TWI685825B - Display and manufacturing method thereof - Google Patents

Abstract

This invention provides a display and a manufacturing method thereof, in which a plurality of conductive patterns are formed on a surface of a first substrate and cover a photosensitive adhesive thereon, and then the photosensitive adhesive is patterned and a viscous retaining wall is formed on the periphery of the conductive patterns. The conductive patterns are staggered with the viscous retaining walls to define a plurality of grooves for electrically driving display material in the grooves, and the viscous retaining walls are used to bond a second substrate to the first substrate, wherein the viscous retaining wall can not only block the fluid display materials that need to be isolated from each other, but also can adhere the two substrates, thereby reducing the process steps.

Description

Display and its manufacturing method

The invention relates to a display device, in particular to a flexible display and a manufacturing method thereof.

Lightweight and portable have always been the development trend of consumer electronic products. In view of this, flexible displays have been developed in the new generation of display technology. Due to material characteristics, process convenience, and cost considerations, most flexible displays use plastic substrates. However, in the manufacturing process, the rolling device is mainly used in a roll-to-roll continuous manner The supply of plastic substrates only causes the plastic substrates to withstand the tensile stress of the rolling equipment.

In addition, in the formation of various layer structures on the surface of the plastic substrate and the layout of electronic components, such as the yellow light process, materials deposition, photoresist coating, exposure, development, and etching must be performed. Therefore, the plastic substrate passes through the rolling equipment. After stretching, acid/alkali solution impregnation, high temperature baking, high pressure and other processes, irregular deformation gradually occurs, which leads to the difficulty of alignment between different patterning processes, which further reduces the manufacturing yield of the product.

Furthermore, the structure of the aforementioned flexible display is mainly based on the retaining wall For the isolation structure between the fluid display materials, it is still necessary to configure another glue material to bond the two substrates, causing inconvenience in the manufacturing process.

Therefore, in flexible displays, how to overcome the above-mentioned problems in order to improve the product yield, simplify the manufacturing process and reduce the manufacturing cost is an important issue in the related industries.

In view of the above-mentioned defects of the prior art, the present invention provides a method for manufacturing a display, which includes: providing a first substrate having opposing first and second surfaces, wherein a plurality of conductive patterns are formed on the first surface; A photosensitive adhesive material is formed on the conductive pattern and the first surface of the first substrate; the photosensitive adhesive material is patterned to form an adhesive barrier on the periphery of the conductive pattern, and the conductive pattern and the adhesive barrier are formed Multiple grooves are defined by staggered arrangement; electrically driven display materials are arranged in the grooves; and a second substrate is bonded to the first substrate by the adhesive barrier.

The present invention also provides a display comprising: a first substrate having a plurality of conductive patterns on one surface, and a viscous barrier wall formed of photosensitive adhesive material on the periphery of the conductive patterns, so that the conductive patterns and The staggered arrangement of the adhesive retaining wall defines a plurality of grooves; an electrically driven display material is disposed in the groove; and a second substrate is bonded to the first substrate by the adhesive retaining wall on.

The aforementioned display and its manufacturing method further include patterning a conductive layer to form the conductive pattern.

In the aforementioned display and its manufacturing method, it further includes forming a light-sensitive material layer on the conductive layer, and providing it on the first surface or the second surface of the first substrate A light shielding pattern is placed, and the light shielding pattern is irradiated with an exposure beam, and a part of the photosensitive material layer and a part of the conductive layer irradiated by the exposure beam are removed to form the plurality of conductive patterns, and then the exposure beam is oriented The shading pattern is irradiated, and a part of the photosensitive adhesive material after being irradiated by the exposure beam is removed to form the adhesive retaining wall, and the conductive pattern and the adhesive retaining wall are shaded by the same during the patterning process The pattern is formed.

In the aforementioned display and its manufacturing method, the material of the conductive layer is a light-transmitting conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), or nano silver metal film. The first substrate is, for example, a light-transmitting substrate.

In the aforementioned display and manufacturing method thereof, the photosensitive adhesive material is a dry film photoresist, a wet film photoresist, a UV pressure sensitive adhesive, a UV anaerobic adhesive, or a two-stage curing UV adhesive.

In the aforementioned display and its manufacturing method, the second substrate is provided with a conductive pattern, so that the electrically driven display material is driven by the conductive pattern provided on the first substrate and the conductive pattern provided on the second substrate .

In the aforementioned display and its manufacturing method, the first substrate and the second substrate are hard substrates or flexible substrates. The hard substrates are, for example, hard glass substrates, and the flexible substrates are, for example, soft glass or polycarbonate. PC), polyimide (PI), polyethylene terephthalate (PET) or polyethylene naphthalate (PEN) soft plastic substrate.

