TWI701134B - 導電性基板、導電性基板之製造方法 - Google Patents

導電性基板、導電性基板之製造方法 Download PDF

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Publication number
TWI701134B
TWI701134B TW105123738A TW105123738A TWI701134B TW I701134 B TWI701134 B TW I701134B TW 105123738 A TW105123738 A TW 105123738A TW 105123738 A TW105123738 A TW 105123738A TW I701134 B TWI701134 B TW I701134B
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TW
Taiwan
Prior art keywords
layer
metal
blackened
conductive substrate
metal layer
Prior art date
Application number
TW105123738A
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English (en)
Chinese (zh)
Other versions
TW201718254A (zh
Inventor
須田貴広
Original Assignee
日商住友金屬礦山股份有限公司
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Publication of TW201718254A publication Critical patent/TW201718254A/zh
Application granted granted Critical
Publication of TWI701134B publication Critical patent/TWI701134B/zh

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/58—After-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Electroluminescent Light Sources (AREA)
TW105123738A 2015-07-31 2016-07-27 導電性基板、導電性基板之製造方法 TWI701134B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-152896 2015-07-31
JP2015152896 2015-07-31

Publications (2)

Publication Number Publication Date
TW201718254A TW201718254A (zh) 2017-06-01
TWI701134B true TWI701134B (zh) 2020-08-11

Family

ID=57942878

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105123738A TWI701134B (zh) 2015-07-31 2016-07-27 導電性基板、導電性基板之製造方法

Country Status (5)

Country Link
JP (1) JP6432684B2 (ja)
KR (1) KR102587364B1 (ja)
CN (1) CN107850967B (ja)
TW (1) TWI701134B (ja)
WO (1) WO2017022539A1 (ja)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201035390A (en) * 2009-03-24 2010-10-01 Mitsui Mining & Smelting Co Electrolytic copper foil having carrier foil, method for producing electrolytic copper foil having carrier foil and copper cladding laminate obtained by using the same
TW201402312A (zh) * 2012-03-26 2014-01-16 Jx Nippon Mining & Metals Corp 附載體銅箔、附載體銅箔之製造方法、印刷配線板用附載體銅箔及印刷配線板

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004213114A (ja) 2002-12-27 2004-07-29 Pentel Corp 静電容量型デジタル式タッチパネル
CN101400826B (zh) * 2006-03-15 2012-06-20 日本帕卡濑精株式会社 铜材料用表面处理液、铜材料的表面处理方法、带表面处理被膜的铜材料和层合构件
US8753933B2 (en) * 2008-11-19 2014-06-17 Micron Technology, Inc. Methods for forming a conductive material, methods for selectively forming a conductive material, methods for forming platinum, and methods for forming conductive structures
TWI425530B (zh) * 2010-09-30 2014-02-01 Far Eastern New Century Corp 具有高光穿透度之透明導電膜及其製備方法
JP5775494B2 (ja) * 2012-02-28 2015-09-09 富士フイルム株式会社 銀イオン拡散抑制層形成用組成物、銀イオン拡散抑制層用フィルム、配線基板、電子機器、導電膜積層体、およびタッチパネル
KR101521681B1 (ko) * 2012-04-24 2015-05-19 삼성전기주식회사 터치패널
JP2013231901A (ja) * 2012-05-01 2013-11-14 Dic Corp 保護フィルム及び加飾保護フィルム
JP6047713B2 (ja) * 2012-05-11 2016-12-21 石原ケミカル株式会社 無電解銅メッキ方法
JP5224203B1 (ja) * 2012-07-11 2013-07-03 大日本印刷株式会社 タッチパネルセンサ、タッチパネル装置および表示装置
JP2014219963A (ja) * 2013-04-12 2014-11-20 信越ポリマー株式会社 センサーシート作製用シート及びその製造方法、タッチパッド用センサーシート及びその製造方法
CN104559628A (zh) * 2013-10-15 2015-04-29 介面光电股份有限公司 黑化涂料及使用该黑化涂料的电极结构
JP6315236B2 (ja) * 2013-12-20 2018-04-25 Dic株式会社 ハードコートフィルム及び画像表示装置
JP6262682B2 (ja) * 2015-03-26 2018-01-17 富士フイルム株式会社 タッチパネル用の導電性フィルム、タッチパネルおよび表示装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201035390A (en) * 2009-03-24 2010-10-01 Mitsui Mining & Smelting Co Electrolytic copper foil having carrier foil, method for producing electrolytic copper foil having carrier foil and copper cladding laminate obtained by using the same
TW201402312A (zh) * 2012-03-26 2014-01-16 Jx Nippon Mining & Metals Corp 附載體銅箔、附載體銅箔之製造方法、印刷配線板用附載體銅箔及印刷配線板

Also Published As

Publication number Publication date
JP6432684B2 (ja) 2018-12-05
WO2017022539A1 (ja) 2017-02-09
TW201718254A (zh) 2017-06-01
CN107850967A (zh) 2018-03-27
KR102587364B1 (ko) 2023-10-10
JPWO2017022539A1 (ja) 2018-06-21
CN107850967B (zh) 2021-02-05
KR20180034436A (ko) 2018-04-04

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