TWI388836B - Electrical connection device - Google Patents

Description

Electrical connection device

The present invention relates to an electrical connection device for performing electrical testing of electronic components such as an LSI (Large Scale Integrated Circuit), and more particularly to an application or specification (size, number of electrodes, electrode arrangement) An electrical connection device for electrical testing of a plurality of different electronic components.

A probe card (electrical connection device) capable of simultaneously testing a plurality of electronic component wafers of a plurality of electronic component wafers formed on one wafer has been widely used (for example, refer to Patent Documents 1 to 3).

The electrical connection device is mainly used for testing mass-produced electronic components such as a memory LSI or a CCD (Charge Coupled Device), but is also used in an application specific integrated circuit such as an ASIC (Application Specific Integrated Circuit). Or special purpose electronic components of system LSI or electronic components of various varieties and small quantities.

In general, since the electrical connection device is manufactured according to the specifications (size, number of electrodes, electrode arrangement, and the like) of the electronic component to be tested, electronic components or a plurality of types for special applications such as a special application integrated circuit and system LSI are used. When a small amount of electronic components are manufactured for manufacturing, the manufacturing cost of the manufacturer of the electrical connection device is large. Moreover, for a manufacturer of an electronic component using an electrical connection device, a process of manufacturing an electronic component having an electrode corresponding to an arrangement of contacts of the electrical connection device is complicated, and the manufacturing cost is also large.

Therefore, Patent Document 4 proposes an external measuring machine (electrical connecting device) having a probe (contactor) capable of simultaneously testing two kinds of semiconductor wafers having different functions.

The external measuring device can perform electrical testing of a semiconductor device including a plurality of first semiconductor wafer regions formed on a wafer and a second scribe line region formed between the first semiconductor wafer regions Semiconductor wafer area.

However, an external measuring device cannot test a semiconductor device including a semiconductor chip of another type having different specifications for an electrical connection device that tests a semiconductor device including a plurality of first and second semiconductor chips (electronic components of the same specification). .

Further, when a plurality of types of electronic components having different specifications are tested by an electrical connecting device, it is required to arrange contacts for testing the respective electronic components without contacting each other. Further, it is required to arrange the contacts in use during the test of an electronic component without contacting the contacts of the other electronic components. Although the external measuring device disclosed in Patent Document 4 satisfies these requirements, as described above, it is not an electrical connecting device capable of testing electronic components having different specifications in the wafer forming region formed on the wafer.

Therefore, an electrical connection device having a plurality of contacts for use in each electronic component having different specifications can be considered, but in the electrical connection device in which the contacts are arranged corresponding to the electrode arrangement of each electronic component, the contact is Since the arrangement area is increased, the overall size of the device is also increased, and the manufacturing cost is increased.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-216204

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2005-243939

[Patent Document 3] Japanese Patent Laid-Open Publication No. 2005-127958

[Patent Document 4] Japanese Laid-Open Patent Publication No. Hei 7-201907 (paragraph "0009", "0010")

It is an object of the present invention to provide a different arrangement of contacts for testing a plurality of types of electronic components having different sizes, numbers, arrangements, and the like, and to save space for arranging the contacts.

An electrical connection device according to the present invention includes a substrate, and a needle main body portion whose upper end is supported on a lower surface of the substrate and extends in a left-right direction or a front-rear direction, and first and second portions including a plurality of contacts including a needle tip portion The contact subgroup extends downward from a front end of the needle body portion and has a needle tip at a lower end.

At least a portion of the contact sub-tip belonging to the second contact sub-group is located in a closed imaginary line connecting the points of the contact sub-tips belonging to the first contact sub-group as viewed from above.

The closed imaginary line can be circular, elliptical or polygonal. The remaining portion of the contact tip belonging to the second contact subgroup may be located outside the closed imaginary line as viewed from above. The contact sub-needle main body belonging to the first contact sub-group may be located outside the imaginary line.

