TWI696650B - 成膜方法、成膜裝置、元件結構體之製造方法及元件結構體之製造裝置 - Google Patents
成膜方法、成膜裝置、元件結構體之製造方法及元件結構體之製造裝置 Download PDFInfo
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- TWI696650B TWI696650B TW107105823A TW107105823A TWI696650B TW I696650 B TWI696650 B TW I696650B TW 107105823 A TW107105823 A TW 107105823A TW 107105823 A TW107105823 A TW 107105823A TW I696650 B TWI696650 B TW I696650B
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/58—After-treatment
- C23C14/5873—Removal of material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-030318 | 2017-02-21 | ||
| JP2017030318 | 2017-02-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201835173A TW201835173A (zh) | 2018-10-01 |
| TWI696650B true TWI696650B (zh) | 2020-06-21 |
Family
ID=63252740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107105823A TWI696650B (zh) | 2017-02-21 | 2018-02-21 | 成膜方法、成膜裝置、元件結構體之製造方法及元件結構體之製造裝置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6653408B2 (ja) |
| KR (1) | KR102234630B1 (ja) |
| CN (1) | CN110268091B (ja) |
| TW (1) | TWI696650B (ja) |
| WO (1) | WO2018155415A1 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7556128B2 (ja) * | 2020-07-27 | 2024-09-25 | 江蘇菲沃泰納米科技股▲フン▼有限公司 | 原料気化装置、コーティング装置、コーティング機器及びその材料投入方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI357775B (en) * | 2004-02-23 | 2012-02-01 | Global Oled Technology Llc | Vaporizing temperature sensitive materials for ole |
| TWI391994B (zh) * | 2005-10-06 | 2013-04-01 | Tokyo Electron Ltd | 汽化器及半導體處理系統 |
| TW201316588A (zh) * | 2011-06-29 | 2013-04-16 | Tokyo Electron Ltd | 材料供給裝置及成膜裝置 |
| TWI434364B (zh) * | 2008-01-18 | 2014-04-11 | Tokyo Electron Ltd | 包含氣化器之半導體處理系統與使用此系統之方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000200781A (ja) * | 1999-01-07 | 2000-07-18 | Ebara Corp | 液体原料気化装置及び方法 |
| JP2002173778A (ja) | 2000-12-04 | 2002-06-21 | Japan Pionics Co Ltd | 気化器 |
| JP2003213422A (ja) | 2002-01-24 | 2003-07-30 | Nec Corp | 薄膜の形成装置及びその形成方法 |
| US7968437B2 (en) * | 2005-11-18 | 2011-06-28 | Hitachi Kokusai Electric Inc. | Semiconductor device manufacturing method and substrate processing apparatus |
| JP4324619B2 (ja) | 2007-03-29 | 2009-09-02 | 東京エレクトロン株式会社 | 気化装置、成膜装置及び気化方法 |
| JP5573666B2 (ja) * | 2010-12-28 | 2014-08-20 | 東京エレクトロン株式会社 | 原料供給装置及び成膜装置 |
| JP2013073880A (ja) | 2011-09-29 | 2013-04-22 | Ulvac Japan Ltd | 発光素子の製造方法 |
| WO2014196137A1 (ja) * | 2013-06-07 | 2014-12-11 | 株式会社アルバック | 素子構造体及びその製造方法 |
-
2018
- 2018-02-20 CN CN201880010348.5A patent/CN110268091B/zh active Active
- 2018-02-20 KR KR1020197016816A patent/KR102234630B1/ko active IP Right Grant
- 2018-02-20 JP JP2019501327A patent/JP6653408B2/ja active Active
- 2018-02-20 WO PCT/JP2018/005925 patent/WO2018155415A1/ja active Application Filing
- 2018-02-21 TW TW107105823A patent/TWI696650B/zh active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI357775B (en) * | 2004-02-23 | 2012-02-01 | Global Oled Technology Llc | Vaporizing temperature sensitive materials for ole |
| TWI391994B (zh) * | 2005-10-06 | 2013-04-01 | Tokyo Electron Ltd | 汽化器及半導體處理系統 |
| TWI434364B (zh) * | 2008-01-18 | 2014-04-11 | Tokyo Electron Ltd | 包含氣化器之半導體處理系統與使用此系統之方法 |
| TW201316588A (zh) * | 2011-06-29 | 2013-04-16 | Tokyo Electron Ltd | 材料供給裝置及成膜裝置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018155415A1 (ja) | 2018-08-30 |
| JPWO2018155415A1 (ja) | 2019-11-07 |
| CN110268091B (zh) | 2021-10-12 |
| KR102234630B1 (ko) | 2021-04-01 |
| JP6653408B2 (ja) | 2020-02-26 |
| KR20190077534A (ko) | 2019-07-03 |
| CN110268091A (zh) | 2019-09-20 |
| TW201835173A (zh) | 2018-10-01 |
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