JP2012199098A - Sealing glass, organic el display device provided with the same, and method for manufacturing organic el display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sealing glass which is capable of preventing reflection of light at a gas/solid interface on the organic EL element side of the sealing glass.SOLUTION: A sealing glass 30 comprises a glass substrate 31 and an antireflection film 32 which is formed on one surface 31a of the glass substrate 31 and is made of a heat-resistant material 36. The antireflection film 32 has a moth eye structure part 34 having an uneven shape. The heat-resistant material 36 of the antireflection film 32 contains a siloxane resin.

Description

  The present invention relates to a sealing glass, and more particularly to a sealing glass for sealing an organic EL element from an external environment. The present invention also relates to an organic EL display device including a sealing glass and a method for manufacturing the organic EL display device.

  2. Description of the Related Art Conventionally, in the field of flat displays and the like, organic EL display devices that emit image light using an organic EL layer configured by sandwiching an organic light emitting layer between an anode and a cathode have been proposed. There is a lot of research. However, the organic light emitting layer is easily affected by moisture and oxygen present in the surroundings. Therefore, when moisture and oxygen enter the organic EL display device, there is a problem that the light emitting performance of the organic EL display device deteriorates.

  In order to solve such a problem, various methods for sealing the organic EL display device have been proposed. For example, Patent Document 1 proposes a method in which a sealing glass is disposed so as to face an organic EL element having an organic EL layer, and the organic EL element and the sealing glass are sealed with a glass frit. .

  When sealing with glass frit is used, generally glass frit and a suitable solution are first mixed to make a glass paste, and then the glass paste is applied onto the sealing glass along the outer edge of the sealing glass . Thereafter, the sealing glass coated with the glass paste is baked for a predetermined time at a temperature higher than the softening point of the glass frit, for example, a temperature of 400 ° C. or higher. As a result, a sealing portion made of glass frit is formed on the sealing glass. Next, the sealing part is fused to the organic EL element by combining the sealing glass and the organic EL element and then heating and melting the sealing part. In this way, the space between the organic EL element and the sealing glass is sealed. At this time, an inert gas is sealed between the organic EL element and the sealing glass.

Special table 2008-517446 gazette

  In the top emission type organic EL display device, the light emitted from the organic EL layer of the organic EL element reaches the observer side through the sealing glass. Incidentally, as described above, an inert gas is generally sealed between the organic EL element and the sealing glass. For this reason, when light enters the surface of the sealing glass on the organic EL element side, the light passes through the gas / solid (glass) interface. In this case, when the refractive index of the sealing glass is taken into consideration, it is considered that about 4% of reflection occurs at the gas / solid interface, thereby reducing the light utilization efficiency.

  As a means for preventing light reflection at the gas / solid interface, it is known to provide a low refractive index layer made of a low refractive index material having a refractive index lower than that of glass on glass. However, the conventionally known low refractive index layer does not have sufficient heat resistance, and therefore, the conventionally known low refractive index layer is considered unable to withstand the baking process of the glass paste. Get it.

  An object of this invention is to provide the manufacturing method of the sealing glass which can solve such a subject effectively, the organic electroluminescence display provided with the sealing glass, and an organic electroluminescence display.

  The present invention relates to a sealing glass used in an organic EL display device, comprising: a glass substrate; and an antireflection film formed on one surface of the glass substrate and made of a heat resistant material, the antireflection film Is a sealing glass characterized in that it has a moth-eye structure having an uneven shape, and the heat-resistant material contains a siloxane resin.

  In the sealing glass according to the present invention, the heat-resistant material may further contain a photosensitive compound dispersed in a siloxane resin, and the photosensitive compound may contain a photoacid generator or a photobase generator.

  The sealing glass according to the present invention may further include a sensor unit that is provided on the other side of the glass substrate and senses the approach of the conductor. In this case, the sensor unit may be formed on the other surface of the glass substrate and have a transparent conductive pattern having conductivity and transparency.

  The sealing glass by this invention WHEREIN: The said sensor part may further have a protective layer which covers the said transparent conductive pattern, and the said protective layer may be comprised from the material containing a siloxane resin.

  The sealing glass by this invention may further be equipped with the sealing part formed on the surface of the one side of the said glass substrate along the outer edge of the said glass substrate. In this case, the sealing portion may be made of glass frit.

The present invention comprises an organic EL element and a sealing glass provided to face the organic EL element, the organic EL element being provided on the organic EL substrate and the organic EL substrate, An organic EL layer including an anode, a cathode, and an organic light emitting layer provided between the anode and the cathode, and the sealing glass includes a glass substrate and the organic EL element side of the glass substrate. An antireflection film formed on a surface and made of a heat-resistant material, and a sealing portion formed on the surface of the glass on the organic EL element side along an outer edge of the glass substrate, and the antireflection The film has a moth-eye structure having an uneven shape, and the heat-resistant material includes a siloxane resin,
The sealing portion is an organic EL display device including glass frit.

  In the organic EL display device according to the present invention, the heat-resistant material further includes a photosensitive compound dispersed in a siloxane resin, and the photosensitive compound may include a photoacid generator or a photobase generator. .

  In the organic EL display device according to the present invention, the sealing glass may further include a sensor unit that is provided on a side opposite to the organic EL element side of the glass substrate and senses the approach of the conductor. In this case, the sensor part may be formed on the surface of the glass substrate opposite to the organic EL element side, and may have a transparent conductive pattern having conductivity and transparency.

  In the organic EL display device according to the present invention, the sensor unit may further include a protective layer covering the transparent conductive pattern, and the protective layer may be made of a material containing a siloxane resin.

  The present invention relates to a method of manufacturing an organic EL display device including an organic EL element, a step of preparing a glass substrate, and a step of forming an antireflection film made of a heat resistant material on one surface of the glass substrate. A step of providing a glass frit on one surface of the glass substrate along an outer edge of the glass substrate, and firing the glass frit at a temperature of at least 400 ° C. to form a sealing portion made of the glass frit A step of arranging the organic EL element on one side of the glass substrate, a step of melting the sealing portion, and thereby sealing between the glass substrate and the organic EL element. And the antireflection film has a moth-eye structure having an uneven shape, and the heat-resistant material includes a siloxane resin.

  In the method of manufacturing an organic EL display device according to the present invention, a sensor unit that senses the approach of a conductor on the other side of the glass substrate before the sealing unit is formed on one surface of the glass substrate. May be provided. In this case, the sensor unit includes a transparent conductive pattern that is formed on the other surface of the glass substrate and has conductivity and transparency, and a protective layer that covers the transparent conductive pattern, and the protective layer. May be made of a material containing a siloxane resin.

  According to the present invention, the antireflection film formed on the surface of the glass substrate of the sealing glass on the organic EL element side and made of a heat-resistant material has a moth-eye structure portion having an uneven shape. The heat resistant material includes a siloxane resin. For this reason, in the organic EL display device sealed by the sealing portion made of glass frit, reflection of light at the gas / solid interface on the organic EL element side of the sealing glass can be suppressed.

FIG. 1 is a diagram showing an organic EL display device according to a first embodiment of the present invention. FIG. 2 is a view showing the sealing glass in the first embodiment of the present invention. FIG. 3A is a plan view showing an example of a touch panel sensor. 3B is a cross-sectional view of the touch panel sensor of FIG. 3A as viewed from the IIIB-IIIB direction. 3C is a cross-sectional view of the touch panel sensor of FIG. 3A as viewed from the IIIC-IIIC direction. FIG. 4 is a view showing a stamper plate used in the manufacturing process of the sealing glass. FIGS. 5A, 5B, and 5C are views showing a manufacturing process of the sealing glass in the first embodiment of the present invention. FIG. 6 is a view showing a modified example of the manufacturing process of the sealing glass in the first embodiment of the present invention. 7A, 7B, and 7C are views showing a process of sealing an organic EL element using a sealing glass. 8A, 8B, and 8C are views showing a manufacturing process of the organic EL display device according to the first comparative embodiment. FIGS. 9A, 9B, 9C, and 9D are views showing a manufacturing process of the sealing glass in the second embodiment of the present invention. FIG. 10 is a diagram showing a modification of the manufacturing process of the sealing glass in the second embodiment of the present invention. FIG. 11 is a diagram showing an organic EL display device according to the third embodiment of the present invention. FIG. 12 is a view showing a sealing glass in a third embodiment of the present invention. FIGS. 13A, 13B, 13C, and 13D are views showing a manufacturing process of the sealing glass in the third embodiment of the present invention. FIGS. 14A, 14B, 14C, and 14D are views showing a modification of the manufacturing process of the sealing glass in the third embodiment of the present invention. FIGS. 15A, 15B, 15C, and 15D are views showing manufacturing steps of the organic EL display device according to the second comparative embodiment.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 7A, 7B and 7C. First, the entire organic EL display device 10 according to the present embodiment will be described with reference to FIGS. 1 and 2.

Organic EL Display Device As shown in FIG. 1, the organic EL display device 10 includes an organic EL element 20 and a sealing glass 30 provided to face the organic EL element 20. In addition, a sealing portion 15 for sealing between the organic EL element 20 and the sealing glass 30 is attached to the sealing glass 30.

[Organic EL device]
First, the organic EL element 20 will be described. As shown in FIG. 1, the organic EL element 20 includes an organic EL substrate 27 and an organic EL layer 24 that is provided on the organic EL substrate 27 and emits light. Although not shown, a driving element such as a transistor for driving the organic EL layer 24 is formed on the organic EL substrate 27. That is, the organic EL substrate 27 is a substrate for driving the organic EL layer 24, that is, a so-called TFT substrate.

  In the present embodiment, light emitted from the organic EL layer 24 of the organic EL element 20 is extracted to the side opposite to the side where the organic EL substrate 27 is located. That is, light from the organic EL layer 24 is extracted from above the organic EL substrate 27 constituting the TFT substrate. Thus, the organic EL display device 10 in the present embodiment is a so-called top emission type organic EL display device.

  The organic EL substrate 27 is not particularly limited as long as it supports the organic EL layer 24 and can block outside air. However, since the stability, durability, and the like are good, glass or A transparent polymer is preferred.

  As shown in FIG. 1, the organic EL layer 24 includes an anode 21, a cathode 23, and an organic light emitting layer 22 provided between the anode 21 and the cathode 23. The anode 21 is not particularly limited as long as it is a material that can inject holes efficiently. For example, aluminum, chromium, molybdenum, tungsten, copper, silver, gold, or an alloy thereof may be used. preferable. On the other hand, the cathode 23 is made of a material that is easy to inject electrons and has good light transmission properties, such as lithium oxide and cesium carbonate. The organic light emitting layer 22 is not particularly limited as long as it contains a fluorescent organic substance that emits light when a predetermined voltage is applied. For example, a quinolinol complex, an oxazole complex, various laser dyes, Paraphenylene vinylene etc. are mentioned.

  Note that a hole transport layer (not shown) may be provided between the anode 21 and the organic light emitting layer 22 in order to efficiently transport holes injected from the anode 21 to the organic light emitting layer 22. . An example of the constituent material of the hole transport layer is tetraphenylbenzidine. Furthermore, a hole injection layer (not shown) may be provided between the anode 21 and the hole transport layer. Further, an electron injection layer (not shown) or an electron transport layer (not shown) may be provided between the organic light emitting layer 22 and the cathode 23. In addition, a barrier film (not shown) that shields moisture may be provided on the organic EL layer 24.

(Sealing glass)
Next, the sealing glass 30 will be described. As shown in FIG. 1, the sealing glass 30 includes a glass substrate 31 and an antireflection film 32 formed on a surface 31 a on one side (the organic EL element 20 side) of the glass substrate 31. Various known glasses can be used as the glass substrate 31. The thickness of the glass substrate 31 is not particularly limited, but is about 0.5 mm, for example. FIG. 2 is an enlarged view showing the sealing glass 30. In the present embodiment, “one side” is a side on which light from the organic EL element 20 is incident, that is, a so-called light source side, and “other side” visually recognizes the light from the organic EL element 20. It is the side where there is an observer, the so-called observer side.

  As will be described later, the sealing glass 30 is later applied with a glass paste and baked at a temperature of 400 ° C. or higher in order to form the sealing portion 15 described above. For this reason, the antireflection film 32 of the sealing glass 30 is required to have heat resistance enough to withstand the firing of the glass paste. Therefore, the antireflection film 32 of the sealing glass 30 according to the present embodiment is made of a heat resistant material. This heat resistant material will be described later.

  By the way, as described above, the antireflection film for preventing the reflection of light at the gas / solid interface has been conventionally made of a low refractive index material having a lower refractive index than that of glass. In this case, in order to sufficiently suppress the reflection of light at the gas / solid interface, a low refractive index material having a refractive index sufficiently lower than that of glass is required. However, it is not easy to prepare a low refractive index material having a sufficiently lower refractive index than glass and heat resistance enough to withstand the firing of the glass paste.

  In order to effectively solve such a problem, in the present embodiment, by forming a fine concavo-convex shape in which the period of the concavo-convex is set to be equal to or less than the wavelength of visible light, Technology that suppresses reflection is adopted. Such a technique uses the principle of a so-called moth-eye structure, and continuously changes the refractive index of light incident on the antireflection film 32 to eliminate the discontinuous interface of the refractive index. This suppresses the reflection of light.

  In the present embodiment, by adopting such a moth-eye structure, the refractive index of the heat resistant material constituting the antireflection film 32 is not sufficiently lower than the refractive index of the glass substrate 31. In addition, it is possible to sufficiently suppress the reflection of light at the interface of the sealing glass 30 on the organic EL element 20 side. Therefore, according to the present embodiment, the material constituting the antireflection film 32 can be selected mainly from the viewpoint of heat resistance, thereby making it easy to obtain the material of the antireflection film 32. .

(Moss eye structure)
Next, the moth-eye structure in the antireflection film 32 will be described in detail. As shown in FIG. 2, the antireflection film 32 includes a base portion 33 formed on one surface 31a of the glass substrate 31, a moth-eye structure portion 34 formed on the base portion 33 and having an uneven shape, have. As shown in FIG. 2, the moth-eye structure 34 includes a plurality of convex portions 35 that are periodically arranged and have a cone shape such as a cone or a quadrangular pyramid. In addition, in FIG. 2, although the example which the top part of each convex part 35 curved is shown, it is not restricted to this, The top part of each convex part 35 may be formed flat, or an acute angle It may be formed.