As can be seen from the above, the display of the present invention and its manufacturing method are mainly provided by the installation of a viscous barrier wall in the display structure. The groove is formed to accommodate fluid display materials that need to be isolated from each other, and can be further used to bond two substrates. Therefore, it is not necessary to separately provide a structure for bonding the two substrates and can complete the packaging of the panel, so the process can be improved. Convenience and reduce costs. In addition, the present invention uses the same shading pattern as a photomask to form conductive patterns and adhesive barriers adjacent to each other. Even, a shading material that has conductivity itself can be used to form a conductive pattern and serve as a patterned photosensitive adhesive material The mask, therefore, can avoid the problem of misalignment caused by the re-alignment of the mask during different patterning processes due to the deformation of the flexible substrate.

1, 2, 3, 4 ‧‧‧ monitor

101, 201, 301, 401‧‧‧ First substrate

102, 202, 302‧‧‧ conductive layer

101a, 201a, 301a, 401a ‧‧‧ first surface

101b, 201b, 301b, 401b ‧‧‧ second surface

103, 203, 303‧‧‧ photosensitive material layer

104, 204, 304, 404

105, 109, 205, 209, 305, 309, 409‧‧‧ conductive pattern

106, 206, 306, 406‧‧‧sensitive adhesive material

1061, 2061, 3061, 4061 ‧‧‧ sticky retaining wall

1062, 2062, 3062, 4062‧Notch

107, 207, 307, 407 ‧‧‧ second substrate

108, 208, 308, 408‧‧‧ electrically driven display materials

I‧‧‧Exposure beam

Figures 1A to 1G are schematic diagrams of the first embodiment of the manufacturing method of the display of the present invention; Figures 2A to 2H are schematic diagrams of the second embodiment of the manufacturing method of the display of the present invention; Figures 3A to 3H are diagrams of the present invention A schematic diagram of a third embodiment of the manufacturing method of the display; and FIGS. 4A to 4E are schematic diagrams of the fourth embodiment of the manufacturing method of the display of the present invention.

The following describes the implementation of the present invention by specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

It should be noted that the structure, ratio, size, etc. shown in the drawings of this specification are only used to match the content disclosed in the specification, so as to familiarize yourself with this skill. The understanding and reading of the person is not used to limit the limitations of the invention, so it has no technical significance. Any structural modification, proportional relationship change or size adjustment does not affect what the invention can produce. Both the efficacy and the objectives that can be achieved should still fall within the scope of the technical content disclosed by the present invention. At the same time, the terms such as "on", "first", "second", and "one" cited in this specification are only for the convenience of description, not to limit the scope of the invention, Changes or adjustments in the relative relationship are considered to be within the scope of the invention without substantial changes in the technical content.

Please refer to FIGS. 1A to 1G, which are schematic diagrams of the first embodiment of the manufacturing method of the display of the present invention.

As shown in FIG. 1A, first a first substrate 101 is provided. The first substrate 101 has a first surface 101a and a second surface 101b opposite to the first surface 101a, and a conductive layer 102 is formed on the first surface 101a. In this embodiment, the first substrate 101 may be a transparent hard substrate or a flexible substrate, wherein the hard substrate is made of hard glass or other hard transparent materials; the flexible substrate is soft Glass or polycarbonate (polycarbonate, PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) And other soft plastic substrates. In addition, the conductive layer 102 may be formed of a light-transmitting conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), nano silver metal film, or a combination thereof, but the invention is not limit.

As shown in FIG. 1B, a light-sensitive material layer is formed on the conductive layer 102 103, and a light-shielding pattern 104 is provided on the other side of the photosensitive material layer 103 relative to the conductive layer 102. Next, an exposure beam I is provided from the other side of the light-shielding pattern 104 relative to the photosensitive material layer 103, and the exposure beam I is irradiated toward the direction of the photosensitive material layer 103. In this embodiment, the light-sensitive material layer 103 is, for example, a positive photoresist layer, which can be covered on the surface of the conductive layer 102 by coating, spraying, depositing, or the like. The light-shielding pattern 104 can block the exposure beam I through the light-shielding pattern 104 by reflecting or absorbing light. When the light-shielding pattern 104 blocks light by reflection, the light-shielding pattern 104 can be made of metal, metal oxide or other reflective materials When the light-shielding pattern 104 blocks light by absorption, the material of the light-shielding pattern 104 can be black ink, carbon powder, high optical density vinyl or other light-absorbing materials that can absorb the exposure beam I. In this embodiment, The exposure beam I is selected from light sources that can interact with the light-sensitive material layer 103, such as a halogen lamp.

