CN112558348A - Color film substrate, manufacturing method of color film substrate and display panel - Google Patents
Color film substrate, manufacturing method of color film substrate and display panel Download PDFInfo
- Publication number
- CN112558348A CN112558348A CN202011599879.8A CN202011599879A CN112558348A CN 112558348 A CN112558348 A CN 112558348A CN 202011599879 A CN202011599879 A CN 202011599879A CN 112558348 A CN112558348 A CN 112558348A
- Authority
- CN
- China
- Prior art keywords
- layer
- substrate
- display area
- black matrix
- color filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
- G02F1/133516—Methods for their manufacture, e.g. printing, electro-deposition or photolithography
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13392—Gaskets; Spacers; Sealing of cells spacers dispersed on the cell substrate, e.g. spherical particles, microfibres
Abstract
The invention discloses a color film substrate, a manufacturing method of the color film substrate and a display panel, wherein the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area is defined to comprise a first non-display area facing a double-layer metal wiring area of the array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the color film substrate further comprises: a substrate base plate; the black matrix layer is arranged on one surface of the substrate base plate; the lifting layer is arranged on the surface, deviating from the substrate base plate, of the black matrix layer and is positioned in the second non-display area; and the conducting layer is arranged on one side of the black matrix layer, which is deviated from the substrate base plate, and is jacked by the two lifting layers to form a bulge. The technical scheme of the invention aims to ensure that the particle size of the gap supporting balls is uniform when the particle size of the gap supporting balls is calculated by using the longitudinal sections of the first non-display area and the second non-display area, thereby ensuring that the box thickness of the display panel is uniform.
Description
Technical Field
The invention relates to the technical field of display panels, in particular to a color film substrate, a manufacturing method of the color film substrate and a display panel.
Background
A Liquid Crystal Display (LCD) panel is widely used because of its advantages such as thin body, power saving, and no radiation. The TFT-LCD process comprises an array manufacturing project, a color film manufacturing project and a liquid crystal box manufacturing project, wherein the liquid crystal box manufacturing project is completed by transferring the liquid crystal box project together after the array and color film manufacturing projects are completed. The main process of the liquid crystal box manufacturing engineering comprises the steps of coating a liquid crystal orientation layer, dripping liquid crystal, coating frame glue, coating a gold ball, assembling a box in vacuum, cutting and the like. The frame glue (seal) coating plays a role in sealing the liquid crystal box to prevent liquid crystal overflow and water vapor invasion, maintaining the peripheral thickness of the liquid crystal box and adhering the array substrate and the color film substrate. In order to maintain the thickness of the peripheral box, a certain proportion of spacers are usually added into the sealant. These spacers are usually glass fibre, silicon and plastic balls, and are collectively referred to as space ball (interstitial support ball) by definition.
The array manufacturing process is to form all circuit traces including a display area (AA area for short) and a non-display area. A complete display screen can be roughly divided into: AA area (display area), non-display A area, non-display B area, and drive IC. The non-display area a belongs to a bonding area, i.e., signals are bonded to the metal through an ACF (anisotropic conductive adhesive), and the non-display area a needs to be used for transmitting signals between packaged chips, so that the resistance of signal lines is required to be low, and thus the non-display area a may use WOA (wire on array, where the metal is placed in an array) wiring, i.e., a double-layer metal wiring. The non-display B region needs metal wirings on layout, which is generally called fanout (output) wirings, and the wirings of fanout generally adopt single-layer metal wirings. The space ball is selected to be a fixed particle size, and when the particle size of the space ball is calculated on a vertical plane where a non-display area A (a double-layer metal wire area) is located, the particle size of the space ball is smaller for a non-display area B (a single-layer metal wire area); when the space ball particle size is calculated on the vertical plane of the non-display area B, the space ball particle size is too large for the non-display area A, which easily causes uneven thickness of the peripheral box of the display panel.
The above description is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission of prior art.
Disclosure of Invention
The invention mainly aims to provide a color film substrate, a manufacturing method of the color film substrate and a display panel, and aims to enable the particle size of gap supporting balls to be uniform when the particle size of the gap supporting balls is calculated by using longitudinal sections of a first non-display area and a second non-display area, so that the uniform box thickness of the display panel is ensured.
In order to achieve the above object, the color filter substrate provided in the present invention has a display area and a non-display area surrounding the display area, and the non-display area is defined to include a first non-display area directly facing a double-layer metal wiring area of the array substrate and a second non-display area directly facing a single-layer metal wiring area of the array substrate, and the color filter substrate further includes:
a substrate base plate;
the black matrix layer is arranged on one surface of the substrate base plate;
the lifting layer is arranged on the surface, away from the substrate, of the black matrix layer and is positioned in the second non-display area; and
and the conducting layer is arranged on one side of the black matrix layer, which is deviated from the substrate base plate, and is jacked by the two lifting layers to form a bulge.
Optionally, the color film substrate is defined to have a first direction, and the height of the lift-up layer in the first direction is d 1;
defining the height difference of the double-layer metal wiring region and the single-layer metal wiring region of the array substrate in the first direction as d2, wherein the relation between d1 and d2 is as follows: d1/d2 is more than or equal to 0.9 and less than or equal to 1.1.
Optionally, the number of the lifting layers is at least two, and the two lifting layers are stacked on the surface of the black matrix layer, which is away from the substrate base plate, and are both located in the second non-display area;
or the number of the raised layers is at least three, and the three raised layers are stacked on the surface of the black matrix layer, which is far away from the substrate base plate, and are positioned in the second non-display area.
Optionally, the color filter substrate is defined to include a second direction perpendicular to the first direction, and the width of two adjacent lifting layers in the second direction is gradually reduced in the first direction.
Optionally, the width of the elevated layer adjacent to the black matrix layer is greater than the width of the elevated layer adjacent to the conductive layer.
Optionally, the color filter substrate further includes a frame glue and a first gap supporting ball, the first gap supporting ball is disposed in the frame glue, the lifting layer is projected on the surface of the conductive layer departing from the black matrix layer in the first direction to form a projection area, and the frame glue is located in the projection area.
Optionally, distances from the sealant to the outer contour of the projection area in the second direction are x1 and x2, respectively, and the value ranges of x1 and x2 are: x1 is more than or equal to 0, and x2 is more than or equal to 0.
Optionally, the lift-off layer comprises at least one of a red color resist layer, a blue color resist layer, a green color resist layer, and a spacer.
The invention also provides a manufacturing method of the color film substrate, the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area comprises a first non-display area facing the double-layer metal wiring area of the array substrate and a second non-display area facing the single-layer metal wiring area of the array substrate, and the manufacturing method of the color film substrate comprises the following steps:
providing a substrate, and forming a black matrix layer on the substrate;
forming a lifting layer positioned in a second non-display area on the surface of the black matrix layer, which is far away from the substrate base plate;
and forming a conductive layer on the surface of the black matrix layer, which is far away from the substrate base plate, wherein the conductive layer covers the uplift layer.
The invention further provides a display panel, which comprises an array substrate and a color film substrate, wherein the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area is defined to comprise a first non-display area facing a double-layer metal wiring area of the array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the color film substrate further comprises:
a substrate base plate;
the black matrix layer is arranged on one surface of the substrate base plate;
the lifting layer is arranged on the surface, away from the substrate, of the black matrix layer and is positioned in the second non-display area; and
the conducting layer is arranged on one side, away from the substrate base plate, of the black matrix layer and is jacked up by the two lifting layers to form a boss, and the color film base plate is arranged opposite to the array base plate;
or, the display panel includes an array substrate and a color film substrate, the array substrate is arranged opposite to the color film substrate, the color film substrate has a display area and a non-display area surrounding the display area, the non-display area includes a first non-display area facing a double-layer metal wiring area of the array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the manufacturing method of the color film substrate includes the following steps:
providing a substrate, and forming a black matrix layer on the substrate;
forming a raised layer on the surface of the black matrix layer, which is far away from the substrate, providing a photomask, and illuminating the raised layer through the photomask to form a raised layer positioned in the display area and a raised layer positioned in the second non-display area, wherein the light transmittance of the photomask in the area for forming the raised layer of the second non-display area is less than that of the area for forming the raised layer of the display area;
and forming a conductive layer on the surface of the black matrix layer, which is far away from the substrate base plate, wherein the conductive layer covers the uplift layer.
According to the technical scheme, the black matrix layer is arranged on the substrate base plate, the lifting layer is arranged on the surface, away from the substrate base plate, of the black matrix layer, the lifting layer is located in the second non-display area, the conductive layer is further arranged on the surface, away from the substrate base plate, of the black matrix layer, at least part of the conductive layer covers the lifting layer and is lifted to form the protruding portion. Since the elevated layer is provided in the second non-display region, the projection is also provided in the second non-display region. It can be understood that, since the first non-display region is disposed facing the double-layered metal wiring region (M1 layer and M2 layer, i.e., gate and source drain) of the array substrate and the second non-display region is disposed facing the single-layered metal wiring region (M1 layer, i.e., gate) of the array substrate, the double-layered metal wiring region of the array substrate has one more metal than the single-layered wiring region, and thus, when the array substrate is placed on a horizontal plane, the height of the double-layered metal wiring region is higher than the region of the single-layered metal wiring, the first non-display region (region facing the double-layered metal region) is closer to the array substrate, and when the lift-up layer is disposed in the second non-display region and the conductive layer is lifted up to form the bump, the height of the second non-display region is raised up, thereby reducing the distance of the second non-display region (region facing the single-layered metal region) from the array substrate, therefore, when the particle sizes of the gap supporting balls are calculated on the longitudinal sections of the first non-display area and the second non-display area, the heights of the gap supporting balls are close, and uneven thickness of the peripheral box of the display panel is prevented. Therefore, the technical scheme of the invention can ensure that the particle size of the gap supporting balls is uniform, thereby ensuring that the box thickness of the display panel is uniform.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, as viewed from a single-layer metal wiring region of an array substrate to a color film substrate side;
FIG. 2 is a cross-sectional view of one embodiment of a display panel in accordance with the exemplary technology;
FIG. 3 is a cross-sectional view of an embodiment of a color filter substrate at A-A in FIG. 1;
FIG. 4 is a partially exploded view of FIG. 3;
fig. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention, as viewed from a double-layer metal wiring region of an array substrate to a color film substrate side;
FIG. 6 is a cross-sectional view of an embodiment of the color filter substrate shown in FIG. 5 at B-B;
fig. 7 is a flowchart illustrating a method for manufacturing a color filter substrate according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
60 | Second gap support ball |
| 101 | A first |
70 | Raising |
| 102 | Second |
300 | |
| 10 | |
301 | |
| 20 | |
302 | Source and |
| 30 | |
303 | Double-layer |
| 31 | Raised |
304 | Single layer |
| 40 | |
500 | |
| 50 | First gap support ball |
The implementation, functional features and advantages of the objects of the present invention will be described in conjunction with the embodiments, optionally with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a color film substrate 100.
Referring to fig. 1 to 6, a color filter substrate 100 according to the present invention has a display area and a non-display area surrounding the display area, the non-display area is defined to include a first non-display area 101 facing a double-layer metal wiring area 303 of an array substrate 300 and a second non-display area 102 facing a single-layer metal wiring area 304 of the array substrate 300, and the color filter substrate 100 further includes:
a base substrate 10;
the black matrix layer 20, the black matrix layer 20 is arranged on one surface of the substrate base plate 10;
the lifting layer 70 is arranged on the surface, away from the substrate base plate 10, of the black matrix layer 20, and is positioned in the second non-display area 102; and
and the conductive layer 30 is arranged on one side of the black matrix layer 20, which is far away from the substrate base plate 10, and is lifted by the two lifting layers 70 to form a convex part 31.
In an embodiment of the present application, the substrate base plate 10 may also be bendable or foldable. The substrate 10 may be made of a glass substrate or other light-transmitting structure.
A display Area (Active Area), which refers to an Area of the substrate capable of displaying an image, may be disposed in a middle Area of the substrate. The non-display area refers to an area which can not display a display image, and is generally arranged around the display area, and circuit wiring and other driving electronic components are arranged in the non-display area.
According to the technical scheme, the black matrix layer 20 is arranged on the substrate base plate 10, the lifting layer 70 is arranged on the surface, away from the substrate base plate 10, of the black matrix layer 20, the lifting layer 70 is located in the second non-display area 102, the conducting layer 30 is arranged on the surface, away from the substrate base plate 10, of the black matrix layer 20, at least part of the conducting layer 30 covers the lifting layer 70, and the lifting layer is lifted to form the protruding portion 31. Since the elevation layer 70 is provided in the second non-display region 102, the projection 31 is also provided in the second non-display region 102. It can be understood that, since the first non-display region 101 is disposed facing the double-layered metal wiring region 303(M1 layer and M2 layer, i.e., the gate electrode 301 and the source drain electrode 302) of the array substrate 300 and the second non-display region 102 is disposed facing the single-layered metal wiring region 304(M1 layer, i.e., the gate electrode 301) of the array substrate 300, the double-layered metal wiring region 303 of the array substrate 300 has one more metal than the single-layered wiring region, and thus, when the array substrate 300 is placed on a horizontal plane, the height of the double-layered metal wiring region 303 is higher than that of the single-layered metal wiring region, so that the first non-display region 101 (region facing the double-layered metal region) is closer to the array substrate 300, and when the lift-up layer 70 is disposed on the second non-display region 102 and the conductive layer 30 is lifted up by the lift-up layer 70 to form the bump 31, the height of the second non-display region 102 is raised up, so that the distance of the second non-display region 102 (region facing the Therefore, when the particle diameters of the gap supporting balls are calculated on the longitudinal sections of the first non-display area 101 and the second non-display area 102, the heights of the gap supporting balls are relatively close, and uneven thickness of the peripheral box of the display panel 500 is prevented. Thus, the technical scheme of the invention can ensure that the particle sizes of the gap supporting balls are uniform, thereby ensuring that the box thickness of the display panel 500 is uniform.
It is understood that the conductive layer 30 is an ITO conductive film, which is an abbreviation of Indium Tin Oxides. As nano indium tin metal oxide, it has good conductivity and transparency, and can cut off electron radiation, ultraviolet rays and far infrared rays harmful to human body. Therefore, indium tin oxide is generally sprayed on glass, plastic and electronic display panels to serve as a transparent conductive film while reducing electron radiation and ultraviolet and infrared rays harmful to the human body.
The black matrix layer 20 may be a chromium-based material or a resin-based material, and is formed on the base substrate 10 by patterning.
The surface of the conductive layer 30 facing away from the black matrix layer 20 is further provided with an alignment film (alignment film), which is a thin film having straight scratches and functions to guide the alignment direction of the liquid crystal molecules. For example, on a glass substrate coated with a transparent conductive film (ITO), a PI coating liquid and a roller are used to print a parallel groove on the ITO film, and then the liquid crystal can be horizontally laid in the groove along the direction of the groove, so as to achieve the purpose of arranging the liquid crystal in the same direction. The material of the alignment film needs to have good light transmittance; must be present or partially ionized for ionization; having a covalent or partially covalent linkage; amorphous and good lattice structure. The alignment film may also be raised to form a third raised portion 31 by the lifting action of the raised portion 31, so as to raise the second non-display region 102.
In one embodiment of the present application, the elevated layer 70 includes at least one of a red color resist layer, a blue color resist layer, a green color resist layer, and a spacer. By using at least one of the red color resist layer, the blue color resist layer, the green color resist layer and the spacer as the elevation of the second non-display area 102, the distance between the second non-display area 102 (the area facing the single-layer metal area) and the array substrate 300 can be reduced, thereby ensuring that the height of the gap supporting balls is relatively close when the particle size of the gap supporting balls is calculated on the longitudinal sections of the first non-display area 101 and the second non-display area 102, and preventing uneven box thickness around the display panel 500.
It should be noted that the technical solution of the embodiment of the present application may also be disposed on the array substrate 300, a specific disposition position of the protrusion may be a portion of the array substrate 300 side corresponding to the second non-display area 102, the protrusion may be disposed on the conductive layer of the array substrate 300 side, the protrusion may be formed by lifting a lifting layer disposed on the substrate, and the lifting layer and the substrate are sequentially disposed.
Referring to fig. 3, 4 and 6, in an embodiment of the present disclosure, the color filter substrate 100 is defined to have a first direction, and a height of the lift-off layer 70 in the first direction is d 1;
defining the height difference of the double-layer metal wiring region 303 and the single-layer metal wiring region 304 of the array substrate 300 in the first direction as d2, wherein the relationship between d1 and d2 is as follows: d1/d2 is more than or equal to 0.9 and less than or equal to 1.1.
The first direction is a stacking direction of each layer of the color film substrate 100 (a direction perpendicular to an extending direction of the color film substrate 100), and it should be noted that the height of the raised layer 70 is a height from an end surface of the raised layer 70 in the first direction to a surface of the black matrix layer 20 away from the substrate 10; in the array substrate 300, the height difference between the double-layer metal wiring region 303 and the single-layer metal wiring region 304 in the first direction is d2, and since the difference between the double-layer metal wiring region 303 and the single-layer metal wiring region 304 is the M2 metal layer, d2 is the height of the M2 metal layer at both end surfaces in the first direction. When d1/d2 is less than 0.9, the height of the protrusion of the raised layer 70 is lowered, so that the distance between the second non-display area 102 and the array substrate 300 is still far from the distance between the first non-display area 101 and the array substrate 300, and therefore, when the gap supporting balls are calculated on the longitudinal section of the second non-display area 102, the height of the gap supporting balls is close to that calculated on the longitudinal section of the first non-display area 101, the particle size of the gap supporting balls is uneven, and the box thickness of the display panel 500 is affected; when d1/d2 is greater than 1.1, the height of the protrusion of the raised layer 70 is increased, so that the distance between the second non-display area 102 and the array substrate 300 is still far from the distance between the first non-display area 101 and the array substrate 300, and therefore, when the gap supporting balls are calculated on the longitudinal section of the second non-display area 102, the height of the gap supporting balls is close to the height of the gap supporting balls calculated on the longitudinal section of the first non-display area 101, which causes uneven particle size of the gap supporting balls, and affects the box thickness of the display panel 500. When the value range of d1/d2 is 0.9 to 1.1, the height of the protrusion of the lifting layer 70 can be moderate, so that the distance between the second non-display area 102 and the array substrate 300 is still moderate to the distance difference between the first non-display area 101 and the array substrate 300, thereby ensuring that when the gap supporting ball is calculated on the longitudinal section of the second non-display area 102, the height of the gap supporting ball is close to that calculated on the longitudinal section of the first non-display area 101, ensuring that the particle size of the gap supporting ball is uniform, and the box thickness of the display panel 500 is uniform. It can be understood that when the value of d1/d2 is 0.92, 0.95, 0.96, 0.98, 0.99, 1, 1.02, 1.05, 1.07, 1.09, or any value therebetween, the height of the protrusion of the elevation layer 70 can be moderate, so that the distance from the second non-display region 102 to the array substrate 300 is still moderate to the distance from the first non-display region 101 to the array substrate 300, thereby ensuring that when the gap supporting balls are calculated on the longitudinal section of the second non-display region 102, the height of the gap supporting balls is close to that calculated on the longitudinal section of the first non-display region 101, ensuring that the particle diameters of the gap supporting balls are uniform, and the box thickness of the display panel 500 is uniform.
Referring to fig. 3 and 4, in an embodiment of the present application, the number of the rising layers 70 is at least two, and two rising layers 70 are stacked on the surface of the black matrix layer 20 away from the substrate base plate 10 and both located in the second non-display area 102; considering that the height of the second non-display area 102, which needs to be padded, is affected by the M2 metal layer, when the thickness of the M2 metal layer is large, the multiple layers of the lifting layers 70 may be needed to lift the height of the second non-display area 102. Of course, when the height at which the second non-display area 102 needs to be raised is low, the multi-layer raising layer 70 may be used, so that the raised height is controlled for multiple times, so that the raised height of the second non-display area 102 is well controlled, and the distance between the second non-display area 102 (the area facing the single-layer metal area) and the array substrate 300 is reduced, thereby ensuring that the heights of the gap supporting balls are closer when the particle sizes of the gap supporting balls are calculated on the longitudinal sections of the first non-display area 101 and the second non-display area 102, and preventing the box thickness around the display panel 500 from being uneven.
In an embodiment of the present application, the number of the lifting layers 70 is at least three, and three lifting layers 70 are stacked on the surface of the black matrix layer 20 facing away from the substrate base plate 10 and are located in the second non-display area 102. Considering that the height of the second non-display area 102, which needs to be padded, is affected by the M2 metal layer, when the thickness of the M2 metal layer is large, the multiple layers of the lifting layers 70 may be needed to lift the height of the second non-display area 102. Of course, when the height at which the second non-display area 102 needs to be raised is low, the multi-layer raising layer 70 may be used, so that the raised height is controlled for multiple times, so that the raised height of the second non-display area 102 is well controlled, and the distance between the second non-display area 102 (the area facing the single-layer metal area) and the array substrate 300 is reduced, thereby ensuring that the heights of the gap supporting balls are closer when the particle sizes of the gap supporting balls are calculated on the longitudinal sections of the first non-display area 101 and the second non-display area 102, and preventing the box thickness around the display panel 500 from being uneven.
Referring to fig. 3 and 4, in an embodiment of the present disclosure, the color filter substrate 100 is defined to include a second direction perpendicular to the first direction, and widths of two adjacent lifting layers 70 in the second direction are gradually reduced in the first direction. The second direction is the extending direction (horizontal direction) of the base substrate 10, and the width of the elevation layer 70 in the second direction is the distance between both end surfaces of the elevation layer 70 in the second direction. The tapered stacking may facilitate stacking of multiple layers of the lifting layer 70 to form the raised portion 31 that lifts the second non-display area 102. The distance between the second non-display region 102 (the region facing the single-layer metal region) and the array substrate 300 is reduced, so that the heights of the gap supporting balls are relatively close to each other when the particle sizes of the gap supporting balls are calculated on the longitudinal sections of the first non-display region 101 and the second non-display region 102, and uneven thickness of the peripheral box of the display panel 500 is prevented.
In an embodiment of the present application, the width of the elevated layer 70 adjacent to the black matrix layer 20 is greater than the width of the elevated layer 70 adjacent to the conductive layer 30. With this arrangement, the width of the bottom elevating layer 70 can be made larger, so that the area formed by enclosing the outer edge of the protruding portion 31 can cover the second non-display area 102, and further the second non-display area 102 can be raised. The distance between the second non-display region 102 (the region facing the single-layer metal region) and the array substrate 300 is reduced, so that the heights of the gap supporting balls are relatively close to each other when the particle sizes of the gap supporting balls are calculated on the longitudinal sections of the first non-display region 101 and the second non-display region 102, and uneven thickness of the peripheral box of the display panel 500 is prevented.
Referring to fig. 2 to 4 and fig. 6, the color film substrate 100 further includes a frame sealant and first gap supporting balls 50, the first gap supporting balls 50 are disposed in the frame sealant, the lifting layer 70 is projected on the surface of the conductive layer 30 away from the black matrix layer 20 in a first direction to form a projection area, and the frame sealant is located in the projection area. The frame sealing adhesive 40 is an adhesive, which bonds the upper and lower substrates (the color film substrate 100 and the array substrate 300) of the liquid crystal display while maintaining a certain gap, and then seals the filled liquid crystal so that it cannot leak and prevent external contaminants from entering, and is the frame sealing adhesive 40, which is also called as edge sealing adhesive. The frame sealing glue 40 for the LCD mainly includes two types: thermal curable adhesives and Ultraviolet (UV) curable adhesives. The two glues differ mainly in their curing pattern. The application of the heat-cured adhesive is wider. However, when the high-precision liquid crystal display screen is manufactured, the UV curing adhesive is superior to the thermal curing adhesive in curing time, adhesion force, humidity resistance, heat resistance and the like. In particular, the curing time is short, the production period is shortened, and the dislocation of two pieces of glass in the long-time curing process is prevented. The UV curing adhesive can be selected, the components of the UV curing adhesive are denatured acrylate compounds, and the UV curing adhesive is yellowish viscous liquid in appearance. When the UV curing adhesive works, the colloidal UV curing adhesive is uniformly coated on the frame position of the surface of the upper glass, after the upper substrate and the lower substrate are bonded, the ultraviolet light is used for irradiating to ensure that the adhesive is mutually crosslinked into a stable net structure from a linear macromolecular structure, and the UV curing adhesive has strong adhesive capacity, so that the two substrates are bonded together. The frame sealing glue 40 is provided with the gap supporting balls to increase the supporting force of the frame sealing glue 40, and it can be understood that the gap supporting balls include the first gap supporting ball 50 located in the second non-display region 102 and the second gap supporting ball 60 located in the first non-display region 101, and when the raised layer 70 is used to lift the conductive layer 30 to form the protruding portion 31, the particle diameters of the first gap supporting ball 50 and the second gap supporting ball 60 are close, thereby ensuring the uniform box thickness of the display panel 500.
Referring to fig. 4, in an embodiment of the present application, the conductive layer 30 has an upper surface and a lower surface in the first direction, and a distance between the upper surface and the lower surface is the same. That is, the thickness of the conductive layer 30 at the portion where the convex portion 31 is formed is the same as the thickness of the portion where the convex portion 31 is not formed, so that in the case where the black matrix layer 20 is provided with the raised layer 70, the conductive layer 30 is ensured to have a flat layer structure, and the influence on the characteristics of the Thin Film Transistor (TFT) due to the difference in the thickness of each portion of the conductive layer 30 is avoided.
Referring to fig. 3 and 4, distances from the sealant to the outer contour of the projection area in the second direction are x1 and x2, respectively, and the value ranges of x1 and x2 are: x1 is more than or equal to 0, and x2 is more than or equal to 0. When viewed in the first direction, the outer contour of the frame sealing adhesive 40 is disposed in the region formed by enclosing the outer edge of the protrusion 31, and the form of the frame sealing adhesive 40 disposed in the region of the outer edge of the protrusion 31 may be a full inclusion in a "go" shape, or a partial inclusion in a "aim" shape (a part of the outer contour of the frame sealing adhesive 40 may coincide with a part of the outer contour of the outer edge of the protrusion 31, and the outer contour of the other part of the frame sealing adhesive 40 is disposed in the outer contour of the other part of the protrusion 31), specifically according to the actual structure of the product, as long as the frame sealing adhesive 40 is disposed at the position where the protrusion 31 is laid. By such arrangement, the sealant 40 can be completely located in the second non-display region 102, on one hand, sealing of the liquid crystal is facilitated, and the thickness of the box is formed, and on the other hand, in order to ensure that the gap supporting balls in the coated sealant correspond to the outer edge of the protruding portion 31 and surround the forming region, the width of the protruding portion 31 should be the width of the sealant plus the sealant coating error. The arrangement is such that when the gap supporting balls are calculated on the longitudinal section of the second non-display area 102, the height of the gap supporting balls is close to that calculated on the longitudinal section of the first non-display area 101, so as to ensure uniform particle size of the gap supporting balls and uniform box thickness of the display panel 500.
Referring to fig. 7, the present invention further provides a manufacturing method of a color filter substrate 100, where the color filter substrate 100 has a display area and a non-display area surrounding the display area, the non-display area includes a first non-display area 101 directly facing a double-layer metal wiring area 303 of an array substrate 300 and a second non-display area 102 directly facing a single-layer metal wiring area 304 of the array substrate 300, and the manufacturing method of the color filter substrate 100 includes the following steps:
step S10, providing a base substrate 10, and forming a black matrix layer 20 on the base substrate 10; it is understood that the black matrix layer 20 is made of one of an organic photoresist, an opaque metal, a metal oxide and a nitride, and can block light or reflect light back; when the black matrix layer 20 is an organic photoresist, the black matrix layer 20 may be formed by using techniques such as a dispenser, screen printing, nozzle printing, ink jet printing, and the like; when the black matrix layer 20 is made of metal or metal oxide, the black matrix layer 20 may be formed by using a thermal evaporation process, a magnetron sputtering process, a vapor deposition process, or the like; when the black matrix layer 20 is made of metal or metal oxide, the black matrix layer 20 may be formed by using a thermal evaporation process, a magnetron sputtering process, a vapor deposition process, or the like.
Step S20, forming a raised layer 70 on the surface of the black matrix layer 20 facing away from the substrate base plate 10, the raised layer being located in the second non-display area 102;
in an embodiment of the present application, when the raised layer 70 is a single layer, a certain transmittance may be provided at a portion of the mask located in the second non-display area 102 to form the raised layer 70 located in the second non-display area 102, and specifically, a layer of photoresist is coated on the substrate 10, and the photoresist covers the second non-display area 102 and the black matrix layer 20; and exposing and developing the photoresist through a photoetching mask plate to obtain a lifting layer 70 corresponding to the second non-display area 102, and when the lifting layer 70 is a color resistance layer, obtaining the color resistance layer positioned in the second non-display area 102 and the color resistance layer corresponding to the display area. When the elevation layer 70 is a multi-layer, the elevation layer height at the second non-display area 102 may be made thin so that the conductive layer 30 is elevated by the multi-layer elevation layer 70. In one embodiment, a layer of photoresist is coated on the substrate base plate 10, and the photoresist covers the second non-display region 102 region and the black matrix layer 20; the photoresist is exposed and developed through a mask blank to obtain the raised layer 70 corresponding to the second non-display area 102, wherein the light transmittance of the mask in the second non-display area 102 is smaller than the light transmittance in the display area, for example, the light transmittance of the mask in the display area is full transmittance, and the light transmittance of the mask in the second non-display area 102 is partial transmittance. Alternatively, the reduction of the partial ultraviolet transmittance may be achieved by using a semi-permeable film of a Tone Mask (Tone Mask) or diffraction of light, so that the light transmittance of the second non-display region 102 is small, and since the light transmittance of the second non-display region 102 is small, the raised layer 70 of the second non-display region 102 is cured less in the first direction, so that the raised layer 70 having a small thickness in the first direction may be formed, and the conductive layer 30 may be accurately lifted up by the multi-layer raised layer 70.
In step S30, a conductive layer 30 is formed on the surface of the black matrix layer 20 facing away from the base substrate 10, wherein the conductive layer 30 covers the raised layer 70 to form the protrusion 31. The conductive layer 30 may be formed on the surface of the black matrix layer 20 away from the substrate 10 by magnetron sputtering or evaporation.
When the lifting layer 70 is arranged in the second non-display area 102 and the conductive layer 30 is lifted by the lifting layer 70 to form the protruding portion 31, the height of the second non-display area 102 is increased, so that the distance between the second non-display area 102 (the area facing the single-layer metal area) and the array substrate 300 is reduced, the height of the gap supporting balls is close when the particle size of the gap supporting balls is calculated on the longitudinal section of the first non-display area 101 and the longitudinal section of the second non-display area 102, and uneven box thickness around the display panel 500 is prevented.
Referring to fig. 1 to 6, the present invention further provides a display panel 500, where the display panel 500 includes an array substrate 300 and a color filter substrate 100, where the color filter substrate 100 has a display area and a non-display area surrounding the display area, the non-display area is defined to include a first non-display area 101 facing a double-layer metal wiring area 303 of the array substrate 300 and a second non-display area 102 facing a single-layer metal wiring area 304 of the array substrate 300, and the color filter substrate 100 further includes:
a base substrate 10;
the black matrix layer 20, the black matrix layer 20 is arranged on one surface of the substrate base plate 10;
the lifting layer 70 is arranged on the surface, away from the substrate base plate 10, of the black matrix layer 20, and is positioned in the second non-display area 102; and
the conductive layer 30 is arranged on one side of the black matrix layer 20, which is away from the substrate base plate 10, and is lifted by the two lifting layers 70 to form a protruding part 31, and the color film base plate 100 is arranged opposite to the array base plate 300;
or, the display panel 500 includes an array substrate 300 and a color filter substrate 100, the array substrate 300 is disposed opposite to the color filter substrate 100, the color filter substrate 100 has a display area and a non-display area surrounding the display area, the non-display area includes a first non-display area 101 facing a double-layer metal wiring area 303 of the array substrate 300 and a second non-display area 102 facing a single-layer metal wiring area 304 of the array substrate 300, and the manufacturing method of the color filter substrate 100 includes the following steps:
providing a substrate 10, and forming a black matrix layer 20 on the substrate 10;
forming a raised layer 70 on the surface of the black matrix layer 20 opposite to the substrate 10, providing a photomask, and illuminating the raised layer 70 through the photomask to form the raised layer 70 located in the display area and the raised layer 70 located in the second non-display area 102, wherein the light transmittance of the photomask in the area of the raised layer 70 for forming the second non-display area 102 is less than the light transmittance of the area of the raised layer 70 for forming the display area;
a conductive layer 30 is formed on the surface of the black matrix layer 20 facing away from the base substrate 10, wherein the conductive layer 30 covers the elevation layer 70. Since the display panel 500 adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area is defined to comprise a first non-display area facing a double-layer metal wiring area of an array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the color film substrate is characterized by further comprising:
a substrate base plate;
the black matrix layer is arranged on one surface of the substrate base plate;
the lifting layer is arranged on the surface, away from the substrate, of the black matrix layer and is positioned in the second non-display area; and
and the conducting layer is arranged on one side of the black matrix layer, which is deviated from the substrate base plate, and is jacked by the two lifting layers to form a bulge.
2. The color filter substrate of claim 1, wherein the color filter substrate is defined to have a first direction, and the height of the lift-up layer in the first direction is d 1;
defining the height difference of the double-layer metal wiring region and the single-layer metal wiring region of the array substrate in the first direction as d2, wherein the relation between d1 and d2 is as follows: d1/d2 is more than or equal to 0.9 and less than or equal to 1.1.
3. The color filter substrate of claim 1, wherein the number of the raised layers is at least two, and two raised layers are stacked on the surface of the black matrix layer away from the substrate and are both located in the second non-display area;
or the number of the raised layers is at least three, and the three raised layers are stacked on the surface of the black matrix layer, which is far away from the substrate base plate, and are positioned in the second non-display area.
4. The color filter substrate of claim 3, wherein the color filter substrate is defined to include a second direction perpendicular to the first direction, and the widths of two adjacent lifting layers in the second direction are gradually reduced in the first direction.
5. The color filter substrate of claim 4, wherein the width of the raised layer adjacent to the black matrix layer is greater than the width of the raised layer adjacent to the conductive layer.
6. The color filter substrate of claim 5, further comprising a frame sealant and first gap support balls, wherein the first gap support balls are disposed in the frame sealant, the lifting layer is projected on a surface of the conductive layer away from the black matrix layer in a first direction to form a projection area, and the frame sealant is located in the projection area.
7. The color filter substrate of claim 6, wherein distances from the frame adhesive to the outer contour of the projection area in the second direction are x1 and x2, respectively, and the ranges of x1 and x2 are as follows: x1 is more than or equal to 0, and x2 is more than or equal to 0.
8. The color filter substrate of any one of claims 1 to 6, wherein the lift-off layer comprises at least one of a red color resist layer, a blue color resist layer, a green color resist layer, and a spacer.
9. A manufacturing method of a color film substrate is provided, the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area comprises a first non-display area facing a double-layer metal wiring area of an array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the manufacturing method of the color film substrate is characterized by comprising the following steps:
providing a substrate, and forming a black matrix layer on the substrate;
forming a lifting layer positioned in a second non-display area on the surface of the black matrix layer, which is far away from the substrate base plate;
and forming a conductive layer on the surface of the black matrix layer, which is far away from the substrate base plate, wherein the conductive layer covers the uplift layer.
10. A display panel, comprising an array substrate and a color filter substrate, wherein the color filter substrate comprises the color filter substrate according to any one of claims 1 to 8, and the color filter substrate is disposed opposite to the array substrate;
or, the display panel includes an array substrate and a color filter substrate, the array substrate is disposed opposite to the color filter substrate, and the color filter substrate is manufactured according to the manufacturing method of the color filter substrate of claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011599879.8A CN112558348B (en) | 2020-12-29 | 2020-12-29 | Color film substrate, manufacturing method of color film substrate and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011599879.8A CN112558348B (en) | 2020-12-29 | 2020-12-29 | Color film substrate, manufacturing method of color film substrate and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112558348A true CN112558348A (en) | 2021-03-26 |
| CN112558348B CN112558348B (en) | 2021-11-30 |
Family
ID=75032953
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011599879.8A Active CN112558348B (en) | 2020-12-29 | 2020-12-29 | Color film substrate, manufacturing method of color film substrate and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112558348B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114200721A (en) * | 2021-12-07 | 2022-03-18 | 昆山龙腾光电股份有限公司 | Display panel, manufacturing method and display device |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101251698A (en) * | 2008-04-07 | 2008-08-27 | 友达光电股份有限公司 | Liquid crystal display panel and method for making the same |
| CN101278228A (en) * | 2005-09-29 | 2008-10-01 | 京瓷株式会社 | Liquid crystal display panel, liquid crystal display device provided with same, and bonding substrate for liquid crystal display panel |
| CN101697043A (en) * | 2009-06-24 | 2010-04-21 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
| CN102760010A (en) * | 2012-05-22 | 2012-10-31 | 友达光电股份有限公司 | Touch display panel and touch liquid crystal display panel |
| CN103293736A (en) * | 2012-09-05 | 2013-09-11 | 上海天马微电子有限公司 | Embedded liquid crystal touch control panel |
| CN203287657U (en) * | 2013-05-30 | 2013-11-13 | 上海天马微电子有限公司 | Embedded-type touch color-film substrate and liquid crystal display |
| CN104216189A (en) * | 2014-09-26 | 2014-12-17 | 南京中电熊猫液晶显示科技有限公司 | Liquid crystal display panel and manufacturing method thereof |
| CN204347396U (en) * | 2014-11-28 | 2015-05-20 | 成都天马微电子有限公司 | A kind of display panels motherboard |
| CN108153013A (en) * | 2018-01-29 | 2018-06-12 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal cell |
| CN110109275A (en) * | 2019-06-10 | 2019-08-09 | 北海惠科光电技术有限公司 | Array substrate and display panel |
| CN110376800A (en) * | 2019-06-11 | 2019-10-25 | 重庆惠科金渝光电科技有限公司 | Array substrate, the production method of array substrate and display panel |
| CN110967877A (en) * | 2019-12-20 | 2020-04-07 | Tcl华星光电技术有限公司 | Display panel |
-
2020
- 2020-12-29 CN CN202011599879.8A patent/CN112558348B/en active Active
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101278228A (en) * | 2005-09-29 | 2008-10-01 | 京瓷株式会社 | Liquid crystal display panel, liquid crystal display device provided with same, and bonding substrate for liquid crystal display panel |
| CN101251698A (en) * | 2008-04-07 | 2008-08-27 | 友达光电股份有限公司 | Liquid crystal display panel and method for making the same |
| CN101697043A (en) * | 2009-06-24 | 2010-04-21 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
| CN102760010A (en) * | 2012-05-22 | 2012-10-31 | 友达光电股份有限公司 | Touch display panel and touch liquid crystal display panel |
| CN103293736A (en) * | 2012-09-05 | 2013-09-11 | 上海天马微电子有限公司 | Embedded liquid crystal touch control panel |
| CN203287657U (en) * | 2013-05-30 | 2013-11-13 | 上海天马微电子有限公司 | Embedded-type touch color-film substrate and liquid crystal display |
| CN104216189A (en) * | 2014-09-26 | 2014-12-17 | 南京中电熊猫液晶显示科技有限公司 | Liquid crystal display panel and manufacturing method thereof |
| CN204347396U (en) * | 2014-11-28 | 2015-05-20 | 成都天马微电子有限公司 | A kind of display panels motherboard |
| CN108153013A (en) * | 2018-01-29 | 2018-06-12 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal cell |
| CN110109275A (en) * | 2019-06-10 | 2019-08-09 | 北海惠科光电技术有限公司 | Array substrate and display panel |
| CN110376800A (en) * | 2019-06-11 | 2019-10-25 | 重庆惠科金渝光电科技有限公司 | Array substrate, the production method of array substrate and display panel |
| CN110967877A (en) * | 2019-12-20 | 2020-04-07 | Tcl华星光电技术有限公司 | Display panel |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114200721A (en) * | 2021-12-07 | 2022-03-18 | 昆山龙腾光电股份有限公司 | Display panel, manufacturing method and display device |
| CN114200721B (en) * | 2021-12-07 | 2024-01-30 | 昆山龙腾光电股份有限公司 | Display panel, manufacturing method and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112558348B (en) | 2021-11-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4473238B2 (en) | Liquid crystal display device and manufacturing method thereof | |
| JP5091355B2 (en) | Liquid crystal display device and manufacturing method thereof | |
| US8525963B2 (en) | Liquid crystal display and method of manufacturing the same | |
| EP2704196A1 (en) | Organic light emitting display and method for manufacturing the same | |
| TWI391733B (en) | Lcd panel and array substrate thereof | |
| US20060221027A1 (en) | Liquid crystal display device | |
| US9104057B2 (en) | Liquid-crystal display (LCD) panel capable of achieving low-temperature display | |
| CN106990594B (en) | Liquid crystal display panel, manufacturing method thereof and display device applied to liquid crystal display panel | |
| KR102085810B1 (en) | Liquid crystal display panel, method of manufacturing the same and liquid crystal display apparatus having the same | |
| CN111367128B (en) | Low-temperature polycrystalline silicon display panel, manufacturing method thereof and liquid crystal display device | |
| KR101574097B1 (en) | Array substrate for Liquid crystal display device | |
| US20170269417A1 (en) | Display device and manufacturing method thereof | |
| CN117631381A (en) | Display panel | |
| CN112558348B (en) | Color film substrate, manufacturing method of color film substrate and display panel | |
| JP4410776B2 (en) | Manufacturing method of liquid crystal display device | |
| TWI402586B (en) | Liquid crystal display panel | |
| CN112558350B (en) | Color film substrate, manufacturing method of color film substrate and display panel | |
| KR101230315B1 (en) | Mold for display device and manufacturing method of dsplay device using the same | |
| CN112596295A (en) | Color film substrate, manufacturing method of color film substrate and display panel | |
| JP2002311439A (en) | Liquid crystal display and its manufacture | |
| JP3987522B2 (en) | Manufacturing method of liquid crystal display device | |
| KR20070047609A (en) | Mold and manufacturing method of dsplay device using thereof | |
| CN207611222U (en) | A kind of display panel and display device | |
| KR101141313B1 (en) | Display panel | |
| CN216958036U (en) | Array substrate, display panel and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |