JP5055149B2 - Electrical connection device - Google Patents

Description

  The present invention relates to an electrical connection apparatus for conducting an electrical test of an electronic device such as an LSI, and more particularly to electrically test a plurality of types of electronic devices having different applications and specifications (size, number of electrodes, electrode arrangement, etc.). The present invention relates to an electrical connection device.

  A probe card (electrical connection device) that can simultaneously test several electronic device chips among many electronic device chips formed on one wafer has already been widely used (for example, Patent Document 1). To 3).

  Such electrical connection devices are mainly used for testing mass-produced electronic devices such as memory LSIs and CCDs, but are specially used for electronic devices such as ASICs (Application Specific Integrated Circuits) and system LSIs. It is also used in electronic devices that are produced in a variety of small quantities.

  Usually, the electrical connection device is manufactured according to the specifications (size, number of electrodes, electrode arrangement, etc.) of the electronic device to be tested. Manufacturing each electronic device or each electronic device that is produced in a variety of small quantities is a burden on the manufacturing cost for the manufacturer of the electrical connection apparatus. In addition, it is cumbersome for a manufacturer of an electronic device that uses an electrical connection device to manufacture an electronic device that includes electrodes corresponding to the arrangement of contacts of the electrical connection device, and the manufacturing cost is high.

  Therefore, as in Patent Document 4, an external measuring machine (electrical connection device) having a probe (contactor) capable of simultaneously testing two types of semiconductor chips having different functions has been devised.

  The external measuring machine performs an electrical test of a semiconductor device including a large number of first semiconductor chips formed on a wafer and a second semiconductor chip formed on a squealer plane between the first semiconductor chips. It can be carried out.

  However, the external measuring device is an electrical connection device for testing a semiconductor device including a large number of first and second semiconductor chips (electronic devices having the same specifications), and a semiconductor including other types of semiconductor chips having different specifications. The device cannot be tested.

  Further, when testing a plurality of types of electronic devices having different specifications with one electrical connection device, it is required to arrange contacts for testing each electronic device so as not to contact each other. Also, while testing one electronic device, it is required to arrange the contacts in use so that they do not contact contacts for another electronic device. Although the external measuring machine described in Patent Document 4 satisfies these requirements, as described above, it is not an electrical connection apparatus that can test electronic devices with different specifications formed in the chip formation region on the wafer.

  Therefore, an electrical connection device having a large number of contacts used for each electronic device having different specifications can be considered, but an electrical connection device in which contacts are arranged corresponding to the electrode arrangement for each electronic device is Since the arrangement area of the child becomes large, the whole apparatus becomes large and the manufacturing cost increases.

JP 2000-216204 A JP 2005-243939 A JP 2005-127958 A Japanese Unexamined Patent Publication No. 7-201907 (paragraphs “0009” and “0010”)

  It is an object of the present invention to provide contacts with different arrangements capable of testing a plurality of types of electronic devices having different specifications such as electrode size, number, arrangement, etc., and to save space for arranging the contacts. It is in.

An electrical connection device according to the present invention includes a substrate, a needle main portion that is supported at the upper end on the lower surface of the substrate and extending in the left-right direction or the front-rear direction, and a tip of the needle main portion. look including a first and second group of contacts including a plurality of contacts comprising a probe tip portion having a needle tip at the lower end a needle point portion extending downward, each contact of said first group of contacts The child is electrically connected to the corresponding contact of the second contact group. The first and second contact groups can be selectively used.

  At least a part of the needle tips of the contacts belonging to the second contact group is located within a closed imaginary line connecting the points of the needle tips of the contacts belonging to the first contact group as viewed from above. Has been.

  The closed imaginary line can be circular, elliptical or polygonal. The remaining part of the needle tips of the contacts belonging to the second contact group may be positioned outside the closed imaginary line as viewed from above. The needle main part of the contact belonging to the first contact group may be located outside the imaginary line.

  According to the electrical connection device of the present invention, at least a part of the needle tip of the contact belonging to the second contact group is a needle of the contact belonging to the first contact group as viewed from above. Since it is located within a closed imaginary line connecting the previous points, it can save the contactor's position space, and it can be used for multiple types with different specifications such as electrode size, number of electrodes, electrode arrangement, etc. Among electronic devices, by using a contact belonging to the first contact group for one electronic device and using a contact belonging to the second contact group for another electronic device, Different types of electronic devices can be electrically tested.

  Thereby, since it is not necessary to manufacture an electrical connection apparatus for every electronic device with a different specification, the manufacturing cost of an electrical connection apparatus can be reduced. In addition, since it is not necessary to replace the electrical connection device depending on the electronic device to be tested, the time for testing different types of electronic devices can be shortened.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. The contact in the present invention will be described as a probe.

[Terminology]
In the present invention, the front-rear direction means the length direction of the short side of the electronic device shown in FIG. 4 or the direction of the columns of the four electrodes (4 pieces) arranged at the end of the short side, and the left-right direction means A direction that intersects the front-rear direction and refers to the length direction of the long side of the electronic device or the row direction of the electrodes (eight) arranged at the end of the long side, and the vertical direction refers to the paper back direction. However, these directions differ depending on the posture of the electronic device that is the device under test when the electronic device is placed in a test apparatus to which the electrical connection device is attached.

  Hereinafter, with reference to FIGS. 1-7, the Example of the electrical-connection apparatus based on this invention is described.

  FIG. 1 is a bottom view schematically showing an electrical connection device 10 according to the present invention, and FIG. 2 is a side view of FIG. 1 and a side view schematically showing a part of an electronic device and its moving device. FIG.

  The electrical connection device 10 includes a support member 18 having a flat lower surface 16, a fixing ring 20 attached to the lower surface 16 of the support member 18 by bolts, and a contactor assembly, that is, a probe assembly, whose edges are held by the fixing ring 20 And a solid 22.

  The probe assembly 22 includes a probe substrate 24 and a number of probes or contacts 26 formed on the lower surface of the probe substrate 24.

  The electrical connection device 10 is used to connect the electrode pad 30 of the electronic device 12 to a measurement terminal of a tester (not shown) for electrical testing of the electronic device 12. In the example shown in FIG. 2, during the test, the moving device 14 moves the electronic device 12 upward and brings the electrode pad 30 of the electronic device 12 into contact with the contact 26 of the electrical connection device 10. When testing another electronic device, the moving device 14 moves the electronic device 12 downward, and then moves the electronic device 12 from below the electrical connection device 10 in either direction. Thereafter, the moving device 14 positions another electronic device below the electrical connection device 10 and moves the electronic device upward so that the electrode pad of the electronic device contacts the contact 26 of the electrical connection device 10. Let

  FIG. 3A is an enlarged cross-sectional view taken along line 3A-3A in FIG. 1 and is a view showing a concept of a partial cross-sectional structure of the electrical connection device. Accordingly, the reference numbers of the contacts differ between FIGS. 1 and 3A, but the contacts shown in FIGS. 1 and 3A have the same configuration.

  The probe substrate 24 is manufactured using an electrically insulating material such as ceramic or polyimide resin, and has a rectangular planar shape. The probe substrate 26 includes a plurality of contacts 32 and a plurality of contacts 34 formed on the lower surface thereof. In FIG. 3A, for simplification of description, among the plurality of contacts 32 and the plurality of contacts 34, two contacts 32, 34 and wiring of the two contacts 32, 34 will be described.

  The contact 32 and the contact 34 are separated from each other in a direction parallel to the lower surface of the probe substrate 24. Inside the probe substrate 24, the internal wiring 36 and the internal wiring 38 connected to the contact 32 and the contact 34 and the internal wirings 36 and 38, respectively, are held electrically apart from each other. Member 40. In addition, arrangement | positioning of a contactor is demonstrated after FIG. 5 using the reference number different from the contactors 32 and 34. FIG.

  In the illustrated example, the electrode pad 30 is disposed below the contact 32. The holding member 40 is fixed inside the probe substrate 24 and has a cylindrical shape extending in the thickness direction of the probe substrate 24. The holding member 40 is electrically connected to a wiring 18 a provided inside the support member 18. The wiring 18a is connected to a measurement terminal of a test apparatus (not shown) that performs an electrical test of the electronic device.

  The contact 32 includes a base 42 supported by the probe substrate 24, a needle main body 44 extending leftward from the base 42, and a needle having a needle tip 46 extending downward from the tip of the needle main body 44 at the tip. A front portion 48. Similarly, the contact 34 includes a base 50 supported by the probe substrate 24, a needle main body 52 extending rightward from the base 50, and a needle tip 54 extending downward from the tip of the needle main body 52. A needle tip portion 56.

  FIG. 3B is an enlarged view showing the vicinity of the holding member 40 of FIG. 3A. Each wiring 36, 38 is made of a linear conductive member extending in the end direction (left-right direction) of the probe substrate 24, and includes an annular portion 60 having a hole 58. The holding member 40 is inserted into the hole 58, and the wirings 36 and 38 are rotatably held by the holding member 40. Therefore, the contacts 32 and 34 are electrically connected to each other via the holding member 40.

  In addition, since the contacts 32 and 34 are respectively used for the electrical test of two types of electronic devices A and B described later, one contact is used for the electrical test of the electronic devices A and B. When used, the other contact is not used. Therefore, since the electrical connection apparatus according to the present invention does not simultaneously perform electrical tests on two different types of electronic devices A and B, the electrode of the electronic device A and the measurement terminal of the tester are electrically connected. The wiring in the electrical connection apparatus and the wiring in the electrical connection apparatus that electrically connects the electrode of the electronic device B and the measurement terminal of the tester can be shared. Thereby, the wiring for every electronic device is unnecessary and the cost concerning wiring can be held down.

  4A is a plan view showing an electronic device to be tested by the electrical connection apparatus according to the present invention, and FIG. 4B is a plan view showing an electronic device different from the electronic device of FIG. 4A. FIG.

  As shown in FIG. 4A, the electronic device A has a rectangular substrate 70. Further, the electronic device A includes eight electrodes arranged at equal intervals in the left-right direction in the vicinity of the front-rear direction end portion of the substrate 70 along each long side 72 (the front-rear direction side in the drawing) of the substrate 70. A pad 74 and four electrode pads 74 arranged at equal intervals in the front-rear direction in the vicinity of the left and right ends of the substrate 70 along each short side 76 (the side in the left-right direction in the drawing) of the substrate 70 are provided. .

In addition, the electronic device B has a rectangular substrate 80 that is smaller than the substrate area of the electronic device A, as shown in FIG. The electronic device B includes four electrode pads arranged at equal intervals in the left-right direction in the vicinity of the front and rear end portions of the substrate 80 along the long sides 82 (sides in the front-rear direction in the drawing) of the substrate 80. 84.
[One Example of Contact Arrangement Used in Electrical Connection Device]

  FIG. 5 is a view showing one embodiment of the arrangement of the contacts used in the electrical connection device according to the present invention, and is a conceptual view seen from below the contacts (on the electrode side of the electronic device). In the illustrated contact, the contacts 26, 32, 34 are represented in a simplified form, and have the same configuration as the contacts 26, 32, 34. The illustrated contact includes a curved edge 90 at one end and a linear edge 92 opposite to the edge 90 at the other end. An edge 90 indicates the needle tip side of the contact, and an edge 92 indicates the base side of the contact.

  The contacts shown in FIG. 5 are used to test the first contact group used to test the electronic device A of FIG. 4 (A) and the electronic device B of FIG. 4 (B). And a second contact group.

  The first contact group includes eight contacts 100 constituting the contact row A1, eight contacts 102 constituting the contact row A2 spaced apart from and opposed to the contact row A1, and the contacts. Four contacts 104 constituting a contactor row A3 positioned on the left side of the rows A1 and A2 and between the contactor rows A1 and A2, and on the right side of the contactor rows A1 and A2 and the contactor row A1, And four contactors 106 constituting a contactor row A4 positioned between A2.

  The second contact group includes six contact elements 108 constituting the contact element array B1 surrounded by the contact element lines A1 to A4, and is surrounded by the contact element lines A1 to A4 in the rear direction of the contact element line B1. 6 contacts 110 constituting the contact row B2 formed.

  In the contact row A1, eight contacts 100 are arranged at equal intervals in the left-right direction, and the needle main portion 100a of each contact 100 is from the edge 92 (base side) to the contact 102 side of the contact row A2. To grow. Further, in the contact row A2, eight contacts 102 are arranged at equal intervals in the left-right direction, and the needle main body portion 102a of each contact 102 is contacted to the contact row A1 from the edge 92 (base side). Extends to 100 side.

  In the contactor row A3, the four contactors 104 are arranged at equal intervals in the front-rear direction, and the needle main body portion 104a of each contactor 104 extends from the edge 92 (base side) to the contactor 106 side of the contactor row A4. To grow. Further, in the contact row A4, the eight contact pieces 106 are arranged at equal intervals in the front-rear direction, and the needle main body portion 106a of each contact piece 106 contacts the contact pieces of the contact row A3 from the edge 92 (base side). Extends to the 104 side.

  In the contact rows A1 to A3, the closed imaginary line 114 connecting the needle point 112 of the contacts 100, 102, 104, 106 adjacent to each other forms an octagon.

  The contact 102 is located on the longitudinal axis of the contact 100 corresponding to the contact 102, and the contact 106 is located on the longitudinal axis of the contact 104 corresponding to the contact 106. , Contacts 100, 102 do not intersect the longitudinal axis of contact 104, and contacts 104, 106 do not intersect the longitudinal axis of contact 100. Therefore, the needle main portions 100a, 102a, 104a, and 106a are not located within the virtual line 114.

  The contact rows B1 and B2 are located within the virtual line 114. The six contacts 108 in the contact row B1 are arranged at equal intervals in the left-right direction, the contact row B2 is positioned rearward from the contact row B1, and the six contacts 110 are left-right. Are arranged at regular intervals.

  The needle main portion 108a of the contact 108 extends from the edge 92 (base side) toward the contact 100, and the needle main portion 110a of the contact 110 extends from the edge 92 (base side) toward the contact 102. Accordingly, the direction of the needle main body portion 108a toward the needle tip is opposite to the direction of the needle main body portion 110a toward the needle tip.

  The contact 110 is located on the longitudinal axis of the contact 108 corresponding to the contact 110, but is not located on the longitudinal axis of the contact 100. Therefore, the position of the contactor 110 and the position of the contactor 100 are not on the same straight line.

  FIG. 6 is a plan view showing a state in which the electronic device A is subjected to an electrical test using the contacts 100, 102, 104, 106 of FIG. 5.

  As shown, the electrical test of the electronic device A is performed by bringing the contacts 100, 102, 104, 106 into contact with the electrode pads 74 of the electronic device A. At this time, the contact 108 and the contact 110 do not contact the electronic device A because the electrode pad 74 has a height.

  FIG. 7 is a plan view showing a state where an electrical test of the electronic device B is performed using the contacts 108 and 110 of FIG.

  As shown, the electrical test of the electronic device B is performed by bringing the contacts 108 and 110 into contact with the electrode pads 84 of the electronic device B. At this time, since the electrode pad 84 has a height, the contacts 100, 102, 104, 106 do not contact the electronic device B. Although not clearly shown in FIGS. 6 and 7, the needle tips of the respective contacts are at the same height position with respect to the electronic device positioned for performing the electrical test.

After the electrical test of the electronic device A is performed by the contact arrays A1 to A4, the electrical test of the electronic device B can be performed by the contact arrays B1 and B2, so that it corresponds to the electronic device to be tested. Thus, it is not necessary to replace the electrical connection device having the contact arrangement. For example, when one type of electronic device is formed on one wafer, the electrical test of the other type of electronic device can be performed by simply replacing the wafer on which the other type of electronic device is formed. In addition, when many types of electronic devices are formed on one wafer, the moving device 14 moves only to a predetermined test position of the electrical connection device 10 without replacing the wafer, so that other electronic devices Electrical tests can be performed.
[Another Example of Contact Arrangement Used in Electrical Connection Device]

  Hereinafter, another embodiment of the arrangement of the contacts used in the electrical connection device according to the present invention will be described with reference to FIGS. In addition, since the electrical connection apparatus according to this embodiment has the same configuration as the configuration of the electrical connection apparatus shown in FIGS. I will explain.

  FIGS. 8A and 8B are plan views of electronic devices A and C, respectively, in which an electrical connection apparatus performs an electrical test. Since the electronic device A is the same as the electronic device A shown in FIG. 4A, the same reference numerals are given and the description thereof is omitted.

  As shown in FIG. 8B, the electronic device C includes a rectangular substrate 120 having the same area as the electronic device A. Further, the electronic device C includes eight electrode pads arranged at equal intervals in the horizontal direction in the vicinity of the front and rear end portions of the substrate 120 along the long sides 122 (the front and rear sides in the drawing) of the substrate 120. 124, and two electrode pads 124 arranged in a line in the front-rear direction near the left and right ends of the substrate 120 along each short side 126 (the side in the left-right direction in the drawing) of the substrate 120.

  The electronic device C includes the two electrode pads 74 on the outermost side (front and rear in the front-rear direction) among the four electrode pads 74 arranged along the short side 76 of the substrate 70 of the electronic device A. Except for the same arrangement of electrode pads.

  FIG. 9 is a diagram showing an example of the arrangement of the contacts of the electrical connection apparatus for testing the electronic devices A and C shown in FIG. 8, respectively, as viewed from below the contacts (electrode side of the electronic device). It is a conceptual diagram. In the illustrated contact, the contacts 26, 32, and 34 are represented in a simplified form and have the same configuration. The illustrated contact includes a curved edge 90 at one end and a linear edge 92 opposite to the edge 90 at the other end. An edge 90 indicates the needle tip side of the contact, and an edge 92 indicates the base side of the contact.

  The contacts shown in FIG. 9 are used to test the first contact group used to test the electronic device A of FIG. 8A and the electronic device C of FIG. 8B. And a second contact group.

  The first contact group includes eight contacts 100 constituting the contact row A1, eight contacts 102 constituting the contact row A2 spaced apart from and opposed to the contact row A1, and the contacts. Four contacts 104 constituting the contactor row A3 located on the left side of the rows A1 and A2, and four contacts constituting a contactor row A4 located on the right side of the contactor rows A1 and A2. Child 106.

  The second contact group includes eight contacts 130 constituting the contact line C1 surrounded by the contact lines A1 to A4, and is positioned in the rearward direction of the contact line A2 relative to the contact line C1. 8 contacts 132 constituting the contactor row C2 and two contacts constituting the contactor row C3 located on the left side of the contactor rows C1 and C2 and continuously to the contactor row A3 And the two contacts 136 constituting the contact row C4 which is located on the right side of the contact rows C1 and C2 and continuously to the contact row A4.

  In the contact row A1, eight contacts 100 are arranged at equal intervals in the left-right direction, and the needle main portion 100a of each contact 100 is from the edge 92 (base side) to the contact 102 side of the contact row A2. To grow. Further, in the contact row A2, eight contacts 102 are arranged at equal intervals in the left-right direction, and the needle main body portion 102a of each contact 102 is contacted to the contact row A1 from the edge 92 (base side). Extends to 100 side.

