TWI701310B - 硬化體、電子零件、顯示元件、及光與濕氣硬化型樹脂組成物 - Google Patents
硬化體、電子零件、顯示元件、及光與濕氣硬化型樹脂組成物 Download PDFInfo
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- TWI701310B TWI701310B TW105111579A TW105111579A TWI701310B TW I701310 B TWI701310 B TW I701310B TW 105111579 A TW105111579 A TW 105111579A TW 105111579 A TW105111579 A TW 105111579A TW I701310 B TWI701310 B TW I701310B
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- C—CHEMISTRY; METALLURGY
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/30—Low-molecular-weight compounds
- C08G18/302—Water
- C08G18/307—Atmospheric humidity
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
- C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/08—Processes
- C08G18/10—Prepolymer processes involving reaction of isocyanates or isothiocyanates with compounds having active hydrogen in a first reaction step
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| JP6905377B2 (ja) * | 2017-03-31 | 2021-07-21 | シチズンファインデバイス株式会社 | 画像表示装置及びその製造方法 |
| JPWO2019203277A1 (ja) * | 2018-04-19 | 2021-03-18 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化体、電子部品及び組立部品 |
| WO2020241803A1 (ja) * | 2019-05-30 | 2020-12-03 | 積水化学工業株式会社 | 硬化性樹脂組成物、硬化体、及び電子部品 |
| KR20230028207A (ko) * | 2020-06-29 | 2023-02-28 | 세키스이가가쿠 고교가부시키가이샤 | 광 습기 경화형 수지 조성물, 및 경화체 |
| WO2022114186A1 (ja) * | 2020-11-30 | 2022-06-02 | 積水化学工業株式会社 | 湿気硬化性樹脂組成物、及び電子機器用接着剤 |
| KR102574109B1 (ko) * | 2022-10-18 | 2023-09-06 | (주)중앙종합안전기술연구원 | 구조물 안전 점검 및 진단용 균열 폭 측정기 |
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| CN103703087A (zh) * | 2011-07-22 | 2014-04-02 | H.B.富勒公司 | 用在电子器件上的单组分双固化粘合剂 |
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| DE19800676A1 (de) * | 1998-01-10 | 1999-07-15 | Henkel Kgaa | Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen |
| JP2000178342A (ja) | 1998-12-17 | 2000-06-27 | Sumitomo Bakelite Co Ltd | 絶縁ペースト |
| US6828355B1 (en) * | 1999-07-19 | 2004-12-07 | Henkel Corporation | Resin-reinforced UV, moisture and UV/moisture dual curable silicone compositions |
| JP2001220569A (ja) * | 2000-02-09 | 2001-08-14 | Sekisui Chem Co Ltd | 反応性接着剤組成物 |
| JP2001240811A (ja) * | 2000-03-01 | 2001-09-04 | Sekisui Chem Co Ltd | 反応性接着剤組成物及び部材の接合方法 |
| JP2004047415A (ja) * | 2002-05-24 | 2004-02-12 | Sekisui Chem Co Ltd | フレキシブルフラットケーブル、接着剤及びその接合体 |
| JP2004018621A (ja) * | 2002-06-14 | 2004-01-22 | Nippon Shokubai Co Ltd | ラジカル硬化性ウレタン樹脂組成物 |
| US7189781B2 (en) * | 2003-03-13 | 2007-03-13 | H.B. Fuller Licensing & Finance Inc. | Moisture curable, radiation curable sealant composition |
| JP5013585B2 (ja) | 2006-09-06 | 2012-08-29 | 日立化成ポリマー株式会社 | 反応性ホットメルト接着剤組成物及びそれを用いた接着方法 |
| JP5228370B2 (ja) | 2007-04-27 | 2013-07-03 | 東亞合成株式会社 | 一液湿気硬化型ウレタン系ホットメルト接着剤組成物及びその使用方法 |
| US8277930B2 (en) * | 2008-02-27 | 2012-10-02 | Dic Corporation | Moisture-permeable film, production method of same and laminate using same |
| JP5488386B2 (ja) * | 2010-10-14 | 2014-05-14 | Ｄｉｃ株式会社 | 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン |
| KR102320903B1 (ko) * | 2014-05-13 | 2021-11-02 | 세키스이가가쿠 고교가부시키가이샤 | 광습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제 |
| CN104031598A (zh) * | 2014-06-30 | 2014-09-10 | 江苏华程光电科技有限公司 | 高导热性led密封胶 |
| JP6510790B2 (ja) * | 2014-10-03 | 2019-05-08 | 積水化学工業株式会社 | 光湿気硬化型樹脂組成物 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001064543A (ja) * | 1999-08-27 | 2001-03-13 | Nippon Shokubai Co Ltd | 硬化型被覆材用樹脂組成物 |
| CN103703087A (zh) * | 2011-07-22 | 2014-04-02 | H.B.富勒公司 | 用在电子器件上的单组分双固化粘合剂 |
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| CN107108772A (zh) | 2017-08-29 |
| JPWO2016167305A1 (ja) | 2018-02-15 |
| JP2020111764A (ja) | 2020-07-27 |
| KR20170137691A (ko) | 2017-12-13 |
| TW201704394A (zh) | 2017-02-01 |
| WO2016167305A1 (ja) | 2016-10-20 |
| KR102260532B1 (ko) | 2021-06-03 |
| JP6698524B2 (ja) | 2020-05-27 |
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