According to the electrical connection device of the present invention, at least a part of the contact sub-tips belonging to the second contact sub-group are located in a closed imaginary line connecting the points of the contact sub-tips belonging to the first contact sub-group, as viewed from above, The contact space of the contact sub-group can be saved, and the contact element belonging to the first contact sub-group is used for one of the plurality of electronic components having different sizes of electrodes, the number of electrodes, and the arrangement of the electrodes, and is used for other electronic components. The contacts belonging to the second contact subgroup allow electrical testing of different types of electronic components.

Thereby, it is not necessary to manufacture an electrical connection device for each electronic component having a different specification, and thus the manufacturing cost of the electrical connection device can be reduced. Moreover, since it is not necessary to replace the electrical connection device based on the electronic component to be tested, it is possible to shorten the time for testing the electronic component of a different type.

Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. Further, the contact person in the present invention will be described as a probe.

[about terms]

In the present invention, the front-rear direction refers to the longitudinal direction of the short side of the electronic component shown in FIG. 4 or the direction of the longitudinal direction of the electrodes (four) disposed at the end of the short side; The direction intersecting the front-rear direction, that is, the longitudinal direction of the long side of the electronic component or the direction of the horizontal direction of the electrodes (eight) disposed at the end of the long side; the so-called vertical direction refers to the paper back direction. However, these directions are different depending on the posture of the component when the electronic component as the test object is placed on the test device in which the electrical connection device is mounted.

Hereinafter, an embodiment of the electrical connecting device of the present invention will be described with reference to Figs. 1 to 7 .

Fig. 1 is a bottom plan view schematically showing an electrical connecting device 10 of the present invention, and Fig. 2 is a side view of Fig. 1 and schematically showing a side view of a part of an electronic component and a moving device thereof.

The electrical connecting device 10 includes a lower horizontal support member 18, a fixing ring 20 that is attached to the lower surface 16 of the support member 18 by bolts, and a probe assembly 22 that is a contact subassembly that holds the edge portion by the fixing ring 20. .

The probe assembly 22 includes a probe substrate 24 and a contact 26 which is a plurality of probes formed on the lower surface of the probe substrate 24.

The electrical connection device 10 is for electrically connecting the electrode pad 30 of the electronic component 12 to a measurement terminal of a tester (not shown) for electrical testing of the electronic component 12. In the example shown in FIG. 2, during the test, the mobile device 14 moves the electronic component 12 upward, bringing the electrode pad 30 of the electronic component 12 into contact with the contact 26 of the electrical connector 10. When the other electronic components are tested, the mobile device 14 moves the electronic component 12 downward, and then moves the electronic component 12 from below the electrical connection device 10 in either direction. Thereafter, the mobile device 14 positions the other electronic components below the electrical connection device 10, moving the electronic components upward, and contacting the electrode pads of the electronic components with the contacts 26 of the electrical connector 10.

Fig. 3A is an enlarged cross-sectional view taken along line 3A-3A of Fig. 1, and is a view showing a concept of a configuration of a partial cross section of the electrical connecting device. Therefore, the reference numerals between the contacts of FIG. 1 and FIG. 3A are different, but the contacts shown in FIG. 1 and FIG. 3A have the same configuration.

The probe substrate 24 is made of an electrically insulating material such as ceramic or polyimide resin, and has a rectangular planar shape. Further, the probe substrate 24 includes a plurality of contact members 32 and a plurality of contact members 34 formed on the lower surface thereof. In FIG. 3A, for the sake of simplicity, the wiring of the plurality of contacts 32 and the two contact members 32, 34 of the plurality of contacts 34 and the two contact members 32, 34 will be described.

The contact 32 and the contact 34 are spaced apart from each other in a direction parallel to the lower surface of the probe substrate 24. The inside of the probe substrate 24 includes an internal wiring 36 and an internal wiring 38 that are connected to the contact 32 and the contact 34, and a conductive holding member 40 that separates and holds the internal wirings 36 and 38 from each other. Further, the arrangement of the contact elements will be described with reference to Fig. 5 and subsequent figures, using reference numerals different from those of the contact members 32, 34.

