CN112558350B - Color film substrate, manufacturing method of color film substrate and display panel - Google Patents
Color film substrate, manufacturing method of color film substrate and display panel Download PDFInfo
- Publication number
- CN112558350B CN112558350B CN202011613754.6A CN202011613754A CN112558350B CN 112558350 B CN112558350 B CN 112558350B CN 202011613754 A CN202011613754 A CN 202011613754A CN 112558350 B CN112558350 B CN 112558350B
- Authority
- CN
- China
- Prior art keywords
- substrate
- display area
- layer
- color filter
- black matrix
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133512—Light shielding layers, e.g. black matrix
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13392—Gaskets; Spacers; Sealing of cells spacers dispersed on the cell substrate, e.g. spherical particles, microfibres
Abstract
The invention discloses a color film substrate, a manufacturing method of the color film substrate and a display panel, wherein the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area is defined to comprise a first non-display area facing a double-layer metal wiring area of the array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the color film substrate further comprises: a substrate base plate; the black matrix layer is arranged on one surface of the substrate base plate, and a first bulge part is formed on the surface, deviating from the substrate base plate, of the black matrix layer in the second non-display area; and the conducting layer is arranged on one side of the black matrix layer, which is deviated from the substrate base plate, and is jacked by the first bulge part to form a second bulge part. The technical scheme of the invention aims to ensure that the particle size of the gap supporting balls is uniform when the particle size of the gap supporting balls is calculated by using the longitudinal sections of the first non-display area and the second non-display area, thereby ensuring that the box thickness of the display panel is uniform.
Description
Technical Field
The invention relates to the technical field of display panels, in particular to a color film substrate, a manufacturing method of the color film substrate and a display panel.
Background
A Liquid Crystal Display (LCD) panel is widely used because of its advantages such as thin body, power saving, and no radiation. The TFT-LCD process comprises an array manufacturing project, a color film manufacturing project and a liquid crystal box manufacturing project, wherein the liquid crystal box manufacturing project is completed by transferring the liquid crystal box project together after the array and color film manufacturing projects are completed. The main process of the liquid crystal box manufacturing engineering comprises the steps of coating a liquid crystal orientation layer, dripping liquid crystal, coating frame sealing glue, coating a gold ball, assembling a box in vacuum, cutting and the like. The seal coating (seal) is used for sealing the liquid crystal box, preventing liquid crystal from overflowing and water vapor from invading, maintaining the peripheral thickness of the liquid crystal box and adhering the array substrate and the color film substrate. In order to maintain the thickness of the peripheral box, a certain proportion of spacers are usually added into the sealant. These spacers are usually glass fibre, silicon and plastic balls, and are collectively referred to as space ball (interstitial support ball) by definition.
The array manufacturing process is to form all circuit traces including a display area (AA area for short) and a non-display area. A complete display screen can be roughly divided into: AA area (display area), non-display A area, non-display B area, and drive IC. The non-display area a belongs to a bonding area, i.e., signals are bonded to the metal through an ACF (anisotropic conductive adhesive), and the non-display area a needs to be used for transmitting signals between packaged chips, so that the resistance of signal lines is required to be low, and thus the non-display area a may use WOA (wire on array, where the metal is placed in an array) wiring, i.e., a double-layer metal wiring. The non-display B region needs metal wirings on layout, which is generally called fanout (output) wirings, and the wirings of fanout generally adopt single-layer metal wirings. The space ball is selected to be a fixed grain size, and when the grain size of the space ball is calculated on a vertical plane where a non-display area A (a first non-display area and a double-layer metal wire area) is located, the grain size of the space ball is smaller for a non-display area B (a second non-display area and a single-layer metal wire area); when the space ball particle size is calculated on the vertical plane of the non-display area B, the space ball particle size is too large for the non-display area A, which easily causes uneven thickness of the peripheral box of the display panel.
The above description is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission of prior art.
Disclosure of Invention
The invention mainly aims to provide a color film substrate, a manufacturing method of the color film substrate and a display panel, and aims to enable the particle size of gap supporting balls to be uniform when the particle size of the gap supporting balls is calculated by using longitudinal sections of a first non-display area and a second non-display area, so that the uniform box thickness of the display panel is ensured.
