KR102492448B1 - 윈도우를 갖는 화학적 기계적 연마 패드 - Google Patents

윈도우를 갖는 화학적 기계적 연마 패드 Download PDF

Info

Publication number
KR102492448B1
KR102492448B1 KR1020160028356A KR20160028356A KR102492448B1 KR 102492448 B1 KR102492448 B1 KR 102492448B1 KR 1020160028356 A KR1020160028356 A KR 1020160028356A KR 20160028356 A KR20160028356 A KR 20160028356A KR 102492448 B1 KR102492448 B1 KR 102492448B1
Authority
KR
South Korea
Prior art keywords
aperture
avg
polishing
apertures
window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020160028356A
Other languages
English (en)
Korean (ko)
Other versions
KR20160110190A (ko
Inventor
소 조셉
치안 바이니안
테스파이 자넷
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20160110190A publication Critical patent/KR20160110190A/ko
Application granted granted Critical
Publication of KR102492448B1 publication Critical patent/KR102492448B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • H01L21/304—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H01L21/30625—
    • H01L22/12—
    • H01L22/26—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020160028356A 2015-03-13 2016-03-09 윈도우를 갖는 화학적 기계적 연마 패드 Active KR102492448B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/657,123 2015-03-13
US14/657,123 US9446498B1 (en) 2015-03-13 2015-03-13 Chemical mechanical polishing pad with window

Publications (2)

Publication Number Publication Date
KR20160110190A KR20160110190A (ko) 2016-09-21
KR102492448B1 true KR102492448B1 (ko) 2023-01-30

Family

ID=56800677

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160028356A Active KR102492448B1 (ko) 2015-03-13 2016-03-09 윈도우를 갖는 화학적 기계적 연마 패드

Country Status (7)

Country Link
US (1) US9446498B1 (https=)
JP (1) JP6888912B2 (https=)
KR (1) KR102492448B1 (https=)
CN (1) CN105965382B (https=)
DE (1) DE102016002339A1 (https=)
FR (1) FR3033512A1 (https=)
TW (1) TWI696517B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN117615879A (zh) * 2021-07-06 2024-02-27 应用材料公司 用于化学机械抛光的声学传感器的耦合

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003019658A (ja) 2001-07-03 2003-01-21 Rodel Nitta Co 研磨パッド
US20030124956A1 (en) 2001-12-28 2003-07-03 Applied Materials, Inc. Polishing pad with transparent window
JP2012515092A (ja) 2009-01-16 2012-07-05 アプライド マテリアルズ インコーポレイテッド 窓支持部を具備する研磨パッドおよび研磨システム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
JP2003133270A (ja) 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
JP5223336B2 (ja) * 2006-02-06 2013-06-26 東レ株式会社 研磨パッドおよび研磨装置
US8182312B2 (en) * 2008-09-06 2012-05-22 Strasbaugh CMP system with wireless endpoint detection system
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
CN101934150A (zh) * 2009-06-29 2011-01-05 鸿富锦精密工业（深圳）有限公司 瞳孔模拟机构及玩具眼睛
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003019658A (ja) 2001-07-03 2003-01-21 Rodel Nitta Co 研磨パッド
US20030124956A1 (en) 2001-12-28 2003-07-03 Applied Materials, Inc. Polishing pad with transparent window
JP2012515092A (ja) 2009-01-16 2012-07-05 アプライド マテリアルズ インコーポレイテッド 窓支持部を具備する研磨パッドおよび研磨システム

Also Published As

Publication number Publication date
US9446498B1 (en) 2016-09-20
TWI696517B (zh) 2020-06-21
JP2016168670A (ja) 2016-09-23
CN105965382A (zh) 2016-09-28
JP6888912B2 (ja) 2021-06-18
CN105965382B (zh) 2018-05-22
TW201632302A (zh) 2016-09-16
US20160263721A1 (en) 2016-09-15
FR3033512A1 (fr) 2016-09-16
DE102016002339A1 (de) 2016-09-15
KR20160110190A (ko) 2016-09-21

Similar Documents

Publication Publication Date Title
US8083570B2 (en) Chemical mechanical polishing pad having sealed window
KR102492448B1 (ko) 윈도우를 갖는 화학적 기계적 연마 패드
KR101744581B1 (ko) 구멍을 가진 폴리싱 패드
JP5143528B2 (ja) 研磨パッド
CN1312742C (zh) 抛光垫、抛光机及制造半导体器件的方法
US9108290B2 (en) Multilayer chemical mechanical polishing pad
TWI630066B (zh) 化學機械硏磨基材之方法
KR102208278B1 (ko) 연성이고 컨디셔닝가능한 연마층을 갖는 다층의 화학 기계적 연마 패드 적층물
JP2010099828A5 (https=)
CN104942700B (zh) 具有窗口的软性且可修整的化学机械抛光垫
US20140256231A1 (en) Multilayer Chemical Mechanical Polishing Pad With Broad Spectrum, Endpoint Detection Window
US9446497B2 (en) Broad spectrum, endpoint detection monophase olefin copolymer window with specific composition in multilayer chemical mechanical polishing pad
WO2016103862A1 (ja) 円形研磨パッド及び半導体デバイスの製造方法
JP2022151229A (ja) 研磨パッド
JP2016159395A (ja) 研磨パッド
WO2022202008A1 (ja) 研磨パッド

Legal Events

Date Code Title Description
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

U11 Full renewal or maintenance fee paid

Free format text: ST27 STATUS EVENT CODE: A-4-4-U10-U11-OTH-PR1001 (AS PROVIDED BY THE NATIONAL OFFICE)

Year of fee payment: 4

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000