In the illustrated example, the electrode pad 30 is disposed below the contact 32. The holding member 40 is fixed to the inside of the probe substrate 24 and has a cylindrical shape extending in the thickness direction of the probe substrate 24. Further, the holding member 40 is electrically connected to the wiring 18a provided inside the support member 18. The wiring 18a is connected to a measurement terminal of a test device (not shown) that electrically tests the electronic component.

The contact 32 includes a base portion 42 supported by the probe substrate 24, a needle main body portion 44 extending in the left direction from the base portion 42, and a needle tip portion 48 extending downward from the front end of the needle main body portion 44 and having a needle tip 46 at the distal end. Similarly, the contact member 34 includes a base portion 50 supported by the probe substrate 24, a needle main body portion 52 extending from the base portion 50 in the right direction, and a needle tip extending downward from the front end of the needle main body portion 52 and having a needle tip 54 at the distal end thereof. Part 56.

Fig. 3B is an enlarged view showing the vicinity of the holding member 40 of Fig. 3A. Each of the wires 36 and 38 is formed of a linear conductive member extending in the end direction (left-right direction) of the probe substrate 24, and includes an annular portion 60 having a hole 58. A holding member 40 is inserted into the hole 58, and the wires 36, 38 are rotatably held by the holding member 40. Therefore, the contact members 32, 34 are electrically connected to each other via the holding member 40.

Furthermore, since the contactors 32 and 34 are respectively used for electrical testing of the two types of electronic components A and B described later, when one contact is used for electrical testing of one of the electronic components A and B, another The contact of one party is not used. Therefore, the electrical connecting device of the present invention does not electrically test two different electronic components A and B at the same time, so that the wiring in the electrical connecting device that electrically connects the electrode of the electronic component A and the measuring terminal of the tester can be shared. And wiring in the electrical connection device that electrically connects the electrode of the electronic component B to the measurement terminal of the tester. Thereby, it is not necessary to wire each electronic component, and the cost of wiring can be suppressed.

4(A) is a plan view showing an electronic component tested by the electrical connecting device of the present invention, and FIG. 4(B) is a plan view showing an electronic component different from the electronic component of FIG. 4(A).

As shown in FIG. 4(A), the electronic component A has a rectangular substrate 70. Further, the electronic component A includes eight electrode pads 74 which are spaced apart from each other along the long sides 72 (the side in the front-rear direction in the drawing) of the substrate 70 at the front and rear end portions of the substrate 70. Arranged in a row in the left-right direction; and four electrode pads 74 along the short sides 76 of the substrate 70 (the sides in the left-right direction in the drawing), at equal intervals around the left and right ends of the substrate 70 Configured in a row in the direction.

Further, as shown in FIG. 4(B), the electronic component B has a rectangular substrate 80 which is smaller than the substrate area of the electronic component A. Further, the electronic component B includes four electrode pads 84 along the long sides 82 (the sides in the front-rear direction in the drawing) of the substrate 80 at equal intervals in the left-right direction near the front end portion of the substrate 80. Configured on a line.

[An example of arrangement of contacts used in an electrical connection device]

Fig. 5 is a view showing an embodiment of arrangement of contacts used in the electrical connecting device of the present invention, and is a conceptual view seen from below the contact (electrode side of the electronic component). Furthermore, the illustrated contact sub-sets represent the contacts 26, 32, 34 in a simplified shape and are identical to the contacts 26, 32, 34. Further, the illustrated contact has a curved edge 90 at one end and an edge 92 that is linear with respect to the edge 90 at the other end. Edge 90 represents the contact tip side and edge 92 represents the base side of the contact.

The contact shown in FIG. 5 constitutes a first contact subgroup for testing the electronic component A of FIG. 4(A) and a second contact subgroup for testing the electronic component B of FIG. 4(B). .

The first contact subgroup includes: 8 contactors 100 constituting the contact sub-row A1; 8 contact sub-blocks 102 which are spaced apart from the contact sub-row A1 and which are in contact with the sub-row A2; 4 contact sub-104, such contacts The sub-104 constitutes a contact sub-row A3 located on the left side of the contact sub-rows A1, A2 and between the contact sub-rows A1, A2; and four contact sub-106s, which are located in the contact sub-rows A1, A2 The contact side row A4 on the right side and between the contact sub-rows A1, A2.