In order to achieve the above object, the color filter substrate provided in the present invention includes a display area and a non-display area surrounding the display area, the non-display area is defined to include a first non-display area directly facing a double-layer metal wiring area of the array substrate and a second non-display area directly facing a single-layer metal wiring area of the array substrate, and the color filter substrate further includes:
a substrate base plate;
the black matrix layer is arranged on one surface of the substrate base plate, and a first bulge part is formed on the surface, away from the substrate base plate, of the black matrix layer in the second non-display area; and
and the conductive layer is arranged on one side of the black matrix layer, which is deviated from the substrate base plate, and is jacked by the first bulge part to form a second bulge part.
Optionally, the color film substrate is defined to have a first direction, and the height of the first protrusion in the first direction is d 1;
defining the height difference of the double-layer metal wiring region and the single-layer metal wiring region of the array substrate in the first direction as d2, wherein the relation between d1 and d2 is as follows: d1/d2 is more than or equal to 0.9 and less than or equal to 1.1.
Optionally, the black matrix layer includes a body layer, the body layer is disposed on a surface of the substrate, and the first protruding portion is protruding from a surface of the body layer facing away from the substrate;
the longitudinal section profile of first bellying is formed with first linkage segment, second linkage segment and the third linkage segment that connects gradually, first linkage segment the third linkage segment connect in the body layer, and with be the contained angle setting between the body layer, the second linkage segment is on a parallel with the horizontal plane setting.
Optionally, the conductive layer has an upper surface and a lower surface in the first direction, and the distance between the upper surface and the lower surface is the same.
Optionally, the color film substrate further includes a frame sealing adhesive and a first gap supporting ball, the first gap supporting ball is disposed in the frame sealing adhesive, and the frame sealing adhesive is disposed on a surface of the second protruding portion deviating from the first protruding portion.
Optionally, the color film substrate is defined to have a second direction perpendicular to the first direction, distances from the frame sealing adhesive to the outer edge of the second protrusion in the second direction are x1 and x2, respectively, and the value ranges of x1 and x2 are: x1 is more than or equal to 0, and x2 is more than or equal to 0.
Optionally, the frame sealing adhesive is spaced from the outer edge of the second protrusion in the second direction by x1 and x2, respectively, and the relationship between x1 and x2 is: x1 ═ x 2.
Optionally, the height of the first gap supporting ball in the first direction is equal to the height of the frame sealing glue in the first direction.
The invention also provides a manufacturing method of the color film substrate, the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area comprises a first non-display area facing the double-layer metal wiring area of the array substrate and a second non-display area facing the single-layer metal wiring area of the array substrate, and the manufacturing method of the color film substrate comprises the following steps:
providing a substrate, and forming a black matrix layer on the substrate;
forming a first bulge on the surface of the black matrix layer, which is far away from the substrate, providing a photomask, and illuminating the raised layer through the photomask to form the black matrix layer positioned in the display area and the first bulge positioned in the second non-display area, wherein the light transmission amount of the photomask in the area for forming the first bulge positioned in the second non-display area is greater than that of the area for forming the black matrix layer of the display area;
and forming a conductive layer on the surface of the black matrix layer, which is far away from the substrate base plate, wherein the conductive layer covers the first bulge part to form a second bulge part.
The invention further provides a display panel, which comprises an array substrate and a color film substrate, wherein the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area is defined to comprise a first non-display area facing a double-layer metal wiring area of the array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the color film substrate further comprises:
a substrate base plate;
the black matrix layer is arranged on one surface of the substrate base plate, and a first bulge part is formed on the surface, away from the substrate base plate, of the black matrix layer in the second non-display area; and
the conducting layer is arranged on one side, away from the substrate base plate, of the black matrix layer and is jacked up by the first bulge to form a second bulge, and the color film base plate is arranged opposite to the array base plate;
or, the display panel includes an array substrate and a color film substrate, the array substrate is arranged opposite to the color film substrate, the color film substrate has a display area and a non-display area surrounding the display area, the non-display area includes a first non-display area facing a double-layer metal wiring area of the array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the manufacturing method of the color film substrate includes the following steps:
providing a substrate, and forming a black matrix layer on the substrate;
forming a first bulge on the surface of the black matrix layer, which is far away from the substrate, providing a photomask, and illuminating the raised layer through the photomask to form the black matrix layer positioned in the display area and the first bulge positioned in the second non-display area, wherein the light transmission amount of the photomask in the area for forming the first bulge positioned in the second non-display area is greater than that of the area for forming the black matrix layer of the display area;
and forming a conductive layer on the surface of the black matrix layer, which is far away from the substrate base plate, wherein the conductive layer covers the first bulge part to form a second bulge part.
