TWI692836B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI692836B
TWI692836B TW107106598A TW107106598A TWI692836B TW I692836 B TWI692836 B TW I692836B TW 107106598 A TW107106598 A TW 107106598A TW 107106598 A TW107106598 A TW 107106598A TW I692836 B TWI692836 B TW I692836B
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TW
Taiwan
Prior art keywords
substrate
processing apparatus
eaves
rotation
holding pin
Prior art date
Application number
TW107106598A
Other languages
English (en)
Chinese (zh)
Other versions
TW201834138A (zh
Inventor
矢野航
野野村正浩
古川正晃
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201834138A publication Critical patent/TW201834138A/zh
Application granted granted Critical
Publication of TWI692836B publication Critical patent/TWI692836B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW107106598A 2017-03-08 2018-02-27 基板處理裝置 TWI692836B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-044080 2017-03-08
JP2017044080A JP6970515B2 (ja) 2017-03-08 2017-03-08 基板処理装置

Publications (2)

Publication Number Publication Date
TW201834138A TW201834138A (zh) 2018-09-16
TWI692836B true TWI692836B (zh) 2020-05-01

Family

ID=63448560

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107106598A TWI692836B (zh) 2017-03-08 2018-02-27 基板處理裝置

Country Status (3)

Country Link
JP (1) JP6970515B2 (ja)
TW (1) TWI692836B (ja)
WO (1) WO2018163748A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814148B (zh) * 2020-11-25 2023-09-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7179466B2 (ja) 2018-02-13 2022-11-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
JP7282494B2 (ja) * 2018-09-18 2023-05-29 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP7277258B2 (ja) * 2019-05-31 2023-05-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229552A (ja) * 2011-12-19 2013-11-07 Dainippon Screen Mfg Co Ltd 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4666473B2 (ja) * 2005-05-12 2011-04-06 大日本スクリーン製造株式会社 基板熱処理装置
JP5795920B2 (ja) * 2011-09-21 2015-10-14 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013229552A (ja) * 2011-12-19 2013-11-07 Dainippon Screen Mfg Co Ltd 基板保持回転装置およびそれを備えた基板処理装置、ならびに基板処理方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI814148B (zh) * 2020-11-25 2023-09-01 日商斯庫林集團股份有限公司 基板處理裝置及基板處理方法

Also Published As

Publication number Publication date
JP2018148131A (ja) 2018-09-20
TW201834138A (zh) 2018-09-16
WO2018163748A1 (ja) 2018-09-13
JP6970515B2 (ja) 2021-11-24

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