The second contact subgroup includes: six contactors 108 constituting the contact sub-row B1 surrounded by the contact sub-rows A1 to A4; and six contact sub-110s, which are formed in the direction after the contact sub-row B1 and The contact sub-row B2 surrounded by the contact sub-rows A1 to A4.

In the contact sub-row A1, eight contact elements 100 are arranged in a row in the left-right direction at equal intervals, and the needle main body portion 100a of each contact 100 extends from the edge 92 (base side) toward the contact sub-102 side of the contact sub-row A2. . Further, in the contact sub-row A2, the eight contact sub-elements 102 are arranged in a line in the left-right direction at equal intervals, and the needle main body portion 102a of each contact sub-102 is contacted from the edge 92 (base portion side) toward the contact sub-line A1. Side extension.

In the contact sub-row A3, the four contact sub-104s are arranged in a row in the front-rear direction at equal intervals, and the needle main body portion 104a of each contact sub-104 extends from the edge 92 (base side) toward the contact sub-106 side of the contact sub-row A4. . Further, in the contact sub-row A4, the eight contact elements 106 are arranged in a line in the front-rear direction at equal intervals, and the needle main body portion 106a of each contact 106 is brought from the edge 92 (base side) toward the contact sub-contact 104 of the sub-line A3. Side extension.

In the contact sub-rows A1 to A3, the closed imaginary line 114 connecting the point 112 of the tip of the contact points 100, 102, 104, 106 adjacent to each other forms an octagon.

The contact 102 is located on the longitudinal axis of the contact 100 corresponding to the contact 102, and the contact 106 is located on the longitudinal axis of the contact 104 corresponding to the contact 106, but the contact 100, 102 does not intersect the longitudinal axis of the contact 104, and the contacts 104, 106 do not intersect the longitudinal axis of the contact 100. Therefore, the needle body portions 100a, 102a, 104a, 106a are not located within the imaginary line 114.

The contact sub-rows B1, B2 are located within the imaginary line 114. The six contactors 108 of the contact sub-row B1 are equally arranged in a row in the left-right direction, and the contact sub-row B2 is located further rearward than the contact sub-row B1, and the six contact sub-110s are equally spaced in the left-right direction. Arranged in a row.

The needle main body portion 108a of the contact 108 extends from the edge 92 (base side) toward the contact sub-100 side, and the needle main body portion 110a of the contact 110 extends from the edge 92 (base side) toward the contact sub-102 side. Therefore, the direction toward the needle tip of the needle main body portion 108a is opposite to the direction toward the needle tip of the needle main body portion 110a.

The contact 110 is located on the longitudinal axis of the contact 108 corresponding to the contact 110, but is not located on the longitudinal axis of the contact 100. Therefore, the position of the contact 110 is not in line with the position of the contact 100.

Fig. 6 is a plan view showing a state in which the electronic component A is electrically tested using the contacts 100, 102, 104, and 106 of Fig. 5.

As shown, the contacts 100, 102, 104, 106 are brought into contact with the electrode pads 74 of the electronic component A, whereby the electronic component A is electrically tested. At this time, the contact 108 and the contact 110 are not in contact with the electronic component A because the electrode pad 74 has a height.

Fig. 7 is a plan view showing a state in which the electronic component B is electrically tested using the contacts 108 and 110 of Fig. 5.

As shown, the contacts 108, 110 are brought into contact with the electrode pads 84 of the electronic component B, whereby the electronic component B is electrically tested. At this time, since the electrode pad 84 has a height, the contacts 100, 102, 104, 106 are not in contact with the electronic component B. Furthermore, although not explicitly shown in FIGS. 6 and 7, each contact tip is located at the same height relative to the electronic component positioned for electrical testing.

