TWI704358B - Suitable for probe modules with multiple units to be tested with inclined conductive contacts - Google Patents
Suitable for probe modules with multiple units to be tested with inclined conductive contacts Download PDFInfo
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
一種適用於具有傾斜導電接點之多待測單元的探針模組,包含有內側面面向相反方向之第一、二探針座以及分別設於第一、二探針座之複數第一、二探針,各探針包含有一懸臂段及一點觸段,該懸臂段具有一與第一或二探針座固接之固定部,以及一連接於固定部且自第一或二探針座之內側面延伸而出之外露部,該點觸段係連接於外露部,該探針模組能定義出至少一假想探針單元分界線而劃分出複數探針單元,同一探針單元僅有第一或二探針且其點觸段末端全部位於一該假想探針單元分界線之同一側;藉此,該探針模組可同時檢測較多待測單元並避免探針干涉。A probe module suitable for multiple units to be tested with inclined conductive contacts, comprising first and second probe holders whose inner sides face opposite directions, and plural first probe holders and plural probe holders respectively arranged on the first and second probe holders. Two probes, each probe includes a cantilever section and a one-point contact section. The cantilever section has a fixed part fixed to the first or second probe holder, and a fixed part connected to the fixed part and from the first or second probe holder The inner side surface extends out of the exposed part, and the point contact section is connected to the exposed part. The probe module can define at least one imaginary probe unit dividing line to divide a plurality of probe units. The same probe unit has only The first or second probes and their point contact ends are all located on the same side of the dividing line of the imaginary probe unit; thereby, the probe module can simultaneously detect more units to be tested and avoid probe interference.
Description
本發明係與探針卡之探針模組有關,特別是關於一種適用於具有傾斜導電接點之多待測單元(multi-UUT)的探針模組。The present invention relates to the probe module of the probe card, and particularly relates to a probe module suitable for multi-UUT with inclined conductive contacts.
請參閱圖1,其中顯示一具有傾斜導電接點之待測單元10(unit under test;簡稱UUT),該待測單元10可為未封裝之晶片(die)或已封裝之晶片(chip),該待測單元10具有排成一或多行之複數用於輸出訊號之第一導電接點11,以及排成一行之複數用於輸入訊號之第二導電接點12,例如圖1所示之待測單元10具有由其一基板13之一第一長邊131朝向一第二長邊132排列之三行第一導電接點11,以及沿該基板13之第二長邊132設置的一行第二導電接點12,該等第一、二導電接點11、12排成多列,每一列之排列方向係實質上平行於一垂直於第一、二長邊131、132之假想分界軸線L,且靠近該假想分界軸線L之列,例如圖1中一中間區塊14所包含者,其中之第一、二導電接點11、12的長邊111、121係實質上平行於該假想分界軸線L,而距離該假想分界軸線L較遠之列的第一、二導電接點11、12則為傾斜導電接點,其較靠近基板13第一長邊131之一端亦較靠近該假想分界軸線L,較遠離基板13第一長邊131之一端則亦較遠離該假想分界軸線L,亦即傾斜導電接點以圖1之方向來看是由上而下且由內而外地傾斜,且距離該假想分界軸線L越遠之第一、二導電接點11、12相對於該假想分界軸線L之角度越大,例如圖1中二外側區塊15、16所包含之第一、二導電接點11、12之長邊111、121相對於該假想分界軸線L之角度θ1、θ2最大。Please refer to FIG. 1, which shows a unit under test (UUT) with inclined conductive contacts. The unit under
前述之待測單元10可利用具有懸臂式探針的探針卡進行檢測,為簡化圖式,圖1中僅示意性地顯示一對應最左邊之第二導電接點12的探針17,實際上每一導電接點11、12皆對應一探針,該探針17之懸臂段171可自一位於該待測單元10之第二長邊132外側上方的探針座18延伸至導電接點12上方,使得探針17之一自其懸臂段171末端向下延伸的點觸段(圖中未示)可點觸對應之導電接點12。The aforementioned unit under
然而,由於該待測單元10具有傾斜角度不一致之傾斜導電接點,其檢測所需之探針難以配置於探針座上,尤其對於多待測單元之檢測,亦即同時檢測至少二該待測單元10,將會有探針17相互干涉之疑慮。甚至,為了提升檢測效率,可能必須以同一探針卡同時檢測四個、六個、八個或更多待測單元10,更容易產生探針17相互干涉之問題。However, because the unit under
有鑑於上述缺失,本發明之主要目的在於提供一種探針模組,係適用於類同上述之具有傾斜導電接點之多待測單元的檢測而可避免探針相互干涉,且可同時檢測較多待測單元而可產生較高的檢測效率。In view of the above-mentioned deficiencies, the main purpose of the present invention is to provide a probe module, which is suitable for the detection of multiple units under test with inclined conductive contacts similar to the above-mentioned, so as to avoid the interference of the probes and simultaneously detect relatively Multiple units to be tested can produce higher detection efficiency.
為達成上述目的,本發明所提供之探針模組係用以同時檢測至少一第一待測單元及至少一第二待測單元,各該第一待測單元及第二待測單元具有排成至少一行之複數導電接點。該探針模組包含有一第一探針座、一第二探針座以及複數探針。該第一探針座及該第二探針座分別具有一內側面,該第一探針座之內側面與該第二探針座之內側面實質上面向相反方向。該等探針中包含設置於該第一探針座之複數第一探針以及設置於該第二探針座之複數第二探針,各該探針包含有一懸臂段及一點觸段,各該第一探針之懸臂段具有一與該第一探針座固接之固定部,以及一連接於該固定部且自該第一探針座之內側面延伸而出之外露部,各該第二探針之懸臂段具有一與該第二探針座固接之固定部,以及一連接於該固定部且自該第二探針座之內側面延伸而出之外露部,各該探針之點觸段係連接於該外露部。該探針模組能定義出至少一假想探針單元分界線,該等探針係由該至少一假想探針單元分界線劃分成複數探針單元,同一探針單元僅包含有第一探針或者僅包含有第二探針,且同一探針單元之探針的點觸段末端全部位於一該假想探針單元分界線之同一側。當該探針模組檢測該等第一待測單元及第二待測單元時,該等第一探針係全部以其點觸段點觸該至少一第一待測單元的導電接點,該等第二探針係全部以其點觸段點觸該至少一第二待測單元的導電接點。To achieve the above object, the probe module provided by the present invention is used to simultaneously detect at least one first unit to be tested and at least one second unit to be tested, each of the first unit to be tested and the second unit to be tested has a row A plurality of conductive contacts in at least one row. The probe module includes a first probe holder, a second probe holder and a plurality of probes. The first probe holder and the second probe holder respectively have an inner side surface, and the inner side surface of the first probe holder and the inner side surface of the second probe holder face substantially opposite directions. The probes include a plurality of first probes arranged on the first probe base and a plurality of second probes arranged on the second probe base, each of the probes includes a cantilever section and a point contact section, each The cantilever section of the first probe has a fixing portion fixedly connected to the first probe holder, and a exposed portion connected to the fixing portion and extending from the inner side surface of the first probe holder. The cantilever section of the second probe has a fixed portion fixedly connected to the second probe base, and a exposed portion connected to the fixed portion and extending from the inner side of the second probe base, each of the probes The touch section of the needle is connected to the exposed part. The probe module can define at least one imaginary probe unit boundary line, the probes are divided into a plurality of probe units by the at least one imaginary probe unit boundary line, and the same probe unit contains only the first probe Or only the second probe is included, and the end of the point contact segments of the probes of the same probe unit are all located on the same side of the dividing line of the imaginary probe unit. When the probe module detects the first unit to be tested and the second unit to be tested, the first probes all touch the conductive contacts of the at least one first unit to be tested with their touch segments, All of the second probes touch the conductive contacts of the at least one second unit to be tested with their touch sections.