As shown in FIGS. 1C and 1D, in this embodiment, the exposure light beam I is irradiated to a part of the photosensitive material layer 103 through the light-shielding pattern 104, and the photosensitive material layer 103 after the light irradiation can be moved by the developer In addition, the conductive layer 102 corresponding to it is exposed, and then the exposed conductive layer 102 is removed by etching, such as wet or dry etching, to form a plurality of conductive patterns 105, and finally, the plurality of conductive patterns 105 are removed The photosensitive material layer 103 completes the patterning process of the conductive layer. In this embodiment, the developing solution may be an alkaline solution, such as Na ₂ CO ₃ , TMAH, etc. The etching acid solution may be oxalic acid or aqua regia, but the invention is not limited to the above.

As shown in FIGS. 1E and 1F, a layer of photosensitive adhesive material 106 is completely covered on the plurality of conductive patterns 105 and the first substrate 101 does not have a conductive pattern 105 On the covered first surface 101a, in this embodiment, the photosensitive adhesive material 106 can be a negative photoresist that has viscosity after development. In other embodiments, the photosensitive adhesive material 106 can also be selected to be adhesive after development. Dry film photoresist, wet film photoresist, UV pressure sensitive adhesive, UV anaerobic adhesive, two-stage curing UV adhesive or other viscous photosensitive materials, and cover the photosensitive adhesive 106 with conductive patterns by coating 105 and the first surface 101a of the first substrate 101. Next, the exposure beam I is irradiated toward the light-shielding pattern 104. The exposure beam I irradiates part of the photosensitive adhesive material 106 through the light-shielding pattern 104. The photosensitive adhesive material 106 that is not irradiated by the exposure light beam I can be passed through the developer. After removing it, the photosensitive adhesive material 106 that has not been removed forms an adhesive barrier 1061 at the periphery of the conductive pattern 105, and a plurality of grooves 1062 are defined by staggering the conductive pattern 105 and the adhesive barrier 1061. That is, the groove 1062 corresponds to the position of the conductive pattern 105.

As shown in FIG. 1G, the electrically driven display material 108 is placed in the grooves 1062. For example, the electrically driven display material 108 can be placed in the groove 1062 by pouring, printing, etc.; A substrate 101 is bonded to a second substrate 107 provided with conductive patterns 109 by an adhesive barrier 1061, thereby limiting the electrically driven display material 108 to the first substrate 101, the second substrate 107 and the adhesive barrier In the space formed by 1061 (that is, the groove 1062), the electrically driven display material 108 can be driven by the conductive pattern 105 on the first substrate 101 and the conductive pattern 109 on the second substrate 107, thereby forming the present invention之Display1.

In addition, it should be noted that the adhesive barrier 1061 formed by the photosensitive adhesive material 106 can be bonded on the first substrate 101 and the second substrate 107 At the same time, the curing is also completed, or, after the bonding of the first substrate 101 and the second substrate 107 is completed, another curing process may be performed. For example, if the photosensitive adhesive 106 is a two-stage curing UV adhesive, it can be After bonding the first substrate 101 and the second substrate 107 with the adhesive barrier 1061, another UV light source or heating is performed to allow the two-stage curing UV adhesive to be completely cured, and the adhesive barrier after the complete curing 1061 further helps to fix the distance between the first substrate 101 and the second substrate 107. In addition, the electrically driven display material 108 can be a liquid crystal material or an organic electroluminescence (OEL) material. For example, the liquid crystal material is, for example, nematic liquid crystal (Nematic Liquid Crystal), cholesterol liquid crystal (Cholesteric liquid crystal) or Other liquid crystal display materials, and organic electroluminescent materials such as organic light-emitting diode (OLED), polymer light-emitting diode (PLED) or other organic electroluminescent displays material. Furthermore, the second substrate 107 can be a transparent hard substrate or a flexible substrate, wherein the material of the rigid substrate is glass or other hard transparent materials, and the flexible substrate material is polycarbonate (polycarbonate) , PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other plastic materials. In addition, a conductive pattern 109 is provided on the second substrate 107, and the conductive pattern 109 may be a transparent conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), nano silver metal film, or a combination thereof However, the present invention is not limited to the above.

Through the foregoing manufacturing process, the present invention also provides a display 1 comprising: a first substrate 101 having a plurality of conductive patterns 105 on one surface, and an adhesive barrier formed of photosensitive adhesive material on the periphery of the conductive pattern 305 The wall 1061 defines a plurality of grooves 1062 by staggering the conductive pattern 105 and the adhesive barrier 1061; an electrically driven display material 108 is disposed in the groove 1062; and a second substrate 107 is a The adhesive retaining wall 1061 is bonded to the first substrate 101.

Please refer to FIGS. 2A to 2H, which are schematic diagrams of the second embodiment of the manufacturing method of the display of the present invention.

