TWI698044B - 天線模組及其製造方法 - Google Patents

天線模組及其製造方法 Download PDF

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Publication number
TWI698044B
TWI698044B TW107113765A TW107113765A TWI698044B TW I698044 B TWI698044 B TW I698044B TW 107113765 A TW107113765 A TW 107113765A TW 107113765 A TW107113765 A TW 107113765A TW I698044 B TWI698044 B TW I698044B
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TW
Taiwan
Prior art keywords
antenna
layer
antenna module
insulating
dielectric layer
Prior art date
Application number
TW107113765A
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English (en)
Chinese (zh)
Other versions
TW201909475A (zh
Inventor
金斗一
白龍浩
許榮植
安成庸
Original Assignee
南韓商三星電機股份有限公司
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Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司
Publication of TW201909475A publication Critical patent/TW201909475A/zh
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Publication of TWI698044B publication Critical patent/TWI698044B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02377—Fan-in arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
TW107113765A 2017-07-18 2018-04-24 天線模組及其製造方法 TWI698044B (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR20170091120 2017-07-18
??10-2017-0091120 2017-07-18
KR10-2017-0091120 2017-07-18
KR10-2017-0146113 2017-11-03
??10-2017-0146113 2017-11-03
KR1020170146113A KR102019952B1 (ko) 2017-07-18 2017-11-03 안테나 모듈 및 안테나 모듈 제조 방법

Publications (2)

Publication Number Publication Date
TW201909475A TW201909475A (zh) 2019-03-01
TWI698044B true TWI698044B (zh) 2020-07-01

Family

ID=65269664

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107113765A TWI698044B (zh) 2017-07-18 2018-04-24 天線模組及其製造方法

Country Status (2)

Country Link
KR (3) KR102019952B1 (ko)
TW (1) TWI698044B (ko)

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KR102066904B1 (ko) 2018-09-18 2020-01-16 삼성전자주식회사 안테나 모듈
KR102163419B1 (ko) * 2019-02-08 2020-10-08 삼성전기주식회사 칩 안테나 모듈
JP6888222B2 (ja) 2019-02-08 2021-06-16 サムソン エレクトロ−メカニックス カンパニーリミテッド． チップアンテナモジュール
KR20200099261A (ko) 2019-02-14 2020-08-24 삼성전자주식회사 인터포저 및 이를 포함하는 전자 장치
US11502402B2 (en) 2019-03-15 2022-11-15 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated patch antenna having insulating substrate with antenna cavity and high-K dielectric
KR102587772B1 (ko) * 2019-03-21 2023-10-12 삼성전자주식회사 복수의 주파수 대역을 천이 및 급전하는 전송 선로를 포함하는 안테나 구조체 및 상기 안테나 구조체를 포함하는 전자 장치
CN112152658B (zh) * 2019-06-27 2022-07-08 Oppo广东移动通信有限公司 电子设备及保护套
KR102387748B1 (ko) * 2019-08-05 2022-04-15 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
KR102137093B1 (ko) * 2019-08-05 2020-07-23 삼성전기주식회사 안테나 모듈 및 이를 포함하는 전자기기
KR102603106B1 (ko) 2019-09-04 2023-11-15 삼성전기주식회사 어레이 안테나
DE102019134673A1 (de) * 2019-09-30 2021-04-01 Taiwan Semiconductor Manufacturing Co. Ltd. Antennen-package zur signalübertragung
US11114745B2 (en) 2019-09-30 2021-09-07 Taiwan Semiconductor Manufacturing Co., Ltd. Antenna package for signal transmission
KR20220006246A (ko) 2020-07-08 2022-01-17 삼성전기주식회사 고주파 패키지
KR20220006784A (ko) 2020-07-09 2022-01-18 삼성전기주식회사 안테나 모듈
CN112216958B (zh) * 2020-09-30 2022-11-18 维沃移动通信有限公司 电子设备
KR102396443B1 (ko) 2021-02-16 2022-05-09 동우 화인켐 주식회사 안테나 구조체 및 이를 포함하는 화상 표시 장치
KR20220126514A (ko) * 2021-03-09 2022-09-16 삼성전자주식회사 안테나 및 그것을 포함하는 전자 장치
KR20230000887A (ko) 2021-06-25 2023-01-03 동우 화인켐 주식회사 안테나 구조체
KR102390288B1 (ko) 2021-07-05 2022-04-22 동우 화인켐 주식회사 안테나 구조체 및 이를 포함하는 화상 표시 장치
KR102367163B1 (ko) 2021-07-05 2022-02-23 동우 화인켐 주식회사 안테나 구조체 및 이를 포함하는 화상 표시 장치
KR102578889B1 (ko) * 2021-07-05 2023-09-15 주식회사 네패스 안테나를 포함하는 반도체 패키지
KR102390287B1 (ko) 2021-07-05 2022-04-22 동우 화인켐 주식회사 안테나 구조체 및 이를 포함하는 화상 표시 장치
KR102390289B1 (ko) 2021-07-05 2022-04-22 동우 화인켐 주식회사 안테나 구조체 및 이를 포함하는 화상 표시 장치
KR20230017015A (ko) 2021-07-27 2023-02-03 동우 화인켐 주식회사 안테나 구조체
KR20230053423A (ko) 2021-10-14 2023-04-21 동우 화인켐 주식회사 안테나 패키지 및 이를 포함하는 화상 표시 장치
KR20230116419A (ko) 2022-01-28 2023-08-04 동우 화인켐 주식회사 안테나용 임피던스 변환기, 이를 포함하는 안테나 모듈 및 이를 포함하는 화상 표시 장치
KR20230116416A (ko) 2022-01-28 2023-08-04 동우 화인켐 주식회사 안테나 패키지 및 이를 포함하는 화상 표시 장치
KR20230121526A (ko) 2022-02-11 2023-08-18 동우 화인켐 주식회사 안테나 구조체
KR20230134776A (ko) 2022-03-15 2023-09-22 동우 화인켐 주식회사 안테나 소자
KR20230134778A (ko) 2022-03-15 2023-09-22 동우 화인켐 주식회사 안테나용 방사 조절체
KR20230134777A (ko) 2022-03-15 2023-09-22 동우 화인켐 주식회사 안테나 구조체
KR20230159093A (ko) 2022-05-13 2023-11-21 동우 화인켐 주식회사 안테나용 회로 기판, 이를 포함하는 안테나 패키지 및 이를 포함하는 화상 표시 장치
KR20230165575A (ko) 2022-05-27 2023-12-05 동우 화인켐 주식회사 안테나용 회로 기판, 이를 포함하는 안테나 패키지 및 이를 포함하는 화상 표시 장치
KR20230171224A (ko) 2022-06-13 2023-12-20 동우 화인켐 주식회사 안테나 소자
KR102636402B1 (ko) 2022-06-27 2024-02-13 동우 화인켐 주식회사 안테나 소자
KR102636403B1 (ko) 2022-08-08 2024-02-14 동우 화인켐 주식회사 안테나 구조체