換言之,該探針模組所點觸之第一待測單元的導電接點全部係受第一探針點觸,該探針模組所點觸之第二待測單元的導電接點全部係受第二探針點觸,亦即,同一待測單元之導電接點係受同一探針座延伸出之探針點觸,因此,在第一、二待測單元的分佈位置係很明顯地可區隔開的情況下,第一、二探針亦可對應地劃分成複數探針單元。當該探針模組檢測該等第一、二待測單元時,第一待測單元的導電接點與第二待測單元的導電接點係位於該假想探針單元分界線的不同側,亦即,本發明之探針模組主要係用以同時檢測分佈位置可由假想探針單元分界線區隔開之待測單元,如此一來,即使仍有一該第一待測單元與一該第二待測單元相鄰,其對應之探針係分別由第一、二探針座延伸而出,因此可避免探針干涉問題。本發明之探針模組特別適合用於檢測呈矩陣排列之多個待測單元,該至少一第一待測單元及該至少一第二待測單元可為其中一部分待測單元且分別位於相鄰兩列,該探針模組同時檢測該部分待測單元之後,只要移動一小段距離即可再檢測位於相鄰兩列之另一部分待測單元,藉此,該探針模組不但可同時檢測較多待測單元,亦可針對更大量之待測單元進行分次檢測而產生更高的檢測效率。In other words, the conductive contacts of the first unit under test touched by the probe module are all touched by the first probe, and all the conductive contacts of the second unit to be tested touched by the probe module are all Touched by the second probe, that is, the conductive contacts of the same unit to be tested are touched by the probes extending from the same probe holder. Therefore, the distribution positions of the first and second units to be tested are obviously In the case of being separable, the first and second probes can also be divided into plural probe units correspondingly. When the probe module detects the first and second units to be tested, the conductive contacts of the first unit to be tested and the conductive contacts of the second unit to be tested are located on different sides of the dividing line of the imaginary probe unit, That is, the probe module of the present invention is mainly used to simultaneously detect the units under test whose distribution positions can be separated by the boundary of the imaginary probe unit. In this way, even if there is still a first unit under test and a second unit under test, The two units to be tested are adjacent, and their corresponding probes extend from the first and second probe holders respectively, so that the problem of probe interference can be avoided. The probe module of the present invention is particularly suitable for detecting a plurality of units to be tested arranged in a matrix. The at least one first unit to be tested and the at least one second unit to be tested may be a part of the units to be tested and are respectively located After the probe module detects the part of the unit under test at the same time in two adjacent rows, it only needs to move a short distance to detect another part of the unit under test located in two adjacent rows, so that the probe module can not only simultaneously To detect more units to be tested, it is also possible to perform sub-tests for a larger number of units to be tested to produce higher detection efficiency.
不論同時檢測之第一、二待測單元的數量分別為一個或複數個,一該第一待測單元可與一該第二待測單元相鄰,即使各該待測單元係如同先前技術中所述之具有傾斜導電接點之待測單元,該等第一、二探針之懸臂段的外露部自第一、二探針座內側面延伸而出之方向仍可配合所對應之導電接點的延伸方向,以避免探針在點測時意外滑動至非對應的導電接點上,在此情況下,由於分別用以點觸第一、二待測單元之第一、二探針係位於假想探針單元分界線的不同側,因此可避免產生探針相互干涉之問題。Regardless of whether the number of the first and second units to be tested at the same time is one or more, a first unit to be tested can be adjacent to a second unit to be tested, even if each unit to be tested is the same as in the prior art For the unit to be tested with inclined conductive contacts, the direction in which the exposed parts of the cantilever sections of the first and second probes extend from the inner sides of the first and second probe holders can still match the corresponding conductive contacts The extension direction of the point to prevent the probe from accidentally sliding onto the non-corresponding conductive contact during point measurement. In this case, it is used to touch the first and second probes of the first and second units under test respectively. Located on different sides of the dividing line of the imaginary probe unit, the problem of mutual interference of the probes can be avoided.
有關本發明所提供之適用於具有傾斜導電接點之多待測單元的探針模組的詳細構造、特點、組裝或使用方式,將於後續的實施方式詳細說明中予以描述。然而,在本發明領域中具有通常知識者應能瞭解,該等詳細說明以及實施本發明所列舉的特定實施例,僅係用於說明本發明,並非用以限制本發明之專利申請範圍。The detailed structure, characteristics, assembly or use of the probe module provided by the present invention, which is suitable for multiple units under test with inclined conductive contacts, will be described in the detailed description of the subsequent embodiments. However, those with ordinary knowledge in the field of the present invention should be able to understand that these detailed descriptions and specific examples for implementing the present invention are only used to illustrate the present invention, and are not intended to limit the scope of the patent application of the present invention.
申請人首先在此說明,在以下將要介紹之實施例以及圖式中,相同之參考號碼,表示相同或類似之元件或其結構特徵。需注意的是,圖式中的各元件及構造為例示方便並非依據真實比例及數量繪製,且若實施上為可能,不同實施例的特徵係可以交互應用。The applicant first explains here that in the following embodiments and drawings, the same reference numbers indicate the same or similar elements or structural features. It should be noted that the various elements and structures in the drawings are for illustrative purposes and are not drawn based on actual proportions and quantities, and if possible in implementation, the features of different embodiments can be applied interactively.