After the electrical component A is electrically tested by the contact sub-rows A1 to A4, the electronic component B can be electrically tested by the contact sub-rows B1 and B2, so that it is not necessary to replace the contacted electronic component corresponding to the electronic component to be tested. Arranged electrical connections. For example, in the case where an electronic component is formed on one wafer, only other wafers of other types of electronic components are replaced, and the other types of electronic components can be electrically tested. Moreover, in the case where a plurality of electronic components are formed on one wafer, the wafer is not replaced, and the wafer is moved to the predetermined test position of the electrical connection device 10 by the mobile device 14 to electrically test other electronic components. .

[Other Embodiments of Arrangement of Contactors Used in Electrical Connection Devices]

Hereinafter, another embodiment of the arrangement of the contactors used in the electrical connecting device of the present invention will be described with reference to Figs. 8 to 11 . In addition, since the electrical connection device of the present embodiment has the same configuration as that of the electrical connection device shown in FIGS. 1 to 3, the description thereof will be omitted. Hereinafter, the arrangement of the contact members of different configurations will be described.

8(A) and 8(B) are plan views showing electronic components A and C for electrical testing of the power supply gas connecting device, respectively. Since the electronic component A is the same as the electronic component A shown in FIG. 4(A), the same reference numerals are attached thereto, and the description thereof is omitted.

As shown in FIG. 8(B), the electronic component C has a rectangular substrate 120 having the same area as the electronic component A. Further, the electronic component C includes eight electrode pads 124 which are spaced apart from each other along the long sides 122 of the substrate 120 (the side in the front-rear direction in the drawing) at the front end portion of the substrate 120. And a plurality of electrode pads 124 disposed along the short sides 126 of the substrate 120 (the sides in the left-right direction in the drawing) in the front-rear direction near the left and right ends of the substrate 120. One line.

Further, the electronic component C has the same except for the two electrode pads 74 on the outermost side (the frontmost and the last in the front-rear direction) of the four electrode pads 74 disposed along the short side 76 of the substrate 70 of the electronic component A. Arrangement of electrode pads.

Fig. 9 is a view showing an embodiment of arrangement of contacts of an electrical connecting device for testing the electronic components A and C shown in Fig. 8, respectively, and the concept of observation from the lower side of the contact (electrode side of the electronic component). Figure. Furthermore, the illustrated contact sub-sets represent the contacts 26, 32, 34 in a simplified shape and are identical to the contacts 26, 32, 34. Further, the illustrated contact has a curved edge 90 at one end and an edge 92 that is linear with respect to the edge 90 at the other end. Edge 90 represents the contact tip side and edge 92 represents the base side of the contact.

The contact shown in FIG. 9 constitutes a first contact subgroup for testing the electronic component A of FIG. 8(A) and a second contact subgroup for testing the electronic component C of FIG. 8(B). .

The first contact subgroup includes: 8 contactors 100 constituting the contact sub-row A1; 8 contact sub-elements 102 which are spaced apart from the contact sub-row A1 and which are in contact with the sub-row A2; and are formed in the contact sub-rows A1, A2 The four contactors 104 of the contact sub-row A3 on the left side; and the four contact sub-106s of the contact sub-row A4 located on the right side of the contact sub-rows A1, A2.

The second contact subgroup includes: eight contact 130s constituting the contact sub-row C1 surrounded by the contact sub-rows A1 to A4; and eight contact sub-132s, which are opposed to the contact sub-line C1 and located a contact sub-row C2 contacting the sub-row A2; two contact sub-134, the contact sub-134 forming a contact sub-line C3 disposed on the left side of the contact sub-row C1, C2 and connected to the contact sub-row A3; Two contactors 136, which constitute a contact sub-row C4 disposed on the right side of the contact sub-rows C1, C2 and connected to the contact sub-row A4.

In the contact sub-row A1, eight contact elements 100 are arranged in a row in the left-right direction at equal intervals, and the needle main body portion 100a of each contact 100 extends from the edge 92 (base side) toward the contact sub-102 side of the contact sub-row A2. . Further, in the contact sub-row A2, the eight contact sub-elements 102 are arranged in a line in the left-right direction at equal intervals, and the needle main body portion 102a of each contact sub-102 is contacted from the edge 92 (base portion side) toward the contact sub-line A1. Side extension.

