CN210487828U

CN210487828U - Probe head and conductive probe of probe head

Info

Publication number: CN210487828U
Application number: CN201921057402.XU
Authority: CN
Inventors: 黄雅如; 王宏杰
Original assignee: Premtek International Inc
Current assignee: Premtek International Inc
Priority date: 2019-07-08
Filing date: 2019-07-08
Publication date: 2020-05-08
Anticipated expiration: 2029-07-08

Abstract

The utility model discloses a probe and conductive probe of probe, conductive probe include the first long lateral margin and the long lateral margin of second that are located opposite both sides respectively, and the center pin has been defined between the long lateral margin of first long lateral margin and second. The conductive probe includes a central section, upper and lower connection sections extending from opposite ends of the central section along the central axis in opposite directions, and upper and lower contact sections extending from the upper and lower connection sections along the central axis in a direction away from the central section. The lower contact section is used for abutting against an integrated circuit component to be tested and comprises a testing tip which is arranged in an offset mode compared with the central axis and a curved surface which is connected with the testing tip and the second long side edge, and a first distance of the testing tip compared with the first long side edge is smaller than a second distance of the testing tip compared with the second long side edge. Accordingly, the test tip is supported by the conductive probe through the curved surface by forming the test tip at the lower contact section to be offset from and connected to the curved surface.

Description

Probe head and conductive probe of probe head

Technical Field

The utility model relates to a probe especially relates to a probe head and conductive probe thereof.

Background

The conventional probe head includes a plurality of conductive probes, one end of each conductive probe is capable of abutting against the interposer, and the other end of each conductive probe is capable of detecting an ic device under test. However, since the conventional probe head is used and improved for many years, the structure of the probe head is difficult to be changed greatly, and the structural design of the conductive probes included in the conventional probe head is not limited to a predetermined frame (e.g., the tip of the conventional conductive probe for detection is located at the center and is composed of a plurality of planes).

Therefore, the present invention considers that the above mentioned defects can be improved, and the application of scientific principles is especially studied and matched, and finally the present invention is provided with a reasonable design and can effectively improve the above mentioned defects.

SUMMERY OF THE UTILITY MODEL

An embodiment of the present invention provides a probe head and a conductive probe thereof, which can effectively improve the defects possibly generated by the existing conductive probe.

The embodiment of the utility model discloses probe head for integrated circuit tests and include: an upper guide plate unit and a lower guide plate unit which are disposed spaced apart from each other; a plurality of conductive probes, one end of which penetrates through the upper guide plate unit and the other end of which penetrates through the lower guide plate unit; wherein, any conductive probe comprises a first long side edge and a second long side edge which are respectively positioned at two opposite sides, and a central axis is defined between the first long side edge and the second long side edge of any conductive probe; any one of the conductive probes includes: a central section located between the upper guide plate unit and the lower guide plate unit; an upper connecting section and a lower connecting section, which are respectively formed by extending from two opposite ends of the central section along the central axis in opposite directions, the upper connecting section is arranged in the upper guide plate unit in a penetrating way, and the lower connecting section is arranged in the lower guide plate unit in a penetrating way; an upper contact section, which is formed by extending the upper guide plate unit from the upper connection section along the central axis towards the direction far away from the central section, and is used for abutting against a signal adapter plate (space transformer); a lower contact section formed by extending the lower guide plate unit from the lower connection section along the central axis in a direction away from the central section, wherein the lower contact section is used for abutting against an integrated circuit component to be tested; the lower contact section comprises a test tip which is arranged in an offset manner compared with the central axis and a curved surface which connects the test tip and the second long side edge, and a first distance of the test tip compared with the first long side edge is smaller than a second distance of the test tip compared with the second long side edge.

Preferably, in any one of the conductive probes, a ratio of the first distance divided by the second distance is greater than or equal to 0 and less than 1, and the first distance is between 0 micrometers (μm) and 40 micrometers.

Preferably, in any one of the conductive probes, the curved surface includes a first curved surface connected to the testing tip and a second curved surface connected to the second long side edge, and the first curved surface and the second curved surface are disposed in opposite directions.