請參閱圖2至圖6,本發明一第一較佳實施例所提供之探針模組20主要包含有一第一探針座21、一第二探針座22、複數第一探針30A~D,以及複數第二探針30E~H。2-6, the
各該第一、二探針30A~H係由導電材料(例如金屬)製成之直線針藉由機械加工彎曲而成,如圖6所示,各該第一、二探針30A~H包含有一懸臂段31及一點觸段32,該懸臂段31具有一與該第一探針座21或第二探針座22固接之固定部311,以及一連接於該固定部311且自該第一探針座21之一內側面211或第二探針座22之一內側面221延伸而出之外露部312。如圖2至圖5所示,部分之第一、二探針30A~H的懸臂段31未經彎折而使其固定部311與外露部312呈一直線,而另一部分之第一、二探針30A~H的懸臂段31則經由彎折而使其固定部311與外露部312非呈一直線。如圖6所示,各該第一、二探針30A~H之點觸段32係自外露部312末端向下延伸。Each of the first and
該第一探針座21及該第二探針座22係由絕緣材料(例如黑膠)製成,該第一、二探針座21、22係以其內側面211、221面向彼此之方向地設置,亦即,該第一、二探針座21、22之內側面211、221實質上面向相反方向。此外,如圖6所示,該第一、二探針座21、22通常係固定於一電路板40之底面41,使得該電路板40、該第一、二探針座21、22以及該等第一、二探針30A~H結合成一探針卡。The
在本發明之實施例中,各該第一、二探針30A~H之固定部311係位於第一或第二探針座21、22內,其固定方式係利用黑膠同時將同一針層(詳述於下文)之探針設置於探針座上的預定位置,再將黑膠烤乾而使探針固定於探針座上。然而,各該第一、二探針30A~H之固定部311亦可藉由黏膠固定於第一或第二探針座21、22之外表面。各該第一、二探針30A~H可更具有一自該第一探針座21之一外側面212或第二探針座22之一外側面222延伸而出之連接段(圖中未示),以藉由該連接段電性連接於該電路板40底面41的導電接點(圖中未示)。In the embodiment of the present invention, the
本實施例中的傾斜探針30A~H(亦即外露部312呈傾斜之第一、二探針30A~H)之固定部311包含有一與外露部312連接的內側區段311a(如圖2所示),以及一自內側區段311a延伸至探針座外側面而與前述之連接段連接之外側區段311b,該內側區段311a係與外露部312成一直線而呈傾斜,該外側區段311b則與前述之連接段成一直線且垂直於探針座之內、外側面(亦即平行於未傾斜之探針),如此之探針形成傾斜之方式,係先根據所對應之導電接點的延伸方向D2(詳述於下文)將直線針擺放於探針座上並以黑膠固定其固定部311之內側區段311a,以將探針之外露部312固定於所需之角度(亦即平行於對應之導電接點的延伸方向D2),此時探針已固定於探針座上,再彎折其固定部311而使其外側區段311b連同該連接段垂直於探針座之內、外側面,然後再以黑膠固定外側區段311b,如此之方式可利於彎折作業之進行,並可使探針之彎折角度固定良好而不易回彈。The
本發明之探針模組係用以進行多待測單元之檢測,亦即同時檢測複數待測單元,例如,如圖2所示,本實施例之探針模組20係用以同時檢測八待測單元,其中包含排成一第一列C1且位置偏向該第一探針座21之四第一待測單元50A~D,以及排成一第二列C2且位置偏向該第二探針座22之四第二待測單元50E~H。本發明之實施例中的待測單元係與先前技術中所述之待測單元10(如圖1所示)相同,惟為了更明確地描述本發明之特徵,在實施例中以不同的描述方式搭配與圖1中不同的元件標號而更進一步地說明該待測單元。The probe module of the present invention is used to detect multiple units to be tested, that is, to detect multiple units to be tested at the same time. For example, as shown in FIG. 2, the
該八待測單元中最靠近該第二探針座22之第一待測單元50D係與該八待測單元中最靠近該第一探針座21之第二待測單元50H相鄰。更明確地說,如圖3所示,各該待測單元50A~H之一上表面56具有朝向相反方向之第一、二主邊緣51、52(通常為長邊)、連接第一、二主邊緣51、52且朝向相反方向之第一、二側邊緣53、54(通常為短邊),以及複數導電接點55,該第一待測單元50D之第二主邊緣52與第二側邊緣54的相交點係與該第二待測單元50H之第一主邊緣51與第一側邊緣53的相交點相鄰。當該探針模組20檢測該等待測單元50A~H時,該第一探針座21係位於該第一待測單元50A之第一主邊緣51的外側上方,該第二探針座22係位於該第二待測單元50E之第二主邊緣52的外側上方,換言之,各該待測單元50A~H之第一主邊緣51係較第二主邊緣52更靠近該第一探針座21,各該待測單元50A~H之第二主邊緣52係較第一主邊緣51更靠近該第二探針座22,該探針模組20係整體(連同前述之電路板40)向下移動,進而以該等第一、二探針30A~H之點觸段32末端點觸該等待測單元50A~H之導電接點55。The first unit under
在此須先說明的是,本實施例之待測單元50A~H分別具有排成多行之導電接點,其中包含靠近第一主邊緣51之多行用於輸出訊號的導電接點,以及沿著第二主邊緣52設置之一行用於輸入訊號的導電接點55。本實施例之探針模組20主要僅對該行用於輸入訊號的導電接點55進行檢測,更明確地說,當該探針模組20檢測該等第一、二待測單元50A~H時,該等第一探針30A~D僅點觸各該第一待測單元50A~D之距離該第一探針座21最遠的該行導電接點55,該等第二探針30E~H僅點觸各該第二待測單元50E~H之距離該第二探針座22最近的該行導電接點55,因此,本發明之圖式中僅對該行導電接點提供標號55,其他導電接點則未標號,下文中僅以導電接點55為代表而對導電接點進一步描述,其他導電接點之形狀及配置則類同於導電接點55。It should be noted here that the units under
此外,本發明係將第一、二探針30A~H之點觸方向D1(如圖6所示)定義為向下,並以此為基準描述其他特徵之方向性(例如上、下、頂、底等用語),例如,前述各該待測單元50A~H設有導電接點55之該上表面56即為面向該點觸方向D1之相反方向的表面,前述該電路板40固設第一、二探針座21、22之該底面41即為面向該點觸方向D1之表面。然而,前述之方向性只是描述各特徵是趨於該點觸方向D1(例如向下)或該點觸方向D1之相反方向(例如向上),而非毫無誤差地符合該點觸方向D1或該點觸方向D1之相反方向,例如,前述各該第一、二探針30A~H之點觸段32係自外露部312末端向下延伸,其意思可包含該點觸段32係朝該點觸方向D1延伸,或者,該點觸段32係如圖6所示地趨於該點觸方向D1地相對該點觸方向D1呈傾斜。In addition, the present invention defines the touch direction D1 of the first and
在各該待測單元50A~H中,各該導電接點55具有一朝向該第一主邊緣51之第一端551以及一朝向該第二主邊緣52之第二端552,為簡化圖式,僅在圖3中的三導電接點55上標示出其第一端551及第二端552,各該導電接點55能定義出一自其第一端551往第二端552之延伸方向D2。在本實施例中,各該待測單元50A~H能定義出一假想分界軸線A1(如圖2所示),各該待測單元50A~H之假想分界軸線A1與第一側邊緣53之間的導電接點55之延伸方向D2係平行於該假想分界軸線A1(例如位於圖4所標示之中間區塊57的導電接點55)或朝該第一側邊緣53靠近地相對於該假想分界軸線A1呈傾斜(例如位於圖4所標示之左側區塊58的導電接點55),各該待測單元50A~H之假想分界軸線A1與第二側邊緣54之間的導電接點55之延伸方向D2係平行於該假想分界軸線A1(例如位於圖4所標示之中間區塊57的導電接點55)或朝該第二側邊緣54靠近地相對於該假想分界軸線A1呈傾斜(例如位於圖4所標示之右側區塊59的導電接點55)。更明確地說,在該假想分界軸線A1附近的導電接點55(位於中間區塊57的導電接點55)之延伸方向D2係平行於該假想分界軸線A1,距離該假想分界軸線A1越遠的導電接點55,其相對於該假想分界軸線A1傾斜的程度越大。In each of the units under
