TWI696517B - 化學機械拋光墊及拋光方法 - Google Patents

化學機械拋光墊及拋光方法 Download PDF

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Publication number
TWI696517B
TWI696517B TW105106942A TW105106942A TWI696517B TW I696517 B TWI696517 B TW I696517B TW 105106942 A TW105106942 A TW 105106942A TW 105106942 A TW105106942 A TW 105106942A TW I696517 B TWI696517 B TW I696517B
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TW
Taiwan
Prior art keywords
polishing
orifice
pad
avg
window
Prior art date
Application number
TW105106942A
Other languages
English (en)
Chinese (zh)
Other versions
TW201632302A (zh
Inventor
約瑟 索
百年 錢
珍妮特 泰斯費
Original Assignee
美商羅門哈斯電子材料Ｃｍｐ控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 美商羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW201632302A publication Critical patent/TW201632302A/zh
Application granted granted Critical
Publication of TWI696517B publication Critical patent/TWI696517B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW105106942A 2015-03-13 2016-03-07 化學機械拋光墊及拋光方法 TWI696517B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/657,123 2015-03-13
US14/657,123 US9446498B1 (en) 2015-03-13 2015-03-13 Chemical mechanical polishing pad with window

Publications (2)

Publication Number Publication Date
TW201632302A TW201632302A (zh) 2016-09-16
TWI696517B true TWI696517B (zh) 2020-06-21

Family

ID=56800677

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105106942A TWI696517B (zh) 2015-03-13 2016-03-07 化學機械拋光墊及拋光方法

Country Status (7)

Country Link
US (1) US9446498B1 (https=)
JP (1) JP6888912B2 (https=)
KR (1) KR102492448B1 (https=)
CN (1) CN105965382B (https=)
DE (1) DE102016002339A1 (https=)
FR (1) FR3033512A1 (https=)
TW (1) TWI696517B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN117615879A (zh) * 2021-07-06 2024-02-27 应用材料公司 用于化学机械抛光的声学传感器的耦合

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201014679A (en) * 2008-09-06 2010-04-16 Strasbaugh CMP system with wireless endpoint detection system

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6716085B2 (en) * 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
JP5223336B2 (ja) * 2006-02-06 2013-06-26 東レ株式会社 研磨パッドおよび研磨装置
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
WO2010082992A2 (en) 2009-01-16 2010-07-22 Applied Materials, Inc. Polishing pad and system with window support
CN101934150A (zh) * 2009-06-29 2011-01-05 鸿富锦精密工业（深圳）有限公司 瞳孔模拟机构及玩具眼睛
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201014679A (en) * 2008-09-06 2010-04-16 Strasbaugh CMP system with wireless endpoint detection system

Also Published As

Publication number Publication date
US9446498B1 (en) 2016-09-20
JP2016168670A (ja) 2016-09-23
KR102492448B1 (ko) 2023-01-30
CN105965382A (zh) 2016-09-28
JP6888912B2 (ja) 2021-06-18
CN105965382B (zh) 2018-05-22
TW201632302A (zh) 2016-09-16
US20160263721A1 (en) 2016-09-15
FR3033512A1 (fr) 2016-09-16
DE102016002339A1 (de) 2016-09-15
KR20160110190A (ko) 2016-09-21

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