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CN101820097A (zh) * 2009-01-14 2010-09-01 莱尔德技术股份有限公司 双极化天线模块
JP2015008410A (ja) * 2013-06-25 2015-01-15 パナソニックＩｐマネジメント株式会社 無線モジュール
US20150029062A1 (en) * 2013-07-24 2015-01-29 Raytheon Company Polarization Dependent Electromagnetic Bandgap Antenna And Related Methods
CN104716122A (zh) * 2013-12-13 2015-06-17 英飞凌科技股份有限公司 具有集成的微波组件的半导体封装件
CN104867912A (zh) * 2013-12-18 2015-08-26 英特尔公司 嵌入式毫米波相控阵列模块
US9711465B2 (en) * 2012-05-29 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd. Antenna cavity structure for integrated patch antenna in integrated fan-out packaging

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CN101820097A (zh) * 2009-01-14 2010-09-01 莱尔德技术股份有限公司 双极化天线模块
US9711465B2 (en) * 2012-05-29 2017-07-18 Taiwan Semiconductor Manufacturing Co., Ltd. Antenna cavity structure for integrated patch antenna in integrated fan-out packaging
JP2015008410A (ja) * 2013-06-25 2015-01-15 パナソニックＩｐマネジメント株式会社 無線モジュール
US20150029062A1 (en) * 2013-07-24 2015-01-29 Raytheon Company Polarization Dependent Electromagnetic Bandgap Antenna And Related Methods
CN104716122A (zh) * 2013-12-13 2015-06-17 英飞凌科技股份有限公司 具有集成的微波组件的半导体封装件
CN104867912A (zh) * 2013-12-18 2015-08-26 英特尔公司 嵌入式毫米波相控阵列模块

Also Published As

Publication number Publication date
KR20190105546A (ko) 2019-09-17
KR20210042871A (ko) 2021-04-20
KR20190009232A (ko) 2019-01-28
KR102314698B1 (ko) 2021-10-19
KR102019952B1 (ko) 2019-09-11
TW201909475A (zh) 2019-03-01
KR102240242B1 (ko) 2021-04-14

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