本實施例之探針模組20能定義出一假想探針單元分界線A2(如圖2所示),該第一探針座21及該等第一探針30A~D大部分都位於該假想探針單元分界線A2之一第一側(左側),且該等第一探針30A~D之點觸段32末端全部位於該假想探針單元分界線A2之第一側,用以點觸該等第一待測單元50A~D之導電接點55;該第二探針座22及該等第二探針30E~H大部分都位於該假想探針單元分界線A2之一第二側(右側),且該等第二探針30E~H之點觸段32末端全部位於該假想探針單元分界線A2之第二側,用以點觸該等第二待測單元50E~H的導電接點55。The
如圖2至圖6所示,該等第一探針30A~D係以實質上對應該等第一待測單元50A~D之導電接點55的排列方式排成四行而在該第一探針座21形成不同高度之第一至第四針層L11~L14,同一針層之第一探針30A~D係延伸至同一行導電接點55,更明確地說,同一針層之第一探針30A~D的點觸段22末端與該第一探針座21之內側面211的垂直距離可實質上相同,但不一定要很準確地相同,只要可用以點觸同一行導電接點即可。該第一探針座21之第一至第四針層L11~L14係由下而上依序設置,位置越高之針層的第一探針之懸臂段31越長且點觸段32末端與該第一探針座21之內側面211的距離越遠,用以點觸距離該第一探針座21越遠之第一待測單元的50A~D導電接點55,亦即,該第一至第四針層L11~L14係分別對應該等第一待測單元50A~D,當該探針模組20檢測該等待測單元50A~H時,該第一針層L11之第一探針30A係以其懸臂段31經過該第一待測單元50A之第一主邊緣51上方而分別延伸至該第一待測單元50A之導電接點55上方(如圖2所示),進而以其點觸段32分別點觸該第一待測單元50A之導電接點55,該第二針層L12之第一探針30B係以其懸臂段31經過第一待測單元50A之第一、二主邊緣51、52及第一待測單元50B之第一主邊緣51上方而分別延伸至該第一待測單元50B之導電接點55上方(如圖3所示),進而以其點觸段分別點觸該第一待測單元50B之導電接點55,以此類推。As shown in FIGS. 2 to 6, the
同樣地,該等第二探針30E~H係以實質上對應該等第二待測單元50E~H之導電接點55的排列方式排成四行而在該第二探針座22形成不同高度之第一至第四針層L21~L24,同一針層之第二探針30E~H係延伸至同一行導電接點55,更明確地說,同一針層之第二探針30E~H的點觸段32末端與該第二探針座22之內側面221的垂直距離(例如圖6所示之垂直距離d為第一針層L21之第二探針30E的點觸段32末端與該第二探針座22之內側面221的垂直距離)可實質上相同,但不一定要很準確地相同,只要可用以點觸同一行導電接點即可。該第二探針座22之第一至第四針層L21~L24係由下而上依序設置,位置越高之針層的第二探針30E~H之懸臂段31越長且點觸段32末端與該第二探針座22之內側面221的距離越遠,用以點觸距離該第二探針座22越遠之第二待測單元50E~H的導電接點55,亦即,該第一至第四針層L21~L24係分別對應該等第二待測單元50E~H,當該探針模組20檢測該等待測單元50A~H時,該第一針層L21之第二探針30E係以其懸臂段31經過第二待測單元50E之第二主邊緣52上方而分別延伸至該第二待測單元50E之導電接點55上方(如圖2所示),進而以其點觸段32分別點觸該第二待測單元50E之導電接點55,該第二針層L22之第二探針30F係以其懸臂段31經過第二待測單元50E之第一、二主邊緣51、52及第二待測單元50F之第二主邊緣52上方而分別延伸至該第二待測單元50F之導電接點55上方(如圖3所示),進而以其點觸段32分別點觸該第二待測單元50F之導電接點55,以此類推。Similarly, the
在本實施例中,各該第一、二探針30A~H之外露部312自探針座21、22延伸而出之方向係實質上對應其所屬第一、二探針30A~H將點觸之導電接點55的延伸方向D2,此處所稱「實質上對應」,係指外露部312自探針座21、22延伸而出之方向不一定要與對應之導電接點55的延伸方向D2相同或相反,而是從上往下看時(亦即圖2至圖5之方向),外露部312係概與其對應之導電接點55的延伸方向D2平行,如此可避免第一、二探針30A~H之點觸段32在進行點觸時偏離至對應的導電接點55之外而產生點觸不確實之問題。換言之,該等第一、二探針30A~H之外露部312的傾斜角度配置係類同於該等導電接點55之傾斜角度配置。In this embodiment, the direction in which the exposed
詳而言之,如圖2所示,該等第一探針30A~D針能定義出一垂直於該第一探針座21之內側面211的第一假想分界線A3(與第一待測單元50A~D之假想分界軸線A1重合),該等第一探針30A~D之外露部312自該內側面211延伸而出之方向係平行於該第一假想分界線A3(例如對應圖4所標示之中間區塊57的第一探針30A~D)或逐漸遠離該第一假想分界線A3地相對於該第一假想分界線A3呈傾斜(例如對應圖4所標示之左、右側區塊58、59的第一探針30A~D)。同樣地,該等第二探針30E~H能定義出一垂直於該第二探針座22之內側面221的第二假想分界線A4(與第二待測單元50E~H之假想分界軸線A1重合),該等第二探針30E~H之外露部312自該內側面221延伸而出之方向係平行於該第二假想分界線A4(例如對應圖4所標示之中間區塊57的第二探針30E~H)或朝該第二假想分界線A4靠近地相對於該第二假想分界線A4呈傾斜(例如對應圖4所標示之左、右側區塊58、59的第二探針30E~H)。In detail, as shown in FIG. 2, the
藉由本發明之探針模組的探針配置,可在將如此繁多之探針以適當間距配置於探針座的前提下,仍可達到前述之確保探針點觸確實之功效。此外,在本實施例中,該等第一、二探針30A~H之固定部311的外側區段311b係實質上相互平行,如此係較方便於將探針配置於探針座;然而,藉由本發明之探針模組的探針配置,亦可便於將固定部311與外露部312實質上呈一直線之探針(亦即傾斜探針係在固定部與外露部的連接點彎折,其固定部未分成內、外側區段而是整體同一方向)配置於探針座,如此更可簡化探針之彎折加工程序。With the probe configuration of the probe module of the present invention, under the premise that so many probes are arranged in the probe holder at an appropriate interval, the aforementioned effect of ensuring the touch of the probe can still be achieved. In addition, in this embodiment, the
更重要的是,本發明之探針模組可用以同時檢測較多待測單元,且特別適合用於檢測呈矩陣排列之多個待測單元,該等第一、二待測單元可為其中一部分待測單元且分別位於相鄰兩列,該探針模組同時檢測該部分待測單元之後,只要移動一小段距離即可再檢測位於相鄰兩列之另一部分待測單元。以本實施例之探針模組20及待測單元50A~H為例,並以圖2至5之方向來看,該第一待測單元50A~D下側(甚至上側)以及該等第二待測單元50E~H上側(甚至下側)可設有其他待測單元,亦即該第一列C1及該第二列C2可分別更具有除了該等第一、二待測單元50A~H以外的待測單元,且該第一列C1左側及該第二列C2右側可設有更多列的待測單元,該探針模組20檢測完本實施例之圖式所示之八個待測單元50A~H之後,可再檢測鄰近之另八個待測單元,例如該等第二待測單元50E~H上側之四待測單元及右側之四待測單元(圖中未示),以此方式進行多次檢測即可快速檢測全部待測單元而達到良好的檢測效率。More importantly, the probe module of the present invention can be used to detect many units to be tested at the same time, and is particularly suitable for detecting a plurality of units to be tested arranged in a matrix, among which the first and second units to be tested can be A part of the units to be tested are located in two adjacent rows. After the probe module detects the part of the units to be tested at the same time, it only needs to move a short distance to detect another part of the units to be tested in two adjacent rows. Taking the