Preferably, in any one of the conductive probes, the testing tip protrudes by a penetration length of 3 to 15 micrometers compared to a boundary between the first curved surface and the second curved surface.

Preferably, in a longitudinal cross section covering the testing tip of any one of the conductive probes and perpendicular to the first long side edge, the lower contact section forms an included angle of 30 to 150 degrees at the testing tip.

Preferably, any one of the conductive probes comprises a first long side surface and a second long side surface which are respectively positioned at two opposite sides, and the central axis of any one of the conductive probes is positioned between the first long side surface and the second long side surface; in any one of the conductive probes, the upper connection segment includes an extension portion extending from the first long side surface toward a direction away from the central axis, the upper contact segment includes a protrusion portion extending from the first long side surface toward the direction away from the central axis, and the protrusion portion and the extension portion are disposed at an interval.

Preferably, in any one of the conductive probes, the extension part is located at a position of the upper connecting section far away from the central section, so that the upper connecting section is formed into a configuration with a wide upper part and a narrow lower part; any of the conductive probes is not formed with any structure protruding beyond the second long side.

Preferably, any one of the conductive probes comprises: a metal pin body, which comprises a plurality of layers of pin bodies which are stacked, wherein each layer of pin body is long and parallel to the central shaft, and one of the plurality of layers of pin bodies is provided with a testing tip; the metal film is completely coated on the outer surface of the metal needle body; wherein, the thickness of the metal film is less than 10% of the thickness of the metal needle body.

Preferably, in any one of the conductive probes, the metal film includes N metal layers stacked in sequence and located outside the metal pin body, and N is a positive integer greater than 1.

The embodiment of the utility model also discloses a conductive probe of the probe head, which comprises a first long side edge and a second long side edge which are respectively positioned at two opposite sides, and a central shaft is defined between the first long side edge and the second long side edge; the conductive probe includes: a central section; an upper connection section and a lower connection section respectively formed by extending from opposite ends of the central section in opposite directions to each other along the central axis; an upper contact section formed by extending from the upper connection section along the central axis in a direction away from the central section, the upper contact section being used for abutting against a signal adapter plate; a lower contact section formed by extending from the lower connection section along the central axis in a direction away from the central section, the lower contact section being adapted to abut against an integrated circuit device to be tested; the lower contact section comprises a test tip which is arranged in an offset manner compared with the central axis and a curved surface which connects the test tip and the second long side edge, and a first distance of the test tip compared with the first long side edge is smaller than a second distance of the test tip compared with the second long side edge.

To sum up, the probe head and the conductive probe thereof disclosed in the embodiments of the present invention are configured with the offset at the lower contact section and connected to the testing tip of the curved surface, so that the conductive probe can support the testing tip through the curved surface to achieve the preferable supporting effect.

For a further understanding of the nature and technical content of the invention, reference should be made to the following detailed description and accompanying drawings, which are provided for illustration only and are not intended to limit the scope of the invention.

Drawings

Fig. 1 is a schematic plan view of a probe head according to an embodiment of the present invention.

Fig. 2 is a partially enlarged schematic view of a portion II of fig. 1.

Fig. 3 is a schematic view of a variation of fig. 2.

Fig. 4 is a partially enlarged schematic view of a portion IV of fig. 1.

Fig. 5 is a schematic sectional view of fig. 4 taken along the sectional line V-V (the metal film is omitted).

Fig. 6 is a schematic view showing a variation of fig. 5 (omitting the metal film).

Fig. 7 is a schematic cross-sectional view of fig. 1 along the sectional line VII-VII.

Fig. 8 is a partially enlarged view of a portion VIII of fig. 7.

Fig. 9 is a schematic view of a variation of fig. 8.

Fig. 10 is a schematic view of another variation of fig. 8.

Detailed Description

Please refer to fig. 1 to 10, which are exemplary embodiments of the present invention, and it should be noted that the related numbers and shapes mentioned in the accompanying drawings are only used for describing the embodiments of the present invention in order to understand the contents of the present invention, but not for limiting the scope of the present invention.