  As shown in FIG. 2, each convex part 35 is arrange | positioned with the period represented by the code | symbol p. Moreover, the space | interval between each convex part 35 is d, and the height of each convex part 35 is h. Here, the reflection suppressing function realized by the antireflection film 32 mainly depends on the period p, the interval d, and the height h. Since a method for designing the antireflection function of the antireflection film 32 based on the period p, the interval d, and the height h is already well known to those skilled in the art, a detailed description thereof will be omitted.

  The period p of each convex part 35 will not be specifically limited if it is below the wavelength of a visible light area | region, According to the reflection suppression function desired, it determines suitably. For example, the period p is in the range of 10 nm to 400 nm, more specifically about 150 nm.

  The height h of each convex portion 35 is not particularly limited, and is appropriately determined according to a desired reflection suppressing function. For example, the height h is in the range of 100 nm to 600 nm. Further, the total height of the antireflection film 32, that is, the total height of the base portion 33 and the height of the convex portion 35 of the moth-eye structure portion 34 is, for example, about 1 μm.

  The distance d between the convex portions 35 is not particularly limited, and is appropriately determined according to a desired reflection suppressing function.

  2 shows an example in which the above-described period p, interval d, and height h are uniform over the entire area of the moth-eye structure 34. However, the present invention is not limited to this, and the desired reflection suppressing function can be achieved. Accordingly, the period p, the interval d, and the height h may be nonuniform. Thus, by making the period p, the interval d, and the height h nonuniform, the reflection suppressing function of the antireflection film 32 can be realized over a wider wavelength range.

(Heat resistant material)
Next, the heat resistant material constituting the antireflection film 32 will be described. The heat-resistant material is a compound having a skeleton of silicon and oxygen, and includes a compound having a Si—O—Si bond (siloxane bond), a so-called siloxane resin. As such a siloxane resin, known ones can be used. For example, a resin obtained by hydrolysis and condensation using a compound represented by the formula R ¹ _n SiX _4-n as an essential component can be used. Here, in the formula, R ¹ is an H atom or F atom, or a group containing a B atom, an N atom, an Al atom, a P atom, a Si atom, a Ge atom, or a Ti atom, or an organic compound having 1 to 20 carbon atoms Represents a group, and X represents a hydrolyzable group. Moreover, n has shown the integer of 0-2. Here, when n is 2, each R ¹ may be the same or different, and when n is 0 to 2, each X may be the same or different. Details of the compound represented by the formula R ¹ _n SiX _4-n are disclosed in Japanese Patent No. 3821165, and in this embodiment, the compound disclosed in Japanese Patent No. 3821165 is appropriately used. Can do. The optical refractive index of the heat-resistant material thus configured is not particularly limited, but is, for example, smaller than the optical refractive index of glass, and more specifically within the range of 1.40 to 1.46. It has become.

  According to the present embodiment, as described above, the antireflection film 32 is made of a siloxane resin. For this reason, the antireflection film 32 has heat resistance enough to withstand a baking process of a glass paste provided on the sealing glass 30 later. For example, as will be described later, even when the glass paste is heated to a temperature of 430 ° C. where the glass paste is fired, it has heat resistance to such an extent that its characteristics do not deteriorate. Accordingly, it is possible to realize strong sealing with glass frit and to suppress light reflection at the interface of the sealing glass 30 on the organic EL element 20 side.

(Sealing part)
Next, the sealing part 15 provided between the organic EL element 20 and the sealing glass 30 will be described. The sealing portion 15 is made of a glass material that melts at a predetermined temperature or higher. For example, it is formed by firing a glass frit made of powdered glass.

  Next, other components included in the organic EL display device 10 will be described. As shown in FIG. 1, the organic EL display device 10 includes a touch panel sensor 40 provided on the viewer side of the sealing glass 30, a circularly polarizing plate 70 provided on the viewer side of the touch panel sensor 40, and circularly polarized light. And a tempered glass 75 provided on the viewer side of the plate 70. Hereinafter, these components will be described.

(Touch panel sensor)
The touch panel sensor 40 senses the position of a detected object made of a conductor that approaches or contacts the organic EL display device 10 from the observer side. The type of the touch panel sensor 40 is not particularly limited, and various types of touch panel sensors 40 can be used as appropriate. For example, a resistive touch panel sensor that detects a touch location based on a pressure from a detected object or a capacitive touch panel sensor that detects a touch location based on static electricity from a detected body such as a human body is used. Can be. In addition, various types of touch panel sensors such as an optical sensor method, a matrix switch method, a surface acoustic wave method, and an electromagnetic induction method can be used.

(Capacitive touch panel sensor)
Next, an example of the configuration of the touch panel sensor 40 in the case where the touch panel sensor 40 is a capacitive type will be described with reference to FIGS. 3A to 3C. 3A is a plan view showing a capacitive touch panel sensor 40, FIG. 3B is a cross-sectional view of the touch panel sensor 40 of FIG. 3A viewed from the IIIB-IIIB direction, and FIG. 3C is a touch panel of FIG. 3A. It is sectional drawing which looked at the sensor 40 from the IIIC-IIIC direction.

  As shown in FIGS. 3A to 3C, the capacitive touch panel sensor 40 includes a touch panel sensor substrate 46 and a plurality of x provided in a predetermined pattern on the viewer side surface of the touch panel sensor substrate 46. A transparent conductive pattern 41 and a y transparent conductive pattern 42 are provided. As shown in FIG. 3A, the x transparent conductive pattern 41 extends in the x direction, and the y transparent conductive pattern 42 extends in the y direction orthogonal to the x direction.

  Each x transparent conductive pattern 41 includes a plurality of x electrode units 41a having a substantially square shape, and an x connection portion 41b that connects adjacent x electrode units 41a in the x direction. By such an x transparent conductive pattern 41, the position in the y direction of the touch location of the detection object is detected. Each of the y transparent conductive patterns 42 includes a plurality of y electrode units 42a having a substantially square shape, and a y connection portion 42b that connects adjacent y electrode units 42a in the y direction. By such a y transparent conductive pattern 42, the position in the x direction of the touch location of the detection object is detected.

  Further, on the touch panel sensor substrate 46, the extraction wiring 43 and the extraction wiring 44, which are provided in a predetermined pattern and are electrically connected to the x transparent conductive pattern 41 and the y transparent conductive pattern 42, respectively, and the extraction wiring 43 and the extraction wiring. A terminal unit 45 connected to the wiring 44 and for taking out signals from the x transparent conductive pattern 41 and the y transparent conductive pattern 42 to the outside is provided.

  In the touch panel sensor 40, a sensor unit 50 that realizes a touch panel function of detecting a touch position and taking out a detection signal to the outside by a combination of the conductive patterns 41 and 42, the extraction wirings 43 and 44, and the terminal unit 45. Is configured.

  Next, the material of each component of the touch panel sensor 40 will be described. Each x transparent conductive pattern 41 and y transparent conductive pattern 42 are arranged in a display area for displaying an image. Therefore, each x transparent conductive pattern 41 and y transparent conductive pattern 42 is made of a conductive and transparent material, such as ITO. On the other hand, the lead-out wiring 43, the lead-out wiring 44, and the terminal portion 45 are arranged in a non-display area located at the periphery of the display area. For this reason, the material which comprises the extraction wiring 43, the extraction wiring 44, and the terminal part 45 does not need to have transparency. Therefore, the lead-out wiring 43, the lead-out wiring 44, and the terminal portion 45 are generally made of a metal material having a higher electrical conductivity than the materials of the x transparent conductive pattern 41 and the y transparent conductive pattern 42.

  The material of the touch panel sensor substrate 46 is not particularly limited as long as it supports the conductive patterns 41 and 42, the extraction wirings 43 and 44, and the terminal portion 45 and has transparency. For example, transparent glass or polymer is used as the material of the touch panel sensor substrate 46.

  As shown in FIGS. 3B and 3C, the sensor unit 50 including the conductive patterns 41 and 42, the extraction wirings 43 and 44, and the terminal unit 45 is formed by laminating ITO or a metal material on the touch panel sensor substrate 46. It is formed. As shown in FIGS. 3B and 3C, in order to prevent the x connection portion 41b and the y connection portion 42b from being electrically connected, an insulating layer 47 is provided between the x connection portion 41b and the y connection portion 42b. It may be interposed. 3B and 3C, a protective layer 49 may be provided to protect the conductive patterns 41 and 42, the extraction wirings 43 and 44, and the terminal portion 45, as indicated by a one-dot chain line. As the protective layer 49, a resin material having transparency and insulation is appropriately used.

(Circularly polarizing plate 70)
A circularly polarizing plate 70 shown in FIG. 1 includes a phase plate 72 and a polarizing plate 71 provided on the observer side of the phase plate 72. Among these, the phase plate 72 is controlled so that the phase difference becomes 1/4 of the wavelength of light. The polarizing plate 71 is a linear polarizing plate that transmits only light polarized in a specific direction.

  The effect of the organic EL display device 10 including such a circularly polarizing plate 70 will be described. The light incident on the organic EL display device 10 from the outside is first linearly polarized by the polarizing plate 71 and then circularly polarized by the phase plate 72. Thereafter, when light is reflected by the anode 21 of the organic EL layer 24, the circular polarization state of the light is reversed. When the reflected light passes through the phase plate 72 again, this light becomes linearly polarized light inclined by 90 degrees compared to when it first passes through the polarizing plate 71. Therefore, this linearly polarized light is absorbed when it reaches the polarizing plate 71 again.

  By providing the circularly polarizing plate 70 as described above, it is possible to prevent light incident on the organic EL display device 10 from the outside from being reflected by the organic EL layer 24 and emitted to the viewer side. That is, the circularly polarizing plate 70 can prevent external light from being reflected, thereby improving the contrast of the organic EL display device 10.

(Tempered glass)
The tempered glass 75 is for protecting the organic EL display device 10 from an impact applied from the observer side. Various types of tempered glass 75 can be used. For example, chemically tempered glass in which a chemically strengthened layer is provided on the outermost surface on the observer side may be used. Here, the chemical strengthening layer is a layer formed by replacing sodium in the glass with potassium. By forming such a chemically strengthened layer on the surface, it is possible to prevent the tempered glass 75 from being broken when any impact is applied to the tempered glass 75. Note that the thickness of such a chemically strengthened layer is not particularly limited, and the thickness of the chemically strengthened layer is appropriately set according to required characteristics.
Examples of tempered glass having a chemically strengthened layer formed on the surface thereof include, for example, Corning Gorilla Glass (Gorilla Glass) and Asahi Glass Company Dragontrail.

  By the way, when the touch panel sensor 40 is in direct contact with the glass substrate 31, it is conceivable that air gaps are generated between the glass substrate 31 and the touch panel sensor 40 in some places. If there is an air gap, it is conceivable that light is reflected on the other surface 31 b of the glass substrate 31. In order to prevent such reflection, an adhesive layer (not shown) may be interposed between the glass substrate 31 of the sealing glass 30 and the touch panel sensor 40. Accordingly, it is possible to prevent an air gap from being generated between the glass substrate 31 and the touch panel sensor 40, thereby preventing light from being reflected on the other surface 31 b of the glass substrate 31. .

  Similarly, an adhesive layer may be provided between the touch panel sensor 40 and the circularly polarizing plate 70 and between the circularly polarizing plate 70 and the tempered glass 75.

Manufacturing method of sealing glass Next, the manufacturing method of the sealing glass 30 is demonstrated. Here, a method for producing the moth-eye structure 34 of the antireflection film 32 of the sealing glass 30 by shaping will be described. First, the plate used for shaping will be described.

(Stamper version)
FIG. 4 is a view showing a stamper plate 60 used for forming the moth-eye structure 34 of the antireflection film 32 by shaping. As shown in FIG. 4, the stamper plate 60 is manufactured by forming a concave portion 61 corresponding to the convex portion 35 of the moth-eye structure portion 34 of the antireflection film 32 on an appropriate base material.

  There is no particular limitation on the method of forming the concave portion 61 on the base material, and various methods can be appropriately employed. For example, the concave portion 61 may be formed by anodizing a base material made of aluminum, or a layer made of a photosensitive material is provided on the base material, and the concave portion 61 is formed by exposing this layer. Also good. As the exposure method, for example, a method of performing exposure with a fine pattern using interference of laser light is appropriately used.

(Method for forming antireflection film)
Next, a method for forming the antireflection film 32 by shaping using the stamper plate 60 will be described with reference to FIGS.

  First, as shown in FIG. 5A, a glass substrate 31 is prepared. Next, the heat resistant material 36 is applied or dropped onto the surface 31 a on one side of the glass substrate 31. The method for applying or dropping the heat-resistant material 36 is not particularly limited, and a known method can be appropriately used. The heat resistant material 36 contains an appropriate solvent for improving the coating property.

  Thereafter, the glass substrate 31 provided with the heat resistant material 36 is heated, and thereby the solvent in the heat resistant material 36 is evaporated. The heating conditions at this time are appropriately set according to the characteristics of the heat-resistant material 36 and the solvent contained. For example, a heating condition of heating at 80 ° C. for 10 minutes is set.

  Next, as shown in FIG. 5B, the heat resistant material 36 on the glass substrate 31 is pressed by the stamper plate 60. As a result, a shape corresponding to the recess 61 of the stamper plate 60 is imparted to the heat resistant material 36.

  Next, the stamper plate 60 is peeled from the heat resistant material 36, and then the glass substrate 31 and the heat resistant material 36 are heated and fired at a predetermined temperature. For example, heating is performed at 400 ° C. As a result, as shown in FIG. 5C, the antireflection film 32 including the base portion 33 and the moth-eye structure portion 34 is formed on the glass substrate 31. Thus, the sealing glass 30 composed of the glass substrate 31 and the antireflection film 32 is obtained.

(Modification of the method of forming the antireflection film)
5A, 5 </ b> B, and 5 </ b> C show an example in which the heat-resistant material 36 is shaped by the flat stamper plate 60, but the present invention is not limited to this. For example, as shown in FIG. 6, the heat-resistant material 36 may be shaped by using a roll body 65 having a stamper plate 66 wound around the surface. In this case, the stamper plate 66 is formed with a recess similar to the recess 61 of the stamper plate 60. Therefore, as shown in FIG. 6, shown with the glass substrate 31 that heat-resistant material 36 is provided is conveyed in the direction indicated by the arrow D _1, the roll body 65 of the stamper plate 66 is provided with an arrow D ₂ The heat resistant material 36 can be shaped by rotating it in the direction to be pressed and pressing the heat resistant material 36 with the stamper plate 66.

