CN105630215A - Touch panel - Google Patents
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- CN105630215A CN105630215A CN201410561990.6A CN201410561990A CN105630215A CN 105630215 A CN105630215 A CN 105630215A CN 201410561990 A CN201410561990 A CN 201410561990A CN 105630215 A CN105630215 A CN 105630215A
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Abstract
The invention relates to a touch panel. The structure of the touch panel comprises a substrate and two induction electrode layers attached to the substrate in a simple attachment manner. Each induction electrode layer is subjected to photolithography process for once so that arrangement of wiring is achieved. A photosensitive resin layer of each induction electrode layer can be attached to the substrate or another induction electrode layer. Therefore, manufacture material is saved and process is reduced so that the purposes of decreasing manufacture cost as well as improving manufacture efficiency are fulfilled.
Description
Technical field
Present disclosure generally relates to a kind of contact panel, espespecially a kind of simplification structure being suitable for the frivolous contact panel of large scale and preparation method thereof.
Background technology
Along with the development of touch technology, existing contact panel develops towards large scale and frivolous direction, and current domestic big factory is with single-glass technology (OneGlassSolution; OGS) touch-control module is main flow. But it is as contact panel and is increasingly towards maximization development, it it is no matter the contact panel of GG framework (such as DITO, SITO), GF framework (such as GF, GF2), GFF framework or OGS/TOL framework, substantial amounts of transparent optical cement is all needed during making, in order to paste glass, PET film or induction electrode layer in substrate, especially transparent optical film adhesive tape OCA (OpticalClearAdhesive) of prior art and liquid clear optical glue LOCA (LiquidOpticalClearAdhesive) so that the manufacturing cost of contact panel is difficult to reduce; And be the making in response to maximization contact panel, ITO sputter process required when the general induction electrode layer making contact panel and multiple tracks gold-tinted micro-photographing process, need vacuum-pumping equipment more expensive more greatly and chamber, and vacuum suction flow process more consuming time, the manufacturing cost making large touch panel is difficult to reduce with man-hours requirement, and how the induction electrode layer of ITO sputter process maintains preferably uniformity a great problem especially in large touch panel. Therefore, it is necessary to structure and processing procedure for large touch panel improve further.
Summary of the invention
In view of this, main purpose system of the present invention provides structure-improved and the method for a kind of contact panel wiring, it is possible to simplifies operation, reduce man-hour and manufacturing cost.
For reaching above-mentioned creation purpose, technical way system of the present invention makes this contact panel include:
One substrate, is be divided into a visible area and a non-visible area, and this non-visible area is arranged around this visible area; Wherein this non-visible area includes a bonding land;
One light shield layer, is the first surface being formed at this substrate, to cover this non-visible area;
One first induction electrode layer, system is formed at this first surface of this substrate and covers this visible area, and including one first photosensitive resin layer being electrically insulated and one first transparency conducting layer, this first photosensitive resin layer is between this first transparency conducting layer and this substrate;
One second induction electrode layer, includes one second photosensitive resin layer and one second transparency conducting layer that are electrically insulated, and this second photosensitive resin layer is between this first transparency conducting layer and this second transparency conducting layer; And
One line layer, is be formed in this non-visible area and on this light shield layer, and tool complex lead, and first and second induction electrode layer that one end of this wire each is corresponding connects, and the other end of this wire each is then concentrated to this bonding land.
It is an advantage of the current invention that, this induction electrode layer each can molding in advance, and wherein this photosensitive resin layer can be mounted directly on the transparency conducting layer of this substrate or another induction electrode layer, save multiple tracks processing procedures such as comprising vacuum suction, sputter and gold-tinted lithographic, make manufacturing cost and man-hour reduce and be easier to realize frivolous; Again owing to this two sensings electrode layer has the structure of all-transparent, it is possible to make to have in this visible area preferably aperture opening ratio.
For reaching above-mentioned creation purpose, technical way system of the present invention makes this contact panel method for making include the following step:
Prepare a substrate and first and second ELD; Wherein this substrate includes a visible area and around the non-visible area of this visible area;
Pressurize and heat the first ELD, this first ELD is fitted on the first surface of this substrate, and being covered by this visible area and part non-visible area;
Exposure, this first ELD that develops are to form one first induction electrode layer;
In the first surface of this substrate and to being formed with plurality of first conductive lines in non-visible area, wherein one end of each first wire coincides and is covered by the part of this non-visible area in this first induction electrode layer;
Pressurize and heat the second ELD, this second ELD being fitted in this and coincides on this one first induction electrode layer, to be covered by this visible area and part non-visible area;
Exposure, this second ELD that develops are to form one second induction electrode layer; And
In the first surface of this substrate and to being formed with plurality of second conductive lines in non-visible area, wherein one end of each second wire coincides and is covered by the part of this non-visible area in this second induction electrode layer.
