TWI690544B - 軟性基板用組成物、其製造方法及軟性基板 - Google Patents
軟性基板用組成物、其製造方法及軟性基板 Download PDFInfo
- Publication number
- TWI690544B TWI690544B TW105135091A TW105135091A TWI690544B TW I690544 B TWI690544 B TW I690544B TW 105135091 A TW105135091 A TW 105135091A TW 105135091 A TW105135091 A TW 105135091A TW I690544 B TWI690544 B TW I690544B
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible substrate
- composition
- formula
- cps
- diamine
- Prior art date
Links
- 0 *C(*C(*)(CC(O1)=O)C1=O)(CC(O1)=O)C1=O Chemical compound *C(*C(*)(CC(O1)=O)C1=O)(CC(O1)=O)C1=O 0.000 description 7
- UHOVQNZJYSORNB-UHFFFAOYSA-N c1ccccc1 Chemical compound c1ccccc1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- DNHMFOOXUBPFRD-UHFFFAOYSA-N CC(C)CCCC(C)C(CC1)C(C)(CC2)C1C(C1)C2C(C)(CCC(C2)C(c(cc3)cc(C(O4)=O)c3C4=O)=O)C2C1C(Oc(cc1)cc(C(O2)=O)c1C2=O)=O Chemical compound CC(C)CCCC(C)C(CC1)C(C)(CC2)C1C(C1)C2C(C)(CCC(C2)C(c(cc3)cc(C(O4)=O)c3C4=O)=O)C2C1C(Oc(cc1)cc(C(O2)=O)c1C2=O)=O DNHMFOOXUBPFRD-UHFFFAOYSA-N 0.000 description 1
- PVGLDAYZFLILOL-UHFFFAOYSA-N CC(C)CCCC(C)C(CC1)C(C)(CC2)C1C(CC1)C2C(C)(CC2)C1CC2(c(cc1)ccc1OC(c(cc1)cc(C(O2)=O)c1C2=O)=O)c(cc1)ccc1OC(c(cc1C(O2)=O)ccc1C2=O)=O Chemical compound CC(C)CCCC(C)C(CC1)C(C)(CC2)C1C(CC1)C2C(C)(CC2)C1CC2(c(cc1)ccc1OC(c(cc1)cc(C(O2)=O)c1C2=O)=O)c(cc1)ccc1OC(c(cc1C(O2)=O)ccc1C2=O)=O PVGLDAYZFLILOL-UHFFFAOYSA-N 0.000 description 1
- IXXQOUONIXORND-CLLWQXLLSA-N CC(C)CCCC(C)[C@@H](CC1)C(C)(CC2)C1C(CC1)C2C(C)(CC2)C1CC2(c(cc1)ccc1OC1=CC=CCC1)c(cc1)ccc1Oc1ccccc1 Chemical compound CC(C)CCCC(C)[C@@H](CC1)C(C)(CC2)C1C(CC1)C2C(C)(CC2)C1CC2(c(cc1)ccc1OC1=CC=CCC1)c(cc1)ccc1Oc1ccccc1 IXXQOUONIXORND-CLLWQXLLSA-N 0.000 description 1
- WVDCTAVKQYGDOC-UHFFFAOYSA-N CC(CCC=C(C)C)C(CC1)C(C)(CC2)C1C(CC1C(Oc(cc3C(O4)=O)ccc3C4=O)=O)C2C(C)(CC2)C1C(C)(C)C2C(c(cc1)cc(C(O2)=O)c1C2=O)=O Chemical compound CC(CCC=C(C)C)C(CC1)C(C)(CC2)C1C(CC1C(Oc(cc3C(O4)=O)ccc3C4=O)=O)C2C(C)(CC2)C1C(C)(C)C2C(c(cc1)cc(C(O2)=O)c1C2=O)=O WVDCTAVKQYGDOC-UHFFFAOYSA-N 0.000 description 1
- FTCRIJJBAVWTTL-UHFFFAOYSA-N Nc1cc(C(OC(CC2)CCC2c(cc2)ccc2Cl)=O)cc(N)c1 Chemical compound Nc1cc(C(OC(CC2)CCC2c(cc2)ccc2Cl)=O)cc(N)c1 FTCRIJJBAVWTTL-UHFFFAOYSA-N 0.000 description 1
- GCWMJBDJJCULIN-UHFFFAOYSA-N O=C(CC1c2ccc(C(CC(O3)=O)C3=O)cc2)OC1=O Chemical compound O=C(CC1c2ccc(C(CC(O3)=O)C3=O)cc2)OC1=O GCWMJBDJJCULIN-UHFFFAOYSA-N 0.000 description 1
- ILNGYDQGFVAWKM-UHFFFAOYSA-N O=C(c(cc1)c2cc1Oc(c(F)c(c(-c(c(F)c(c(Oc(cc1C(O3)=O)ccc1C3=O)c1F)F)c1F)c1F)F)c1F)OC2=O Chemical compound O=C(c(cc1)c2cc1Oc(c(F)c(c(-c(c(F)c(c(Oc(cc1C(O3)=O)ccc1C3=O)c1F)F)c1F)c1F)F)c1F)OC2=O ILNGYDQGFVAWKM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1085—Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105135091A TWI690544B (zh) | 2016-10-28 | 2016-10-28 | 軟性基板用組成物、其製造方法及軟性基板 |
CN201710951580.6A CN108003614B (zh) | 2016-10-28 | 2017-10-13 | 软性基板用组合物、其制造方法及软性基板 |
