TWI534679B - Touch Panel And Manufacturing Method Thereof - Google Patents

Description

Touch panel and its manufacturing method

The present invention relates to a touch panel and a method of fabricating the same, and more particularly to a simplified structure suitable for a large-sized lightweight touch panel and a manufacturing method thereof.

With the development of touch technology, the existing touch panels are developing in the direction of large size and lightness. At present, domestic manufacturers are mainly adopting One Glass Solution (OGS) touch modules. However, as touch panels are gradually becoming larger, both GG architectures (eg DITO, SITO), GF architectures (eg GF, GF2), GFF architectures or OGS/TOL architecture touch panels are required for production. a large number of transparent optical adhesives for coating glass, PET film or sensing electrode layers on the substrate, especially the prior art transparent optical film tape OCA (Optical Clear Adhesive) and liquid transparent optical glue LOCA (Liquid Optical Clear Adhesive), The manufacturing cost of the touch panel is difficult to reduce; and in order to manufacture the large-sized touch panel, the ITO sputtering process and the multi-channel yellow lithography process required for the general production of the sensing electrode layer of the touch panel need to be larger and larger. Expensive vacuum pumping equipment and chambers, as well as more time-consuming vacuum pumping process, make it difficult to reduce the manufacturing cost and required working time of large-size touch panels, and how the sensing electrode layer of ITO sputtering process is large. Maintaining better uniformity of the touch panel is a major problem. Therefore, it is necessary to further improve the structure and process of the large-sized touch panel.

In view of this, the main purpose of the present invention is to provide an improved structure of a touch panel wiring and a manufacturing method thereof, which can simplify processes, reduce man-hours, and manufacture costs.

In order to achieve the above-mentioned purpose, the main technical means adopted by the present invention is that the touch panel comprises: a substrate divided into a visible area and a non-visible area, wherein the non-visible area is disposed around the visible area; wherein the non-visible area is disposed; The visible area includes a bonding area; a light shielding layer is formed on the first surface of the substrate to cover the non-visible area; a first sensing electrode layer is formed on the first surface of the substrate and covers the visible area, And comprising a first photosensitive resin layer electrically insulated from the first transparent conductive layer and the substrate; a second sensing electrode layer comprising a second photosensitive resin layer electrically insulated and a second transparent conductive layer interposed between the first transparent conductive layer and the second transparent conductive layer; and a circuit layer formed In the non-visible area and above the light shielding layer, and having a plurality of wires, one end of each of the wires is connected to the corresponding first and second sensing electrode layers, and the other end of each of the wires is concentrated to the bonding .

The invention has the advantages that each of the sensing electrode layers can be pre-formed, and wherein the photosensitive resin layer can be directly attached to the transparent conductive layer of the substrate or another sensing electrode layer, eliminating the need for vacuum pumping and sputtering. And the multi-pass process such as the yellow light lithography, the manufacturing cost and the working time are reduced and the lightness and thinness are relatively easy to realize; and since the two sensing electrode layers have a completely transparent structure, the visible region can have a better aperture ratio.

In order to achieve the above-mentioned creative purposes, the main technical means adopted by the present invention is to make the touch panel manufacturing method include the following steps: Preparing a substrate and a first and second transparent electrode film; wherein the substrate comprises a visible area and a non-visible area surrounding the visible area; pressurizing and heating the first transparent electrode film, the first transparent electrode film Bonding on the first surface of the substrate, and covering the visible area and a portion of the non-visible area; exposing and developing the first transparent electrode film to form a first sensing electrode layer; and on the first surface of the substrate Forming a plurality of first wires in the non-visible region, wherein one end of each of the first wires is overlapped on a portion of the first sensing electrode layer covering the invisible region; and pressing and heating the second transparent electrode film The second transparent electrode film is laminated on the first sensing electrode layer to cover the visible area and a portion of the non-visible area; and the second transparent electrode film is exposed and developed to form a second sensing An electrode layer; and a plurality of second wires are formed in the first surface of the substrate and in the non-visible region, wherein one end of each of the second wires is overlapped on the portion of the second sensing electrode layer covering the non-visible region .

The invention has the advantages that the stacking and fixing of the first and second sensing electrode layers can be completed in a simple bonding manner in a non-vacuum process environment, and each of the sensing electrode layers requires only one yellow lithography process. That is, the wiring is completed, so that the process can be simplified and the manufacturing cost can be reduced. Moreover, each of the sensing electrode layers has a uniform thickness, so that it has a relatively stable electrical performance.