  In the contactor row A3, the four contactors 104 are arranged at equal intervals in the front-rear direction, and the needle main body portion 104a of each contactor 104 extends from the edge 92 (base side) to the contactor 106 side of the contactor row A4. To grow. Further, in the contact row A4, the eight contact pieces 106 are arranged at equal intervals in the front-rear direction, and the needle main body portion 106a of each contact piece 106 contacts the contact pieces of the contact row A3 from the edge 92 (base side). Extends to the 104 side.

  In the contact rows A1 to A3, the closed imaginary line 114 that connects the needle point 112 of the contacts 100, 102, 104, and 106 adjacent to each other forms an octagon.

  The contact 102 is located on the longitudinal axis of the contact 100 corresponding to the contact 102, and the contact 106 is located on the longitudinal axis of the contact 104 corresponding to the contact 106. , Contacts 100, 102 do not intersect the longitudinal axis of contact 104, and contacts 104, 106 do not intersect the longitudinal axis of contact 100. Therefore, the needle main portions 100a, 102a, 104a, and 106a are not located within the virtual line 114.

  The contact column C1 is positioned within the virtual line 114, and the contact column C2 to C4 is positioned outside the virtual line 114. The six contacts 130 in the contact row C1 are arranged at equal intervals in the left-right direction, the contact row C2 is arranged in the rear direction from the contact row C1, and the six contacts 132 are arranged in the left-right direction. Are arranged at regular intervals. The two contacts 134 in the contact row C3 are arranged in one row in the front-rear direction, and the two contacts 136 in the contact row C4 are located in one row in the front-rear direction.

  The contact 130 is positioned on the longitudinal axis of the contact 132 corresponding to the contact 130, but is not positioned on the longitudinal axis of the contact 100. Therefore, the position of the contact 130 and the position of the contact 100 are not on the same straight line.

  The needle main portion 130a of the contact 130 extends from the edge 92 (base side) toward the contact 102, and the needle main portion 132a of the contact 132 extends rearward from the edge 92 (base side). Therefore, the direction of the needle main body portion 130a toward the needle tip and the direction of the needle main body portion 132a toward the needle tip are the same. The needle main part 134a of the contactor 134 extends from the edge 92 (base side) to the contactor 136 side, and the needle main body part 136a of the contactor 136 extends from the edge 92 (base part side) to the contactor 134 side. Accordingly, the direction of the needle main body portion 134a toward the needle tip is opposite to the direction of the needle main body portion 136a toward the needle tip.

  FIG. 10 is a plan view showing a state where an electrical test of the electronic device A is performed using the contacts 100, 102, 104, 106 of FIG. 9.

  As shown, the electrical test of the electronic device A is performed by bringing the contacts 100, 102, 104, 106 into contact with the electrode pads 74 of the electronic device A. At this time, the contacts 130, 132, 134, 136 do not contact the electronic device A because the electrode pad 74 has a height.

  FIG. 11 is a plan view showing a state where an electrical test of the electronic device C is performed using the contacts 130, 132, 134, 136 of FIG. 9.

  As shown, the electrical test of the electronic device C is performed by bringing the contacts 130, 132, 134, 136 into contact with the electrode pads 124 of the electronic device C. At this time, since the electrode pad 124 has a height, the contacts 130, 132, 134, 136 do not contact the electronic device C. Although not clearly shown in FIGS. 10 and 11, the needle tips of the respective contacts are at the same height position with respect to the electronic device positioned for performing the electrical test.

  After the electrical test of the electronic device A is performed by the contact arrays A1 to A4, the electrical test of the electronic device C can be performed by the contact arrays C1 to C4, so that it corresponds to the electronic device to be tested. Thus, it is not necessary to replace the electrical connection device having the contact arrangement.

  For example, when one type of electronic device is formed on one wafer, the electrical test of the other type of electronic device can be performed by simply replacing the wafer on which the other type of electronic device is formed. In addition, when many types of electronic devices are formed on one wafer, the moving device 14 moves only to a predetermined test position of the electrical connection device 10 without replacing the wafer, so that other electronic devices Electrical tests can be performed.

  The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In the above embodiment, a plate-like contact is used, but a needle-like contact may be used.

  In the above embodiment, by arranging the electrode pads of the electronic device to be tested in, for example, a circle, an ellipse or a polygon, a closed imaginary line connecting the points of the needle points of the contacts is a circle, an ellipse or a polygon. It may be.

It is a bottom view which shows roughly the electrical connection apparatus which concerns on this invention. FIG. 2 is a side view of FIG. 1 and a cross-sectional view schematically showing an electronic device and a part of a moving device thereof. It is an expanded sectional view obtained along the 3A-3A line of FIG. 1, and is a figure which shows the concept of the structure of the partial cross section of an electrical connection apparatus. It is an enlarged view which shows the holding member vicinity of FIG. 3A. (A) is a top view which shows the electronic device tested with the electrical connection apparatus which concerns on this invention, (B) is a top view which shows the electronic device different from the electronic device of (A). It is a figure which shows one Example of the arrangement | sequence of the contact of the electrical connection apparatus which concerns on this invention, Comprising: It is the conceptual diagram seen from the downward direction (electrode side of an electronic device) of a contact. FIG. 6 is a plan view showing a state where an electrical test of the electronic device of FIG. 4A is performed using a part of the contact of FIG. 5. FIG. 6 is a plan view illustrating a state where an electrical test of the electronic device of FIG. 4B is performed using a part of the contact of FIG. 5. (A) is a top view which shows the electronic device which the electrical connection apparatus based on this invention performs an electrical test, (B) is a top view which shows the electronic device different from the electronic device of (A). . FIG. 9 is a plan view showing another embodiment of the arrangement of the contacts of the electrical connection apparatus according to the present invention for testing each of the two electronic devices shown in FIG. 8. It is a top view which shows the state which performs the electrical test of the electronic device of FIG. 8 (A) using a part of contactor of FIG. It is a top view which shows the state which performs the electrical test of the electronic device of FIG. 8 (B) using a part of contactor of FIG.

Explanation of symbols

10 Electrical connection device 24 Probe board 26, 32, 34 Contact 100, 102, 104, 106, 108, 110 Contact 130, 132, 134, 136 Contact 112 Point of needle point 114 Virtual line 52, 54 Main body of needle Part 100a, 102a, 104a, 106a, 108a, 110a Needle main part 130a, 132a, 134a, 136a Needle main part 48, 56 Needle point part 46, 54 Needle point

Claims (5)

A substrate, a needle main body that is supported at the upper end on the lower surface of the substrate, a needle main body that extends in the left-right direction or the front-rear direction, and a needle tip that extends downward from the tip of the needle main body; A first contact group and a second contact group each including a plurality of contacts each having a needle tip portion having a needle tip at a lower end;
At least a part of the needle tips of the contacts belonging to the second contact group is located within a closed imaginary line connecting the points of the needle tips of the contacts belonging to the first contact group as viewed from above. An electrical connection device in which each contact of the first contact group is electrically connected to a corresponding contact of the second contact group.   The electrical connection device according to claim 1, wherein the first and second contact groups are selectively used.   The electrical connection device according to claim 1, wherein the closed virtual line is a circle, an ellipse, or a polygon.   2. The electrical connection device according to claim 1, wherein a remaining part of a needle tip of a contact belonging to the second contact group is positioned outside the closed imaginary line as viewed from above.   The electrical connection device according to claim 1, wherein a needle main part of a contact belonging to the first contact group is located outside the virtual line.

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