TWI700399B - 電解液輸送及產生設備 - Google Patents

電解液輸送及產生設備 Download PDF

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Publication number
TWI700399B
TWI700399B TW105116202A TW105116202A TWI700399B TW I700399 B TWI700399 B TW I700399B TW 105116202 A TW105116202 A TW 105116202A TW 105116202 A TW105116202 A TW 105116202A TW I700399 B TWI700399 B TW I700399B
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TW
Taiwan
Prior art keywords
anolyte
electrolyte
catholyte
chamber
acid
Prior art date
Application number
TW105116202A
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English (en)
Chinese (zh)
Other versions
TW201710563A (zh
Inventor
史蒂芬 Ｔ 邁爾
貴格瑞 卡恩斯
理查 Ｇ 亞伯拉罕
勞倫斯 奧索夫斯基
Original Assignee
美商蘭姆研究公司
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Publication date
Application filed by 美商蘭姆研究公司 filed Critical 美商蘭姆研究公司
Publication of TW201710563A publication Critical patent/TW201710563A/zh
Application granted granted Critical
Publication of TWI700399B publication Critical patent/TWI700399B/zh

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00—Operating or servicing cells
    • C25B15/02—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00—Operating or servicing cells
    • C25B15/08—Supplying or removing reactants or electrolytes; Regeneration of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
TW105116202A 2015-05-29 2016-05-25 電解液輸送及產生設備 TWI700399B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562168198P 2015-05-29 2015-05-29
US62/168,198 2015-05-29
US14/921,602 US10011919B2 (en) 2015-05-29 2015-10-23 Electrolyte delivery and generation equipment
US14/921,602 2015-10-23

Publications (2)

Publication Number Publication Date
TW201710563A TW201710563A (zh) 2017-03-16
TWI700399B true TWI700399B (zh) 2020-08-01

Family

ID=57398152

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105116202A TWI700399B (zh) 2015-05-29 2016-05-25 電解液輸送及產生設備

Country Status (6)