前述之實施例係以同時檢測八個待測單元50A~H且僅檢測各該待測單元50A~H之一行導電接點55為例,因此針層L11~L14、L21~L24之總數係與待測單元50A~H的數量相同,如此可在方便配置探針的前提下,達到所需之檢測目的並達到良好的檢測效率。然而,本發明之探針模組可依使用需求而配置成針對單一或複數第一待測單元以及單一或複數第二待測單元,且亦可藉由同一探針座之複數針層分別檢測同一待測單元之複數行導電接點,亦即,針層之總數不一定與待測單元之數量相同,而是與所需檢測之導電接點的行數相同。The foregoing embodiment takes the simultaneous detection of eight
不論同時檢測之第一、二待測單元的數量分別為一個或複數個,一該第一待測單元可與一該第二待測單元相鄰,其相鄰之態樣可如前述第一較佳實施例中第一待測單元50D與第二待測單元50H相鄰之態樣,或者,如圖7及圖8所示之本發明一第二較佳實施例中第一待測單元50D與第二待測單元50H相鄰之態樣,在第二較佳實施例中,該第一待測單元50D之第二側邊緣54係與該第二待測單元50H之第一側邊緣53相鄰,因此該第一待測單元50D鄰近第二側邊緣54之導電接點55的延伸方向D2與該第二待測單元50H鄰近第一側邊緣53之導電接點55的延伸方向D2係相互靠近,即使在這樣的情況下,由於分別用以點觸第一、二待測單元之第一、二探針係位於不同側,該等第一、二探針30A~H之懸臂段31的外露部312自第一、二探針座21、22之內側面211、221延伸而出之方向仍可配合所對應之導電接點55的延伸方向D2,而不會產生探針相互干涉之問題。Regardless of whether the number of the first and second units to be tested at the same time is one or more, the first unit to be tested can be adjacent to the second unit to be tested, and the adjacent state can be the same as the first In the preferred embodiment, the first unit under
在前述之實施例中,該探針模組20之探針僅由一假想探針單元分界線A2劃分成二探針單元,亦即包含有全部第一探針30A~D之第一探針單元61,以及包含有全部第二探針30E~H之第二探針單元62,如圖2及圖7所示(圖2及圖7中僅顯示出部分探針)。然而,本發明亦可應用於如圖9及圖10所示之本發明第三及第四較佳實施例中排成三列之待測單元,其中第一列C1及第三列C3為偏向第一探針座21之第一待測單元50A~D,第二列C2則為偏向第二探針座22之第二待測單元50E~H,亦即,第三及第四較佳實施例中的待測單元係分別以第一及第二較佳實施例之待測單元再加上與第一列C1相同之第三列C3待測單元。在第三及第四較佳實施例中,該探針模組20之探針係由一第一假想探針單元分界線A21及一第二假想探針單元分界線A22劃分成一僅包含有第一探針30A~D(圖9及圖10中僅顯示出第一探針30D)之第一探針單元61、一僅包含有第二探針30E~H(圖9及圖10中僅顯示出第二探針30H)之第二探針單元62,以及一僅包含有第一探針30A~D(圖9及圖10中僅顯示出第一探針30D)之第三探針單元63,亦即,第三及第四較佳實施例中的探針模組20係分別以第一及第二較佳實施例之探針模組20再加上與第一探針單元61相同之第三探針單元63,該第一探針單元61與該第二探針單元62分別位於該第一假想探針單元分界線A21二側,該第二探針單元62與該第三探針單元63分別位於該第二假想探針單元分界線A22二側,亦即,該第一探針單元61之第一探針30A~D的點觸段32末端與該第二探針單元62之第二探針30E~H的點觸段32末端係位於該第一假想探針單元分界線A21的不同側,該第二探針單元62之第二探針30E~H的點觸段32末端與該第三探針單元63之第一探針30A~D的點觸段32末端係位於該第二假想探針單元分界線A22的不同側,如此亦可達成前述之功效。In the foregoing embodiment, the probes of the
可想而知,本發明亦可應用於以類同前述排列方式排列成更多列之待測單元,例如圖11及圖12所示之本發明第五及第六較佳實施例中排成四列之待測單元,係分別以第三及第四較佳實施例之待測單元再加上一與第二列C2相同之第四列C4的第二待測單元50E~H。在第五及第六較佳實施例中,該探針模組20之探針係由第一至第三假想探針單元分界線A21~A23劃分成四探針單元,其中除了第三及第四較佳實施例中所述之第一至第三探針單元61~63,更加上一與第二探針單元62相同、僅包含有第二探針30E~H(圖11及圖12中僅顯示出第二探針30H)之第四探針單元64,該第三探針單元63與該第四探針單元64分別位於該第三假想探針單元分界線A23二側,亦即,該第三探針單元63之第一探針30A~D的點觸段32末端與該第四探針單元64之第二探針30E~H的點觸段32末端係位於該第三假想探針單元分界線A23的不同側,如此亦可達成前述之功效。It is conceivable that the present invention can also be applied to units to be tested arranged in more rows in the same arrangement as the aforementioned arrangement, such as the arrangement in the fifth and sixth preferred embodiments of the present invention shown in FIGS. 11 and 12 The four rows of cells to be tested are the cells to be tested in the third and fourth preferred embodiments respectively plus a second cell to be tested 50E~H in the fourth row C4 which is the same as the second row C2. In the fifth and sixth preferred embodiments, the probes of the
再者,本發明亦可應用於如圖13所示之本發明一第七較佳實施例中排成一列之待測單元,本實施例中待測單元的分佈方式係將第一較佳實施例中的第一、二待測單元50A~H由原本排成相鄰兩列改為排成同一列,本實施例之探針模組20的第一、二探針可由一平行於第一、二探針座21、22之內側面211、221的假想探針單元分界線A2劃分開,該等第一探針30A~D(圖13中僅顯示出第一探針30D)之點觸段32末端全部位於該假想探針單元分界線A2與該第一探針座21之間,該等第二探針30E~H(圖13中僅顯示出第二探針30H)之點觸段32末端全部位於該假想探針單元分界線A2與該第二探針座22之間,如此亦可達成前述之功效。Furthermore, the present invention can also be applied to the units under test arranged in a row in a seventh preferred embodiment of the present invention as shown in FIG. 13. The distribution of the units under test in this embodiment is based on the first preferred embodiment In the example, the first and
更進一步地,本發明之探針模組20亦可應用於如圖14所示之本發明一第八較佳實施例中排成一第一列C1及一第二列C2(甚至可更多列)之待測單元50A~H,該第一列C1及該第二列C2之待測單元50A~H係分別如同第七較佳實施例中之第一、二待測單元50A~H的排列方式,且該第一列C1及該第二列C2係間隔一大於一該第一、二待測單元50A~H之寬度W3、W4(在本實施例中W3、W4係相等)的距離。對應地,本實施例之探針模組20包含有與第七較佳實施例之探針分佈方式相同、用以點觸第一列C1待測單元50A~H之一第一探針單元61及一第二探針單元62,以及與第一探針單元61及第二探針單元62相同、用以點觸第二列C2待測單元50A~H之一第三探針單元63及一第四探針單元64。Furthermore, the
