TWI704023B - 雷射加工機的控制裝置、雷射加工方法及雷射加工機 - Google Patents

雷射加工機的控制裝置、雷射加工方法及雷射加工機 Download PDF

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Publication number
TWI704023B
TWI704023B TW107124413A TW107124413A TWI704023B TW I704023 B TWI704023 B TW I704023B TW 107124413 A TW107124413 A TW 107124413A TW 107124413 A TW107124413 A TW 107124413A TW I704023 B TWI704023 B TW I704023B
Authority
TW
Taiwan
Prior art keywords
laser beam
pulsed laser
control device
laser
light source
Prior art date
Application number
TW107124413A
Other languages
English (en)
Chinese (zh)
Other versions
TW201916961A (zh
Inventor
石原裕
Original Assignee
日商住友重機械工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 日商住友重機械工業股份有限公司 filed Critical 日商住友重機械工業股份有限公司
Publication of TW201916961A publication Critical patent/TW201916961A/zh
Application granted granted Critical
Publication of TWI704023B publication Critical patent/TWI704023B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042—Automatically aligning the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Mechanical Optical Scanning Systems (AREA)
TW107124413A 2017-10-24 2018-07-16 雷射加工機的控制裝置、雷射加工方法及雷射加工機 TWI704023B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017204857A JP7066368B2 (ja) 2017-10-24 2017-10-24 レーザ加工機の制御装置、レーザ加工方法、及びレーザ加工機
JP2017-204857 2017-10-24

Publications (2)

Publication Number Publication Date
TW201916961A TW201916961A (zh) 2019-05-01
TWI704023B true TWI704023B (zh) 2020-09-11

Family

ID=66229695

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107124413A TWI704023B (zh) 2017-10-24 2018-07-16 雷射加工機的控制裝置、雷射加工方法及雷射加工機

Country Status (4)

Country Link
JP (1) JP7066368B2 (ko)
KR (1) KR20190045817A (ko)
CN (1) CN109693035B (ko)
TW (1) TWI704023B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7339879B2 (ja) * 2019-12-23 2023-09-06 住友重機械工業株式会社 レーザ加工機の制御装置及びレーザ加工方法
JP2022063595A (ja) * 2020-10-12 2022-04-22 住友重機械工業株式会社 レーザ加工機の制御装置、レーザ加工機、及びレーザ加工方法

Citations (5)

* Cited by examiner, † Cited by third party
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CN101722363A (zh) * 2008-10-21 2010-06-09 三菱电机株式会社 激光加工装置
CN203236853U (zh) * 2012-12-21 2013-10-16 上海大量光电科技有限公司 激光加工影像检测校正装置
CN106141444A (zh) * 2015-05-15 2016-11-23 株式会社迪思科 激光加工装置
US20170259373A1 (en) * 2014-11-24 2017-09-14 Scansonic Mi Gmbh Method and Apparatus for Joining Workpieces at a Lap Joint
TW201733728A (zh) * 2016-03-17 2017-10-01 伊雷克托科學工業股份有限公司 在雷射加工系統中的像平面之定位

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JPH0195889A (ja) * 1987-10-06 1989-04-13 Amada Co Ltd レーザ加工装置およびレーザ加工方法
JP2938336B2 (ja) * 1994-02-09 1999-08-23 新日本製鐵株式会社 鋼板へのレーザ刻印装置および方法
JP2004066300A (ja) 2002-08-07 2004-03-04 Matsushita Electric Ind Co Ltd レーザ加工装置およびレーザ加工方法
JP2004358550A (ja) * 2003-06-09 2004-12-24 Sumitomo Heavy Ind Ltd レーザ加工方法およびレーザ加工装置
US7133182B2 (en) * 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM frequency and amplitude modulation techniques for facilitating full beam extinction in laser systems
JP4749092B2 (ja) * 2005-02-28 2011-08-17 パナソニック電工Ｓｕｎｘ株式会社 レーザ加工方法、並びにレーザ加工装置
JP2007142000A (ja) * 2005-11-16 2007-06-07 Denso Corp レーザ加工装置およびレーザ加工方法
EP2076354B1 (en) * 2006-08-22 2011-11-02 GSI Group Corporation System for employing scanners in an x-y high speed drilling system
US7982160B2 (en) * 2008-03-31 2011-07-19 Electro Scientific Industries, Inc. Photonic clock stabilized laser comb processing
JP4873578B2 (ja) * 2009-09-07 2012-02-08 住友重機械工業株式会社 レーザ加工装置及び加工条件の決定方法
JP2015054330A (ja) * 2013-09-10 2015-03-23 株式会社片岡製作所 レーザ加工機
JP6234296B2 (ja) * 2014-03-27 2017-11-22 住友重機械工業株式会社 レーザ加工装置及びレーザ加工方法
CN203791833U (zh) * 2014-04-02 2014-08-27 温州职业技术学院 一种聚焦透镜激光束出射位置调校辅助装置
CN104972221B (zh) * 2014-04-03 2017-12-26 苏州天弘激光股份有限公司 一种激光加工设备及激光加工寻焦方法
WO2015198398A1 (ja) * 2014-06-24 2015-12-30 三菱電機株式会社 レーザ加工装置、加工制御装置およびレーザ加工方法
JP6570921B2 (ja) * 2015-03-16 2019-09-04 ビアメカニクス株式会社 レーザ穴あけ加工条件の設定方法及びレーザ加工機
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101722363A (zh) * 2008-10-21 2010-06-09 三菱电机株式会社 激光加工装置
CN203236853U (zh) * 2012-12-21 2013-10-16 上海大量光电科技有限公司 激光加工影像检测校正装置
US20170259373A1 (en) * 2014-11-24 2017-09-14 Scansonic Mi Gmbh Method and Apparatus for Joining Workpieces at a Lap Joint
CN106141444A (zh) * 2015-05-15 2016-11-23 株式会社迪思科 激光加工装置
TW201733728A (zh) * 2016-03-17 2017-10-01 伊雷克托科學工業股份有限公司 在雷射加工系統中的像平面之定位

Also Published As

Publication number Publication date
CN109693035B (zh) 2022-06-14
JP2019076919A (ja) 2019-05-23
TW201916961A (zh) 2019-05-01
JP7066368B2 (ja) 2022-05-13
KR20190045817A (ko) 2019-05-03
CN109693035A (zh) 2019-04-30

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