10‧‧‧Substrate

11‧‧‧visible area

12‧‧‧Invisible area

13‧‧‧Lighting layer

14‧‧‧Line layer

15‧‧‧Contacts

20a‧‧‧first sensing electrode layer

20b‧‧‧Second sensing electrode layer

21a‧‧‧First photosensitive resin layer

21b‧‧‧Second photosensitive resin layer

22a‧‧‧First transparent conductive layer

22b‧‧‧Second transparent conductive layer

23a‧‧‧First film support

23b‧‧‧Second film support

30‧‧‧Protective layer

40‧‧‧Bridge structure

121‧‧‧ junction area

200a‧‧‧First transparent electrode film

200b‧‧‧Second transparent electrode film

Figure 1: Top view of the creation of the touch panel.

Figure 2: A cross-sectional view of the touch panel of the present invention.

3A to 3K are plan views of a semi-finished product of each step in the first preferred embodiment of the method for fabricating a touch panel.

4A to 4K: cross-sectional views corresponding to Figs. 3A to 3K.

5A to 5F are cross-sectional views showing a part of the steps in a second preferred embodiment of the method for fabricating a touch panel.

FIG. 6 is an opaque bridge structure of a sensing electrode layer of a prior art touch panel.

The technical means adopted by the present creation for achieving the purpose of creation are further explained below in conjunction with the drawings and the preferred embodiment of the present invention.

Referring to FIG. 1 and FIG. 2 , a preferred embodiment of the touch panel wiring structure includes a substrate 10 , a light shielding layer 13 , a circuit layer 14 , a first sensing electrode layer 20 a , and a first The second sensing electrode layer 20b and a protective layer 30.

The substrate 10 has a viewing zone 11 and at least one non-visible zone 12 on the side of the viewing zone 11 which, in a particular embodiment, is a predetermined viewing zone 11 in the center of the substrate 10 and is predetermined around the viewing zone 11. The area 12 is visible, but the position and number of the visible area 11 may vary according to design requirements, for example, depending on the location of the circuit layer. The substrate 10 is, for example, a see-through tempered glass substrate or a plastic substrate or any other suitable substrate. The substrate 10 serves as a cover lens of the touch panel, and the substrate 10 itself provides a function of protecting and carrying the components. In addition, some functional layers such as anti-glare, anti-fingerprint, anti-reflection and the like may be disposed on the substrate 10.

A light shielding layer 13 and a wiring layer 14 are disposed corresponding to the position of the non-visible area 12, and a light shielding layer 13 is formed on the first surface of the substrate 10 to cover the non-visible area 12. In this embodiment, the light shielding layer 13 is disposed between the non-visible area 12 and the circuit layer 14. The light shielding layer 13 can be black photoresist, black printing ink, black resin or any other suitable shading material and color. The light shielding layer 13 can shield the circuit layer 14 or other circuit components that are not suitable for being seen by the user, so that the touch panel has an aesthetic effect. The circuit layer 14 is formed in the non-visible area 12 and above the light shielding layer 13 and has a plurality of wires, one end of each of the wires is connected to the corresponding first sensing electrode layer 20a and second sensing electrode layer 20b, and The other end of each of the wires is concentrated to a land 121 on the substrate 10. The material of the wiring layer 14 may be made of a metal material including, but not limited to, molybdenum, gold, silver, copper, and aluminum. In addition, it may also include a nano metal material, a metal mesh, a transparent conductive material, etc., a nano metal material such as a nano silver wire, a nano copper wire, a carbon nanotube, etc., and a transparent conductive material such as indium oxide. Indium tin oxide (ITO) and the like.

The first sensing electrode layer 20a and the second sensing electrode layer 20b are disposed at least corresponding to the visible region 11. The first sensing electrode layer 20a is formed on the first surface of the substrate 10 and covers the visible area. In this embodiment, the first sensing electrode layer 20a is formed side by side in the Y direction on one surface of the substrate 10. The second sensing electrode layer 20b is formed in parallel with the first sensing electrode layer 20a in the X direction. The first sensing electrode layer 20a and the second sensing electrode layer 20b are electrically connected to the circuit layer 14. The first sensing electrode layer 20a includes an electrically insulating first photosensitive resin layer 21a and a first transparent conductive layer 22a, and each of the first transparent conductive layers 22a is formed on each of the first photosensitive resin layers 21a. The first photosensitive resin layer 21a of the first sensing electrode layer 20a is interposed between the first transparent conductive layer 22a of the first sensing electrode layer 20a and the substrate 10. The second sensing electrode layer 20b includes an electrically insulating second photosensitive resin layer 21b and a second transparent electrode layer 22b. The second photosensitive resin layer 21b of the second sensing electrode layer 20b is interposed between the first transparent conductive layer 22a of the first sensing electrode layer 20a and the second transparent conductive layer 22b of the second sensing electrode layer 20b. The first and second transparent conductive layers 22a, 22b may be an organic conductive material, and the organic conductive material may be selected from the group consisting of polymers of thiophene derivatives, including polyhexylthiophene, polyethylenedioxythiophene, and the like.