詳而言之,本實施例之探針模組20能定義出一平行於第一、二探針座21、22之內側面211、221的第一假想探針單元分界線A21,以及實質上垂直於該第一假想探針單元分界線A21之一第二假想探針單元分界線A22及一第三假想探針單元分界線A23,僅包含有第一探針30A~D(圖14中僅顯示出第一探針30D)之第一、三探針單元61、63係位於該第一假想探針單元分界線A21與該第一探針座21之間,僅包含有第二探針30E~H(圖14中僅顯示出第二探針30H)之第二、四探針單元62、64係位於該第一假想探針單元分界線A21與該第二探針座22之間,該第二假想探針單元分界線A22與該第三假想探針單元分界線A23之間有一未設置任何探針之點觸段末端的間隔空間P,該間隔空間P之寬度W5係大於一該第一、二待測單元50A~H之寬度W3、W4,第一、二探針單元61、62係與該間隔空間P位於該第二假想探針單元分界線A22之不同側,第三、四探針單元63、64係與該間隔空間P位於該第三假想探針單元分界線A23之不同側,更明確地說,該間隔空間P係位於該第二假想探針單元分界線A22之右側及該第三假想探針單元分界線A23之左側,即該間隔空間P係位於該第二假想探針單元分界線A22及該第三假想探針單元分界線A23之間,第一、二探針單元61、62之探針30A~H(圖14中僅顯示出探針30D、30H)的點觸段末端全部位於該第二假想探針單元分界線A22之左側,第三、四探針單元63、64之探針30A~H(圖14中僅顯示出探針30D、30H)的點觸段末端全部位於該第三假想探針單元分界線A23之右側。In detail, the probe module 20 of this embodiment can define a first imaginary probe unit boundary line A21 parallel to the inner sides 211, 221 of the first and second probe holders 21, 22, and substantially A second virtual probe unit boundary line A22 and a third virtual probe unit boundary line A23 perpendicular to the first virtual probe unit boundary line A21 only include the first probes 30A~D (Figure 14 only It is shown that the first and third probe units 61, 63 of the first probe 30D) are located between the first imaginary probe unit boundary A21 and the first probe holder 21, and only include the second probe 30E ~H (only the second probe 30H is shown in FIG. 14) The second and fourth probe units 62, 64 are located between the first imaginary probe unit dividing line A21 and the second probe holder 22, the Between the second imaginary probe unit boundary line A22 and the third imaginary probe unit boundary line A23, there is a spacing space P at the end of the point contact section without any probe, and the width W5 of the spacing space P is greater than a first The widths W3 and W4 of the first and second test units 50A~H, the first and second probe units 61, 62 and the spacing space P are located on different sides of the second imaginary probe unit boundary line A22, the third and fourth The probe units 63, 64 and the spacing space P are located on different sides of the third imaginary probe unit boundary line A23. More specifically, the spacing space P is located on the right side of the second imaginary probe unit boundary line A22 And the left side of the third virtual probe unit boundary line A23, that is, the spacing space P is located between the second virtual probe unit boundary line A22 and the third virtual probe unit boundary line A23, the first and second probes The tip ends of the
本實施例之探針模組20不但可達成如前述之高檢測效率及避免探針干涉之功效,更重要的是,該間隔空間P內事實上更設置另一列待測單元50A~H,且第一列C1待測單元之左側及第二列C2待測單元之右側亦設置更多列待測單元50A~H,本實施例之探針模組20同時檢測圖14所示之第一、二列C1、C2共十六個待測單元50A~H之後,只要移動一小段距離即可再檢測分別與該第一、二列C1、C2待測單元50A~H相鄰之另二列待測單元50A~H,例如該間隔空間P內之一列待測單元50A~H(圖中未示)以及第二列C2待測單元右側之一列待測單元50A~H(圖中未示),以此方式進行多次檢測即可快速檢測全部待測單元而達到更加良好的檢測效率。The
在前述本發明之較佳實施例中,僅包含有第一探針30A~D之探針單元,例如前述之第一、三探針單元61、63,係能以其最外側之二該第一探針(亦即最外側之第一探針30A)的固定部311之距離定義為一第一固定部分佈寬度W1(如圖2所示),該第一固定部分佈寬度W1係小於該第一待測單元50A~D之寬度W3。此外,僅包含有第二探針30E~H之探針單元,例如前述之第二、四探針單元62、64,係能以其最外側之二該第二探針(亦即最外側之第二探針30H)的固定部311之距離定義為一第二固定部分佈寬度W2,該第二固定部分佈寬度W2係大於該第二待測單元50E~H之寬度W4(在本發明之較佳實施例中W3與W4係相等)。再者,該第二固定部分佈寬度W2係大於該第一固定部分佈寬度W1。藉由前述之探針單元的分佈方式,搭配上述之探針固定部的分佈方式,係更可使如此繁多之探針以適當間距配置於探針座,以達到高檢測效率以及避免探針干涉之功效。In the aforementioned preferred embodiment of the present invention, only the probe units containing the
最後,必須再次說明,本發明於前揭實施例中所揭露的構成元件,僅為舉例說明,並非用來限制本案之範圍,其他等效元件的替代或變化,亦應為本案之申請專利範圍所涵蓋。Finally, it must be explained again that the constituent elements disclosed in the previously disclosed embodiments of the present invention are merely examples and are not intended to limit the scope of the case. Alternatives or changes to other equivalent elements should also be the scope of the patent application for this case. Covered.