According to the technical scheme, the black matrix layer is arranged on the substrate base plate, the first protruding portion is arranged on the surface, away from the substrate base plate, of the black matrix layer and located in the second non-display area, the conducting layer is arranged on the surface, away from the substrate base plate, of the black matrix layer, at least part of the conducting layer covers the first protruding portion and is jacked to form the second protruding portion. Since the first projecting portion is provided in the second non-display region, the second projecting portion is also provided in the second non-display region. It can be understood that, since the first non-display region is disposed facing the double-layered metal wiring region (M1 and M2 layers) of the array substrate and the second non-display region is disposed facing the single-layered metal wiring region (M1 layer) of the array substrate, the double-layered metal wiring region of the array substrate has one more metal than the single-layered wiring region, and thus, when the array substrate is placed on a horizontal plane, the height of the double-layered metal wiring region is higher than that of the single-layered metal wiring region, the first non-display region (region facing the double-layered metal wiring region) is closer to the array substrate, and when the first protrusion is disposed on the second non-display region and the conductive layer is lifted by the first protrusion to form the second protrusion, the height of the second non-display region is increased, thereby reducing the distance between the second non-display region (region facing the single-layered metal wiring region) and the array substrate, therefore, when the particle sizes of the gap supporting balls are calculated on the longitudinal sections of the first non-display area and the second non-display area, the heights of the gap supporting balls are close, and uneven thickness of the peripheral box of the display panel is prevented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention, as viewed from a single-layer metal wiring region of an array substrate to a color film substrate side;
FIG. 2 is a cross-sectional view of one embodiment of a display panel in accordance with the exemplary technology;
FIG. 3 is a cross-sectional view of an embodiment of a color filter substrate at A-A in FIG. 1;
FIG. 4 is a partially exploded view of FIG. 3;
fig. 5 is a schematic structural diagram of a display panel according to an embodiment of the present invention, as viewed from a double-layer metal wiring region of an array substrate to a color film substrate side;
FIG. 6 is a cross-sectional view of an embodiment of the color filter substrate shown in FIG. 5 at B-B;
fig. 7 is a flowchart illustrating a method for manufacturing a color filter substrate according to the present invention.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be described in conjunction with the embodiments, optionally with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a color film substrate 100.
Referring to fig. 1 to 6, a color filter substrate 100 according to the present invention has a display area and a non-display area surrounding the display area, the non-display area is defined to include a first non-display area 101 facing a double-layer metal wiring area 303 of an array substrate 300 and a second non-display area 102 facing a single-layer metal wiring area 304 of the array substrate 300, and the color filter substrate 100 further includes:
a base substrate 10;
the black matrix layer 20 is arranged on one surface of the substrate base plate 10, and a first protruding part 21 is formed on the surface, away from the substrate base plate 10, of the black matrix layer 20 in the second non-display area 102; and
and the conductive layer 30 is arranged on one side of the black matrix layer 20, which is far away from the substrate base plate 10, and is lifted by the first bulge part 21 to form a second bulge part 31.
In an embodiment of the present application, the substrate base plate 10 may also be bendable or foldable. The substrate 10 may be made of a glass substrate or other light-transmitting structure.
A display Area (Active Area), which refers to an Area of the substrate capable of displaying an image, may be disposed in a middle Area of the substrate. The non-display area refers to an area which can not display a display image, and is generally arranged around the display area, and circuit wiring and other driving electronic components are arranged in the non-display area.