Referring to FIG. 1, a probe head 100 for IC testing is disclosed, which is suitable for testing an IC device under test (not shown), such as a semiconductor wafer. The probe head 100 includes a positioning base 1 and a plurality of conductive probes 2 passing through the positioning base 1, and two ends of the plurality of conductive probes 2 respectively penetrate through the positioning base 1, so that one ends of the plurality of conductive probes 2 (e.g., top ends of the conductive probes 2 in fig. 1) can be used for being fixed and electrically connected to a signal adapter (not shown in the figure) and the other ends of the plurality of conductive probes 2 (e.g., bottom ends of the conductive probes 2 in fig. 1) can be used for abutting against and detecting the ic component to be tested.

It should be noted that, in the embodiment, the plurality of conductive probes 2 are collocated with the positioning base 1 for illustration, but the invention is not limited thereto. For example, in other embodiments not shown, the conductive probe 2 may be applied (e.g., sold) separately or in combination with other components. Moreover, to facilitate understanding of the present embodiment, the drawings only show a partial structure of the probe head 100, so as to clearly show the structure and connection relationship of the various components of the probe head 100. The structure and connection relationship of the positioning base 1 and the conductive probe 2 will be described below.

The positioning base 1 includes an upper guide unit 11, a lower guide unit 12 spaced apart from the upper guide unit 11, and a spacing unit (not shown) clamped between the upper guide unit 11 and the lower guide unit 12. That is, the upper guide plate unit 11 and the lower guide plate unit 12 are separated by the above-mentioned spacing unit in this embodiment, and the spacing unit in this embodiment may be a ring-shaped spacing plate, but the specific structure of the spacing unit may be adjusted and changed according to the design requirement, and is not limited to the embodiment.

Furthermore, the upper guide plate unit 11 and the lower guide plate unit 12 are laterally displaced from each other in the present embodiment, so that the two end portions of each conductive probe 2 are respectively pressed by the upper guide plate unit 11 and the lower guide plate unit 12, and the central portion of each conductive probe 2 is deformed, so that each conductive probe 2 is positioned on the upper guide plate unit 11 and the lower guide plate unit 12.

In more detail, in the present embodiment, the upper guide unit 11 is a single guide 111 formed with a plurality of upper through holes 112, and the lower guide unit 12 is a single guide 121 formed with a plurality of lower through holes 122. The plurality of lower through holes 122 of the lower guide plate unit 12 correspond to the plurality of upper through holes 112 of the upper guide plate unit 11 in position, respectively, so that the corresponding upper through holes 112 and lower through holes 122 can allow one conductive probe 2 to pass through.

In addition, in other embodiments not shown in the present invention, at least one of the upper guide plate unit 11 and the lower guide plate unit 12 may also include two guide plates disposed in parallel and a spacer sandwiched between the two guide plates, so as to clamp any one of the conductive probes 2 by the mutual displacement of the two guide plates.

As shown in fig. 1, one end of each of the conductive probes 2 is inserted into (the corresponding upper through hole 112 of) the upper guide plate unit 11, and the other end of each of the conductive probes 2 is inserted into (the corresponding lower through hole 122 of) the lower guide plate unit 12. Since the plurality of conductive probes 2 of the probe head 100 of the present embodiment have substantially the same structure, the drawings and the following description take a single conductive probe 2 and the corresponding upper through hole 112 and lower through hole 122 as examples, but the present invention is not limited thereto. For example, in an embodiment not shown in the present invention, the plurality of conductive probes 2 of the probe head 100 may also have different configurations from each other.

As shown in fig. 1 and 7, the conductive probe 2 includes a first long side edge 2a and a second long side edge 2b on opposite sides, and a first long side surface 2c and a second long side surface 2d on opposite sides. In other words, the conductive probe 2 is illustrated as a conductive probe 2 with a substantially rectangular cross section in the present embodiment, and the first long side edge 2a, the second long side edge 2b, the first long side surface 2c, and the second long side surface 2d of the conductive probe 2 can be surrounded together to form a rectangular tube, but the invention is not limited thereto.