In the contact sub-row A3, the four contact sub-104s are arranged in a row in the front-rear direction at equal intervals, and the needle main body portion 104a of each contact sub-104 extends from the edge 92 (base side) toward the contact sub-106 side of the contact sub-row A4. . Further, in the contact sub-row A4, the eight contact elements 106 are arranged in a line in the front-rear direction at equal intervals, and the needle main body portion 106a of each contact 106 is brought from the edge 92 (base side) toward the contact sub-contact 104 of the sub-line A3. Side extension.

In the contact sub-rows A1 to A3, the closed imaginary line 114 connecting the point 112 of the tip of the contact points 100, 102, 104, 106 adjacent to each other forms an octagon.

The contact 102 is located on the longitudinal axis of the contact 100 corresponding to the contact 102, and the contact 106 is located on the longitudinal axis of the contact 104 corresponding to the contact 106, but the contact 100, 102 does not intersect the longitudinal axis of the contact 104, and the contacts 104, 106 do not intersect the longitudinal axis of the contact 100. Therefore, the needle body portions 100a, 102a, 104a, 106a are not located within the imaginary line 114.

The contact sub-line C1 is located in the imaginary line 114, and the contact sub-rows C2 to C4 are located outside the imaginary line 114. The six contact 130s of the contact sub-row C1 are equally arranged in a row in the left-right direction, and the contact sub-rows C2 are arranged in a direction further rearward than the contact sub-row C1, and the six contact sub-132s are equally spaced from each other. Arrange in a row in the direction. The two contact members 134 of the contact sub-row C3 are arranged in a row in the front-rear direction, and the two contact members 136 of the contact sub-row C4 are arranged in a row in the front-rear direction.

The contact 130 is located on the longitudinal axis of the contact 132 corresponding to the contact 130, but is not located on the longitudinal axis of the contact 100. Therefore, the position of the contact 130 is not in line with the position of the contact 100.

The needle main body portion 130a of the contact 130 extends from the edge 92 (base side) toward the contact sub-102 side, and the needle main body portion 132a of the contact sub-132 extends rearward from the edge 92 (base side). Therefore, the direction toward the needle tip of the needle main body portion 130a is the same as the direction toward the needle tip of the needle main body portion 132a. The needle main body portion 134a of the contact 134 extends from the edge 92 (base side) toward the contact 136 side, and the needle main body portion 136a of the contact 136 extends from the edge 92 (base side) toward the contact 134 side. Therefore, the direction toward the needle tip of the needle main body portion 134a is opposite to the direction toward the needle tip of the needle main body portion 136a.

Fig. 10 is a plan view showing a state in which the electronic component A is electrically tested using the contacts 100, 102, 104, and 106 of Fig. 9.

As shown, the contacts 100, 102, 104, 106 are brought into contact with the electrode pads 74 of the electronic component A, whereby the electronic component A is electrically tested. At this time, the contactors 130, 132, 134, and 136 are not in contact with the electronic component A because the electrode pad 74 has a height.

Fig. 11 is a plan view showing a state in which the electronic component C is electrically tested using the contacts 130, 132, 134, and 136 of Fig. 9.

As shown, the contacts 130, 132, 134, 136 are brought into contact with the electrode pads 124 of the electronic component C, whereby the electronic component C is electrically tested. At this time, since the electrode pad 124 has a height, the contacts 130, 132, 134, 136 are not in contact with the electronic component C. Furthermore, although not explicitly shown in FIGS. 10 and 11, each of the contact sub-tips is located at the same height relative to the electronic components that are positioned for electrical testing.

After the electrical component A is electrically tested by the contact sub-rows A1 to A4, the electronic component C can be electrically tested by the contact sub-rows C1 to C4, so that it is not necessary to replace the contact with the electronic component as the test object. Arranged electrical connections.

For example, in the case where an electronic component is formed on one wafer, only other wafers of other types of electronic components are replaced, and the other types of electronic components can be electrically tested. Moreover, in the case where a plurality of electronic components are formed on one wafer, the other electronic components can be electrically operated without moving the wafer and moving the wafer to the predetermined test position of the electrical connection device 10 only by the mobile device 14. test.