According to the technical scheme, the black matrix layer 20 is arranged on the substrate base plate 10, the first protruding portion 21 is arranged on the surface, away from the substrate base plate 10, of the black matrix layer 20, the first protruding portion 21 is located in the second non-display area 102, the conducting layer 30 is arranged on the surface, away from the substrate base plate 10, of the black matrix layer 20, at least part of the conducting layer 30 covers the first protruding portion 21, and the second protruding portion 31 is formed by jacking. Since the first projecting portion 21 is provided in the second non-display region 102, the second projecting portion 31 is also provided in the second non-display region 102. It can be understood that since the first non-display region 101 is disposed facing the double-layered metal wiring region 303(M1 layer and M2 layer, i.e., the gate electrode 301 and the source drain electrode 302) of the array substrate 300 and the second non-display region 102 is disposed facing the single-layered metal wiring region 304(M1 layer, i.e., the gate electrode 301) of the array substrate 300, referring to fig. 6, the double-layered metal wiring region 303 of the array substrate 300 has one more metal than the single-layered wiring region, and thus, when the array substrate 300 is placed on a horizontal plane, the height of the double-layered metal wiring region 303 is higher than that of the single-layered metal wiring region, so that the first non-display region 101 (region facing the double-layered metal wiring region 303) is closer to the array substrate 300, and when the first protrusion 21 is disposed on the second non-display region 102 and the conductive layer 30 is lifted up by the first protrusion 21 to form the second protrusion 31, the height of the second non-display region 102 is raised up, therefore, the distance between the second non-display region 102 (the region facing the single-layer metal wiring region 304) and the array substrate 300 is reduced, so that the heights of the gap supporting balls are relatively close to each other when the particle diameters of the gap supporting balls are calculated on the longitudinal sections of the first non-display region 101 and the second non-display region 102, and uneven box thickness around the display panel 500 is prevented. Thus, the technical scheme of the invention can ensure that the particle sizes of the gap supporting balls are uniform, thereby ensuring that the box thickness of the display panel 500 is uniform.
It is understood that the conductive layer 30 is an ITO conductive film, which is an abbreviation of Indium Tin Oxides. As nano indium tin metal oxide, it has good conductivity and transparency, and can cut off electron radiation, ultraviolet rays and far infrared rays harmful to human body. Therefore, indium tin oxide is generally sprayed on glass, plastic and electronic display panels to serve as a transparent conductive film while reducing electron radiation and ultraviolet and infrared rays harmful to the human body.
The black matrix layer 20 may be a chromium-based material or a resin-based material, and is formed on the base substrate 10 by patterning; the first protrusion portion 21 may be a portion formed by thickening the black matrix layer 20, that is, the first protrusion portion 21 may be formed as an integral structure with the black matrix layer 20.
The surface of the conductive layer 30 facing away from the black matrix layer 20 is further provided with an alignment film (alignment film), which is a thin film having straight scratches and functions to guide the alignment direction of the liquid crystal molecules. For example, on a glass substrate coated with a transparent conductive film (ITO), a PI coating liquid and a roller are used to print a parallel groove on the ITO film, and then the liquid crystal can be horizontally laid in the groove along the direction of the groove, so as to achieve the purpose of arranging the liquid crystal in the same direction. The material of the alignment film needs to have good light transmittance; must be present or partially ionized for ionization; having a covalent or partially covalent linkage; amorphous and good lattice structure. The alignment film may also be raised to form a third raised portion under the lifting action of the second raised portion 31, so as to raise the second non-display area 102.
It should be noted that the technical solution of the embodiment of the present application may also be disposed on the array substrate 300, a specific disposition position of the protrusion may be a portion of the array substrate 300 side corresponding to the second non-display region 102, and the protrusion may be disposed on the conductive layer of the array substrate 300 side, and the protrusion may be formed by being lifted by the substrate of the array substrate 300.
Referring to fig. 3, 4, and 6, in an embodiment of the present disclosure, it is defined that the color filter substrate 100 has a first direction, and a height of the first protrusion 21 in the first direction is d 1;
defining the height difference of the double-layer metal wiring region 303 and the single-layer metal wiring region 304 of the array substrate 300 in the first direction as d2, wherein the relationship between d1 and d2 is as follows: d1/d2 is more than or equal to 0.9 and less than or equal to 1.1.