It is an advantage of the current invention that, can under antivacuum processing environment, with simple laminating type, complete storehouse and the set of first and second induction electrode layer, and each this induction electrode layer only needs a gold-tinted micro-photographing process namely to complete wiring, reduce man-hour therefore, it is possible to simplify operation, reduce manufacturing cost; This induction electrode layer each has uniform thickness again so that it is have more stable electrical performance.
Accompanying drawing explanation
Fig. 1: for the top view of contact panel of the present invention.
Fig. 2: for the profile of contact panel of the present invention.
Fig. 3 A to 3K: for the semi-finished product top view of each step in the first preferred embodiment of contact panel method for making of the present invention.
Fig. 4 A to 4K: the profile of corresponding diagram 3A to 3K.
Fig. 5 A to 5F: for the semi-finished product profile of the second preferred embodiment partial step of contact panel method for making of the present invention.
Fig. 6: for the opaque bridging structure of the induction electrode layer of prior art contact panel.
Detailed description of the invention
Hereinafter coordinate graphic and the preferred embodiments of the invention, the present invention is expanded on further and reaches the technological means that creation purpose is taked.
Referring to shown in Fig. 1 and Fig. 2, for one of contact panel wire structures of the present invention preferred embodiment, it comprises substrate 10, light shield layer 13, line layer 14,1 first induction electrode layer 20a, one second induction electrode layer 20b and a protective layer 30.
Substrate 10 has a visible area 11 and at least one non-visible area 12 being positioned at visible area 11 side, in a specific embodiment, at the visible area 11 that substrate 10 central authorities are predetermined, and for predetermined non-visible area 12 around visible area 11, but the position of visible area 11 and number can be different according to design requirement, for instance can change according to the position of line layer. Substrate 10 is such as any substrate being suitable for of the hardened glass substrate that can have an X-rayed or plastic base or other. This substrate 10 is the protection enclosing cover (coverlens) as contact panel, and substrate 10 itself can provide the function of protection and bearing assembly. It addition, some functional layers also can be arranged on the substrate 10, for instance functional layers such as anti-glare, anti-fingerprint, antireflections.
One light shield layer 13 and a line layer 14 are arranged corresponding to the position of non-visible area 12, and light shield layer 13 is the first surface being formed at this substrate 10, to cover this non-visible area 12. In the present embodiment, this light shield layer 13 is be arranged between non-visible area 12 and line layer 14, this light shield layer 13 can be black photoresistance, black printed ink, black resin or other any light screening material being suitable for and color, light shield layer 13 can cover line layer 14 or other are unsuitable for the circuit unit that is seen by a user, makes contact panel have effect attractive in appearance. Line layer 14 is be formed in this non-visible area 12 and on this light shield layer 13, and tool complex lead, the first induction electrode layer 20a or the second induction electrode layer 20b that one end of this wire each is corresponding connect, and the other end of this wire each is then concentrated to the bonding land 121 on substrate 10. The material of this line layer 14 can be made by metal material, and described metal material comprises: molybdenum, gold, silver, copper and aluminum wherein any one, but is not limited to this. In addition, also nm metal material, metal grill (metalmesh), transparent conductive material etc. can be included, nm metal material is nm silver wire, nm copper cash, carbon nanotube etc. such as, transparent conductive material such as tin indium oxide (indiumtinoxide; ITO) etc.
First induction electrode layer 20a is arranged with the second at least corresponding visible area 11 of induction electrode layer 20b. this the first induction electrode layer 20a system is formed at this first surface of this substrate 10 and covers this visible area, in the present embodiment, this the first induction electrode layer 20a system is formed on one of this substrate 10 surface with Y-direction side by side, this the second induction electrode layer 20b system is formed on this first induction electrode layer 20a with X-direction side by side, this first induction electrode layer 20a and this second induction electrode layer 20b is electrically connected this line layer 14, and it respectively includes the photosensitive resin layer 21 being electrically insulated and a transparency conducting layer 22, respectively this transparency conducting layer 22 is formed at respectively on this photosensitive resin layer 21. the photosensitive resin layer 21 of the first induction electrode layer 20a is between transparency conducting layer 22 and the substrate 10 of this first induction electrode layer 20a. the photosensitive resin layer 21 of this second induction electrode layer 20b is between the transparency conducting layer 22 and the transparency conducting layer 22 of this second induction electrode layer 20b of this first induction electrode layer 20a. this transparency conducting layer 22 can be organic conductive material, and this organic conductive material is selected from the polymer of thiophene derivant, and it includes poly-hexyl thiophene, poly-Ethylenedioxy Thiophene etc.
