TWI699409B - 用於電磁屏蔽的導電組成物、由其形成之電磁屏蔽層、包含其之電路板積層體以及形成電磁屏蔽層的方法 - Google Patents

用於電磁屏蔽的導電組成物、由其形成之電磁屏蔽層、包含其之電路板積層體以及形成電磁屏蔽層的方法 Download PDF

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Publication number
TWI699409B
TWI699409B TW107137754A TW107137754A TWI699409B TW I699409 B TWI699409 B TW I699409B TW 107137754 A TW107137754 A TW 107137754A TW 107137754 A TW107137754 A TW 107137754A TW I699409 B TWI699409 B TW I699409B
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Taiwan
Prior art keywords
electromagnetic shielding
conductive composition
shielding layer
patent application
item
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TW107137754A
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English (en)
Chinese (zh)
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TW201938705A (zh
Inventor
徐賢柱
愼庸完
李雨星
沈在俊
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南韓商三星Ｓｄｉ股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
TW107137754A 2018-03-05 2018-10-25 用於電磁屏蔽的導電組成物、由其形成之電磁屏蔽層、包含其之電路板積層體以及形成電磁屏蔽層的方法 TWI699409B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180026025A KR20190105455A (ko) 2018-03-05 2018-03-05 전자파 차폐용 도전성 조성물, 이로부터 제조된 전자파 차폐층, 이를 포함하는 회로기판 적층체 및 전자파 차폐층 형성방법
KR10-2018-0026025 2018-03-05

Publications (2)

Publication Number Publication Date
TW201938705A TW201938705A (zh) 2019-10-01
TWI699409B true TWI699409B (zh) 2020-07-21

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TW107137754A TWI699409B (zh) 2018-03-05 2018-10-25 用於電磁屏蔽的導電組成物、由其形成之電磁屏蔽層、包含其之電路板積層體以及形成電磁屏蔽層的方法

Country Status (3)

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KR (1) KR20190105455A (fr)
TW (1) TWI699409B (fr)
WO (1) WO2019172493A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116026312B (zh) * 2023-03-31 2023-05-30 中国船舶集团有限公司第七〇七研究所 一种具有均热磁屏蔽功能的光纤环圈
CN117925146A (zh) * 2024-01-26 2024-04-26 火星新材料科技(深圳)有限公司 一种低频段电磁屏蔽胶及其制备方法、使用方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102711428A (zh) * 2012-06-21 2012-10-03 广州方邦电子有限公司 一种高屏蔽效能的极薄屏蔽膜及其制作方法
TWI405801B (zh) * 2007-10-19 2013-08-21 Nat Univ Tsing Hua 具有電磁波干擾遮蔽效應之多壁碳奈米管／高分子奈米複合材之製備方法
WO2018028092A1 (fr) * 2016-08-09 2018-02-15 苏州列治埃盟新材料技术转移有限公司 Matériau composite à base de particules de carbure de silicium plaquées de nickel autocatalytique, de cuivre et d'aluminium, et son procédé de fabrication

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100808146B1 (ko) * 2005-04-29 2008-02-29 한국전자통신연구원 전자파 차폐용 박형 도전성 테이프 조성물, 이의 제조방법및 상기 조성물로 제조한 전자파 차폐용 박형 도전성테이프
KR20090047328A (ko) * 2007-11-07 2009-05-12 삼성전기주식회사 도전성 페이스트 및 이를 이용한 인쇄회로기판
KR101160589B1 (ko) * 2010-09-07 2012-06-28 두성산업 주식회사 내열성, 접착성, 내굴곡성, 및 도전성이 향상된 연성인쇄회로기판의 전자파 차폐용 접착시트 및 이를 포함하는 연성인쇄회로기판
KR20150069383A (ko) * 2013-12-13 2015-06-23 가톨릭대학교 산학협력단 전자파 차폐제 및 그 제조 방법과 상기 전자파 차폐제를 포함한 전자기기
CN108140635A (zh) * 2015-09-30 2018-06-08 三星Sdi株式会社 半导体封装件及其制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI405801B (zh) * 2007-10-19 2013-08-21 Nat Univ Tsing Hua 具有電磁波干擾遮蔽效應之多壁碳奈米管／高分子奈米複合材之製備方法
CN102711428A (zh) * 2012-06-21 2012-10-03 广州方邦电子有限公司 一种高屏蔽效能的极薄屏蔽膜及其制作方法
WO2018028092A1 (fr) * 2016-08-09 2018-02-15 苏州列治埃盟新材料技术转移有限公司 Matériau composite à base de particules de carbure de silicium plaquées de nickel autocatalytique, de cuivre et d'aluminium, et son procédé de fabrication

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Publication number Publication date
WO2019172493A1 (fr) 2019-09-12
KR20190105455A (ko) 2019-09-17
TW201938705A (zh) 2019-10-01

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