As shown in FIG. 2A, a first substrate 201 is first provided. The first substrate 201 has a first surface 201a and a second surface 201b opposite to the first surface 201a. The first surface 201a is provided with a conductive layer 202. In this embodiment, the first substrate 201 may be a transparent hard substrate or a flexible substrate, wherein the hard substrate is, for example, hard glass or other hard translucent materials, and the flexible substrate is, for example, soft glass or polycarbonate Ester (polycarbonate, PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other soft plastic substrates In addition, the conductive layer 202 may be a light-transmitting conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), nano silver metal film, or a combination of the above, but the invention is not limited to the above.

As shown in FIG. 2B, a photosensitive material layer 203 is formed on the surface of the conductive layer 202, and a light-shielding pattern 204 is formed on the second surface 201b of the first substrate 201. Next, lift on the second surface 201b side of the first substrate 201 An exposure beam I is provided, and the exposure beam I is irradiated toward the light shielding pattern 204 and the photosensitive material layer 203. In this embodiment, the light-sensitive material layer 203 is, for example, a negative photoresist layer, which can be covered on the surface of the conductive layer 202 by coating, spraying, depositing, or the like. In addition, the light-shielding pattern 204 can block the exposure light beam I from passing through the light-shielding pattern 204 by reflecting or absorbing light. When the light-shielding pattern 204 blocks light in a reflective manner, the light-shielding pattern 204 can be reflective with metal, metal oxide, etc. As the material, when the shading pattern 204 blocks light by absorption, the shading pattern 204 can be selected from black ink, toner, high optical density vinyl or other light absorbing materials that can absorb the exposure beam I. In this embodiment, the exposure beam I comes from a light source that can interact with the photosensitive material layer 203, such as a halogen lamp. However, the present invention is not limited to the above.

As shown in FIGS. 2C to 2E, the exposed light beam I irradiates a part of the photosensitive material layer 203 through the light-shielding pattern 204, and the portion of the photosensitive material 203 that is not irradiated by the exposed light beam I can be removed by the developer, and The conductive layer 202 corresponding to it is exposed, so that the exposed conductive layer 202 can be further removed by etching, such as wet or dry etching, to form a plurality of conductive patterns 205. Then, the plurality of conductive patterns 205 are removed The photosensitive material layer 203 completes the patterning process of the conductive layer. In this embodiment, the developing solution may be an alkaline solution, such as Na ₂ CO ₃ , TMAH, etc. The etching acid solution may be oxalic acid or aqua regia, but the invention is not limited to the above.

As shown in FIGS. 2F and 2G, a layer of photosensitive adhesive material 206 is completely covered on the plurality of conductive patterns 205 and the first surface 201a of the first substrate 201 that is not covered by the conductive pattern 205. In this embodiment, the photosensitive adhesive material 206 It can be a positive photoresist that has viscosity after development. In other embodiments, the photosensitive The adhesive material 206 can also be selected from dry film photoresist, wet film photoresist, UV pressure sensitive adhesive, UV anaerobic adhesive, two-stage curing UV adhesive, or other viscous photosensitive materials after development. A procedure is arranged to cover the photosensitive adhesive material 206 on the conductive pattern 205 and the first surface 201a of the first substrate 201 not covered by the conductive pattern 205, and then irradiate the exposure beam I toward the shading pattern 204, and the exposure beam I passes through the shading The pattern 204 is irradiated to a part of the photosensitive adhesive material 206. The photosensitive adhesive material 206 irradiated with light can be removed by a developer. After this patterning process, the unremoved photosensitive adhesive material 206 is in the conductive pattern 205 A viscous barrier wall 2061 is formed at the periphery, and the conductive patterns 205 and the viscous barrier wall 2061 are alternately arranged to form a plurality of grooves 2062.

As shown in FIG. 2H, the electrically driven display material 208 is placed in the grooves 2062, and the second substrate 207 is bonded to the first substrate 201 by the adhesive barrier 2061. For example, the electrically driven display material 208 can be placed into the groove 2062 by pouring, printing, etc. Then, the first substrate 201 is bonded to the second substrate 207 by the adhesive barrier 2061, thereby, The electrically driven display material 208 is limited to the space formed by the first substrate 201, the second substrate 207, and the adhesive barrier 2061. The electrically driven display material 208 can be provided by the conductive pattern 205 on the first substrate 201 and The conductive patterns 209 on the two substrates 207 are driven to form the display 2 of the present invention.

