TWI697382B - 研磨墊及研磨墊的製造方法 - Google Patents

研磨墊及研磨墊的製造方法 Download PDF

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Publication number
TWI697382B
TWI697382B TW104131365A TW104131365A TWI697382B TW I697382 B TWI697382 B TW I697382B TW 104131365 A TW104131365 A TW 104131365A TW 104131365 A TW104131365 A TW 104131365A TW I697382 B TWI697382 B TW I697382B
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TW
Taiwan
Prior art keywords
polishing
adhesive
layer
polishing layer
less
Prior art date
Application number
TW104131365A
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English (en)
Chinese (zh)
Other versions
TW201620670A (zh
Inventor
向史博
田浦歳和
高木大輔
鈴木真二
Original Assignee
日商阪東化學股份有限公司
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Publication date
Application filed by 日商阪東化學股份有限公司 filed Critical 日商阪東化學股份有限公司
Publication of TW201620670A publication Critical patent/TW201620670A/zh
Application granted granted Critical
Publication of TWI697382B publication Critical patent/TWI697382B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW104131365A 2014-09-26 2015-09-23 研磨墊及研磨墊的製造方法 TWI697382B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014197481 2014-09-26
JP2014-197481 2014-09-26

Publications (2)

Publication Number Publication Date
TW201620670A TW201620670A (zh) 2016-06-16
TWI697382B true TWI697382B (zh) 2020-07-01

Family

ID=55581062

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104131365A TWI697382B (zh) 2014-09-26 2015-09-23 研磨墊及研磨墊的製造方法

Country Status (4)

Country Link
JP (2) JP6822840B2 (ja)
CN (1) CN206717685U (ja)
TW (1) TWI697382B (ja)
WO (1) WO2016047535A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109202696A (zh) * 2018-09-10 2019-01-15 台山市远鹏研磨科技有限公司 一种金刚石陶瓷减薄垫
JP3224896U (ja) * 2019-11-13 2020-01-30 バンドー化学株式会社 研磨パッド

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI233384B (en) * 2000-08-14 2005-06-01 3M Innovative Properties Co Abrasive pad for CMP
TW201021972A (en) * 2008-09-17 2010-06-16 Kuraray Co Polishing pad
TW201404542A (zh) * 2012-07-13 2014-02-01 3M Innovative Properties Co 硏磨墊及硏磨玻璃，陶瓷及金屬材料之方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03256676A (ja) * 1990-03-05 1991-11-15 Romatetsuku Kk 研削布
JP2007190613A (ja) * 2004-02-09 2007-08-02 Bando Chem Ind Ltd 研磨フィルム及びその製造方法
JP2007007844A (ja) * 2005-05-31 2007-01-18 Mineo Kobayashi 軟質樹脂砥石、それを用いた円筒状研削ロールとその製造方法
JP2009072832A (ja) * 2007-09-18 2009-04-09 Bando Chem Ind Ltd 研磨シートおよびその製造方法
JP2011031361A (ja) * 2009-08-05 2011-02-17 Nihon Micro Coating Co Ltd 研磨用具、研磨方法及び研磨用具の製造方法
JP2012064295A (ja) * 2009-11-10 2012-03-29 Showa Denko Kk 磁気記録媒体用ガラス基板の製造方法
CN102862128B (zh) * 2012-09-20 2015-10-21 北京国瑞升科技股份有限公司 一种凹凸结构磨料制品及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI233384B (en) * 2000-08-14 2005-06-01 3M Innovative Properties Co Abrasive pad for CMP
TW201021972A (en) * 2008-09-17 2010-06-16 Kuraray Co Polishing pad
TW201404542A (zh) * 2012-07-13 2014-02-01 3M Innovative Properties Co 硏磨墊及硏磨玻璃，陶瓷及金屬材料之方法

Also Published As

Publication number Publication date
JPWO2016047535A1 (ja) 2017-07-20
TW201620670A (zh) 2016-06-16
JP2021020314A (ja) 2021-02-18
JP6822840B2 (ja) 2021-01-27
WO2016047535A1 (ja) 2016-03-31
CN206717685U (zh) 2017-12-08

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