The first direction is a stacking direction of each layer of the color filter substrate 100 (a direction perpendicular to an extending direction of the color filter substrate 100), and it should be noted that the height of the first protruding portion 21 is a height from an end face of the first protruding portion 21 in the first direction to a surface of the black matrix layer 20 away from the substrate 10; in the array substrate 300, the height difference between the double-layer metal wiring region 303 and the single-layer metal wiring region 304 in the first direction is d2, and since the difference between the double-layer metal wiring region 303 and the single-layer metal wiring region 304 is the M2 metal layer, d2 is the height of the M2 metal layer at both end surfaces in the first direction. When d1/d2 is less than 0.9, the height of the first protrusion 21 is lowered, so that the distance between the second non-display area 102 and the array substrate 300 is far from the distance between the first non-display area 101 and the array substrate 300, and therefore, when the gap supporting balls are calculated on the longitudinal section of the second non-display area 102, the height of the gap supporting balls is close to the height of the gap supporting balls calculated on the longitudinal section of the first non-display area 101, so that the particle size of the gap supporting balls is uneven, and the box thickness of the display panel 500 is affected; when d1/d2 is greater than 1.1, the height of the first protrusion 21 is increased, so that the distance between the second non-display region 102 and the array substrate 300 is different from the distance between the first non-display region 101 and the array substrate 300, and therefore, when the gap-supporting balls are calculated on the vertical section of the second non-display region 102, the height of the gap-supporting balls is close to the height of the gap-supporting balls calculated on the vertical section of the first non-display region 101, which causes the particle size of the gap-supporting balls to be uneven, thereby affecting the cell thickness of the display panel 500. When the value range of d1/d2 is 0.9 to 1.1, the height of the first protrusion 21 is moderate, so that the distance between the second non-display area 102 and the array substrate 300 is moderate to the distance between the first non-display area 101 and the array substrate 300, thereby ensuring that the height of the gap supporting balls is close to the height of the gap supporting balls calculated on the longitudinal section of the first non-display area 101 when the gap supporting balls are calculated on the longitudinal section of the second non-display area 102, ensuring that the particle size of the gap supporting balls is uniform, and the box thickness of the display panel 500 is uniform. It can be understood that when the value of d1/d2 is 0.92, 0.95, 0.96, 0.98, 0.99, 1, 1.02, 1.05, 1.07, 1.09, or any value therebetween, the height of the first protrusion 21 is moderate, so that the distance from the second non-display region 102 to the array substrate 300 is moderate different from the distance from the first non-display region 101 to the array substrate 300, thereby ensuring that when the gap supporting balls are calculated on the longitudinal section of the second non-display region 102, the height of the gap supporting balls is close to that calculated on the longitudinal section of the first non-display region 101, ensuring that the particle diameters of the gap supporting balls are uniform, and the box thickness of the display panel 500 is uniform.
Referring to fig. 4, in an embodiment of the present application, the black matrix layer 20 includes a body layer 22, the body layer 22 is disposed on a surface of the substrate 10, and the first protrusion 21 is protruded from a surface of the body layer 22 facing away from the substrate 10;
the longitudinal section profile of first bellying 21 is formed with first linkage segment 211, second linkage segment 212 and the third linkage segment 213 that connects gradually, first linkage segment 211 third linkage segment 213 connect in body layer 22, and with be the contained angle setting between the body layer 22, second linkage segment 212 is on a parallel with the horizontal plane setting.
In this embodiment, the profile of the longitudinal cross section of the first protruding portion 21 is a trapezoid with a narrow top and a wide bottom, so that by providing the first protruding portion 21, the film quality of the conductive layer 30 corresponding to the inclined portion of the first protruding portion 21 is loose, that is, the film quality of the conductive layer 30 corresponding to the first connection section 211 and the third connection section 213 of the first protruding portion 21 is loose, when exposure processing is performed, the loose film quality portion is easily and smoothly transited, and the formation of the second protruding portion 31 is ensured, so that when the gap-supporting ball is calculated on the longitudinal cross section of the second non-display area 102, the height of the gap-supporting ball is similar to that calculated on the longitudinal cross section of the first non-display area 101, the particle size of the gap-supporting ball is ensured to be uniform, and the box thickness of the display panel 500 is uniform. The height of the first protruding portion 21 is the height from the end face of the first protruding portion 21 in the first direction to the surface of the body layer 22 away from the substrate 10.