In addition, it should be noted that the adhesive barrier wall 2061 formed of the photosensitive adhesive material 206 can be cured while the first substrate 201 and the second substrate 207 are bonded together, or the first substrate can also be completed 201 with this After the second substrate 207 is bonded, another curing process is performed. For example, if the photosensitive adhesive material 206 adopts a two-stage curing UV adhesive, the first substrate 201 and the second substrate can be bonded with an adhesive barrier 2061 After 207, additionally expose the UV light source or heat once to allow the two-stage curing UV glue to fully cure. The fully cured adhesive barrier 2061 is more helpful for fixing the first substrate 201 and the second substrate 207 Pitch. In addition, the electrically driven display material 208 may be a liquid crystal material or an organic electroluminescence (OEL) material. For example, the liquid crystal material is, for example, nematic liquid crystal (Nematic Liquid Crystal), cholesterol liquid crystal (Cholesteric liquid crystal) or Other liquid crystal display materials, and organic electroluminescent materials such as organic light-emitting diode (OLED), polymer light-emitting diode (PLED) or other organic electroluminescent displays material. Furthermore, the second substrate 207 can be a transparent hard substrate or a flexible substrate, wherein the material of the rigid substrate is glass or other hard transparent materials, and the flexible substrate material is polycarbonate (polycarbonate) , PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other plastic materials. In addition, the second substrate 207 is provided with a conductive pattern 209, which can be a transparent conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), nano silver metal film, or a combination thereof However, the present invention is not limited to the above.

Please refer to Figures 3A to 3H for the display manufacturing method of the present invention A schematic diagram of the third embodiment.

As shown in FIG. 3A, a first substrate 301 is provided. The first substrate 301 has a first surface 301a and a second surface 301b opposite to the first surface 301a. The first surface 301a is provided with a conductive layer 302. In this embodiment, the first substrate 301 may be a transparent hard substrate or a flexible substrate, wherein the hard substrate is, for example, hard glass or other hard translucent materials, and the flexible substrate is, for example, soft glass or polycarbonate Ester (polycarbonate, PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other soft plastic substrates However, the present invention is not limited to the above. In addition, the conductive layer 302 may be a light-transmitting conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), nano silver metal film, or a combination thereof, but the invention is not limited to the above.

As shown in FIG. 3B, a light-sensitive material layer 303 is formed on the surface of the conductive layer 302, and a light-shielding pattern 304 is formed on the second surface 301b of the first substrate 301. Next, an exposure beam I is provided on the second surface 301b side of the first substrate 301, and the exposure beam I is irradiated toward the light shielding pattern 304 and the photosensitive material layer 303. In this embodiment, the photosensitive material layer 303 is, for example, a positive photoresist layer, which can be covered on the surface of the conductive layer 302 by coating, spraying, deposition, etc. The light-shielding pattern 304 can block the exposure beam by reflecting or absorbing light I pass through the light-shielding pattern 304, wherein, when the light-shielding pattern 304 blocks light in a reflective manner, the light-shielding pattern 304 can be made of a reflective material such as metal or metal oxide, and when the light-shielding pattern 304 blocks light in an absorption manner, Optional black ink, toner, black with high optical density Glue or other light-absorbing materials that can absorb the exposure beam I. In this embodiment, the exposure beam I comes from a light source that can interact with the photosensitive material layer 303, such as a halogen lamp, however, the present invention is not limited to the above.

As shown in FIGS. 3C to 3E, the exposure beam I irradiates part of the photosensitive material layer 303 through the light-shielding pattern 304, and the photosensitive material 303 irradiated with light can be removed by the developing solution and made to correspond to the conductive underneath After the layer 302 is exposed, the exposed conductive layer 302 can be further removed by etching, such as wet or dry etching, to form a plurality of conductive patterns 305. Finally, the photosensitive material 303 on the plurality of conductive patterns 305 is removed Patterning process of conductive layer. In this embodiment, the developing solution may be an alkaline solution, such as Na ₂ CO ₃ , TMAH, etc. The etching acid solution may be oxalic acid or aqua regia, but the invention is not limited to the above.

As shown in FIGS. 3F and 3G, a layer of photosensitive adhesive material 306 is first covered on the plurality of conductive patterns 305 and the first surface 301a of the first substrate 301 that is not covered by the conductive patterns 305. In this embodiment, the photosensitive adhesive The material 306 can be a negative photoresist that has viscosity after development. In other embodiments, the photosensitive adhesive material 306 can also be a dry film photoresist, wet film photoresist, UV pressure sensitive adhesive, UV Anaerobic adhesive, two-stage curing UV adhesive or other viscous photosensitive material, and the photosensitive adhesive material 306 is covered on the conductive pattern 305 and the first surface 301a of the first substrate 301 not covered by the conductive pattern 305 through the coating process , And irradiate the exposure beam I toward the light-shielding pattern 304. The exposure beam I irradiates a part of the photosensitive adhesive material 306 through the light-shielding pattern 304. The photosensitive adhesive material 306 that has not been irradiated with light can be removed by a developing solution. After this patterning process, the photosensitive adhesive that has not been removed The adhesive material 306 forms an adhesive barrier 3061 at the periphery of the conductive pattern 305, and the conductive pattern 305 and the adhesive barrier 3061 are alternately arranged to define a plurality of grooves 3062.

As shown in FIG. 3H, after forming a plurality of grooves 3062 on the first substrate 301, the electrically driven display material 308 can be placed into the grooves 3062, and a second substrate can be formed by the adhesive barrier 3061 307 is bonded to the first substrate 301. In this embodiment, the electrically driven display material 308 can be placed in the groove 3062 by pouring, printing, etc., and the first substrate 301 is then bonded to the second substrate 307 by the adhesive barrier 3061, so as to The electrically driven display material 308 is limited to the space formed by the first substrate 301, the second substrate 307, and the adhesive barrier 3061. The electrically driven display material 308 can be provided by the conductive pattern 305 of the first substrate 301 and the second substrate The conductive pattern 309 on 307 is driven to form the display 3 of the present invention.

In addition, it should be noted that the adhesive barrier 3061 formed by the photosensitive adhesive material 306 can be cured while the first substrate 301 and the second substrate 307 are bonded together, or the first substrate can also be completed After the bonding of 301 and the second substrate 307, another curing process is performed. For example, if the photosensitive adhesive material 306 adopts a two-stage curing UV adhesive, the first substrate 301 and the first substrate 301 can be bonded with the adhesive barrier 307 After the second substrate 307, additionally expose the UV light source or heat once to allow the two-stage curing of the UV glue to fully cure. The fully cured adhesive barrier 307 further helps to fix the first substrate 301 and the second substrate The spacing between 307. In addition, the electrically driven display material 308 may be a liquid crystal material or an organic electroluminescence (OEL) material. For example, the liquid crystal material is, for example, Nematic Liquid Crystal, Cholesteric Liquid Crystal or other liquid crystal display materials, and organic electroluminescent materials such as organic light-emitting diode (OLED), polymer light-emitting Diode (polymer light-emitting diode, PLED) or other organic electroluminescent display materials. In addition, the second substrate 307 may be a light-transmissive hard substrate or a flexible substrate, wherein the material of the hard substrate is glass or other hard light-transmitting materials, and the material of the flexible substrate is polycarbonate (polycarbonate, for example). PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other plastic materials. In addition, the second substrate 307 is provided with a conductive pattern 309, which can be a transparent conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), nano silver metal film, or a combination thereof However, the present invention is not limited to the above.

Please refer to FIGS. 4A to 4E, which are schematic diagrams of the fourth embodiment of the manufacturing method of the display of the present invention.

As shown in FIGS. 4A and 4B, first a first substrate 401 is provided. The first substrate 401 has a first surface 401a and a second surface 401b opposite to the first surface 401a, and a conductive shading pattern 404 is provided on the first surface 401a. In this embodiment, the first substrate 401 may be a transparent hard substrate or a flexible substrate, wherein the hard substrate is made of hard glass or other hard light-transmitting materials; the flexible substrate is a soft substrate Glass or polycarbonate (PC), polyimide (polyimide, PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other soft plastic substrates. In addition, the light-shielding pattern 404 is a conductive material that can reflect or absorb light, and can be formed on the first surface 401a by printing methods such as gravure printing, relief printing, pad printing, spray printing, or screen printing, and the light-shielding pattern 404 It can be made of aluminum, silver, nickel or graphite.

As shown in FIGS. 4C and 4D, then, the first surface 401a of the first substrate 401 is fully covered with a layer of photosensitive adhesive material 406 on the light shielding pattern 404 and the first surface 401a of the first substrate 401 not covered by the light shielding pattern 404 As mentioned above, in this embodiment, the photosensitive adhesive material 406 can be a negative photoresist that has viscosity after development. In other embodiments, the photosensitive adhesive material 406 can also be a dry film photoresist or wet film that has viscosity after development. Film photoresist, UV pressure sensitive adhesive, UV anaerobic adhesive, two-stage curing UV adhesive or other viscous photosensitive materials, and through the coating process to cover the photosensitive adhesive material 406 on the shading pattern 404 and the first substrate 401 The first surface 401a not covered by the light-shielding pattern 404 is then irradiated with the exposure beam I toward the light-shielding pattern 404, and the exposure beam I irradiates part of the photosensitive adhesive material 406 through the light-shielding pattern 404, and the light-sensitive photosensitive adhesive The material 406 can be removed by the developer. Through this patterning process, the unremoved photosensitive adhesive material 406 forms an adhesive barrier 4061 around the light shielding pattern 404, and the light shielding pattern 404 and the adhesive barrier The walls 4061 are staggered to form a plurality of grooves 4062.

