TWI696682B - 表面保護膜 - Google Patents
表面保護膜 Download PDFInfo
- Publication number
- TWI696682B TWI696682B TW105111851A TW105111851A TWI696682B TW I696682 B TWI696682 B TW I696682B TW 105111851 A TW105111851 A TW 105111851A TW 105111851 A TW105111851 A TW 105111851A TW I696682 B TWI696682 B TW I696682B
- Authority
- TW
- Taiwan
- Prior art keywords
- film
- adhesive layer
- protective film
- cover
- surface protection
- Prior art date
Links
- 239000010408 film Substances 0.000 claims abstract description 311
- 239000012790 adhesive layer Substances 0.000 claims abstract description 152
- 230000001681 protective effect Effects 0.000 claims abstract description 101
- 239000013039 cover film Substances 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims abstract description 83
- 230000003287 optical effect Effects 0.000 claims abstract description 82
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000000853 adhesive Substances 0.000 claims description 78
- 230000001070 adhesive effect Effects 0.000 claims description 77
- 238000000034 method Methods 0.000 claims description 26
- 230000035699 permeability Effects 0.000 claims description 8
- 238000007689 inspection Methods 0.000 description 34
- 239000003795 chemical substances by application Substances 0.000 description 14
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 238000003384 imaging method Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 239000000428 dust Substances 0.000 description 8
- -1 polyethylene Polymers 0.000 description 8
- 238000012545 processing Methods 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 229920000642 polymer Polymers 0.000 description 5
- 238000011900 installation process Methods 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920000180 alkyd Polymers 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000005038 ethylene vinyl acetate Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920006264 polyurethane film Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
Landscapes
- Power Engineering (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015098349 | 2015-05-13 | ||
| JP2015-098349 | 2015-05-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201706376A TW201706376A (zh) | 2017-02-16 |
| TWI696682B true TWI696682B (zh) | 2020-06-21 |
Family
ID=57248014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105111851A TWI696682B (zh) | 2015-05-13 | 2016-04-15 | 表面保護膜 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6747696B2 (ja) |
| CN (1) | CN108307636B (ja) |
| TW (1) | TWI696682B (ja) |
| WO (1) | WO2016181741A1 (ja) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018210680A1 (de) * | 2018-06-29 | 2020-01-02 | Trumpf Laser Gmbh | Optisches Element mit abziehbarer Schutzfolie |
| CN109264182A (zh) * | 2018-09-28 | 2019-01-25 | Oppo广东移动通信有限公司 | 保护膜及其制作方法 |
| CN109337600B (zh) * | 2018-11-16 | 2021-01-19 | 深圳市飞荣达科技股份有限公司 | 胶面局部无胶的单面胶及其生产方法 |
| US20220348393A1 (en) * | 2019-08-16 | 2022-11-03 | Nitto Denko Corporation | Cover member and member supply assembly including same |
| KR20220026855A (ko) * | 2020-08-26 | 2022-03-07 | 엘지이노텍 주식회사 | 보호 시트 및 이를 포함하는 카메라 모듈 |
| CN114125203B (zh) * | 2020-08-28 | 2024-03-08 | 宁波舜宇光电信息有限公司 | 光学镜头及其制备方法、摄像模组和电子设备 |
| JP2022089364A (ja) * | 2020-12-04 | 2022-06-16 | 日東電工株式会社 | 粘着シート |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200842176A (en) * | 2006-12-18 | 2008-11-01 | Nitto Denko Corp | Pressure-sensitive adhesive sheet |
| JP2010174067A (ja) * | 2009-01-27 | 2010-08-12 | Furukawa Electric Co Ltd:The | 表面保護用粘着テープ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0636597Y2 (ja) * | 1987-08-20 | 1994-09-21 | リンテック株式会社 | 電子部品用保護テ−プ |
| JPH0636597A (ja) * | 1992-07-20 | 1994-02-10 | Texas Instr Japan Ltd | 半導体記憶装置 |
| JP4447280B2 (ja) * | 2003-10-16 | 2010-04-07 | リンテック株式会社 | 表面保護用シートおよび半導体ウエハの研削方法 |
| WO2005057644A1 (ja) * | 2003-12-15 | 2005-06-23 | The Furukawa Electric Co., Ltd. | ウェハ加工用テープおよびその製造方法 |
| JP4116607B2 (ja) * | 2004-04-28 | 2008-07-09 | 日東電工株式会社 | 映像センサの実装方法およびそれに用いる粘着テープ |
| JP2015044924A (ja) * | 2013-08-27 | 2015-03-12 | 大和グランド株式会社 | 画面保護フィルム及びその製造方法 |
-
2016
- 2016-04-11 WO PCT/JP2016/061740 patent/WO2016181741A1/ja active Application Filing
- 2016-04-11 JP JP2017517832A patent/JP6747696B2/ja active Active
- 2016-04-11 CN CN201680026769.8A patent/CN108307636B/zh active Active
- 2016-04-15 TW TW105111851A patent/TWI696682B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200842176A (en) * | 2006-12-18 | 2008-11-01 | Nitto Denko Corp | Pressure-sensitive adhesive sheet |
| JP2010174067A (ja) * | 2009-01-27 | 2010-08-12 | Furukawa Electric Co Ltd:The | 表面保護用粘着テープ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6747696B2 (ja) | 2020-08-26 |
| CN108307636B (zh) | 2021-04-23 |
| TW201706376A (zh) | 2017-02-16 |
| JPWO2016181741A1 (ja) | 2018-03-01 |
| CN108307636A (zh) | 2018-07-20 |
| WO2016181741A1 (ja) | 2016-11-17 |
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