The present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention.

In the above embodiment, a plate-shaped contact is used, but a needle-shaped contact can also be used.

In the above embodiment, the electrode pads of the electronic component as the test object may be arranged in, for example, a circular shape, an elliptical shape or a polygonal shape, whereby the closed imaginary line connecting the points contacting the needle tip is circular, elliptical or Polygon.

10. . . Electrical connection device

twenty four. . . Probe substrate

26, 32, 34. . . Contactor

46, 54. . . Tip

48, 56. . . Tip tip

52, 54. . . Needle body

100, 102, 104, 106, 108, 110. . . Contactor

100a, 102a, 104a, 106a, 108a, 110a. . . Needle body

112. . . Point of the needle

114. . . Imaginary line

130, 132, 134, 136. . . Contactor

130a, 132a, 134a, 136a. . . Needle body

Fig. 1 is a bottom plan view schematically showing an electrical connecting device of the present invention.

Figure 2 is a side elevational view of Figure 1 and is a cross-sectional view schematically showing a portion of an electronic component and its moving device.

Fig. 3A is an enlarged cross-sectional view taken along line 3A-3A of Fig. 1, and is a view showing a concept of a partial sectional configuration of the electrical connecting device.

Fig. 3B is an enlarged view showing the vicinity of the holding member of Fig. 3A.

4(A) is a plan view showing an electronic component tested by the electrical connecting device of the present invention, and FIG. 4(B) is a plan view showing an electronic component different from the electronic component of FIG. 4(A).

Fig. 5 is a view showing an embodiment of the arrangement of contactors of the electrical connecting device of the present invention, and is a conceptual view seen from below the contact (electrode side of the electronic component).

Fig. 6 is a plan view showing a state in which the electronic component of Fig. 4(A) is electrically tested using one of the contacts of Fig. 5.

Fig. 7 is a plan view showing a state in which the electronic component of Fig. 4(B) is electrically tested using one of the contacts of Fig. 5.

Fig. 8(A) is a plan view showing an electronic component for electrical testing of the electrical connecting device of the present invention, and Fig. 8(B) is a plan view showing an electronic component different from the electronic component of Fig. 8(A).

Fig. 9 is a plan view showing another embodiment of the arrangement of the contacts of the electrical connecting device of the present invention for testing the two electronic components shown in Fig. 8.

Fig. 10 is a plan view showing a state in which the electronic component of Fig. 8(A) is electrically tested using one of the contacts of Fig. 9.

Fig. 11 is a plan view showing a state in which the electronic component of Fig. 8(B) is electrically tested using one of the contacts of Fig. 9.

90, 92. . . edge

100, 102, 104, 106, 108, 110. . . Contactor

100a, 102a, 104a, 106a, 108a, 110a. . . Needle body

112. . . Point of the needle

114. . . Imaginary line

A1, A2, A3, A4, B1, B2. . . Contact sub-row

Claims (5)

An electrical connection device comprising a substrate, wherein the upper end is supported by the lower surface of the substrate, and the needle body portion extending in the left-right direction or the front-rear direction, and the first and second contacts respectively including a plurality of contacts including the needle tip portion a sub-group extending downward from a front end of the needle main body and having a needle tip at a lower end; at least a part of the contact sub-tip belonging to the second contact sub-group is located at the first contact as viewed from above The sub-group is in the closed imaginary line of the point of the contact tip. The electrical connecting device of claim 1, wherein the closed imaginary line is circular, elliptical or polygonal. The electrical connection device of claim 1, wherein the remaining portion of the contact tip of the second contact subgroup is located outside the closed imaginary line as viewed from above. The electrical connection device of claim 1, wherein the contact sub-needle body portion belonging to the first contact sub-group is located outside the imaginary line. The electrical connection device according to claim 1, wherein the first contact group and the second contact sub-system of the first group and the second group are electrically connected to each other, and the first group and the second group are selectively used. The first and second contacts of the two groups.