Furthermore, for the convenience of describing the structure of the conductive probe 2 of the present embodiment, the conductive probe 2 defines a central axis C parallel to the length direction between the first long side edge 2a and the second long side edge 2b (or between the first long side surface 2C and the second long side surface 2 d); that is, the central axis C is located between the first long side edge 2a, the second long side edge 2b, the first long side surface 2C, and the second long side surface 2d, and is spaced apart from the first long side edge 2a and the second long side edge 2b by the same distance, respectively, and is also spaced apart from the first long side surface 2C and the second long side surface 2d by the same distance, respectively.

As shown in fig. 1 and 2, the conductive probe 2 includes a central portion 21, an upper connecting portion 22 and a lower connecting portion 23 extending from opposite ends of the central portion 21 along the central axis C in opposite directions, an upper contact portion 24 extending from the upper connecting portion 22 along the central axis C in a direction away from the central portion 21, and a lower contact portion 25 extending from the lower connecting portion 23 along the central axis C in a direction away from the central portion 21. That is, the conductive probe 2 is sequentially an upper contact section 24, an upper connection section 22, a central section 21, a lower connection section 23, and a lower contact section 25 along the central axis C.

The central section 21 is located between the upper guide plate unit 11 and the lower guide plate unit 12, the upper connecting section 22 is inserted into (the corresponding upper through hole 112 of) the upper guide plate unit 11, and the lower connecting section 23 is inserted into (the corresponding lower through hole 122 of) the lower guide plate unit 12. The upper contact section 24 is formed by extending from the upper connection section 22 through the upper guide plate unit 11 and is used for abutting against the signal adapter plate. The lower contact section 25 is formed by extending from the lower connection section 23 through the lower guide plate unit 12 and is used for abutting against the integrated circuit component to be tested.

Further, as shown in fig. 2, the upper connecting section 22 includes an extending portion 221 extending from the first long side surface 2C in a direction away from the central axis C, the upper contact section 24 includes a protruding portion 241 extending from the first long side surface 2C in the direction away from the central axis C, and the protruding portion 241 and the extending portion 221 are disposed at an interval. That is, a single elongated protrusion on any probe is not identical to the protrusion 241 and the extension 221 in the present embodiment, and two protrusions formed on different long sides of the probe, respectively, are not identical to the protrusion 241 and the extension 221 in the present embodiment.

It should be noted that, in the present embodiment, the conductive probe 2 is preferably of any structure without the protruding second long side surface 2d, that is, the conductive probe 2 is formed with at least two protrusions (e.g., the extension portion 221 and the protruding portion 241) at the first long side surface 2c, but the second long side surface 2d of the conductive probe 2 is planar or formed with at least one recess, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the conductive probe 2 may also be formed with at least one protrusion on the conductive probe 2.

Furthermore, the extension 221 is located at a position of the upper connecting section 22 away from the central section 21 (e.g., the top of the upper connecting section 22 in fig. 2), so that the upper connecting section 22 has a structure with a wide top and a narrow bottom. Accordingly, a distance between the wall of the upper through hole 112 and the first long side 2c of the upper connecting section 22 without the extending portion 221 is greater than a distance between the wall of the upper through hole 112 and the second long side 2 d. That is, the center axis C of the conductive probe 2 does not fall on the center line of the upper through hole 112.

The projection 241 is located at the end of the upper contact section 24 and the projection 241 can be used to abut and secure to a signal patch panel. The structure of the protrusion 241 and the extension 221 of the present embodiment can be adjusted and changed according to design requirements, and is not limited to that shown in fig. 2. For example, as shown in fig. 3, the upper contact section 24 is recessed to form a notch N corresponding to the second long side 2d of the protrusion 241, and the angle of the notch N is between 1 degree and 80 degrees (preferably, 15 degrees and 45 degrees). Furthermore, the distance between the protrusion 241 and the central axis C is greater than the distance between the extension 221 and the central axis C and greater than 50% of the aperture of the upper through hole 112.

As described above, the conductive probe 2 of the present embodiment forms the extension portion 221 and the protrusion portion 241 on the same side (e.g., the first long side surface 2C), so that the upper contact section 24 can be stably connected to the signal adapting board through the protrusion portion 241, and a small gap can be maintained between the portion of the upper connection section 22 formed with the extension portion 221 and the hole wall of the upper through hole 112, thereby effectively controlling the relative position between the central axis C of the conductive probe 2 and the upper guide plate unit 11.

