TWI698413B - 抗蝕基板前處理組成物及抗蝕基板之製造方法 - Google Patents

抗蝕基板前處理組成物及抗蝕基板之製造方法 Download PDF

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Publication number
TWI698413B
TWI698413B TW106142657A TW106142657A TWI698413B TW I698413 B TWI698413 B TW I698413B TW 106142657 A TW106142657 A TW 106142657A TW 106142657 A TW106142657 A TW 106142657A TW I698413 B TWI698413 B TW I698413B
Authority
TW
Taiwan
Prior art keywords
substrate
pretreatment composition
amphoteric surfactant
resist
value
Prior art date
Application number
TW106142657A
Other languages
English (en)
Chinese (zh)
Other versions
TW201825453A (zh
Inventor
竹田拓馬
佐藤祥平
Original Assignee
日商三洋化成工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三洋化成工業股份有限公司 filed Critical 日商三洋化成工業股份有限公司
Publication of TW201825453A publication Critical patent/TW201825453A/zh
Application granted granted Critical
Publication of TWI698413B publication Critical patent/TWI698413B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02—Anionic compounds
    • C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
    • C11D1/29—Sulfates of polyoxyalkylene ethers
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38—Cationic compounds
    • C11D1/52—Carboxylic amides, alkylolamides or imides or their condensation products with alkylene oxides
    • C11D1/521—Carboxylic amides (R1-CO-NR2R3), where R1, R2 and R3 are alkyl or alkenyl groups
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/88—Ampholytes; Electroneutral compounds
    • C11D1/94—Mixtures with anionic, cationic or non-ionic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Detergent Compositions (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW106142657A 2016-12-22 2017-12-06 抗蝕基板前處理組成物及抗蝕基板之製造方法 TWI698413B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016249838 2016-12-22
JPJP2016-249838 2016-12-22

Publications (2)

Publication Number Publication Date
TW201825453A TW201825453A (zh) 2018-07-16
TWI698413B true TWI698413B (zh) 2020-07-11

Family

ID=62626418

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106142657A TWI698413B (zh) 2016-12-22 2017-12-06 抗蝕基板前處理組成物及抗蝕基板之製造方法

Country Status (5)

Country Link
JP (1) JP6653771B2 (ja)
KR (1) KR102120022B1 (ja)
CN (1) CN109964546B (ja)
TW (1) TWI698413B (ja)
WO (1) WO2018116780A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI234578B (en) * 2000-03-03 2005-06-21 Rohm & Haas Removable coating composition and preparative method
TW200924977A (en) * 2007-08-27 2009-06-16 Du Pont Compositions and methods for wet lamination of photopolymerizable dry films onto substrates
WO2016111035A1 (ja) * 2015-01-07 2016-07-14 太陽インキ製造株式会社 金属基材用表面処理剤

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07263845A (ja) 1994-03-18 1995-10-13 Fujitsu Ltd プリント配線板の製造方法及びその製造装置
JPH0918115A (ja) 1995-06-30 1997-01-17 Kokusai Electric Co Ltd レジストパターンの形成方法
JPH10300921A (ja) * 1997-04-28 1998-11-13 Sumitomo Chem Co Ltd ブラックマトリックスの製造方法
JP2004299386A (ja) * 2003-03-20 2004-10-28 Ricoh Co Ltd 画像形成方法とそれに用いる画像形成装置及びインクセット
CN100404274C (zh) * 2003-03-20 2008-07-23 株式会社理光 成像方法、成像装置、油墨组、油墨盒和印刷物
EP2277929B1 (en) * 2004-09-30 2012-11-21 JSR Corporation Copolymer and top coating composition
JP2007227715A (ja) 2006-02-24 2007-09-06 Stanley Electric Co Ltd パターニング基板の製造方法
US20070237899A1 (en) 2006-04-05 2007-10-11 David Sawoska Process for creating a pattern on a copper surface
WO2009028156A1 (ja) * 2007-08-29 2009-03-05 Panasonic Corporation 配線部材、樹脂付金属部品及び樹脂封止半導体装置、並びにこれらの製造方法
JP5676908B2 (ja) * 2010-04-21 2015-02-25 上村工業株式会社 プリント配線基板の表面処理方法及び表面処理剤
JP5498328B2 (ja) 2010-09-14 2014-05-21 積水化学工業株式会社 プリント配線板の製造方法
JP6094587B2 (ja) * 2012-09-10 2017-03-22 Jsr株式会社 レジスト下層膜形成用組成物及びパターン形成方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI234578B (en) * 2000-03-03 2005-06-21 Rohm & Haas Removable coating composition and preparative method
TW200924977A (en) * 2007-08-27 2009-06-16 Du Pont Compositions and methods for wet lamination of photopolymerizable dry films onto substrates
WO2016111035A1 (ja) * 2015-01-07 2016-07-14 太陽インキ製造株式会社 金属基材用表面処理剤

Also Published As

Publication number Publication date
WO2018116780A1 (ja) 2018-06-28
CN109964546B (zh) 2021-09-10
TW201825453A (zh) 2018-07-16
KR20190069496A (ko) 2019-06-19
JPWO2018116780A1 (ja) 2019-06-24
KR102120022B1 (ko) 2020-06-05
CN109964546A (zh) 2019-07-02
JP6653771B2 (ja) 2020-02-26

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