The protective layer 30 covers the visible region in a whole layer, and further includes a substrate 10, a light shielding layer 13, a wiring layer 14, a first sensing electrode layer 20a, and a second sensing electrode layer 20b. The protective layer 30 may have a single layer structure or a multilayer structure. In an embodiment of the invention, the protective layer is made of a transparent material and has a single layer structure. The protective layer material may include an inorganic material such as silicon nitride, silicon oxide, and silicon oxynitride, or may be an organic material such as C. Other suitable materials such as an acrylic resin may also be a combination of the above materials, but the invention is not limited thereto.

Please refer to FIGS. 3A to 3K and FIGS. 4A to 4K , which are a preferred embodiment of the method for fabricating the touch panel.

First, a substrate 10 and a first transparent electrode film 200a and a second transparent electrode film 200b are prepared. In detail, the first transparent electrode film 200a is sequentially laminated to include a first photosensitive resin layer 21a, a first transparent conductive layer 22a, a first thin film support 23a (or a release film), and the second transparent electrode film 200b is The sequence stack includes a second photosensitive resin layer 21b, a second transparent conductive layer 22b, and a second film support 23b, wherein the substrate 10 includes a visible area 11 and a non-visible area 12 surrounding the visible area 11. In some embodiments, the surfaces of the first photosensitive resin layer 21a of the first transparent electrode film 200a and the photosensitive resin layer 21b of the second transparent electrode film 200b respectively have a film support for protecting the first and second surfaces. Photosensitive resin layers 21a and 22b.

Referring to FIG. 3A and FIG. 4A, the first photosensitive resin layer 21a of the first transparent electrode film 200a is first bonded to the first surface of the substrate 10 having the light shielding layer 13, and The first transparent electrode film 200a is covered with the visible region 11 of the substrate 10, and one of the sides covers the non-visible region 12. In some embodiments, the first film support 23a on the first photosensitive resin layer 21a is separated, and the first photosensitive resin layer 21a of the first transparent electrode film 200a is bonded to the substrate 10. On the first surface of the light shielding layer 13. Since the first photosensitive resin layer 21a of the present invention can be viscous in a high-temperature and high-pressure environment, the substrate 10 or the first transparent electrode film 200a can be further pressurized and heated during the bonding, so that the first transparent electrode film The first photosensitive resin layer 21a of 200a is viscous, and the preferable condition for pressurizing the substrate 10 or the first transparent electrode film 200a is 3.5 MPa, and the preferable condition for heating the substrate 10 or the first transparent electrode film 200a is 70 Å. To 140 degrees. Further, if the degree of lamination is further increased, the substrate 10 and the first transparent electrode film 200a can be further heated.

Next, the exposure process is performed, as shown in FIG. 3B and FIG. 4B. Since the first and second photosensitive resin layers 21a and 21b and the first and second transparent conductive layers 22a and 22b of the present invention have an oxygen-suppressive photosensitive curing property, ultraviolet light (UV) is used to transmit a pattern having a juxtaposition in the Y direction. The photomask performs one exposure on the first transparent electrode film 200a, and the preferred wavelength of the ultraviolet light is 365 nm. Since the first photosensitive resin layer 21a is interposed between the substrate 10 and the first transparent conductive layer 22a, and the first transparent conductive layer 22a is interposed between the first photosensitive resin layer 21a and the first thin film support 23a, the first photosensitive When the resin layer 21a and the first transparent conductive layer 22a are in an oxygen-deficient state at this time, the portion where the first photosensitive resin layer 21a and the first transparent conductive layer 22a are irradiated to the ultraviolet light in the absence of oxygen generates a curing reaction. The above-mentioned curing is more intensive to the internal molecular bonding of the material, so that it is not easily eroded by the etching liquid.

After the exposure process is completed, referring to FIG. 3C and FIG. 4C, the first film support 23a of the first transparent electrode film 200a is removed first.

Next, a development process is performed. Referring to FIG. 3D and FIG. 4D, the uncured photosensitive resin layer 21 and the corresponding first transparent conductive layer 22a of the first transparent electrode film 200a are removed by using a developing solution, and the developer is preferably used. The condition was a 1% Na ₂ Co ₃ solution.