As shown in fig. 4 and 5, the lower contact section 25 includes a test tip 251 disposed with an offset from the central axis C and a curved surface 252 connecting one side of the test tip 251 and the second long side edge 2 b. In other words, any conductive probe that connects the testing tip and the long side edge only by a plane is different from the conductive probe 2 referred to in the present embodiment.

It should be noted that, for convenience of describing the testing tip 251 and the curved surface 252 of the conductive probe 2 of the present embodiment, the following is illustrated with reference to fig. 5, and fig. 5 is a longitudinal section covering the testing tip 251 of the conductive probe 2 and perpendicular to the first long side 2a, and the longitudinal section is also perpendicular to the second long side 2b and parallel to the first long side 2c and the second long side 2d in the present embodiment, in the longitudinal section, the lower contact section 25 forms an included angle α between 30 degrees and 150 degrees at the testing tip 251, and the included angle α is preferably between 45 degrees and 120 degrees, but the present invention is not limited thereto.

Further, a first distance D1 of the testing tip 251 compared to the first long side edge 2a is smaller than a second distance D2 compared to the second long side edge 2b, and a ratio of the first distance D1 divided by the second distance D2 is preferably greater than or equal to 0 and less than 1. In the embodiment, the first distance D1 is between 0 micrometers (μm) and 40 μm, and when the first distance D1 is not 0, the testing tip 251 is connected to the first long side edge 2a through a side curved surface 253, but the invention is not limited thereto. Accordingly, the conductive probe 2 of the present embodiment supports the test tip 251 mainly by the curved surface 252 to achieve a preferable supporting effect.

Moreover, the curved surface 252 includes a first curved surface 2521 connected to the testing tip 251 and a second curved surface 2522 connected to the second long side edge 2b in the embodiment, and the first curved surface 2521 and the second curved surface 2522 are disposed in a reverse direction to each other (as shown in fig. 5, the center of curvature of the first curved surface 2521 is located on the upper side of the testing tip 251, and the center of curvature of the second curved surface 2522 is located on the lower side of the testing tip 251), but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the first curved surface 2521 and the second curved surface 2522 may be disposed in the same direction, that is, the centers of curvature of the first curved surface 2521 and the second curved surface 2522 are located on the same side of the testing tip 251.

In addition, in order to make the testing tip 251 effectively supported by the curved surface 252 in the present embodiment, the testing tip 251 preferably protrudes by a penetration length L of 3 to 15 micrometers compared to a boundary between the first curved surface 2521 and the second curved surface 2522, but the present invention is not limited thereto.

It should be noted that, in the present embodiment, the upper contact section 24 and the lower contact section 25 of the conductive probe 2 are respectively formed according to different requirements, so that the two sections do not have the possibility of being used upside down; that is, any probe portion for abutting against the signal transfer board is not equivalent to the lower contact section 25 of the conductive probe 2 of the present embodiment. In addition, the specific configuration of the lower contact section 25 of the present embodiment can be modified according to design requirements, and is not limited to the configuration shown in fig. 5. For example, the lower contact section 25 may also be configured as shown in fig. 6.

As shown in fig. 7, from another perspective of the conductive probe 2, the conductive probe 2 includes a metal pin 201 and a metal film 202 completely covering the outer surface of the metal pin 201; that is, the metal needle 201 and the metal film 202 together constitute one conductive probe 2. The thickness T202 of the metal film 202 is less than 10% of the thickness T201 of the metal needle 201, and the thickness T202 of the metal film 202 is between 0.1 micrometer (μm) and 5 micrometers, but the present invention is not limited thereto. In other words, the thickness of the metal film of any probe is 10% greater than the thickness of the metal needle body, which is not the conductive probe 2 in this embodiment.

Accordingly, the conductive probe 2 of the present embodiment forms the completely-coated and thin metal film 202 on the outer surface of the metal needle 201, so that the conductive probe 2 can effectively prevent the metal needle 201 from being damaged or oxidized on the premise of avoiding the excessive thickness of the conductive probe 2, thereby improving the stability of the conductive probe 2.