Method for Manufacturing Organic EL Display Device Next, a method for forming the organic EL display device 10 by combining the sealing glass 30 and the organic EL element 20 will be described with reference to FIGS. 7 (a), 7 (b), and 7 (c). .

  First, a glass paste is applied along the outer edge of the glass substrate 31 on the surface 31 a on one side of the glass substrate 31. This glass paste is constituted by mixing glass frit and an appropriate solution. Thereafter, the glass paste applied on the glass substrate 31 is heated under predetermined conditions. For example, after heating up to 330 ° C. at a heating rate of 7 to 10 ° C./min, heating is performed at 330 ° C. for 30 minutes. Then, after heating up to 430 degreeC, the heating for 10 minutes is implemented. As a result, the glass paste is baked, and as a result, the sealing portion 15 is formed as shown in FIG. As described above, the antireflection film 32 is made of a heat resistant material 36 containing a siloxane resin. For this reason, the antireflection film 32 is prevented from being damaged or deteriorated during the baking process of the glass paste.

Thereafter, as shown in FIG. 7B, the sealing glass 30 and the organic EL element 20 are combined through the sealing portion 15. Thereafter, as shown in FIG. 7 (c), irradiated with laser light L ₁ to the sealing portion 15 from the organic EL element 20 side, thereby locally heating the sealing portion 15. As a result, the sealing portion 15 is melted, whereby the sealing portion 15 is fused to the organic EL element 20. In this way, the organic EL display device 10 sealed by the sealing portion 15 is obtained. For this reason, it is possible to firmly prevent moisture and oxygen from entering the organic EL display device 10.

  Further, according to the present embodiment, the antireflection film 32 formed on the one surface 31 a of the glass substrate 31 of the sealing glass 30 and made of the heat-resistant material 36 has the moth-eye structure portion 34 having an uneven shape. is doing. For this reason, reflection of light at the gas / solid interface on one side of the sealing glass 30 can be suppressed. The heat resistant material 36 constituting the antireflection film 32 contains a siloxane resin. For this reason, it is possible to prevent the antireflection film 32 from being damaged or deteriorated during the baking process of the glass paste containing glass frit.

First Comparison Mode Next, the effects of the present embodiment will be described in comparison with the first comparison mode with reference to FIGS. 8 (a), (b), (c), and (d). The manufacturing method of the organic EL display device 110 according to the first comparative embodiment shown in FIGS. 8A, 8 </ b> B, and 8 </ b> C is performed on one side of the glass substrate 31 before the antireflection film is formed by shaping. The only difference is that the sealing portion 15 is formed on the surface 31a, and the other configuration is substantially the same as the manufacturing method of the organic EL display device 10 in the present embodiment described above. In the first comparative embodiment shown in FIGS. 8A, 8B, and 8C, the same parts as those of the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  8A, 8B, 8C, and 8D are views showing a method for manufacturing the organic EL display device 110 according to the first comparative embodiment.

  First, as shown in FIG. 8A, a glass substrate 31 is prepared. Next, a glass paste is applied along the outer edge of the glass substrate 31 on the surface 31 a on one side of the glass substrate 31. Thereafter, the glass paste applied on the glass substrate 31 is baked. As a result, the sealing portion 15 is formed as shown in FIG. The firing conditions are substantially the same as those in the present embodiment described above.

  Next, as shown in FIG. 8B, a material for forming an antireflection film is applied on the surface 31 a on one side of the glass substrate 31. In the first comparative embodiment, the glass paste is already fired as described above. For this reason, unlike the case of this Embodiment mentioned above, the material for comprising an antireflection film does not need to have the heat resistance which can endure baking of a glass paste. Therefore, in the first comparative embodiment, the non-heat resistant material 136 is applied on the glass substrate 31. Note that the non-heat resistant material 136 contains an appropriate solvent for improving the coating property. Thereafter, the glass substrate 31 provided with the non-heat resistant material 136 is heated, and thereby the solvent in the non-heat resistant material 136 is evaporated.

  Next, as shown in FIG. 8C, the non-heat resistant material 136 on the glass substrate 31 is pressed by the stamper plate 160. As a result, a shape corresponding to the recess 61 of the stamper plate 160 is given to the non-heat resistant material 136. Next, the stamper plate 160 is peeled from the non-heat resistant material 136, and then the glass substrate 31 and the non-heat resistant material 136 are heated at a predetermined temperature. As a result, the antireflection film 132 is formed on the glass substrate 31, and the sealing glass 130 according to the first comparative embodiment is obtained. In addition, the heating temperature of the glass substrate 31 and the non-heat resistant material 136 is lower than the heating temperature of the heat resistant material 36 in this Embodiment, for example, 400 degreeC.

  Thereafter, the sealing glass 130 and the organic EL element 20 are combined through the sealing portion 15 to form the organic EL display device 110. Since the procedure at this time is substantially the same as the procedure in the above-described embodiment, detailed description thereof is omitted.

  By the way, in the first comparative embodiment, as described above, the sealing portion 15 is already formed on the surface 31a on one side of the glass substrate 31 during the shaping using the stamper plate 160. For this reason, it is necessary to configure the stamper plate 160 so as not to contact the sealing portion 15 when the non-heat resistant material 136 is pressed. Further, when the non-heat resistant material 136 is pressed by the stamper plate 160, it is necessary to precisely operate the stamper plate 160 so that the stamper plate 160 does not contact the sealing portion 15.

  On the other hand, according to the present embodiment, as described above, the sealing portion 15 is not yet formed on the surface 31a on one side of the glass substrate 31 during shaping using the stamper plate 60. For this reason, as shown in FIG.5 (b), the stamper plate 60 extended over the whole surface 31a of the one side of the glass substrate 31 can be used. Alternatively, as shown in FIG. 6, a stamper plate 66 wound around a roll body 65 can be used. Further, when the heat resistant material 36 is pressed by the stampers 60, 66, there is no concern that the stamper plates 60, 66 come into contact with the sealing portion 15. For this reason, according to the present embodiment, shaping by the stamper plates 60 and 66 can be performed more easily.

  In this embodiment, after the stamper plate 60 is peeled from the heat resistant material 36, the glass substrate 31 and the heat resistant material 36 are heated at a predetermined temperature, whereby the heat resistant material 36 is fired. It was. However, the present invention is not limited to this, and the baking of the heat resistant material 36 may be realized simultaneously with the baking of the glass paste performed later. This can reduce the number of firing steps by one.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. 9 (a), 9 (b), 9 (c) and 9 (d). In the second embodiment shown in FIGS. 9A, 9B, 9C, and 9D, a heat-resistant material containing a photosensitive compound dispersed in a siloxane resin is used as a material constituting the antireflection film 32. Only the difference is used, and other configurations are substantially the same as those of the first embodiment shown in FIGS. 1 to 7A, 7B, and 7C. In the second embodiment shown in FIGS. 9A, 9B, 9C, and 9D, the same parts as those in the first embodiment shown in FIGS. 1 to 7A, 7B, and 7C are used. Are denoted by the same reference numerals, and detailed description thereof is omitted.

(Heat resistant material)
As described above, in the present embodiment, the heat resistant material 37 containing the photosensitive compound dispersed in the siloxane resin is used as the material constituting the antireflection film 32. Since the siloxane resin used is substantially the same as the siloxane resin in the first embodiment described above, detailed description thereof is omitted.

  The photosensitive compound contained in the heat-resistant material 37 includes a photoacid generator or a photobase generator that releases an acidic active substance or a basic active substance when irradiated with light. By including such a photosensitive compound in the heat resistant material 37, the heat resistant material 37 can be cured by irradiating the heat resistant material 37 with light. The photosensitive compound may further contain a polymerizable compound, a sensitizer and the like in addition to the photoacid generator or the photobase generator.

  The photoacid generator or photobase generator used is not particularly limited, and known ones can be used as appropriate. For example, a photoacid generator or a photobase generator described in Japanese Patent No. 3821165 can be used.

(Method for forming antireflection film)
Next, with reference to FIGS. 9A, 9B, 9C, and 9D, a method of forming the antireflection film 32 by shaping using the stamper plate 60 will be described.

  First, as shown in FIG. 9A, a glass substrate 31 is prepared. Next, a heat-resistant material 37 is applied or dropped onto the surface 31 a on one side of the glass substrate 31. The method for applying or dropping the heat-resistant material 37 is not particularly limited, and a known method can be appropriately used. The heat resistant material 37 contains an appropriate solvent for improving the coating property.

  Thereafter, the glass substrate 31 provided with the heat resistant material 37 is heated, and thereby the solvent in the heat resistant material 37 is evaporated. The heating conditions at this time are set as appropriate according to the characteristics of the heat-resistant material 37 and the solvent contained. For example, a heating condition of heating at 80 ° C. for 10 minutes is set.

  Next, as shown in FIG. 9B, the heat resistant material 37 on the glass substrate 31 is pressed by the stamper plate 60. As a result, a shape corresponding to the concave portion 61 of the stamper plate 60 is imparted to the heat resistant material 37.

Thereafter, as shown in FIG. 9C, the heat resistant material 37 pressed by the stamper plate 60 is irradiated with light. For example irradiation with ultraviolet _{L 2.} Thereby, the photosensitive compound containing a photoacid generator or a photobase generator releases an acidic active substance or a basic active substance. Thereafter, curing (hydrolysis polycondensation) of the heat-resistant material 37 proceeds using the released acidic active substance or basic active substance as a catalyst. For this reason, the heat-resistant material 37 is cured and contracted, thereby improving the releasability of the heat-resistant material 37.

  Next, the stamper plate 60 is peeled off from the heat resistant material 37, and then the glass substrate 31 and the heat resistant material 37 are heated at a predetermined temperature and fired. For example, heating is performed at 400 ° C. As a result, as shown in FIG. 9D, the antireflection film 32 including the base portion 33 and the moth-eye structure portion 34 is formed on the glass substrate 31. Thus, the sealing glass 30 composed of the glass substrate 31 and the antireflection film 32 is obtained.

As described above, according to the present embodiment, the heat-resistant material 37 containing the photosensitive compound dispersed in the siloxane resin is used as the material constituting the antireflection film 32. Here, the photosensitive compound contains a photoacid generator or a photobase generator that releases an acidic active substance or a basic active substance when irradiated with light. Therefore, by irradiating the ultraviolet rays L ₂ with respect to heat-resistant material 37 that is pressed by the stamper plate 60, it can be contracted together to cure the heat-resistant material 37. As a result, the stamper plate 60 is easily peeled off from the heat resistant material 37.

(Modification of the method of forming the antireflection film)
9A, 9B, 9C, and 9D show examples in which the heat-resistant material 37 is shaped by the flat stamper plate 60, the present invention is not limited to this. For example, as shown in FIG. 10, the heat-resistant material 37 may be shaped by using a roll body 65 having a stamper plate 66 wound around the surface.

  In the present embodiment, after the stamper plate 60 is peeled from the heat resistant material 37, the glass substrate 31 and the heat resistant material 37 are heated at a predetermined temperature, whereby the heat resistant material 37 is fired. It was. However, the present invention is not limited to this, and the baking of the heat-resistant material 37 may be realized simultaneously with the baking of the glass paste performed later. This can reduce the number of firing steps by one.

Third Embodiment Next, a third embodiment of the present invention will be described with reference to FIGS. 11 to 14 (a), (b), (c) and (d). The third embodiment shown in FIGS. 11 to 14 (a), (b), (c), and (d) is different only in that the touch panel sensor is formed integrally with the sealing glass. Is substantially the same as the first embodiment shown in FIGS. 1 to 7A, 7B, and 7C. 11 to 14 (a) (b) (c) (d) in the third embodiment shown in FIGS. 1 to 7 (a) (b) (c) and the first embodiment. The same parts are denoted by the same reference numerals, and detailed description thereof is omitted.

(Touch panel sensor integrated sealing glass)
FIG. 12 is a diagram showing a sealing glass 30A integrated with a touch panel sensor formed integrally with the touch panel sensor. Moreover, FIG. 11 is a figure which shows the organic electroluminescence display 10 provided with the sealing glass 30A by this Embodiment. As shown in FIG. 12, the sealing glass 30 </ b> A is formed on the glass substrate 31, the antireflection film 32 formed on the one surface 31 a of the glass substrate 31, and the other surface 31 b of the glass substrate 31. Sensor unit 50A.

  The sensor unit 50A of the sealing glass 30A is different only in that the insulating layer 47A and the protective layer 49A are made of a material containing a siloxane resin, and other configurations are the sensor unit 50 in the first embodiment. Is substantially the same. In the sensor unit 50A of the sealing glass 30A, the same parts as those of the sensor unit 50 in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the present embodiment, as described above, the insulating layer 47A and the protective layer 49A are made of a material containing a siloxane resin. For this reason, the sensor unit 50A has heat resistance enough to withstand baking of the glass paste. The siloxane resin constituting the material of the insulating layer 47A and the protective layer 49A may be the same as or different from the siloxane resin constituting the heat resistant material 36 and the heat resistant material 37 described above.

  Here, “the touch panel sensor is formed integrally with the sealing glass 30A” means that the glass substrate 31 of the sealing glass 30A supports the sensor unit 50A of the touch panel sensor as shown in FIG. This means that it also serves as a substrate.

(Method for forming sealing glass)
Next, with reference to FIGS. 13A, 13B, 13C, and 13D, a method of forming the sealing glass 30A according to the present embodiment will be described.

  First, as shown in FIG. 13A, a glass substrate 31 is prepared. Next, the above-described sensor unit 50A for realizing the touch panel function is formed on the other surface 31b of the glass substrate 31. As a method of forming the sensor unit 50A, for example, a photolithography method can be used.

  Thereafter, as shown in FIG. 13B, the glass substrate 31 is turned upside down, and then a heat resistant material 36 is applied or dropped onto the surface 31 a on one side of the glass substrate 31. The heat resistant material 36 contains an appropriate solvent for improving the coating property. Thereafter, the glass substrate 31 provided with the heat resistant material 36 is heated, and thereby the solvent in the heat resistant material 36 is evaporated. The heating conditions at this time are appropriately set according to the characteristics of the heat-resistant material 36 and the solvent contained. For example, a heating condition of heating at 80 ° C. for 10 minutes is set.

  Next, as shown in FIG. 13C, the heat resistant material 36 on the glass substrate 31 is pressed by the stamper plate 60. As a result, a shape corresponding to the recess 61 of the stamper plate 60 is imparted to the heat resistant material 36.