Protective layer 30 be a flood be covered in this visible area, it more comprises and is coated with substrate 10, light shield layer 13, line layer the 14, first induction electrode layer 20a and the second induction electrode layer 20b. Protective layer 30 can be single layer structure, it is possible to for multiple structure. In one of present invention embodiment, this protective layer is that transparent material is made and for single layer structure. Protective layer material can include inorganic material; such as; silicon nitride (siliconnitride), silicon oxide (siliconoxide) and silicon oxynitride (siliconoxynitride); it is alternatively organic material; such as; other material being suitable for such as acrylic resin (acrylicresin), it is possible to for the combination of above-mentioned material, but the present invention is not limited thereto.
Refer to shown in Fig. 3 A to 3K and Fig. 4 A to 4K, for one of contact panel method for making of the present invention preferred embodiment.
First a substrate 10 and one first ELD 200a and one second ELD 200b are prepared. Specifically, first ELD 200a sequentially coincides and comprises photosensitive resin layer 21, transparency conducting layer 22, film support 23 (or claiming mould release membrance), second ELD 200b sequentially coincides and comprises photosensitive resin layer 21, transparency conducting layer 22, film support 23, and wherein this substrate 10 includes a visible area 11 and around the non-visible area 12 of this visible area 11. In certain embodiments, the surface of the photosensitive resin layer 21 of the first ELD 200a and the second ELD 200b all has film support respectively, in order to protect photosensitive resin layer 21.
It is lamination at the beginning, refer to shown in Fig. 3 A and Fig. 4 A, first the photosensitive resin layer 21 of this first ELD 200a is fitted in this substrate 10 and have on the first surface of light shield layer 13, and make this first ELD 200a cover the visible area 11 of substrate 10, and wherein side is covered in non-visible area 12. In certain embodiments, then need first to be separated by the film support on photosensitive resin layer 21, then the photosensitive resin layer 21 of this first ELD 200a is fitted in this substrate 10 have on the first surface of light shield layer 13. Owing to the photosensitive resin layer 21 of this exposure can produce stickiness under the environment of High Temperature High Pressure, therefore can further substrate 10 or this first ELD 200a be pressurizeed and heating during fitting, the photosensitive resin layer 21 making the first ELD 200a produces stickiness, the optimum condition that substrate 10 or this first ELD 200a are pressurizeed is 3.5MPa, and the optimum condition that substrate 10 or this first ELD 200a are heated is 70 to 140 degree Celsius. It addition, as being intended to raising stacking adaptation further, can further substrate 10 and this first ELD 200a be heated simultaneously.
Then it is exposed operation, refers to shown in Fig. 3 B and Fig. 4 B. Oxygen photo-curing characteristic is pressed down owing to the photosensitive resin layer 21 of this exposure and transparency conducting layer 22 have, using ultraviolet light (UV), through a light shield with the pattern arranged side by side with Y-direction, above-mentioned this first ELD 200a is carried out single exposure, the optimal wavelength of its ultraviolet light is 365nm. Due to photosensitive resin layer 21 between substrate 10 and transparency conducting layer 22, transparency conducting layer 22 is between photosensitive resin layer 21 and film support 23, therefore photosensitive resin layer 21 and transparency conducting layer 22 are now under the situation of anoxia, and photosensitive resin layer 21 and transparency conducting layer 22 are irradiated to the part of ultraviolet light under the situation of anoxia and produce curing reaction. Above-mentioned this is cured as its material internal molecular binding to be strengthened more, and makes it not easily be etched liquid and corroded.
After exposure process terminates, refer to shown in Fig. 3 C and Fig. 4 C, first remove the film support 23 of above-mentioned ELD 200.
Then developing procedure is carried out, refer to shown in Fig. 3 D and Fig. 4 D, using developer solution to remove the transparency conducting layer 22 of uncured sensing optical activity resin 21 and correspondence thereof in above-mentioned first ELD 200a, the optimum condition of its developer solution is the Na2Co3 solution of concentration 1%. Namely retain the cured portion of the transparency conducting layer 22 of the first ELD 200a, and remove the uncured portion of the transparency conducting layer of the first ELD 200a.