As shown in FIG. 4E, the electrically driven display material 408 is placed in the grooves 4062, and the second substrate 407 is bonded by an adhesive barrier 4061 To the first substrate 401. For example, the electrically driven display material 408 can be placed into the groove 4062 by pouring, printing, etc. Then, the first substrate 401 is bonded to the second substrate 407 by the adhesive barrier 4061, thereby, The electrically driven display material 408 is limited to the space formed by the first substrate 401, the second substrate 407, and the adhesive barrier 4061. The electrically driven display material 408 can be formed by the conductive shading pattern 404 on the first substrate 401 and The conductive pattern 409 provided on the second substrate 407 is driven to form the display 4 of the present invention.

In addition, it should be noted that the adhesive barrier 4061 formed by the photosensitive adhesive material 406 can be cured while the first substrate 401 and the second substrate 407 are bonded together, or the first substrate can also be completed After the bonding of 401 and the second substrate 407, another curing process is performed. For example, if the photosensitive adhesive material 406 adopts a two-stage curing UV adhesive, the first substrate 401 and the first substrate 401 can be bonded with the adhesive barrier 4061 After the second substrate 407, an additional UV light source or heating is performed to allow the two-stage curing of the UV glue to be fully cured. The fully cured adhesive barrier 4061 further helps to fix the first substrate 401 and the second substrate The spacing between 407. In addition, the electrically driven display material 408 may be a liquid crystal material or an organic electroluminescence (OEL) material. For example, the liquid crystal material is, for example, nematic liquid crystal (Nematic Liquid Crystal), cholesterol liquid crystal (Cholesteric liquid crystal) or Other liquid crystal display materials, and organic electroluminescent materials such as organic light-emitting diode (OLED), polymer light-emitting diode (PLED) or other organic electroluminescent display equipment material. Furthermore, the second substrate 407 may be a transparent hard substrate or a flexible substrate, wherein the material of the hard substrate is glass or other hard transparent materials, and the flexible substrate material is polycarbonate (polycarbonate) , PC), polyimide (PI), polyethylene terephthalate (PET), polyethylene naphthalate (PEN) and other plastic materials. In addition, the second substrate 407 is provided with a conductive pattern 409, which can be a transparent conductive material, such as indium tin oxide (ITO), transparent conductive polymer (PEDOT), nano silver metal film, or a combination thereof However, the present invention is not limited to the above.

In addition, the light-shielding pattern, the light-sensitive material layer and the light source providing the exposure beam I used in the above embodiments can be selected according to the optical characteristics of each other, that is, when a material with a specific absorption band is selected as the light-shielding pattern, it is necessary With a light source that can be absorbed in this band and its wavelength range can also function with the light-sensitive material layer, for example, if the light-shielding pattern is a light-absorbing material with a cut-off wavelength of less than 380 nm, and the photosensitive wavelength of the light-sensitive material layer is 365 nm, At this time, a UV LED with a wavelength of 365 nm or other light sources with the same wavelength can be used to provide the exposure beam I. For another example, the shading pattern is a light-absorbing material with a cut-off wavelength of 380 nm or more, and the photosensitive wavelength of the light-sensitive material layer is 400 nm. In this case, a UV LED with a wavelength of 400 nm or other light sources with the same wavelength can be used to provide the exposure beam I . However, the present invention is not limited to the above.

In summary, the display structure and manufacturing method disclosed in the present invention can be applied to a display using an electrically driven fluid as a display material, such as a liquid crystal Display, organic electroluminescence display, electrowetting display, etc., because the display structure of the present invention is provided with an adhesive barrier, the adhesive barrier can not only define grooves with conductive patterns to accommodate fluids that need to be isolated from each other The display material can be further used for bonding two substrates. Therefore, it is not necessary to separately provide a structure for bonding the two substrates and complete panel packaging, so the convenience of the manufacturing process can be improved and the cost can be reduced. In addition, in the manufacturing method of the present invention, the same shading pattern can be used as a photomask to form conductive patterns and adhesive barriers adjacent to each other, and even, the shading pattern can be formed and patterned using a material that has conductivity itself Photomask with photosensitive adhesive material, therefore, it can avoid the problem of misalignment caused by the realignment of the mask during different patterning processes due to the deformation of the flexible substrate, which is improved by improving the alignment accuracy Product yield.

The above embodiments are used to exemplify the principles and effects of the present invention, rather than to limit the present invention. Anyone who is familiar with this skill can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be as listed in the scope of patent application mentioned later.