[先前技術] [Prior Art]
10:待測單元10: Unit to be tested
11:第一導電接點 11: The first conductive contact
111:長邊111: long side
12:第二導電接點 12: The second conductive contact
121:長邊121: long side
13:基板 13: substrate
131:第一長邊131: The first long side
132:第二長邊 132: second long side
14:中間區塊14: Middle block
15、16:外側區塊 15, 16: Outer block
17:探針17: Probe
171:懸臂 171: Cantilever
18:探針座18: Probe holder
L:假想分界軸線 L: imaginary dividing axis
θ1、θ2:角度 θ1, θ2: angle
[實施例] [Example]
20:探針模組20: Probe module
21:第一探針座 21: The first probe holder
211:內側面211: inside
212:外側面 212: outer side
22:第二探針座22: The second probe holder
221:內側面 221: inside
222:外側面 222: outer side
30A~D:第一探針30A~D: the first probe
30E~H:第二探針 30E~H: second probe
31:懸臂段31: Cantilever section
311:固定部 311: Fixed part
311a:內側區段311a: inner section
311b:外側區段 311b: Outer section
312:外露部312: Exposed
32:點觸段 32: Touch segment
40:電路板40: circuit board
41:底面 41: Bottom
50A~D:第一待測單元50A~D: The first unit to be tested
50E~H:第二待測單元 50E~H: The second unit to be tested
51:第一主邊緣51: First Main Edge
52:第二主邊緣 52: Second Main Edge
53:第一側邊緣53: first side edge
54:第二側邊緣 54: second side edge
55:導電接點55: Conductive contact
551:第一端 551: first end
552:第二端552: second end
56:上表面 56: upper surface
57:中間區塊57: middle block
58:左側區塊 58: Left block
59:右側區塊 59: right block
61:第一探針單元61: The first probe unit
62:第二探針單元 62: The second probe unit
63:第三探針單元63: The third probe unit
64:第四探針單元 64: The fourth probe unit
A1:假想分界軸線A1: Imaginary dividing axis
A2:假想探針單元分界線 A2: Boundary line of imaginary probe unit
A21:第一假想探針單元分界線A21: The boundary of the first imaginary probe unit
A22:第二假想探針單元分界線 A22: The second imaginary probe unit boundary
A23:第三假想探針單元分界線 A23: The boundary of the third imaginary probe unit
A3:第一假想分界線A3: The first imaginary dividing line
A4:第二假想分界線 A4: The second imaginary dividing line
C1:第一列C1: first column
C2:第二列 C2: second column
C3:第三列C3: third column
C4:第四列 C4: fourth column
D1:點觸方向D1: Touch direction
D2:延伸方向 D2: Extension direction
d:垂直距離d: vertical distance
L11~L14:第一至第四針層 L11~L14: the first to fourth needle layers
L21~L24:第一至第四針層L21~L24: the first to fourth needle layers
P:間隔空間 P: Interval
W1:第一固定部分佈寬度W1: width of the first fixed part
W2:第二固定部分佈寬度 W2: width of the second fixed part
W3、W4、W5:寬度 W3, W4, W5: width
圖1為一具有傾斜導電接點之待測單元、一探針及一探針座之頂視示意圖。 圖2概為本發明一第一較佳實施例所提供之探針模組及八待測單元之頂視示意圖,惟其中顯示之探針僅為第一針層之第一、二探針。 圖3係類同於圖2,惟其中顯示之探針僅為第二針層之第一、二探針。 圖4係類同於圖3,惟其中顯示之探針僅為第三針層之第一、二探針。 圖5係類同於圖4,惟其中顯示之探針僅為第四針層之第一、二探針。 圖6為本發明該第一較佳實施例所提供之探針模組、該等待測單元及一電路板之側視圖。 圖7係類同於圖5,惟顯示不同排列方式之八待測單元以及對應之本發明一第二較佳實施例所提供之探針模組。 圖8為本發明該第二較佳實施例所提供之探針模組、該等待測單元及一電路板之側視圖。 圖9概為本發明一第三較佳實施例所提供之探針模組及十二待測單元之頂視示意圖,惟其中顯示之探針僅為第四針層之第一、二探針。 圖10概為本發明一第四較佳實施例所提供之探針模組及十二待測單元之頂視示意圖,惟其中顯示之探針僅為第四針層之第一、二探針。 圖11概為本發明一第五較佳實施例所提供之探針模組及十六待測單元之頂視示意圖,惟其中顯示之探針僅為第四針層之第一、二探針。 圖12概為本發明一第六較佳實施例所提供之探針模組及十六待測單元之頂視示意圖,惟其中顯示之探針僅為第四針層之第一、二探針。 圖13概為本發明一第七較佳實施例所提供之探針模組及八待測單元之頂視示意圖,惟其中顯示之探針僅為第四針層之第一、二探針。 圖14概為本發明一第八較佳實施例所提供之探針模組及十六待測單元之頂視示意圖,惟其中顯示之探針僅為第四針層之第一、二探針。 Figure 1 is a schematic top view of a unit under test with inclined conductive contacts, a probe and a probe holder. 2 is a schematic top view of a probe module and eight units under test provided by a first preferred embodiment of the present invention, but the probes shown therein are only the first and second probes of the first needle layer. Figure 3 is similar to Figure 2, except that the probes shown are only the first and second probes of the second needle layer. Figure 4 is similar to Figure 3, except that the probes shown are only the first and second probes of the third needle layer. Figure 5 is similar to Figure 4, except that the probes shown are only the first and second probes of the fourth needle layer. 6 is a side view of the probe module, the waiting unit and a circuit board provided by the first preferred embodiment of the present invention. Fig. 7 is similar to Fig. 5, but shows eight DUTs in different arrangements and the corresponding probe module provided by a second preferred embodiment of the present invention. 8 is a side view of the probe module, the waiting unit and a circuit board provided by the second preferred embodiment of the present invention. 9 is a schematic top view of the probe module and twelve units under test provided by a third preferred embodiment of the present invention, but the probes shown are only the first and second probes of the fourth needle layer . 10 is a schematic top view of the probe module and twelve units under test provided by a fourth preferred embodiment of the present invention, but the probes shown are only the first and second probes of the fourth needle layer . 11 is a schematic top view of the probe module and sixteen units under test provided by a fifth preferred embodiment of the present invention, but the probes shown are only the first and second probes of the fourth needle layer . 12 is a schematic top view of the probe module and sixteen units under test provided by a sixth preferred embodiment of the present invention, but the probes shown are only the first and second probes of the fourth needle layer . 13 is a schematic top view of a probe module and eight units under test provided by a seventh preferred embodiment of the present invention, but the probes shown are only the first and second probes of the fourth needle layer. 14 is a schematic top view of a probe module and sixteen units under test provided by an eighth preferred embodiment of the present invention, but the probes shown are only the first and second probes of the fourth needle layer .