Country Link
US (2) US10011919B2 (https=)
JP (1) JP6794138B2 (https=)
KR (1) KR102634096B1 (https=)
CN (1) CN106191934B (https=)
SG (1) SG10201603606SA (https=)
TW (1) TWI700399B (https=)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI592518B (zh) * 2015-08-11 2017-07-21 Miz Company Ltd 氫氣生成裝置
SG11201804241UA (en) * 2015-12-02 2018-06-28 Downunder Geosolutions Pty Ltd Fluid cooling system and method for electronics equipment
CN108232246B (zh) * 2016-12-15 2020-03-10 中国科学院大连化学物理研究所 一种铝空气电池系统及其工作方法
CN108179437B (zh) * 2017-11-30 2023-12-29 一生氢松（深圳）科技有限公司 一种阳极湿润电解装置及含有其的器具
AU2019222995B2 (en) * 2018-02-20 2024-10-03 Nuvera Fuel Cells, LLC High-voltage fuel-cell stack
CN110755727B (zh) * 2018-07-26 2023-11-28 林信涌 可电耦接云端监控系统的氢气产生器及其云端监控系统
DE102018129192A1 (de) * 2018-11-20 2020-05-20 Deutsches Zentrum für Luft- und Raumfahrt e.V. System und Verfahren zur Bestimmung der Konzentration von Metallionen in einer Lösung
JP7202230B2 (ja) * 2019-03-20 2023-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7291223B2 (ja) * 2019-08-01 2023-06-14 Ｊｘ金属株式会社 酸化第一錫の溶解方法
CN112378838A (zh) * 2020-08-18 2021-02-19 万向一二三股份公司 一种评测极耳可靠性的装置
CN112251775A (zh) * 2020-10-23 2021-01-22 珠海格力电器股份有限公司 一种电解装置的控制方法、控制装置及电解装置
CN112701072B (zh) * 2021-03-25 2021-10-22 西安奕斯伟硅片技术有限公司 晶圆处理装置及晶圆缺陷评价方法
CN113391554B (zh) * 2021-06-16 2022-06-17 江苏东南环保科技有限公司 一种基于人工智能的电镀方法
PL4254590T3 (pl) * 2022-03-31 2025-05-12 Hoppecke Batterien Gmbh & Co. Kg. Urządzenie napełniające do ogniw baterii i sposób
US20230313406A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
US12606928B2 (en) 2022-04-04 2026-04-21 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
US20240068108A1 (en) * 2022-08-30 2024-02-29 Tech-Etch, Inc. Process for chemically treating surfaces to increase wettability
CN116397267B (zh) * 2023-05-09 2026-03-17 中铜东南铜业有限公司 一种铜电解/电积装置及其工作方法
CN116874036B (zh) * 2023-07-17 2025-08-15 宁波方太厨具有限公司 一种电解槽
WO2025128964A1 (en) * 2023-12-15 2025-06-19 Lam Research Corporation Inert anode and electrolyte control
CN119243186B (zh) * 2024-12-05 2025-05-02 福建德尔科技股份有限公司 一种全氟三丙胺的自动补液连续生产装置及工艺
CN120158780B (zh) * 2025-04-29 2025-11-11 北京亿能氢源科技有限公司 基于变频循环泵的电解液流量精准调控系统及方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103137994A (zh) * 2013-03-12 2013-06-05 上海新源动力有限公司 一种降低燃料电池系统尾排氢气峰值浓度的方法
US20140166492A1 (en) * 2012-12-13 2014-06-19 Ebara Corporation Sn ALLOY PLATING APPARATUS AND METHOD
CN104160067A (zh) * 2012-02-08 2014-11-19 奥图泰(芬兰)公司 操作电解槽的方法以及阴极框架
TW201500598A (zh) * 2013-05-09 2015-01-01 Ebara Corp 錫合金鍍膜裝置以及錫合金鍍膜方法
US20150008133A1 (en) * 2013-07-03 2015-01-08 Tel Nexx, Inc. Electrochemical deposition apparatus and methods for controlling the chemistry therein
TW201518556A (zh) * 2013-10-31 2015-05-16 Ebara Corp 錫合金鍍覆裝置及錫合金鍍覆方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4530739A (en) * 1984-03-09 1985-07-23 Energy Conversion Devices, Inc. Method of fabricating an electroplated substrate
NL8602730A (nl) 1986-10-30 1988-05-16 Hoogovens Groep Bv Werkwijze voor het electrolytisch vertinnen van blik met behulp van een onoplosbare anode.
JPH04116200A (ja) * 1990-09-05 1992-04-16 Kawasaki Steel Corp 電気めっきにおける金属イオンの供給装置
US5104496A (en) * 1990-10-18 1992-04-14 Optical Radiation Corporation Low mist chromium plating method and system
US5082538A (en) 1991-01-09 1992-01-21 Eltech Systems Corporation Process for replenishing metals in aqueous electrolyte solutions
JPH05186899A (ja) * 1992-01-10 1993-07-27 Kawasaki Steel Corp 成分管理装置付錫めっき装置
US5312539A (en) * 1993-06-15 1994-05-17 Learonal Inc. Electrolytic tin plating method
JP3316606B2 (ja) * 1994-03-30 2002-08-19 川崎製鉄株式会社 錫めっき装置および錫めっき方法
US5618404A (en) * 1994-05-17 1997-04-08 Daiwa Fine Chemicals Co., Ltd. Electrolytic process for producing lead sulfonate and tin sulfonate for solder plating use
ITMI20011374A1 (it) * 2001-06-29 2002-12-29 De Nora Elettrodi Spa Cella di elettrolisi per il ripristino della concentrazione di ioni metallici in processi di elettrodeposizione
US6833124B2 (en) * 2002-01-31 2004-12-21 University Of Dayton Recovery process for wastes containing hexavalent chromium
US7368043B2 (en) * 2003-04-10 2008-05-06 Applied Intellectual Capital Configurations and methods of electrochemical lead recovery from contaminated soil
JP4242248B2 (ja) * 2003-10-22 2009-03-25 石川金属工業株式会社 不溶性陽極を使用する錫めっき方法
US7743783B2 (en) 2006-04-04 2010-06-29 Air Liquide Electronics U.S. Lp Method and apparatus for recycling process fluids
FR2919619B1 (fr) * 2007-07-30 2009-10-09 Siemens Vai Metals Tech Sas Installation et procede pour l'etamage electrolytique de bandes d'acier,mettant en oeuvre une anode insoluble
EP2194165A1 (en) 2008-10-21 2010-06-09 Rohm and Haas Electronic Materials LLC Method for replenishing tin and its alloying metals in electrolyte solutions
US9017528B2 (en) * 2011-04-14 2015-04-28 Tel Nexx, Inc. Electro chemical deposition and replenishment apparatus
US20130341196A1 (en) 2012-06-20 2013-12-26 Honeywell International Inc. Refining process for producing low alpha tin
DE102012112388A1 (de) * 2012-12-17 2014-07-03 Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG Induktiver Leitfähigkeitssensor und Verfahren zu dessen Herstellung
US9303329B2 (en) * 2013-11-11 2016-04-05 Tel Nexx, Inc. Electrochemical deposition apparatus with remote catholyte fluid management

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104160067A (zh) * 2012-02-08 2014-11-19 奥图泰(芬兰)公司 操作电解槽的方法以及阴极框架
US20140166492A1 (en) * 2012-12-13 2014-06-19 Ebara Corporation Sn ALLOY PLATING APPARATUS AND METHOD
TW201435147A (zh) * 2012-12-13 2014-09-16 Ebara Corp Ｓｎ合金鍍敷裝置及方法
CN103137994A (zh) * 2013-03-12 2013-06-05 上海新源动力有限公司 一种降低燃料电池系统尾排氢气峰值浓度的方法
TW201500598A (zh) * 2013-05-09 2015-01-01 Ebara Corp 錫合金鍍膜裝置以及錫合金鍍膜方法
US20150008133A1 (en) * 2013-07-03 2015-01-08 Tel Nexx, Inc. Electrochemical deposition apparatus and methods for controlling the chemistry therein
TW201518556A (zh) * 2013-10-31 2015-05-16 Ebara Corp 錫合金鍍覆裝置及錫合金鍍覆方法

Also Published As

Publication number Publication date
TW201710563A (zh) 2017-03-16
CN106191934A (zh) 2016-12-07
SG10201603606SA (en) 2016-12-29
US10011919B2 (en) 2018-07-03
US20160348265A1 (en) 2016-12-01
JP6794138B2 (ja) 2020-12-02
JP2017020102A (ja) 2017-01-26
KR102634096B1 (ko) 2024-02-07
US20180274123A1 (en) 2018-09-27
KR20160140483A (ko) 2016-12-07
CN106191934B (zh) 2019-10-25

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