Referring to FIG. 3E and FIG. 4E, the portion of the first transparent electrode film 200a that is cured and not removed by the developer, that is, a pattern that is juxtaposed along the Y direction, is the first sensing electrode of the touch panel. Layer 20a. Then, the circuit layer 14 is formed in the non-visible area 12 by screen printing, and one end of each of the plurality of wires 14 is connected to the portion of the corresponding first sensing electrode layer 20a in the non-visible area, and each The other end of the plurality of wires 14 is concentrated to the land 121 and can be connected to a corresponding contact 15, that is, the fabrication of the first sensing electrode layer 20a is completed.

Next, the second sensing electrode layer 20b is formed. Referring to FIG. 3F and FIG. 4F, the manufacturing process is substantially the same as that of the first sensing electrode layer 20a, but a second process is performed during the lamination process. The transparent electrode film 200b is bonded to the first sensing electrode layer 20a. In some embodiments, the second film support 23b on the second photosensitive resin layer 21b is separated first, and then the second through The second photosensitive resin layer 21b of the bright electrode film 200b is bonded to the first sensing electrode layer 20a. When performing the exposure process, referring to FIG. 3G and FIG. 4G, the second transparent electrode film 200b is exposed using a photomask having a pattern arranged in the X direction. When performing the development process, please refer to FIG. 3J and FIG. 4J. The portion of the second transparent electrode film 200b that is cured and not removed by the developer, that is, a pattern in which the X direction is juxtaposed is the second sensing electrode layer 20b of the touch panel; and the first sensing electrode layer Since 20a is cured, the development process of the second sensing electrode layer 20b does not cause damage to the first sensing electrode layer 20a.

After the fabrication of the first and second sensing electrode layers 20a and 20b is completed, as shown in FIG. 3K and FIG. 4K, a transparent insulating protective layer 30 is formed on the second sensing electrode 20b to protect the second. The sensing electrode layer 20b and the first sensing electrode layer 20a complete the fabrication of the touch panel.

Referring to FIG. 5, another preferred embodiment of the method for fabricating the touch panel is substantially the same as that of the first sensing electrode layer 20a in the above embodiment, that is, FIG. 5A to FIG. 5C respectively correspond to FIG. 3A. ~3C (or corresponding to Figures 4A-4C respectively), Figures 5E~5F correspond to Figures 3D~3E (or respectively corresponding to Figures 4D~4E), or Figures 5A~5C correspond to Figures 3F~3H respectively (or respectively Corresponding to FIGS. 4F to 4H), FIGS. 5E to 5F respectively correspond to FIGS. 3I to 3J (or respectively corresponding to FIGS. 4I to 4J), except that the exposure process is performed after the first film support 23a is removed, and the development process is not performed. Previously, the photomask is removed and the first photosensitive resin layer 21a and the first transparent conductive layer 22a are double-exposed so that the first photosensitive resin layer 21a is exposed in an unexposed portion in one exposure (for example, FIGS. 3B and 4B). Cured. Therefore, at the time of the developing process, since the first photosensitive resin layer 21a has all been cured, the corresponding first photosensitive resin layer 21a of the unexposed portion in FIGS. 3B and 4B can retain a large thickness (about 4.2 μm to 4.6). Mm). Due to the above-mentioned double exposure, the first film supporting body 23a has been removed, and the first photosensitive resin layer 21a is not in an oxygen-deficient environment, so that the image generated during one exposure is not destroyed during the double exposure. .

Therefore, the display panel of the present invention uses a simple wiring method and structure, thereby simplifying the process, reducing the man-hour and manufacturing cost, and providing the uniformity and the aperture ratio of the large-sized touch panel.

The above description is only a preferred embodiment of the present invention, and does not impose any form limitation on the present invention. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present creation, and has any technical field. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical essence of the present invention, any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the present technical solution.

10‧‧‧Substrate

11‧‧‧visible area

12‧‧‧Invisible area

13‧‧‧Lighting layer

14‧‧‧Line layer

15‧‧‧Contacts

20a‧‧‧first sensing electrode layer

20b‧‧‧Second sensing electrode layer

121‧‧‧ junction area

30‧‧‧Protective layer

Claims (8)