  Next, the stamper plate 60 is peeled from the heat resistant material 36, and then the glass substrate 31 and the heat resistant material 36 are heated at a predetermined temperature. For example, heating is performed at 400 ° C. As a result, as shown in FIG. 13D, an antireflection film 32 including a base portion 33 and a moth-eye structure portion 34 is formed on the glass substrate 31. Thus, from the glass substrate 31, the antireflection film 32 formed on the one surface 31a of the glass substrate 31, and the sensor unit 50A formed on the other surface 31b of the glass substrate 31. Thus, the sealing glass 30A integrated with the touch panel sensor is obtained.

  As described above, the sensor unit 50A includes the protective layer 49A. For this reason, it is possible to prevent the sensor unit 50A from being damaged when the glass substrate 31 is turned upside down to form the antireflection film 32 on the one surface 31a of the glass substrate 31.

(Method for forming organic EL display device)
Thereafter, the sealing glass 30 </ b> A and the organic EL element 20 are combined via the sealing portion 15 to form the organic EL display device 10. Since this procedure is substantially the same as the procedure in the first embodiment described above, detailed description is omitted.

  According to the present embodiment, the touch panel sensor is integrated with the sealing glass 30A. Thereby, a touch panel function can be given to sealing glass 30A more simply. Moreover, compared with the case where the touch panel sensor 40 and the sealing glass 30 are comprised separately, the board | substrate for touch panel sensors can be made unnecessary. Therefore, when the organic EL display device 10 with a touch panel function is configured using the sealing glass 30A, the thickness and weight of the organic EL display device 10 can be reduced by the amount of the touch panel sensor substrate.

  According to the present embodiment, the other surface 31b of the glass substrate 31 is covered with the sensor unit 50A. Accordingly, no air gap is formed on the other surface 31 b of the glass substrate 31. For this reason, it is possible to prevent light from being reflected on the other side of the glass substrate 31 without providing an adhesive layer or the like on the other side of the glass substrate 31 as in the case of the first embodiment described above. That is, according to the present embodiment, not only can the sealing glass 30A be provided with a touch panel function, but at the same time, light reflection on the other side of the glass substrate 31 can be prevented.

  Further, by preventing the adhesive layer from being interposed between the sensor unit 50A and the glass substrate 31, the sensitivity of the sensor unit 50A can be improved and the light transmittance can be improved. Moreover, the process of bonding the sealing glass 30 and the touch panel sensor 40 through the adhesive layer is not required, thereby reducing the number of manufacturing steps and avoiding problems that may occur during bonding. For example, it is possible to eliminate the concern that bubbles or the like are mixed at the time of bonding, thereby reducing the yield.

(Modification of the method for forming the sealing glass)
13A, 13 </ b> B, 13 </ b> C, and 13 </ b> D, first, the sensor unit 50 </ b> A is formed on the other surface 31 b of the glass substrate 31, and then, on the one surface 31 a of the glass substrate 31. An example in which the antireflection film 32 is formed is shown in FIG. However, the present invention is not limited to this. First, as shown in FIGS. 14A, 14B, 14C, and 14D, an antireflection film 32 is formed on the surface 31a on one side of the glass substrate 31, Thereafter, the sensor unit 50 </ b> A may be formed on the other surface 31 b of the glass substrate 31. In this case, the heat resistant material 36 constituting the antireflection film 32 is appropriately selected so as not to be damaged by the etching performed when the sensor portion 50A is formed by photolithography. For example, when an etching solution containing oxalic acid or a mixture of phosphoric acid, nitric acid, and acetic acid is used in etching, the heat-resistant material 36 is selected to have resistance to these etching solutions.

Second Comparison Mode Next, with reference to FIGS. 15A, 15B, 15C, and 15D, the effect of the present embodiment will be described in comparison with the second comparison mode. 15 (a), (b), (c), and (d), the second comparative form is the same as that of the glass substrate 31 before the sensor unit 50 and the antireflection film 132 are formed on the glass substrate 31. The only difference is that the sealing portion 15 is formed on the side surface 31a, and the other configuration is substantially the same as the method of manufacturing the organic EL display device 10 in the present embodiment described above. In the second comparison mode shown in FIGS. 15A, 15B, 15C, and 15D, the same parts as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  FIGS. 15A, 15B, 15C, and 15D are views showing a method of manufacturing the organic EL display device 110 according to the second comparative embodiment.

  First, as shown in FIG. 15A, a glass substrate 31 is prepared. Next, a glass paste is applied along the outer edge of the glass substrate 31 on the surface 31 a on one side of the glass substrate 31. Thereafter, the glass paste applied on the glass substrate 31 is baked. As a result, the sealing portion 15 is formed as shown in FIG. The firing conditions are substantially the same as those in the present embodiment described above.

  Next, as shown in FIG. 15 (b), a material for forming an antireflection film is applied on the surface 31 a on one side of the glass substrate 31. In the second comparative embodiment, the glass paste is already fired as described above. For this reason, unlike the case of this Embodiment mentioned above, the material for comprising an antireflection film does not need to have the heat resistance which can endure baking of a glass paste. Therefore, in the second comparative embodiment, the non-heat resistant material 136 is applied on the glass substrate 31 as in the case of the first comparative embodiment described above. Note that the non-heat resistant material 136 contains an appropriate solvent for improving the coating property. Thereafter, the glass substrate 31 provided with the non-heat resistant material 136 is heated, and thereby the solvent in the non-heat resistant material 136 is evaporated.

  Next, the non-heat resistant material 136 on the glass substrate 31 is pressed by the stamper plate 160. As a result, a shape corresponding to the recess 61 of the stamper plate 160 is given to the non-heat resistant material 136. Next, the stamper plate 160 is peeled from the non-heat resistant material 136, and then the glass substrate 31 and the heat resistant material 136 are heated at a predetermined temperature. As a result, an antireflection film 132 is formed on the glass substrate 31. In addition, the heating temperature of the glass substrate 31 and the non-heat resistant material 136 is lower than the heating temperature of the heat resistant material 36 in this Embodiment, for example, 400 degreeC.

  Thereafter, as shown in FIG. 15C, the glass substrate 31 is turned upside down, and the sensor unit 50 for realizing the touch panel function is formed on the other surface 31 b of the glass substrate 31. Thereby, the sealing glass 130A integrated with the touch panel sensor is obtained. In the second comparative embodiment, the glass paste is already fired as described above. For this reason, unlike the case of the above-described embodiment, the insulating layer 47 and the protective layer 49 of the sensor unit 50 do not have to have heat resistance that can withstand firing of the glass paste.

  Thereafter, as shown in FIG. 15D, the organic EL display device 110 is formed by combining the sealing glass 130 </ b> A and the organic EL element 20 through the sealing portion 15.

  By the way, in the 2nd comparison form, as mentioned above, the sealing part 15 is already formed on the surface 31a of the one side of the glass substrate 31 in the shaping using the stamper plate 160. For this reason, it is necessary to configure the stamper plate 160 so as not to contact the sealing portion 15 when the non-heat resistant material 136 is pressed. Further, when the non-heat resistant material 136 is pressed by the stamper plate 160, it is necessary to precisely operate the stamper plate 160 so that the stamper plate 160 does not contact the sealing portion 15.

