TWI690544B - 軟性基板用組成物、其製造方法及軟性基板 - Google Patents

軟性基板用組成物、其製造方法及軟性基板 Download PDF

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Publication number
TWI690544B
TWI690544B TW105135091A TW105135091A TWI690544B TW I690544 B TWI690544 B TW I690544B TW 105135091 A TW105135091 A TW 105135091A TW 105135091 A TW105135091 A TW 105135091A TW I690544 B TWI690544 B TW I690544B
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TW
Taiwan
Prior art keywords
flexible substrate
composition
formula
cps
diamine
Prior art date
Application number
TW105135091A
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English (en)
Chinese (zh)
Other versions
TW201815892A (zh
Inventor
梁育豪
陳志榮
Original Assignee
奇美實業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 奇美實業股份有限公司 filed Critical 奇美實業股份有限公司
Priority to TW105135091A priority Critical patent/TWI690544B/zh
Priority to CN201710951580.6A priority patent/CN108003614B/zh
Priority to JP2017207146A priority patent/JP6973701B2/ja
Publication of TW201815892A publication Critical patent/TW201815892A/zh
Application granted granted Critical
Publication of TWI690544B publication Critical patent/TWI690544B/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structure Of Printed Boards (AREA)
TW105135091A 2016-10-28 2016-10-28 軟性基板用組成物、其製造方法及軟性基板 TWI690544B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW105135091A TWI690544B (zh) 2016-10-28 2016-10-28 軟性基板用組成物、其製造方法及軟性基板
CN201710951580.6A CN108003614B (zh) 2016-10-28 2017-10-13 软性基板用组合物、其制造方法及软性基板
JP2017207146A JP6973701B2 (ja) 2016-10-28 2017-10-26 フレキシブル基板用組成物、その製造方法及びフレキシブル基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW105135091A TWI690544B (zh) 2016-10-28 2016-10-28 軟性基板用組成物、其製造方法及軟性基板

Publications (2)

Publication Number Publication Date
TW201815892A TW201815892A (zh) 2018-05-01
TWI690544B true TWI690544B (zh) 2020-04-11

Family

ID=62051623

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105135091A TWI690544B (zh) 2016-10-28 2016-10-28 軟性基板用組成物、其製造方法及軟性基板

Country Status (3)

Country Link
JP (1) JP6973701B2 (ja)
CN (1) CN108003614B (ja)
TW (1) TWI690544B (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201305248A (zh) * 2011-06-14 2013-02-01 Nippon Steel Chemical Co 交聯聚醯亞胺樹脂、其製造方法、接著劑樹脂組成物、其硬化物、覆層膜、電路基板、熱傳導性基板及熱傳導性聚醯亞胺膜
TW201322834A (zh) * 2011-11-25 2013-06-01 Innocom Tech Shenzhen Co Ltd 軟性基板、具有其之顯示裝置及其製造方法
TW201629154A (zh) * 2015-02-09 2016-08-16 奇美實業股份有限公司 軟性基板用組成物及軟性基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5287692B2 (ja) * 2008-12-26 2013-09-11 Ｊｓｒ株式会社 ポリイミド系材料、組成物及びフィルム、並びにその製造方法
JP2010260996A (ja) * 2009-05-11 2010-11-18 Fujifilm Corp テトラカルボン酸二無水物、及び重合体
JP5899605B2 (ja) * 2010-01-12 2016-04-06 Jnc株式会社 熱硬化性組成物
JP5831712B2 (ja) * 2010-12-28 2015-12-09 日産化学工業株式会社 ポリイミド膜形成用塗布液、液晶配向剤、ポリイミド膜、液晶配向膜及び液晶表示素子
TWI465483B (zh) * 2010-12-28 2014-12-21 Chi Mei Corp 液晶配向劑，液晶配向膜，及含有該液晶配向膜的液晶顯示元件
JP5784993B2 (ja) * 2011-06-14 2015-09-24 新日鉄住金化学株式会社 架橋ポリイミド樹脂、その製造方法、接着剤樹脂組成物、その硬化物、カバーレイフィルム及び回路基板
US9777034B2 (en) * 2013-05-21 2017-10-03 The Trustees Of The University Of Pennsylvania Modular synthesis of amphiphilic Janus glycodendrimers and their self-assembly into glycodendrimersomes
TWI495404B (zh) * 2013-06-21 2015-08-01 Chi Mei Corp 軟性基板用組成物及軟性基板
CN105315463B (zh) * 2014-07-15 2019-11-26 捷恩智株式会社 聚合物、液晶取向剂、液晶取向膜、及液晶显示元件
KR102014627B1 (ko) * 2015-02-09 2019-08-26 코니카 미놀타 가부시키가이샤 투명 내열성 적층 필름의 제조 방법, 투명 내열성 적층 필름, 플렉시블 프린트 기판, 플렉시블 디스플레이용 기판, 플렉시블 디스플레이용 전방면판, led 조명 장치 및 유기 일렉트로루미네센스 표시 장치
TWI565756B (zh) * 2015-03-04 2017-01-11 奇美實業股份有限公司 液晶配向劑、液晶配向膜及含彼之液晶顯示元件

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201305248A (zh) * 2011-06-14 2013-02-01 Nippon Steel Chemical Co 交聯聚醯亞胺樹脂、其製造方法、接著劑樹脂組成物、其硬化物、覆層膜、電路基板、熱傳導性基板及熱傳導性聚醯亞胺膜
TW201322834A (zh) * 2011-11-25 2013-06-01 Innocom Tech Shenzhen Co Ltd 軟性基板、具有其之顯示裝置及其製造方法
TW201629154A (zh) * 2015-02-09 2016-08-16 奇美實業股份有限公司 軟性基板用組成物及軟性基板

Also Published As

Publication number Publication date
CN108003614B (zh) 2021-06-29
JP6973701B2 (ja) 2021-12-01
CN108003614A (zh) 2018-05-08
TW201815892A (zh) 2018-05-01
JP2018070883A (ja) 2018-05-10

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