A touch panel comprises: a substrate divided into a visible area and a non-visible area, wherein the non-visible area is disposed around the visible area; wherein the non-visible area comprises a joint area; a light shielding layer is formed on the substrate a first surface to cover the non-visible area; a first sensing electrode layer formed on the first surface of the substrate and covering the visible area, and comprising a first photosensitive resin layer electrically insulated and a first a transparent conductive layer, the first photosensitive resin layer being interposed between the first transparent conductive layer and the substrate; wherein the first photosensitive resin layer and the first transparent conductive layer have the same pattern, and the first transparent conductive layer Attaching to the substrate through the first photosensitive resin layer; a second sensing electrode layer comprising a second photosensitive resin layer electrically insulated and a second transparent conductive layer, wherein the second photosensitive resin layer is interposed Between the first transparent conductive layer and the second transparent conductive layer; wherein the second photosensitive resin layer and the second transparent conductive layer have the same pattern, and the second transparent conductive layer passes through the second photosensitive resin layer And the first transparent conductive layer; and a circuit layer formed in the non-visible area and the light shielding layer, and having a plurality of wires, each of the wires having a first end and a second sensing electrode layer corresponding thereto Connected, and the other end of each of the wires is concentrated to the junction. The touch panel of claim 1, further comprising a protective layer formed on the second sensing electrode layer and covering the visible area. The touch panel of claim 2, wherein the first transparent conductive layer and the second transparent conductive layer are organic conductive materials, and the organic conductive material is selected from the group consisting of polymers of thiophene derivatives. The touch panel of claim 3, further comprising a plurality of parallel contacts, corresponding to the bonding region and formed on the light shielding layer, and each of the contacts is connected to a corresponding wire. A touch panel manufacturing method includes the following steps: Preparing a substrate and a first and second transparent electrode film; wherein the substrate comprises a visible area and a non-visible area surrounding the visible area; pressurizing and heating the first transparent electrode film, the first transparent electrode film Bonding on the first surface of the substrate, and covering the visible area and a portion of the non-visible area; exposing and developing the first transparent electrode film to form a first sensing electrode layer; and on the first surface of the substrate Forming a plurality of first wires in the non-visible region, wherein one end of each of the first wires is overlapped on a portion of the first sensing electrode layer covering the invisible region; and pressing and heating the second transparent electrode film The second transparent electrode film is attached to the first sensing electrode layer to cover the visible area and a portion of the non-visible area; and the second transparent electrode film is exposed and developed to form a second sensing electrode layer; A plurality of second wires are formed on the first surface of the substrate and in the non-visible region, wherein one end of each of the second wires is overlapped on a portion of the second sensing electrode layer covering the non-visible region. The touch panel manufacturing method of claim 5, wherein the first transparent electrode film sequentially comprises a first photosensitive resin layer, a first transparent conductive layer and a first thin film support, the second transparent electrode The film system is sequentially laminated to include a second photosensitive resin layer, a second transparent conductive layer and a second thin film support, wherein the step of exposing and developing the first transparent electrode film further comprises: preparing a a mask of the pattern of the sensing electrode layer, and aligned with the first transparent electrode film; one exposure to partially cure the exposed portion of the first transparent conductive layer; removing the first film support; and retaining the first transparent conductive layer a curing portion, and removing the uncured portion of the first transparent conductive layer to form the first sensing electrode layer; the step of exposing and developing the second transparent electrode film further comprises: preparing a layer having the second sensing electrode a patterned reticle and aligned with the second transparent electrode film; One exposure to partially cure the second transparent conductive layer; removing the second film support; and retaining the cured portion of the second transparent conductive layer, and removing the uncured portion of the second transparent conductive layer to form the first Two sensing electrode layers. The touch panel manufacturing method of claim 5, wherein the first transparent electrode film sequentially comprises a first photosensitive resin layer, a first transparent conductive layer and a first thin film support, the second transparent electrode The film system is sequentially laminated to include a second photosensitive resin layer, a second transparent conductive layer and a second thin film support, wherein the step of exposing and developing the first transparent electrode film further comprises: preparing a first a mask of the pattern of the sensing electrode layer, and aligned with the first transparent electrode film; one exposure to partially cure the exposed portion of the first transparent conductive layer; removing the first film support; removing the mask and double exposure So that the unexposed portion of the first photosensitive resin layer is cured; and the cured portion of the first transparent conductive layer is retained, and the uncured portion of the first transparent conductive layer is removed to form the first sensing electrode layer; The step of the second transparent electrode film further includes: preparing a mask having a pattern of the second sensing electrode layer, and aligning the second transparent electrode film; and exposing the second transparent electrode layer once Exposing partially cured; removing the second film support; removing the mask and double exposure to cure the unexposed portion of the second photosensitive resin layer; and retaining the cured portion of the second transparent conductive layer, and removing the second An uncured portion of the transparent conductive layer to form the second sensing electrode layer. The touch panel manufacturing method according to claim 6 or 7, after the step of forming a plurality of second wires in the first surface of the substrate and in the non-visible region, forming a transparent insulating protective layer on the second sensing electrode Above the layer.