  In the second comparative embodiment, as described above, when the sensor unit 50 is formed on the other surface 31 b of the glass substrate 31, the sealing portion 15 has already been formed on the one surface 31 a of the glass substrate 31. Is formed. For this reason, it is considered that the process of forming the sensor unit 50 on the other surface 31b of the glass substrate 31 by the photolithography method becomes difficult.

  In contrast, according to the present embodiment, as described above, when the antireflection film 32 and the sensor unit 50A are formed on the glass substrate 31, the sealing unit 15 is not yet formed. For this reason, as shown in FIG.13 (b) or FIG.14 (b), the stamper plate 60 extended over the whole surface 31a of the one side of the glass substrate 31 can be used. Further, when the heat resistant material 36 is pressed by the stamper 60, there is no concern that the stamper plate 60 contacts the sealing portion 15. For this reason, according to this Embodiment, the shaping by the stamper plate 60 can be implemented more simply.

  Further, according to the present embodiment, the insulating layer 47A and the protective layer 49A are made of a material containing a siloxane resin. For this reason, the sensor unit 50A has heat resistance enough to withstand baking of the glass paste. Thus, the sensor unit 50A can be formed on the other surface 31b of the glass substrate 31 before the sealing portion 15 is formed on the one surface 31a of the glass substrate 31. Yes.

  In the present embodiment, the example in which the antireflection film 32 is made of the heat resistant material 36 is shown. However, the present invention is not limited to this, and as in the case of the second embodiment described above, the antireflection film 32 is made of a heat resistant material 37 containing a photosensitive compound dispersed in a siloxane resin. May be.

  In each of the above-described embodiments, the glass paste containing glass frit is fired at 430 ° C., and the heat-resistant material constituting the antireflection film 32 has heat resistance enough to withstand 430 ° C. An example is shown. However, the temperature at which the glass paste is fired is not limited to 430 ° C., and can be fired at various temperatures of at least 400 ° C. or more depending on the characteristics of the glass frit used. Further, the heat resistance of the heat-resistant material constituting the antireflection film 32 is not limited to the heat resistance that can withstand 430 ° C., and the antireflection film 32 is formed according to the firing temperature of the glass paste containing glass frit. The heat resistance of the refractory material to be constructed can be designed.

  Moreover, in each above-mentioned embodiment, the example in which the shaping of the heat resistant material provided on the glass substrate 31 was implemented with the sheet | seat was shown. However, the present invention is not limited to this. First, a glass sheet continuously extending in one direction is prepared, a heat-resistant material is continuously provided on the glass sheet, and then a roll body around which a stamper plate is wound is prepared. By using it, the heat-resistant material may be shaped continuously. Thereby, an antireflection film is continuously formed on the glass sheet. Thereafter, the glass sheet on which the antireflection film is formed is cut into a predetermined size, thereby obtaining a sealing glass including the glass substrate and the antireflection film that is neglected on the glass substrate. The thickness of the glass sheet is not particularly limited, but is about 100 μm, for example.

DESCRIPTION OF SYMBOLS 10 Organic EL display device 15 Sealing part 20 Organic EL element 21 Anode 22 Organic light emitting layer 23 Cathode 24 Organic EL layer 27 Organic EL substrate 30, 30A Sealing glass 31 Glass substrate 32 Antireflection film 33 Base part 34 Mosaic structure part 35 convex part 36 heat-resistant material 37 heat-resistant material 40 touch panel sensor 41 x transparent conductive pattern 41a x electrode unit 41b x connecting part 42 y transparent conductive pattern 42a x electrode unit 42b x connecting part 43 lead-out wiring 44 lead-out wiring 45 terminal part 46 Touch panel sensor substrate 47, 47A Insulating layer 49, 49A Protective layer 50, 50A Sensor portion 60 Stamper plate 61 Recess 65 Roll body 66 Stamper plate 70 Circularly polarizing plate 71 Polarizing plate 72 Phase plate 75 Tempered glass

Claims (11)

In the sealing glass used in the organic EL display device,
A glass substrate;
An antireflection film formed on one surface of the glass substrate and made of a heat-resistant material,
The antireflection film has a moth-eye structure portion having an uneven shape,
The sealing glass, wherein the heat-resistant material contains a siloxane resin. The heat resistant material further includes a photosensitive compound dispersed in a siloxane resin,
The sealing glass according to claim 1, wherein the photosensitive compound contains a photoacid generator or a photobase generator. A sensor unit that is provided on the other side of the glass substrate and senses the approach of a conductor;
3. The sealing glass according to claim 1, wherein the sensor unit has a transparent conductive pattern that is formed on the other surface of the glass substrate and has conductivity and transparency. The sensor unit further includes a protective layer covering the transparent conductive pattern,
The sealing glass according to claim 3, wherein the protective layer is made of a material containing a siloxane resin. A sealing part formed on the surface of one side of the glass substrate along the outer edge of the glass substrate;
The sealing glass according to claim 1, wherein the sealing portion is made of glass frit. An organic EL element;
Sealing glass provided to face the organic EL element,
The organic EL element includes an organic EL substrate, an organic EL layer provided on the organic EL substrate, and including an anode, a cathode, and an organic light emitting layer provided between the anode and the cathode. And
The sealing glass is formed on a glass substrate, a surface of the glass substrate on the organic EL element side, an antireflection film made of a heat-resistant material, and the glass the organic EL element along an outer edge of the glass substrate. A sealing portion formed on the side surface,
The antireflection film has a moth-eye structure portion having an uneven shape,
The heat resistant material includes a siloxane resin,
The organic EL display device, wherein the sealing portion includes glass frit. The heat resistant material further includes a photosensitive compound dispersed in a siloxane resin,
The organic EL display device according to claim 6, wherein the photosensitive compound includes a photoacid generator or a photobase generator. The sealing glass is provided on a side opposite to the organic EL element side of the glass substrate, and further includes a sensor unit that senses the approach of the conductor,
The said sensor part is formed on the surface on the opposite side to the organic EL element side of the said glass substrate, and has a transparent conductive pattern which has electroconductivity and transparency, The Claim 6 or 7 characterized by the above-mentioned. Organic EL display device. The sensor unit further includes a protective layer covering the transparent conductive pattern,
The organic EL display device according to claim 8, wherein the protective layer is made of a material containing a siloxane resin. In a method for manufacturing an organic EL display device including an organic EL element,
Preparing a glass substrate;
Forming an antireflection film made of a heat-resistant material on one surface of the glass substrate;
Providing a glass frit on a surface of one side of the glass substrate along an outer edge of the glass substrate;
Baking the glass frit at a temperature of at least 400 ° C. to form a sealing portion made of glass frit;
Arranging the organic EL element on one side of the glass substrate;
Melting the sealing portion, thereby sealing between the glass substrate and the organic EL element,
The antireflection film has a moth-eye structure portion having an uneven shape,
The method for manufacturing an organic EL display device, wherein the heat-resistant material contains a siloxane resin. Before the sealing part is formed on the surface of one side of the glass substrate, a sensor part for detecting the approach of the conductor is provided on the other side of the glass substrate,
The sensor unit is formed on the other surface of the glass substrate, and has a conductive conductive and transparent transparent conductive pattern, and a protective layer covering the transparent conductive pattern,
The method for manufacturing an organic EL display device according to claim 10, wherein the protective layer is made of a material containing a siloxane resin.

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