SG10201603606SA - Electrolyte delivery and generation equipment - Google Patents

Electrolyte delivery and generation equipment

Info

Publication number
SG10201603606SA
SG10201603606SA SG10201603606SA SG10201603606SA SG10201603606SA SG 10201603606S A SG10201603606S A SG 10201603606SA SG 10201603606S A SG10201603606S A SG 10201603606SA SG 10201603606S A SG10201603606S A SG 10201603606SA SG 10201603606S A SG10201603606S A SG 10201603606SA
Authority
SG
Singapore
Prior art keywords
generation equipment
electrolyte delivery
electrolyte
delivery
generation
Prior art date
Application number
SG10201603606SA
Other languages
English (en)
Inventor
Steven T Mayer
Gregory Kearns
Richard G Abraham
Lawrence Ossowski
Original Assignee
Lam Res Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Corp filed Critical Lam Res Corp
Publication of SG10201603606SA publication Critical patent/SG10201603606SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00—Operating or servicing cells
    • C25B15/02—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00—Operating or servicing cells
    • C25B15/08—Supplying or removing reactants or electrolytes; Regeneration of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
SG10201603606SA 2015-05-29 2016-05-06 Electrolyte delivery and generation equipment SG10201603606SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562168198P 2015-05-29 2015-05-29
US14/921,602 US10011919B2 (en) 2015-05-29 2015-10-23 Electrolyte delivery and generation equipment

Publications (1)

Publication Number Publication Date
SG10201603606SA true SG10201603606SA (en) 2016-12-29

Family

ID=57398152

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10201603606SA SG10201603606SA (en) 2015-05-29 2016-05-06 Electrolyte delivery and generation equipment

Country Status (6)

Country Link
US (2) US10011919B2 (https=)
JP (1) JP6794138B2 (https=)
KR (1) KR102634096B1 (https=)
CN (1) CN106191934B (https=)
SG (1) SG10201603606SA (https=)
TW (1) TWI700399B (https=)

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CN108232246B (zh) * 2016-12-15 2020-03-10 中国科学院大连化学物理研究所 一种铝空气电池系统及其工作方法
CN108179437B (zh) * 2017-11-30 2023-12-29 一生氢松（深圳）科技有限公司 一种阳极湿润电解装置及含有其的器具
AU2019222995B2 (en) * 2018-02-20 2024-10-03 Nuvera Fuel Cells, LLC High-voltage fuel-cell stack
CN110755727B (zh) * 2018-07-26 2023-11-28 林信涌 可电耦接云端监控系统的氢气产生器及其云端监控系统
DE102018129192A1 (de) * 2018-11-20 2020-05-20 Deutsches Zentrum für Luft- und Raumfahrt e.V. System und Verfahren zur Bestimmung der Konzentration von Metallionen in einer Lösung
JP7202230B2 (ja) * 2019-03-20 2023-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7291223B2 (ja) * 2019-08-01 2023-06-14 Ｊｘ金属株式会社 酸化第一錫の溶解方法
CN112378838A (zh) * 2020-08-18 2021-02-19 万向一二三股份公司 一种评测极耳可靠性的装置
CN112251775A (zh) * 2020-10-23 2021-01-22 珠海格力电器股份有限公司 一种电解装置的控制方法、控制装置及电解装置
CN112701072B (zh) * 2021-03-25 2021-10-22 西安奕斯伟硅片技术有限公司 晶圆处理装置及晶圆缺陷评价方法
CN113391554B (zh) * 2021-06-16 2022-06-17 江苏东南环保科技有限公司 一种基于人工智能的电镀方法
PL4254590T3 (pl) * 2022-03-31 2025-05-12 Hoppecke Batterien Gmbh & Co. Kg. Urządzenie napełniające do ogniw baterii i sposób
US20230313406A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
US12606928B2 (en) 2022-04-04 2026-04-21 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
US20240068108A1 (en) * 2022-08-30 2024-02-29 Tech-Etch, Inc. Process for chemically treating surfaces to increase wettability
CN116397267B (zh) * 2023-05-09 2026-03-17 中铜东南铜业有限公司 一种铜电解/电积装置及其工作方法
CN116874036B (zh) * 2023-07-17 2025-08-15 宁波方太厨具有限公司 一种电解槽
WO2025128964A1 (en) * 2023-12-15 2025-06-19 Lam Research Corporation Inert anode and electrolyte control
CN119243186B (zh) * 2024-12-05 2025-05-02 福建德尔科技股份有限公司 一种全氟三丙胺的自动补液连续生产装置及工艺
CN120158780B (zh) * 2025-04-29 2025-11-11 北京亿能氢源科技有限公司 基于变频循环泵的电解液流量精准调控系统及方法

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Also Published As

Publication number Publication date
TW201710563A (zh) 2017-03-16
TWI700399B (zh) 2020-08-01
CN106191934A (zh) 2016-12-07
US10011919B2 (en) 2018-07-03
US20160348265A1 (en) 2016-12-01
JP6794138B2 (ja) 2020-12-02
JP2017020102A (ja) 2017-01-26
KR102634096B1 (ko) 2024-02-07
US20180274123A1 (en) 2018-09-27
KR20160140483A (ko) 2016-12-07
CN106191934B (zh) 2019-10-25

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