1‧‧‧Monitor

101‧‧‧The first substrate

101a‧‧‧First surface

101b‧‧‧Second surface

105, 109‧‧‧ conductive pattern

1061‧‧‧ Sticky retaining wall

107‧‧‧Second substrate

108‧‧‧Electric drive display material

Claims (24)

A method for manufacturing a display includes: providing a first substrate having opposing first and second surfaces, wherein a plurality of conductive patterns are formed on the first surface; a photosensitive adhesive material is covered on the conductive patterns and the first A portion of the first surface of a substrate that is not covered by conductive patterns; patterning the photosensitive adhesive material to form an adhesive barrier around the conductive pattern, as defined by the alternating arrangement of the conductive pattern and the adhesive barrier A plurality of grooves are formed; an electrically driven display material is arranged in the grooves; and a second substrate is bonded to the first substrate through the adhesive barrier wall. The method for manufacturing a display as described in item 1 of the patent application range, wherein the conductive pattern is formed by patterning a conductive layer provided on the first surface. The manufacturing method of the display as described in item 2 of the patent application scope, wherein the method of patterning the conductive layer to form the conductive pattern includes: arranging a layer of photosensitive material on the conductive layer; A light-shielding pattern is provided on a surface or the second surface, and the light-shielding pattern is irradiated with an exposure beam; and a portion of the light-sensitive material layer and a portion of the conductive layer irradiated by the exposure beam are removed to form the plurality of conductive patterns . The manufacturing method of the display as described in item 1 of the patent application scope, wherein the formation method of the adhesive retaining wall includes: A light-shielding pattern is provided on the photosensitive adhesive material; the exposure beam is irradiated toward the light-shielding pattern; and a portion of the photosensitive adhesive material irradiated by the exposure beam is removed to form the adhesive retaining wall. The manufacturing method of the display described in item 2 of the patent application scope, wherein the material forming the conductive layer is a light-transmitting conductive material. The manufacturing method of the display as described in Item 5 of the patent application range, wherein the translucent conductive material includes indium tin oxide (ITO), transparent conductive polymer (PEDOT) or nano silver metal film. The manufacturing method of the display as described in item 1 of the patent scope, wherein the first substrate is a light-transmitting substrate. The manufacturing method of the display as described in item 1 of the patent application range, wherein the photosensitive adhesive material is dry film photoresist, wet film photoresist, UV pressure sensitive adhesive, UV anaerobic adhesive or two-stage curing UV adhesive. The manufacturing method of the display as described in item 1 of the patent application scope, wherein the second substrate is provided with a conductive pattern, so that the electrically driven display material is provided by the conductive pattern provided on the first substrate and the The conductive patterns on the two substrates are driven. The method for manufacturing a display as described in item 1 of the patent scope, wherein the first substrate and the second substrate are hard substrates or flexible substrates. The manufacturing method of the display as described in item 10 of the patent application scope, wherein the hard substrate is a hard glass substrate. The manufacturing method of the display as described in item 10 of the patent application scope, wherein the flexible substrate is soft glass or polycarbonate (polycarbonate, PC), polyimide (polyimide, PI), polyethylene terephthalate (polyethylene terephthalate, PET) or polyethylene naphthalate (polyethylene naphthalate, PEN) soft plastic substrate. The manufacturing method of the display as described in item 1 of the scope of the patent application further includes patterning the photosensitive adhesive material with the conductive pattern, wherein the conductive pattern is used as a light-shielding pattern. A display includes: a first substrate with a plurality of conductive patterns on one surface, and a viscous barrier wall formed of photosensitive adhesive glue on the periphery of the conductive pattern, so that the conductive pattern and the viscous barrier A plurality of grooves are defined by the staggered arrangement of walls; an electrically driven display material is disposed in the grooves; and a second substrate is bonded to the first substrate by the adhesive barrier. The display according to item 14 of the patent application scope, wherein the conductive pattern and the adhesive barrier are formed by the same light-shielding pattern during the patterning process. The display according to item 15 of the patent application scope, wherein the material forming the conductive layer is a light-transmitting conductive material. The display according to item 16 of the patent application range, wherein the translucent conductive material includes indium tin oxide (ITO), transparent conductive polymer (PEDOT), or nano silver metal film. The display described in item 14 of the patent application scope, wherein the first The substrate is a light-transmitting substrate. The display according to item 14 of the patent application scope, wherein the photosensitive adhesive material is a dry film photoresist, a wet film photoresist, a UV pressure sensitive adhesive, a UV anaerobic adhesive, or a two-stage curing UV adhesive. The display according to item 14 of the patent application scope, wherein the second substrate is provided with a conductive pattern, so that the electrically driven display material is provided by the conductive pattern provided on the first substrate and the second substrate On the conductive pattern. The display according to item 14 of the patent application scope, wherein the first substrate and the second substrate are hard substrates or flexible substrates. The display described in item 21 of the patent application range, wherein the hard substrate is a hard glass substrate. The display as described in item 21 of the patent application scope, wherein the flexible substrate is soft glass or polycarbonate (polycarbonate, PC), polyimide (PI), polyethylene terephthalate Ester (polyethylene terephthalate, PET) or polyethylene naphthalate (PEN) soft plastic substrate. The display according to item 14 of the patent application scope, wherein the conductive pattern is a light-shielding pattern.

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