CN106191934B - 电解液输送和生成装置 - Google Patents

电解液输送和生成装置 Download PDF

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Publication number
CN106191934B
CN106191934B CN201610369815.6A CN201610369815A CN106191934B CN 106191934 B CN106191934 B CN 106191934B CN 201610369815 A CN201610369815 A CN 201610369815A CN 106191934 B CN106191934 B CN 106191934B
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China
Prior art keywords
anolyte
catholyte
chamber
electrolyte
acid
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CN201610369815.6A
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Chinese (zh)
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CN106191934A (zh
Inventor
史蒂文·T·迈耶
格雷戈里·卡恩斯
理查德·G·亚伯拉罕
劳伦斯·奥索维斯基
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Rum Research Corp
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Rum Research Corp
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B1/00—Electrolytic production of inorganic compounds or non-metals
    • C25B1/01—Products
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00—Operating or servicing cells
    • C25B15/02—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25B—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FOR THE PRODUCTION OF COMPOUNDS OR NON-METALS; APPARATUS THEREFOR
    • C25B15/00—Operating or servicing cells
    • C25B15/08—Supplying or removing reactants or electrolytes; Regeneration of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/235—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising optical enhancement of defects or not-directly-visible states

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
CN201610369815.6A 2015-05-29 2016-05-30 电解液输送和生成装置 Active CN106191934B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562168198P 2015-05-29 2015-05-29
US62/168,198 2015-05-29
US14/921,602 US10011919B2 (en) 2015-05-29 2015-10-23 Electrolyte delivery and generation equipment
US14/921,602 2015-10-23

Publications (2)

Publication Number Publication Date
CN106191934A CN106191934A (zh) 2016-12-07
CN106191934B true CN106191934B (zh) 2019-10-25

Family

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Family Applications (1)

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CN201610369815.6A Active CN106191934B (zh) 2015-05-29 2016-05-30 电解液输送和生成装置

Country Status (6)

Country Link
US (2) US10011919B2 (https=)
JP (1) JP6794138B2 (https=)
KR (1) KR102634096B1 (https=)
CN (1) CN106191934B (https=)
SG (1) SG10201603606SA (https=)
TW (1) TWI700399B (https=)

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CN108232246B (zh) * 2016-12-15 2020-03-10 中国科学院大连化学物理研究所 一种铝空气电池系统及其工作方法
CN108179437B (zh) * 2017-11-30 2023-12-29 一生氢松（深圳）科技有限公司 一种阳极湿润电解装置及含有其的器具
AU2019222995B2 (en) * 2018-02-20 2024-10-03 Nuvera Fuel Cells, LLC High-voltage fuel-cell stack
CN110755727B (zh) * 2018-07-26 2023-11-28 林信涌 可电耦接云端监控系统的氢气产生器及其云端监控系统
DE102018129192A1 (de) * 2018-11-20 2020-05-20 Deutsches Zentrum für Luft- und Raumfahrt e.V. System und Verfahren zur Bestimmung der Konzentration von Metallionen in einer Lösung
JP7202230B2 (ja) * 2019-03-20 2023-01-11 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP7291223B2 (ja) * 2019-08-01 2023-06-14 Ｊｘ金属株式会社 酸化第一錫の溶解方法
CN112378838A (zh) * 2020-08-18 2021-02-19 万向一二三股份公司 一种评测极耳可靠性的装置
CN112251775A (zh) * 2020-10-23 2021-01-22 珠海格力电器股份有限公司 一种电解装置的控制方法、控制装置及电解装置
CN112701072B (zh) * 2021-03-25 2021-10-22 西安奕斯伟硅片技术有限公司 晶圆处理装置及晶圆缺陷评价方法
CN113391554B (zh) * 2021-06-16 2022-06-17 江苏东南环保科技有限公司 一种基于人工智能的电镀方法
PL4254590T3 (pl) * 2022-03-31 2025-05-12 Hoppecke Batterien Gmbh & Co. Kg. Urządzenie napełniające do ogniw baterii i sposób
US20230313406A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
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US20240068108A1 (en) * 2022-08-30 2024-02-29 Tech-Etch, Inc. Process for chemically treating surfaces to increase wettability
CN116397267B (zh) * 2023-05-09 2026-03-17 中铜东南铜业有限公司 一种铜电解/电积装置及其工作方法
CN116874036B (zh) * 2023-07-17 2025-08-15 宁波方太厨具有限公司 一种电解槽
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CN119243186B (zh) * 2024-12-05 2025-05-02 福建德尔科技股份有限公司 一种全氟三丙胺的自动补液连续生产装置及工艺
CN120158780B (zh) * 2025-04-29 2025-11-11 北京亿能氢源科技有限公司 基于变频循环泵的电解液流量精准调控系统及方法

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Also Published As

Publication number Publication date
TW201710563A (zh) 2017-03-16
TWI700399B (zh) 2020-08-01
CN106191934A (zh) 2016-12-07
SG10201603606SA (en) 2016-12-29
US10011919B2 (en) 2018-07-03
US20160348265A1 (en) 2016-12-01
JP6794138B2 (ja) 2020-12-02
JP2017020102A (ja) 2017-01-26
KR102634096B1 (ko) 2024-02-07
US20180274123A1 (en) 2018-09-27
KR20160140483A (ko) 2016-12-07

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