Refer to shown in Fig. 3 E and Fig. 4 E, the part that above-mentioned first ELD 200a solidifies and do not removed by this developer solution, namely form one with pattern arranged side by side along the Y direction, for the first induction electrode layer 20a of above-mentioned contact panel. Then, in non-visible area 12, line layer 14 is formed again in screen painting mode, one end system of this complex lead 14 each connects in the part of non-visible area with above-mentioned corresponding first induction electrode layer 20a position, the other end of this complex lead 14 each is then concentrated to this bonding land 121, and contact 15 that can be corresponding with one connects, namely complete the making of the first induction electrode layer 20a.
Then the making of the second induction electrode layer 20b is carried out, refer to shown in Fig. 3 F and Fig. 4 F, its Making programme is roughly the same with the Making programme of above-mentioned first induction electrode layer 20a, only in time carrying out lamination, is fitted in by one second ELD 200b on the first induction electrode layer 20a. In certain embodiments, then need first to be separated by the film support on photosensitive resin layer 21, then fitted on the first induction electrode layer 20a by the photosensitive resin layer 21 of this first ELD 200b. When being exposed operation, refer to shown in Fig. 3 G and Fig. 4 G, use a light shield with the pattern arranged side by side with X-direction that this second ELD 200b is exposed; When carrying out developing procedure, refer to shown in Fig. 3 J and Fig. 4 J, the part that this second ELD 200b solidifies and do not removed by this developer solution, namely one is formed with X-direction pattern arranged side by side, the second induction electrode layer 20b for above-mentioned contact panel, namely retain the cured portion of the transparency conducting layer 22 of the second ELD 200b, and remove the uncured portion of the transparency conducting layer of the second ELD 200b, to form the second induction electrode layer 20b. Owing to the first induction electrode layer 20a is cured, therefore the first induction electrode layer 20a will not be damaged by the developing procedure of this second induction electrode layer 20b.
After completing the making of above-mentioned two sensing electrode layers 20; refer to shown in Fig. 3 K and Fig. 4 K; on the second induction electrode 20, form the protective layer 30 of a transparent insulation, in order to protect this second induction electrode layer 20b and this first induction electrode layer 20a, namely complete the making of contact panel.
Refer to shown in Fig. 5, another preferred embodiment for contact panel method for making of the present invention, it is roughly the same with the Making programme of the first induction electrode layer 20a in above-described embodiment, namely Fig. 5 A��5C corresponds respectively to Fig. 3 A��3C (or corresponding respectively to Fig. 4 A��4C), Fig. 5 E��5F corresponds respectively to Fig. 3 D��3E (or corresponding respectively to Fig. 4 D��4E), or Fig. 5 A��5C corresponds respectively to Fig. 3 F��3H (or corresponding respectively to Fig. 4 F��4H), Fig. 5 E��5F corresponds respectively to Fig. 3 I��3J (or corresponding respectively to Fig. 4 I��4J), only exposure process is after removing film support 23, and before not carrying out developing procedure, remove light shield and photosensitive resin layer 21 and transparency conducting layer 22 are carried out re-expose, this photosensitive resin layer 21 (such as Fig. 3 B and Fig. 4 B) unexposed portion in single exposure is made to solidify. therefore when developing procedure, owing to photosensitive resin layer 21 is all cured, therefore in Fig. 3 B and 4B, photosensitive resin layer 21 corresponding to unexposed portion can retain more thickness (about 4.2 ��m to 4.6 ��m). during due to aforementioned re-expose, film support 23 is removed, and this photosensitive resin layer 21 has been not in anaerobic condition environment, therefore can't destroy produced figure during single exposure when re-expose.
Thereby, the display floater of the present invention uses easy wiring method and structure, and then can reach to simplify operation, reduce man-hour and manufacturing cost, and makes large touch panel have preferably uniformity and aperture opening ratio.
The above is only presently preferred embodiments of the present invention, not the present invention is done any pro forma restriction, although the present invention is disclosed above with preferred embodiment, but it is not limited to the present invention, any art has usually intellectual, without departing from the scope of technical solution of the present invention, when the technology contents of available the disclosure above makes a little change or is modified to the Equivalent embodiments of equivalent variations, in every case it is the content without departing from technical solution of the present invention, the technical spirit of the foundation present invention is to any simple modification made for any of the above embodiments, equivalent variations and modification, all still fall within the scope of technical solution of the present invention.
