated by the memory modules is transferred upwards through the heat dissipating pads, and crosses between the memory modules and the heat dissipating pads through a plurality of layers Stacked structure, conducted to the uppermost layer of the heat-dissipating pad; and A heat dissipation housing is assembled above the circuit board. The heat dissipation housing is provided with a maintenance window corresponding to the memory modules, and the heat dissipation housing is assembled with a cover plate corresponding to the maintenance window. The bottom surface of the cover plate The heat-dissipating gasket resists the uppermost layer to form a vertical limit and anti-vibration structure, and conducts the heat generated by the memory modules to the heat-dissipating shell through the cover plate for heat dissipation. As for the anti-vibration and heat dissipation structure of the memory slot described in the first item of the patent application, the two opposite sides of the cover plate each extend downwardly with a limit cantilever, and the limit cantilevers are used to resist and limit the memory The two sides of the body slot are provided with an outer side of the rotating arm to form a horizontal limit structure for the memory modules, the heating chip and the heat dissipation pads. According to the anti-vibration and heat dissipation structure of the memory slot described in the first item of the scope of patent application, the heat dissipation housing is recessed with at least one positioning groove on the periphery of the maintenance window, and at least one fixing hole is provided in the positioning groove, and the The positioning groove is for positioning the cover plate corresponding to one of the fixing protrusions, and the fixing protrusion is provided with at least one perforation for a fixing member to pass through and be fixed in the fixing hole of the positioning groove to shape The fixing structure of the cover plate and the heat dissipation shell. The anti-vibration and heat dissipation structure of the memory slot described in item 1 of the scope of patent application, wherein the At least one heating chip is arranged on one side of the memory sockets on the road board. As for the anti-vibration and heat dissipation structure of the memory slot described in item 4 of the scope of patent application, a heat-conducting element is further provided on the bottom surface of the heat-dissipating shell at the position where the chip should be heated, and the surface of the heat-conducting element is further provided to resist the heat A heat dissipating paste or a phase change material above the chip is used to form a heat conduction and anti-vibration structure between the heat generating chip and the heat dissipating shell. As for the anti-vibration and heat dissipation structure of the memory slot described in the first item of the scope of patent application, the memory module refers to a small form factor dual in-line memory module. According to the anti-vibration and heat dissipation structure of the memory socket described in the first item of the scope of patent application, the memory sockets are arranged on the circuit board in an obliquely stacked structure.

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