21:第一探針座 21: The first probe holder
211:內側面 211: inside
212:外側面 212: outer side
22:第二探針座 22: The second probe holder
221:內側面 221: inside
222:外側面 222: outer side
30A:第一探針 30A: First probe
30E:第二探針 30E: second probe
31:懸臂段 31: Cantilever section
311:固定部 311: Fixed part
311a:內側區段 311a: inner section
311b:外側區段 311b: Outer section
312:外露部 312: Exposed
50A~D:第一待測單元 50A~D: The first unit to be tested
50E~H:第二待測單元 50E~H: The second unit to be tested
55:導電接點 55: Conductive contact
61:第一探針單元 61: The first probe unit
62:第二探針單元 62: The second probe unit
A1:假想分界軸線 A1: Imaginary dividing axis
A2:假想探針單元分界線 A2: Boundary line of imaginary probe unit
A3:第一假想分界線 A3: The first imaginary dividing line
A4:第二假想分界線 A4: The second imaginary dividing line
C1:第一列 C1: first column
C2:第二列 C2: second column
L11、L21:第一針層 L11, L21: the first needle layer
W1:第一固定部分佈寬度 W1: width of the first fixed part
W3:寬度 W3: width
Claims (25)
Priority Applications (3)
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TW108133223A TWI704358B (en) | 2019-09-16 | 2019-09-16 | Suitable for probe modules with multiple units to be tested with inclined conductive contacts |
CN202010332162.0A CN112505374A (en) | 2019-09-16 | 2020-04-24 | Probe module suitable for multiple units to be tested with inclined conductive contacts |
KR1020200051308A KR102292881B1 (en) | 2019-09-16 | 2020-04-28 | Probing Module Adapted for Testing Multi-units Having Inclined Conductive Contacts |
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TW108133223A TWI704358B (en) | 2019-09-16 | 2019-09-16 | Suitable for probe modules with multiple units to be tested with inclined conductive contacts |
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TW202113365A TW202113365A (en) | 2021-04-01 |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5926028A (en) * | 1996-05-17 | 1999-07-20 | Tokyo Electron Limited | Probe card having separated upper and lower probe needle groups |
TWM457875U (en) * | 2013-01-21 | 2013-07-21 | Mpi Corp | Cantilever probe card |
TW201441629A (en) * | 2013-04-26 | 2014-11-01 | Mpi Corp | Probe needle module |
TWI612312B (en) * | 2017-05-03 | 2018-01-21 | 創意電子股份有限公司 | Probe card system, probe loader device and manufacturing method of the probe loader device |
US20180321278A1 (en) * | 2017-05-03 | 2018-11-08 | Global Unichip Corporation | Probe card system, probe loader device and manufacturing method of the probe loader device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69733928T2 (en) * | 1996-05-17 | 2006-06-14 | Formfactor Inc | MICROELECTRONIC CONTACT STRUCTURE AND MANUFACTURING METHOD THEREFOR |
JP3446636B2 (en) * | 1998-11-20 | 2003-09-16 | 三菱マテリアル株式会社 | Contact probe and probe device |
US6471538B2 (en) * | 1998-11-30 | 2002-10-29 | Advantest Corp. | Contact structure and production method thereof and probe contact assembly using same |
JP4579361B2 (en) * | 1999-09-24 | 2010-11-10 | 軍生 木本 | Contact assembly |
WO2006017078A2 (en) * | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
JP2006162422A (en) * | 2004-12-07 | 2006-06-22 | Japan Electronic Materials Corp | Probe card |
DE102005005752A1 (en) * | 2005-02-07 | 2006-08-31 | Bourns, Inc., Riverside | potentiometer |
CN101308163A (en) * | 2007-05-15 | 2008-11-19 | 旺矽科技股份有限公司 | Probe card with electrical shield structure |
KR100967339B1 (en) * | 2007-10-22 | 2010-07-05 | (주)티에스이 | Probe card for wafer test |
KR200455379Y1 (en) * | 2011-06-13 | 2011-09-01 | 나경화 | Pins for testing semiconductor chips and sockets for testing semiconductor chips including them |
KR20130047933A (en) * | 2011-11-01 | 2013-05-09 | 솔브레인이엔지 주식회사 | Probe, probe assembly and probe card comprising it |
-
2019
- 2019-09-16 TW TW108133223A patent/TWI704358B/en active
-
2020
- 2020-04-24 CN CN202010332162.0A patent/CN112505374A/en active Pending
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5926028A (en) * | 1996-05-17 | 1999-07-20 | Tokyo Electron Limited | Probe card having separated upper and lower probe needle groups |
TWM457875U (en) * | 2013-01-21 | 2013-07-21 | Mpi Corp | Cantilever probe card |
TW201441629A (en) * | 2013-04-26 | 2014-11-01 | Mpi Corp | Probe needle module |
TWI612312B (en) * | 2017-05-03 | 2018-01-21 | 創意電子股份有限公司 | Probe card system, probe loader device and manufacturing method of the probe loader device |
US20180321278A1 (en) * | 2017-05-03 | 2018-11-08 | Global Unichip Corporation | Probe card system, probe loader device and manufacturing method of the probe loader device |
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TW202113365A (en) | 2021-04-01 |
CN112505374A (en) | 2021-03-16 |
KR20210032889A (en) | 2021-03-25 |
KR102292881B1 (en) | 2021-08-24 |
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