Claims (8)
1. a contact panel, it is characterised in that be comprise:
One substrate, is be divided into a visible area and a non-visible area, and this non-visible area is arranged around this visible area; Wherein this non-visible area includes a bonding land;
One light shield layer, is the first surface being formed at this substrate, to cover this non-visible area;
One first induction electrode layer, system is formed at this first surface of this substrate and covers this visible area, and including one first photosensitive resin layer being electrically insulated and one first transparency conducting layer, this first photosensitive resin layer is between this first transparency conducting layer and this substrate;
One second induction electrode layer, includes one second photosensitive resin layer and one second transparency conducting layer that are electrically insulated, and this second photosensitive resin layer is between this first transparency conducting layer and this second transparency conducting layer; And
One line layer, is be formed in this non-visible area and on this light shield layer, and tool complex lead, and first and second induction electrode layer that one end of this wire each is corresponding connects, and the other end of this wire each is then concentrated to this bonding land.
2. contact panel as claimed in claim 1, it is characterised in that be further include a protective layer, is be formed on this second induction electrode layer, and covers this visible area.
3. contact panel as claimed in claim 2, it is characterised in that such first and second conductive layers are organic conductive material, this organic conductive material is selected from the polymer of thiophene derivant.
4. contact panel as claimed in claim 3, it is characterised in that be further include plural number contact side by side, be that correspondence to bonding land and is formed on this light shield layer, and the wire connection that this each contact is corresponding.
5. a contact panel method for making, it is characterised in that be comprise the steps of
Prepare a substrate and first and second ELD; Wherein this substrate includes a visible area and around the non-visible area of this visible area;
Pressurize and heat the first ELD, this first ELD is fitted on the first surface of this substrate, and being covered by this visible area and part non-visible area;
Exposure, this first ELD that develops are to form one first induction electrode layer;
In the first surface of this substrate and to being formed with plurality of first conductive lines in non-visible area, wherein one end of each first wire coincides and is covered by the part of this non-visible area in this first induction electrode layer;
Pressurize and heat the second ELD, this second ELD being fitted in this and coincides on this one first induction electrode layer, to be covered by this visible area and part non-visible area;
Exposure, this second ELD that develops are to form one second induction electrode layer; And
In the first surface of this substrate and to being formed with plurality of second conductive lines in non-visible area, wherein one end of each second wire coincides and is covered by the part of this non-visible area in this second induction electrode layer.
6. contact panel method for making as claimed in claim 5, it is characterized in that, this the first ELD system sequentially coincides and includes one first photosensitive resin layer, one first transparency conducting layer and a first film supporter, this the second ELD system sequentially coincides and includes one second photosensitive resin layer, one second transparency conducting layer and one second film support, wherein
Step in this exposure, this first ELD that develops further includes:
Prepare the light shield of a pattern with the first induction electrode layer, and be directed at this first ELD;
Single exposure is so that this first transparency conducting layer exposed portion solidifies;
Remove this first film supporter; And
Retain the cured portion of the first transparency conducting layer, and remove the uncured portion of this first transparency conducting layer to form this first induction electrode layer;
Step in this exposure, this second ELD that develops further includes:
Prepare the light shield of a pattern with the second induction electrode layer, and be directed at this second ELD;
Single exposure is so that this second transparency conducting layer exposed portion solidifies;
Remove this second film support; And
Retain the cured portion of the second transparency conducting layer, and remove the uncured portion of this second transparency conducting layer to form this second induction electrode layer.
7. contact panel method for making as claimed in claim 5, it is characterized in that, this the first ELD system sequentially coincides and includes one first photosensitive resin layer, one first transparency conducting layer and a first film supporter, this the second ELD system sequentially coincides and includes one second photosensitive resin layer, one second transparency conducting layer and one second film support, wherein
Above-mentioned exposure, first ELD that develops step further include:
Prepare the light shield of a pattern with the first induction electrode layer, and be directed at this first ELD;
Single exposure is so that this first transparency conducting layer exposed portion solidifies;
Remove this first film supporter;
Remove light shield re-expose so that this first photosensitive resin layer unexposed portion solidifies; And
Retain the cured portion of the first transparency conducting layer, and remove the uncured portion of this first transparency conducting layer to form this first induction electrode layer;
Step in above-mentioned exposure, second ELD that develops further includes:
Prepare the light shield of a pattern with the second induction electrode layer, and be directed at this second ELD;
Single exposure is so that this second transparent electrode layer exposed portion solidifies;
Remove this second film support;
Remove light shield re-expose so that this second photosensitive resin layer unexposed portion solidifies; And
Retain the cured portion of the second transparency conducting layer, and remove the uncured portion of this second transparency conducting layer to form this second induction electrode layer.
8. contact panel method for making as claimed in claims 6 or 7, it is characterised in that in the first surface of this substrate and to the step that should be formed with plurality of second conductive lines in non-visible area after, form the protective layer of a transparent insulation on the second induction electrode layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410561990.6A CN105630215B (en) | 2014-08-16 | 2014-10-01 | Touch panel |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410408594X | 2014-08-16 | ||
| CN201410408594 | 2014-08-16 | ||
| CN201410561990.6A CN105630215B (en) | 2014-08-16 | 2014-10-01 | Touch panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105630215A true CN105630215A (en) | 2016-06-01 |
| CN105630215B CN105630215B (en) | 2019-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410561990.6A Active CN105630215B (en) | 2014-08-16 | 2014-10-01 | Touch panel |
| CN201420609451.0U Withdrawn - After Issue CN204256699U (en) | 2014-08-16 | 2014-10-01 | Contact panel |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420609451.0U Withdrawn - After Issue CN204256699U (en) | 2014-08-16 | 2014-10-01 | Contact panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN105630215B (en) |
| TW (2) | TWM500306U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110221731A (en) * | 2018-03-02 | 2019-09-10 | 宸鸿光电科技股份有限公司 | The direct patterning method and its touch panel of touch panel |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105630215B (en) * | 2014-08-16 | 2019-02-12 | 长鸿光电(厦门)有限公司 | Touch panel |
| CN107992238A (en) * | 2017-11-28 | 2018-05-04 | 业成科技（成都）有限公司 | Contact panel module |
| CN110221718B (en) * | 2018-03-02 | 2023-07-04 | 宸鸿光电科技股份有限公司 | Direct patterning method of touch panel and touch panel thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102750025A (en) * | 2011-04-22 | 2012-10-24 | 扬升照明股份有限公司 | Manufacturing method of touch device |
| CN103576977A (en) * | 2012-08-09 | 2014-02-12 | 纬创资通股份有限公司 | Touch panel and manufacturing method thereof |
| US20140104227A1 (en) * | 2012-10-17 | 2014-04-17 | Samsung Electro-Mechanics Co., Ltd. | Touch panel and method for manufacturing the same |
| CN104020882A (en) * | 2014-05-30 | 2014-09-03 | 南昌欧菲光科技有限公司 | Touch screen |
| CN204256699U (en) * | 2014-08-16 | 2015-04-08 | 长鸿光电(厦门)有限公司 | Contact panel |
-
2014
- 2014-10-01 CN CN201410561990.6A patent/CN105630215B/en active Active
- 2014-10-01 CN CN201420609451.0U patent/CN204256699U/en not_active Withdrawn - After Issue
- 2014-12-24 TW TW103222859U patent/TWM500306U/en not_active IP Right Cessation
- 2014-12-24 TW TW103145312A patent/TWI534679B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102750025A (en) * | 2011-04-22 | 2012-10-24 | 扬升照明股份有限公司 | Manufacturing method of touch device |
| CN103576977A (en) * | 2012-08-09 | 2014-02-12 | 纬创资通股份有限公司 | Touch panel and manufacturing method thereof |
| US20140104227A1 (en) * | 2012-10-17 | 2014-04-17 | Samsung Electro-Mechanics Co., Ltd. | Touch panel and method for manufacturing the same |
| CN104020882A (en) * | 2014-05-30 | 2014-09-03 | 南昌欧菲光科技有限公司 | Touch screen |
| CN204256699U (en) * | 2014-08-16 | 2015-04-08 | 长鸿光电(厦门)有限公司 | Contact panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110221731A (en) * | 2018-03-02 | 2019-09-10 | 宸鸿光电科技股份有限公司 | The direct patterning method and its touch panel of touch panel |
| CN110221731B (en) * | 2018-03-02 | 2023-03-28 | 宸鸿光电科技股份有限公司 | Direct patterning method of touch panel and touch panel thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN204256699U (en) | 2015-04-08 |
| TWI534679B (en) | 2016-05-21 |
| CN105630215B (en) | 2019-02-12 |
| TW201608428A (en) | 2016-03-01 |
| TWM500306U (en) | 2015-05-01 |
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