JP2017207146A JP6973701B2 (ja) | 2016-10-28 | 2017-10-26 | フレキシブル基板用組成物、その製造方法及びフレキシブル基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105135091A TWI690544B (zh) | 2016-10-28 | 2016-10-28 | 軟性基板用組成物、其製造方法及軟性基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201815892A TW201815892A (zh) | 2018-05-01 |
TWI690544B true TWI690544B (zh) | 2020-04-11 |
Family
ID=62051623
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105135091A TWI690544B (zh) | 2016-10-28 | 2016-10-28 | 軟性基板用組成物、其製造方法及軟性基板 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6973701B2 (ja) |
CN (1) | CN108003614B (ja) |
TW (1) | TWI690544B (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201305248A (zh) * | 2011-06-14 | 2013-02-01 | Nippon Steel Chemical Co | 交聯聚醯亞胺樹脂、其製造方法、接著劑樹脂組成物、其硬化物、覆層膜、電路基板、熱傳導性基板及熱傳導性聚醯亞胺膜 |
TW201322834A (zh) * | 2011-11-25 | 2013-06-01 | Innocom Tech Shenzhen Co Ltd | 軟性基板、具有其之顯示裝置及其製造方法 |
TW201629154A (zh) * | 2015-02-09 | 2016-08-16 | 奇美實業股份有限公司 | 軟性基板用組成物及軟性基板 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5287692B2 (ja) * | 2008-12-26 | 2013-09-11 | Jsr株式会社 | ポリイミド系材料、組成物及びフィルム、並びにその製造方法 |
JP2010260996A (ja) * | 2009-05-11 | 2010-11-18 | Fujifilm Corp | テトラカルボン酸二無水物、及び重合体 |
JP5899605B2 (ja) * | 2010-01-12 | 2016-04-06 | Jnc株式会社 | 熱硬化性組成物 |
JP5831712B2 (ja) * | 2010-12-28 | 2015-12-09 | 日産化学工業株式会社 | ポリイミド膜形成用塗布液、液晶配向剤、ポリイミド膜、液晶配向膜及び液晶表示素子 |
TWI465483B (zh) * | 2010-12-28 | 2014-12-21 | Chi Mei Corp | 液晶配向劑,液晶配向膜,及含有該液晶配向膜的液晶顯示元件 |
JP5784993B2 (ja) * | 2011-06-14 | 2015-09-24 | 新日鉄住金化学株式会社 | 架橋ポリイミド樹脂、その製造方法、接着剤樹脂組成物、その硬化物、カバーレイフィルム及び回路基板 |
US9777034B2 (en) * | 2013-05-21 | 2017-10-03 | The Trustees Of The University Of Pennsylvania | Modular synthesis of amphiphilic Janus glycodendrimers and their self-assembly into glycodendrimersomes |
TWI495404B (zh) * | 2013-06-21 | 2015-08-01 | Chi Mei Corp | 軟性基板用組成物及軟性基板 |
CN105315463B (zh) * | 2014-07-15 | 2019-11-26 | 捷恩智株式会社 | 聚合物、液晶取向剂、液晶取向膜、及液晶显示元件 |
KR102014627B1 (ko) * | 2015-02-09 | 2019-08-26 | 코니카 미놀타 가부시키가이샤 | 투명 내열성 적층 필름의 제조 방법, 투명 내열성 적층 필름, 플렉시블 프린트 기판, 플렉시블 디스플레이용 기판, 플렉시블 디스플레이용 전방면판, led 조명 장치 및 유기 일렉트로루미네센스 표시 장치 |
TWI565756B (zh) * | 2015-03-04 | 2017-01-11 | 奇美實業股份有限公司 | 液晶配向劑、液晶配向膜及含彼之液晶顯示元件 |
-
2016
- 2016-10-28 TW TW105135091A patent/TWI690544B/zh active
-
2017
- 2017-10-13 CN CN201710951580.6A patent/CN108003614B/zh active Active
- 2017-10-26 JP JP2017207146A patent/JP6973701B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201305248A (zh) * | 2011-06-14 | 2013-02-01 | Nippon Steel Chemical Co | 交聯聚醯亞胺樹脂、其製造方法、接著劑樹脂組成物、其硬化物、覆層膜、電路基板、熱傳導性基板及熱傳導性聚醯亞胺膜 |
TW201322834A (zh) * | 2011-11-25 | 2013-06-01 | Innocom Tech Shenzhen Co Ltd | 軟性基板、具有其之顯示裝置及其製造方法 |
TW201629154A (zh) * | 2015-02-09 | 2016-08-16 | 奇美實業股份有限公司 | 軟性基板用組成物及軟性基板 |
Also Published As
Publication number | Publication date |
---|---|
CN108003614B (zh) | 2021-06-29 |
JP6973701B2 (ja) | 2021-12-01 |
CN108003614A (zh) | 2018-05-08 |
TW201815892A (zh) | 2018-05-01 |
JP2018070883A (ja) | 2018-05-10 |
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