Further, as shown in fig. 7, the metal pin 201 includes a plurality of layers of pins 2011 stacked in a row, and each layer of pins 2011 is elongated and parallel to the central axis C. In the present embodiment, without considering the metal film 202, the first long side edge 2a and the second long side edge 2b of the conductive probe 2 are respectively formed by two outermost needle bodies 2011 of the needle bodies 2011 stacked in multiple layers, and the first long side surface 2c and the second long side surface 2d are respectively formed by multiple layers of needle bodies 2011, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the first long side 2a and the second long side 2b may be respectively formed by a plurality of layers of the pins 2011, and the first long side 2c and the second long side 2d may be respectively formed by two outermost pins 2011 of the pins 2011 stacked in a plurality of layers.

Furthermore, one of the multi-layer probe bodies 2011 is formed with the testing tip 251 of the conductive probe 2 (see fig. 5), and the multi-layer probe body 2011 is formed with the extension 221 and the protrusion 241 (see fig. 2 and 7), but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the testing tip 251 may be formed by multiple layers of the pins 2011, and the extension 221 and the protrusion 241 may be formed by a single pin 2011.

In addition, the junction between the first curved surface 2521 and the second curved surface 2522 is located at the junction of the two layers of pins 2011 in the present embodiment (see fig. 5); that is, the first curved surface 2521 and the second curved surface 2522 of the conductive probe 2 are formed by different pins 2011 in the embodiment, so as to improve the forming accuracy of the first curved surface 2521 and the second curved surface 2522.

More specifically, as shown in fig. 7, the conductive probe 2 in the embodiment includes three layers of pins 2011, and the material and characteristics of any one layer of pins 2011 may be different from those of the pins 2011 of other layers (e.g., the pins 2011 formed with the testing tip 251 have a hardness greater than that of the pins 2011 of other layers, so as to improve the durability of the conductive probe 2), but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the conductive probe 2 may include two or more layers of pins 2011, or the multi-layer pins 2011 have the same material and characteristics.

The utility model discloses a metal film 202 is only required to accord with the 10% restriction that its thickness T202 is less than metal needle 201 thickness T201, and the concrete structure of metal film 202 can be adjusted according to the design demand and change, and is not restricted to this embodiment and shows. For example, the metal film 202 may have a single-layer structure as shown in fig. 7 and 8 or a multi-layer structure as shown in fig. 9 and 10 in the present embodiment. As shown in fig. 9 and 10, the metal film 202 includes N metal layers 2021 stacked in sequence and located outside the metal pins 201, where N is a positive integer greater than 1. As shown in fig. 9, N is 2, and one 2021 of the two metal layers 2021 completely covers the outer surface of the metal pin 201; as shown in fig. 10, the metal film 202 further includes a bonding layer 2022, and the bonding layer 2022 is connected between the outer surface of the metal pin 201 and the N metal layers 2021.

[ technical effects of the embodiments of the present invention ]

Furthermore, the probe head and the conductive probe according to the embodiment of the present invention respectively form the extending portion and the protruding portion on the same side (e.g. the first long side) of the upper connecting section and the upper contact section, so that the upper contact section can be stably connected to the signal adapting board through the protruding portion, and a small gap can be maintained between the upper connecting section formed with the extending portion and the upper guide plate unit (e.g. the hole wall of the upper through hole), thereby effectively controlling the relative position of the central axis of the conductive probe and the upper guide plate unit.

Additionally, the embodiment of the utility model provides a disclosed probe head and conductive probe are through being formed with the metal film of complete cladding and thin shape on metal needle body's surface to make conductive probe can avoid under its too big prerequisite of thickness, prevent effectively that metal needle body from receiving damage or oxidation, and then improve conductive probe's stability.

The above disclosure is only a preferred embodiment of the present invention and is not intended to limit the scope of the claims, so that all the modifications of the equivalent technology using the contents of the specification and drawings are included in the scope of the claims.

