CN206717685U - 研磨垫 - Google Patents
研磨垫 Download PDFInfo
- Publication number
- CN206717685U CN206717685U CN201590000989.4U CN201590000989U CN206717685U CN 206717685 U CN206717685 U CN 206717685U CN 201590000989 U CN201590000989 U CN 201590000989U CN 206717685 U CN206717685 U CN 206717685U
- Authority
- CN
- China
- Prior art keywords
- grinding
- layer
- convex shaped
- shaped part
- grinding layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014197481 | 2014-09-26 | ||
JP2014-197481 | 2014-09-26 | ||
PCT/JP2015/076379 WO2016047535A1 (ja) | 2014-09-26 | 2015-09-17 | 研磨パッド及び研磨パッドの製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206717685U true CN206717685U (zh) | 2017-12-08 |
Family
ID=55581062
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201590000989.4U Active CN206717685U (zh) | 2014-09-26 | 2015-09-17 | 研磨垫 |
Country Status (4)
Country | Link |
---|---|
JP (2) | JP6822840B2 (ja) |
CN (1) | CN206717685U (ja) |
TW (1) | TWI697382B (ja) |
WO (1) | WO2016047535A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109202696A (zh) * | 2018-09-10 | 2019-01-15 | 台山市远鹏研磨科技有限公司 | 一种金刚石陶瓷减薄垫 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3224896U (ja) * | 2019-11-13 | 2020-01-30 | バンドー化学株式会社 | 研磨パッド |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03256676A (ja) * | 1990-03-05 | 1991-11-15 | Romatetsuku Kk | 研削布 |
JP2002057130A (ja) * | 2000-08-14 | 2002-02-22 | Three M Innovative Properties Co | Cmp用研磨パッド |
JP2007190613A (ja) * | 2004-02-09 | 2007-08-02 | Bando Chem Ind Ltd | 研磨フィルム及びその製造方法 |
JP2007007844A (ja) * | 2005-05-31 | 2007-01-18 | Mineo Kobayashi | 軟質樹脂砥石、それを用いた円筒状研削ロールとその製造方法 |
JP2009072832A (ja) * | 2007-09-18 | 2009-04-09 | Bando Chem Ind Ltd | 研磨シートおよびその製造方法 |
WO2010032715A1 (ja) * | 2008-09-17 | 2010-03-25 | 株式会社クラレ | 研磨パッド |
JP2011031361A (ja) * | 2009-08-05 | 2011-02-17 | Nihon Micro Coating Co Ltd | 研磨用具、研磨方法及び研磨用具の製造方法 |
JP2012064295A (ja) * | 2009-11-10 | 2012-03-29 | Showa Denko Kk | 磁気記録媒体用ガラス基板の製造方法 |
JP6188286B2 (ja) * | 2012-07-13 | 2017-08-30 | スリーエム イノベイティブ プロパティズ カンパニー | 研磨パッド及びガラス、セラミックス、及び金属材料の研磨方法 |
CN102862128B (zh) * | 2012-09-20 | 2015-10-21 | 北京国瑞升科技股份有限公司 | 一种凹凸结构磨料制品及其制备方法 |
-
2015
- 2015-09-17 CN CN201590000989.4U patent/CN206717685U/zh active Active
- 2015-09-17 JP JP2016550140A patent/JP6822840B2/ja active Active
- 2015-09-17 WO PCT/JP2015/076379 patent/WO2016047535A1/ja active Application Filing
- 2015-09-23 TW TW104131365A patent/TWI697382B/zh active
-
2020
- 2020-10-30 JP JP2020183345A patent/JP2021020314A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109202696A (zh) * | 2018-09-10 | 2019-01-15 | 台山市远鹏研磨科技有限公司 | 一种金刚石陶瓷减薄垫 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2016047535A1 (ja) | 2017-07-20 |
TW201620670A (zh) | 2016-06-16 |
TWI697382B (zh) | 2020-07-01 |
JP2021020314A (ja) | 2021-02-18 |
JP6822840B2 (ja) | 2021-01-27 |
WO2016047535A1 (ja) | 2016-03-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |