CN105965382B - 具有窗口的化学机械抛光垫 - Google Patents

具有窗口的化学机械抛光垫 Download PDF

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Publication number
CN105965382B
CN105965382B CN201610127791.3A CN201610127791A CN105965382B CN 105965382 B CN105965382 B CN 105965382B CN 201610127791 A CN201610127791 A CN 201610127791A CN 105965382 B CN105965382 B CN 105965382B
Authority
CN
China
Prior art keywords
window
avg
aperture
polishing
orifice
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610127791.3A
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English (en)
Chinese (zh)
Other versions
CN105965382A (zh
Inventor
J·索
B·钱
J·泰斯法
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
Original Assignee
ROHM AND HAAS ELECTRONIC MATER
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ROHM AND HAAS ELECTRONIC MATER filed Critical ROHM AND HAAS ELECTRONIC MATER
Publication of CN105965382A publication Critical patent/CN105965382A/zh
Application granted granted Critical
Publication of CN105965382B publication Critical patent/CN105965382B/zh
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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/205Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/005Control means for lapping machines or devices
    • B24B37/013Devices or means for detecting lapping completion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/22Lapping pads for working plane surfaces characterised by a multi-layered structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201610127791.3A 2015-03-13 2016-03-07 具有窗口的化学机械抛光垫 Active CN105965382B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/657,123 2015-03-13
US14/657,123 US9446498B1 (en) 2015-03-13 2015-03-13 Chemical mechanical polishing pad with window

Publications (2)

Publication Number Publication Date
CN105965382A CN105965382A (zh) 2016-09-28
CN105965382B true CN105965382B (zh) 2018-05-22

Family

ID=56800677

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610127791.3A Active CN105965382B (zh) 2015-03-13 2016-03-07 具有窗口的化学机械抛光垫

Country Status (7)

Country Link
US (1) US9446498B1 (https=)
JP (1) JP6888912B2 (https=)
KR (1) KR102492448B1 (https=)
CN (1) CN105965382B (https=)
DE (1) DE102016002339A1 (https=)
FR (1) FR3033512A1 (https=)
TW (1) TWI696517B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
US10569383B2 (en) * 2017-09-15 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Flanged optical endpoint detection windows and CMP polishing pads containing them
US11192215B2 (en) * 2017-11-16 2021-12-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad with pad wear indicator
KR102674027B1 (ko) * 2019-01-29 2024-06-12 삼성전자주식회사 재생 연마패드
CN117615879A (zh) * 2021-07-06 2024-02-27 应用材料公司 用于化学机械抛光的声学传感器的耦合

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5605760A (en) 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US6716085B2 (en) * 2001-12-28 2004-04-06 Applied Materials Inc. Polishing pad with transparent window
JP4570286B2 (ja) * 2001-07-03 2010-10-27 ニッタ・ハース株式会社 研磨パッド
JP2003133270A (ja) 2001-10-26 2003-05-09 Jsr Corp 化学機械研磨用窓材及び研磨パッド
US7226339B2 (en) 2005-08-22 2007-06-05 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US7520797B2 (en) * 2005-09-06 2009-04-21 Freescale Semiconductor, Inc. Platen endpoint window with pressure relief
JP5223336B2 (ja) * 2006-02-06 2013-06-26 東レ株式会社 研磨パッドおよび研磨装置
US8182312B2 (en) * 2008-09-06 2012-05-22 Strasbaugh CMP system with wireless endpoint detection system
US8083570B2 (en) * 2008-10-17 2011-12-27 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad having sealed window
WO2010082992A2 (en) 2009-01-16 2010-07-22 Applied Materials, Inc. Polishing pad and system with window support
CN101934150A (zh) * 2009-06-29 2011-01-05 鸿富锦精密工业(深圳)有限公司 瞳孔模拟机构及玩具眼睛
US9108290B2 (en) * 2013-03-07 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad

Also Published As

Publication number Publication date
US9446498B1 (en) 2016-09-20
TWI696517B (zh) 2020-06-21
JP2016168670A (ja) 2016-09-23
KR102492448B1 (ko) 2023-01-30
CN105965382A (zh) 2016-09-28
JP6888912B2 (ja) 2021-06-18
TW201632302A (zh) 2016-09-16
US20160263721A1 (en) 2016-09-15
FR3033512A1 (fr) 2016-09-16
DE102016002339A1 (de) 2016-09-15
KR20160110190A (ko) 2016-09-21

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Address after: Delaware, USA

Patentee after: DuPont Electronic Materials Holdings Co.,Ltd.

Country or region after: U.S.A.

Address before: Delaware, USA

Patentee before: ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, Inc.

Country or region before: U.S.A.