Claims

1. A probe head for integrated circuit testing, the probe head comprising:

an upper guide plate unit and a lower guide plate unit which are arranged at intervals; and

a plurality of conductive probes, one end of which penetrates through the upper guide plate unit and the other end of which penetrates through the lower guide plate unit; wherein, any one of the conductive probes comprises a first long side edge and a second long side edge which are respectively positioned at two opposite sides, and a central axis is defined between the first long side edge and the second long side edge of any one of the conductive probes; any one of the conductive probes includes:

a central section located between the upper guide plate unit and the lower guide plate unit;

an upper connecting section and a lower connecting section respectively formed by extending from opposite ends of the central section along the central axis in opposite directions to each other, the upper connecting section being inserted into the upper guide plate unit, and the lower connecting section being inserted into the lower guide plate unit;

the upper contact section is formed by extending the upper guide plate unit from the upper connecting section along the central axis towards the direction far away from the central section and is used for abutting against a signal adapter plate; and

a lower contact section formed by extending the lower guide plate unit from the lower connection section along the central axis in a direction away from the central section, wherein the lower contact section is used for abutting against an integrated circuit component to be tested; the lower contact section comprises a testing tip which is arranged in an offset manner relative to the central axis and a curved surface which connects the testing tip and the second long lateral edge, and a first distance between the testing tip and the first long lateral edge is smaller than a second distance between the testing tip and the second long lateral edge.

2. The tip according to claim 1, wherein in any of the conductive probes, a ratio of the first distance divided by the second distance is greater than or equal to 0 and less than 1, and the first distance is between 0 micrometers and 40 micrometers.

3. The probe head as claimed in claim 1, wherein the curved surface comprises a first curved surface connected to the testing tip and a second curved surface connected to the second long side edge, and the first curved surface and the second curved surface are disposed opposite to each other.

4. The probe head as claimed in claim 3, wherein in any of the conductive probes, the testing tip protrudes by a penetration length of 3 to 15 microns compared to a boundary between the first curved surface and the second curved surface.

5. The probe head as claimed in claim 1, wherein in a longitudinal cross section covering the testing tip of any one of the conductive probes and perpendicular to the first long side edge, the lower contact section forms an included angle of 30 to 150 degrees at the testing tip.

6. The probe head as claimed in claim 1, wherein each of the conductive probes comprises a first long side and a second long side respectively located at two opposite sides, and the central axis of each of the conductive probes is located between the first long side and the second long side; in any of the conductive probes, the upper connection segment includes an extension portion extending from the first long side surface in a direction away from the central axis, the upper contact segment includes a protrusion portion extending from the first long side surface in a direction away from the central axis, and the protrusion portion and the extension portion are spaced apart from each other.

7. The probe head as claimed in claim 6, wherein in any of the conductive probes, the extension is located at a position of the upper connecting section away from the central section so as to form a configuration that the upper connecting section is wider at the top and narrower at the bottom; any of the conductive probes is not formed with any structure protruding beyond the second long side.

8. The probe head as claimed in claim 1, wherein any of the conductive probes comprises:

a metal pin body comprising a plurality of layers of pin bodies stacked one on top of the other, each layer of pin bodies being elongated and parallel to the central axis, one of the plurality of layers of pin bodies forming the test tip; and

the metal film is completely coated on the outer surface of the metal needle body; wherein the thickness of the metal film is less than 10% of the thickness of the metal needle body.

9. The probe head as claimed in claim 8, wherein in any of the conductive probes, the metal film comprises N metal layers stacked in sequence and located outside the metal needle body, and N is a positive integer greater than 1.

10. A conductive probe of a probe head is characterized in that the conductive probe comprises a first long side edge and a second long side edge which are respectively positioned at two opposite sides, and a central shaft is defined between the first long side edge and the second long side edge; the conductive probe includes:

a central section;

an upper connecting section and a lower connecting section respectively formed by extending from opposite ends of the central section in opposite directions to each other along the central axis;

the upper contact section is formed by extending from the upper connecting section along the central axis in the direction far away from the central section and is used for abutting against a signal adapter plate; and

a lower contact section formed by extending from the lower connection section along the central axis in a direction away from the central section, and the lower contact section is used for abutting against an integrated circuit component to be tested; the lower contact section comprises a testing tip which is arranged in an offset manner relative to the central axis and a curved surface which connects the testing tip and the second long lateral edge, and a first distance between the testing tip and the first long lateral edge is smaller than a second distance between the testing tip and the second long lateral edge.