JP6888912B2 - 窓付きのケミカルメカニカルポリッシングパッド - Google Patents
窓付きのケミカルメカニカルポリッシングパッド Download PDFInfo
- Publication number
- JP6888912B2 JP6888912B2 JP2016046719A JP2016046719A JP6888912B2 JP 6888912 B2 JP6888912 B2 JP 6888912B2 JP 2016046719 A JP2016046719 A JP 2016046719A JP 2016046719 A JP2016046719 A JP 2016046719A JP 6888912 B2 JP6888912 B2 JP 6888912B2
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- opening
- avg
- openings
- window
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/657,123 | 2015-03-13 | ||
| US14/657,123 US9446498B1 (en) | 2015-03-13 | 2015-03-13 | Chemical mechanical polishing pad with window |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016168670A JP2016168670A (ja) | 2016-09-23 |
| JP2016168670A5 JP2016168670A5 (https=) | 2019-04-04 |
| JP6888912B2 true JP6888912B2 (ja) | 2021-06-18 |
Family
ID=56800677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016046719A Active JP6888912B2 (ja) | 2015-03-13 | 2016-03-10 | 窓付きのケミカルメカニカルポリッシングパッド |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9446498B1 (https=) |
| JP (1) | JP6888912B2 (https=) |
| KR (1) | KR102492448B1 (https=) |
| CN (1) | CN105965382B (https=) |
| DE (1) | DE102016002339A1 (https=) |
| FR (1) | FR3033512A1 (https=) |
| TW (1) | TWI696517B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD785339S1 (en) * | 2014-10-23 | 2017-05-02 | Griot's Garage, Inc. | Hand applicator buffing pad |
| US10569383B2 (en) * | 2017-09-15 | 2020-02-25 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Flanged optical endpoint detection windows and CMP polishing pads containing them |
| US11192215B2 (en) * | 2017-11-16 | 2021-12-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad with pad wear indicator |
| KR102674027B1 (ko) * | 2019-01-29 | 2024-06-12 | 삼성전자주식회사 | 재생 연마패드 |
| CN117615879A (zh) * | 2021-07-06 | 2024-02-27 | 应用材料公司 | 用于化学机械抛光的声学传感器的耦合 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5605760A (en) | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| US6716085B2 (en) * | 2001-12-28 | 2004-04-06 | Applied Materials Inc. | Polishing pad with transparent window |
| JP4570286B2 (ja) * | 2001-07-03 | 2010-10-27 | ニッタ・ハース株式会社 | 研磨パッド |
| JP2003133270A (ja) | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
| US7226339B2 (en) | 2005-08-22 | 2007-06-05 | Applied Materials, Inc. | Spectrum based endpointing for chemical mechanical polishing |
| US7520797B2 (en) * | 2005-09-06 | 2009-04-21 | Freescale Semiconductor, Inc. | Platen endpoint window with pressure relief |
| JP5223336B2 (ja) * | 2006-02-06 | 2013-06-26 | 東レ株式会社 | 研磨パッドおよび研磨装置 |
| US8182312B2 (en) * | 2008-09-06 | 2012-05-22 | Strasbaugh | CMP system with wireless endpoint detection system |
| US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
| WO2010082992A2 (en) | 2009-01-16 | 2010-07-22 | Applied Materials, Inc. | Polishing pad and system with window support |
| CN101934150A (zh) * | 2009-06-29 | 2011-01-05 | 鸿富锦精密工业(深圳)有限公司 | 瞳孔模拟机构及玩具眼睛 |
| US9108290B2 (en) * | 2013-03-07 | 2015-08-18 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad |
-
2015
- 2015-03-13 US US14/657,123 patent/US9446498B1/en active Active
-
2016
- 2016-02-26 DE DE102016002339.2A patent/DE102016002339A1/de not_active Withdrawn
- 2016-03-07 CN CN201610127791.3A patent/CN105965382B/zh active Active
- 2016-03-07 TW TW105106942A patent/TWI696517B/zh active
- 2016-03-09 KR KR1020160028356A patent/KR102492448B1/ko active Active
- 2016-03-10 JP JP2016046719A patent/JP6888912B2/ja active Active
- 2016-03-10 FR FR1651996A patent/FR3033512A1/fr not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| US9446498B1 (en) | 2016-09-20 |
| TWI696517B (zh) | 2020-06-21 |
| JP2016168670A (ja) | 2016-09-23 |
| KR102492448B1 (ko) | 2023-01-30 |
| CN105965382A (zh) | 2016-09-28 |
| CN105965382B (zh) | 2018-05-22 |
| TW201632302A (zh) | 2016-09-16 |
| US20160263721A1 (en) | 2016-09-15 |
| FR3033512A1 (fr) | 2016-09-16 |
| DE102016002339A1 (de) | 2016-09-15 |
| KR20160110190A (ko) | 2016-09-21 |
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