Referring to fig. 4, in an embodiment of the present application, the conductive layer 30 has an upper surface and a lower surface in the first direction, and a distance between the upper surface and the lower surface is the same. That is, the thickness of the conductive layer 30 at the portion where the second protrusion 31 is formed is the same as the thickness of the portion where the second protrusion 31 is not formed, so that in the case where the first protrusion 21 is provided on the black matrix layer 20, the conductive layer 30 is ensured to have a flat layer structure, and the influence on the characteristics of a Thin Film Transistor (TFT) due to the difference in thickness of each portion of the conductive layer 30 is avoided.
Referring to fig. 2 to 4, the color film substrate 100 further includes a frame sealing adhesive 40 and first gap supporting balls 50, the first gap supporting balls 50 are disposed in the frame sealing adhesive 40, and the frame sealing adhesive 40 is disposed on a surface of the second protruding portion 31 deviating from the first protruding portion 21.
The frame sealing adhesive 40 is an adhesive, which bonds the upper and lower substrates (the color film substrate 100 and the array substrate 300) of the liquid crystal display while maintaining a certain gap, and then seals the filled liquid crystal so that it cannot leak and prevent external contaminants from entering, and is the frame sealing adhesive 40, which is also called as edge sealing adhesive. The frame sealing glue 40 for the LCD mainly includes two types: thermal curable adhesives and Ultraviolet (UV) curable adhesives. The two glues differ mainly in their curing pattern. The application of the heat-cured adhesive is wider. However, when the high-precision liquid crystal display screen is manufactured, the UV curing adhesive is superior to the thermal curing adhesive in curing time, adhesion force, humidity resistance, heat resistance and the like. In particular, the curing time is short, the production period is shortened, and the dislocation of two pieces of glass in the long-time curing process is prevented. The UV curing adhesive can be selected, the components of the UV curing adhesive are denatured acrylate compounds, and the UV curing adhesive is yellowish viscous liquid in appearance. When the UV curing adhesive works, the colloidal UV curing adhesive is uniformly coated on the frame position of the surface of the upper glass, after the upper substrate and the lower substrate are bonded, the ultraviolet light is used for irradiating to ensure that the adhesive is mutually crosslinked into a stable net structure from a linear macromolecular structure, and the UV curing adhesive has strong adhesive capacity, so that the two substrates are bonded together. The frame sealing glue 40 is provided with the gap supporting balls to increase the supporting force of the frame sealing glue 40, and it can be understood that the gap supporting balls include the first gap supporting balls 50 located in the second non-display region 102 and the second gap supporting balls 60 located in the first non-display region 101, and when the first protruding portion 21 is used for jacking the conductive layer 30 to form the second protruding portion 31, the particle diameters of the first gap supporting balls 50 and the second gap supporting balls 60 are similar, so that the uniform thickness of the display panel 500 is ensured.
Referring to fig. 3 and 4, in an embodiment of the present disclosure, the color film substrate 100 is defined to have a second direction perpendicular to the first direction, distances x1 and x2 from the outer edge of the second protrusion 31 in the second direction of the frame sealing adhesive 40 are respectively defined, and the value ranges of x1 and x2 are as follows: x1 is more than or equal to 0, and x2 is more than or equal to 0. It should be noted that the second direction is an extending direction (horizontal direction) of the substrate 10, and when viewed in the first direction, the outer contour of the sealant 40 is disposed in the region formed by enclosing the outer edge of the second protrusion 31, the form of the sealant 40 disposed in the region of the outer edge of the second protrusion 31 may be a complete inclusion in a shape of "hui" or a partial inclusion in a shape of "mu" (a part of the outer contour of the sealant 40 may coincide with a part of the outer contour of the outer edge of the second protrusion 31, and the outer contour of the other part of the sealant 40 is disposed in the outer contour of the other part of the second protrusion 31), which is specifically set according to the actual structure of the product, as long as the sealant 40 is disposed at the position where the second protrusion 31 is laid. By such arrangement, the frame sealing adhesive 40 can be completely located in the second non-display region 102, on one hand, sealing of the liquid crystal is facilitated, and the box thickness is formed, and on the other hand, in order to ensure that the gap supporting balls in the coated frame sealing adhesive 40 correspond to the outer edge of the second protrusion portion 31 in the enclosing forming region, the width of the second protrusion portion 31 should be the sum of the width of the frame sealing adhesive 40 and the coating error of the frame sealing adhesive 40. The arrangement is such that when the gap supporting balls are calculated on the longitudinal section of the second non-display area 102, the height of the gap supporting balls is close to that calculated on the longitudinal section of the first non-display area 101, so as to ensure uniform particle size of the gap supporting balls and uniform box thickness of the display panel 500.
In an embodiment of the present application, the relationship between x1 and x2 is: x1 ═ x 2. By such arrangement, the frame sealing adhesive 40 can be disposed in the middle of the second protrusion portion 31, so that the frame sealing adhesive 40 is prevented from being excessively close to one side of the second protrusion portion 31, which results in a reduction in sealing performance, and is not beneficial to being jacked by the first protrusion portion 21 and the second protrusion portion 31 to reduce the gap between the frame sealing adhesive and the array substrate 300.
Referring to fig. 2 to 4, in an embodiment of the present application, a height of the first gap supporting balls 50 in the first direction is equal to a height of the sealant 40 in the first direction. The frame sealing glue 40 can be supported well by the arrangement, and the strength of the gap supporting balls is superior to that of the frame sealing glue 40, so that the box thickness formed by the display panel 500 is better.
Referring to fig. 7, the present invention further provides a manufacturing method of a color filter substrate 100, where the color filter substrate 100 has a display area and a non-display area surrounding the display area, the non-display area includes a first non-display area 101 directly facing a double-layer metal wiring area 303 of an array substrate 300 and a second non-display area 102 directly facing a single-layer metal wiring area 304 of the array substrate 300, and the manufacturing method of the color filter substrate 100 includes the following steps:
step S10, providing a base substrate 10, and forming a black matrix layer 20 on the base substrate 10; it is understood that the black matrix layer 20 is made of one of an organic photoresist, an opaque metal, a metal oxide and a nitride, and can block light or reflect light back; when the black matrix layer 20 is an organic photoresist, the black matrix layer 20 may be formed by using techniques such as a dispenser, screen printing, nozzle printing, ink jet printing, and the like; when the black matrix layer 20 is made of metal or metal oxide, the black matrix layer 20 may be formed by using a thermal evaporation process, a magnetron sputtering process, a vapor deposition process, or the like; when the black matrix layer 20 is made of metal or metal oxide, the black matrix layer 20 may be formed by using a thermal evaporation process, a magnetron sputtering process, a vapor deposition process, or the like.
Step S20, forming a first protrusion 21 on the surface of the black matrix layer 20 away from the substrate 10, providing a mask, and illuminating the raised layer through the mask to form the black matrix layer 20 in the display area and the first protrusion 21 in the second non-display area 102, wherein the light transmittance of the mask in the area for forming the first protrusion 21 in the second non-display area 102 is greater than the light transmittance of the area for forming the black matrix layer 20 in the display area;
in an embodiment of the present application, a light-transmitting region with a larger light-transmitting amount may be disposed on the mask of the second non-display region 102, so as to form the first protrusion 21 of the black matrix layer 20 with a height higher than that of the display region. Specifically, in an embodiment of the present application, the step of forming the first protrusion 21 on the surface of the black matrix layer 20 away from the substrate base plate 10 includes:
coating a positive photoresist on the surface of the black matrix layer 20, which is far away from the substrate;
vacuum drying the black matrix layer 20 coated with the positive photoresist;
removing the edge photoresist of the dried black matrix layer 20, and performing baking and cooling;
the black matrix layer 20 is exposed by a mask, wherein the mask in the second non-display area 102 has a larger transmittance, for example, the mask in the first display area 101 has a transmittance of partial light, and the mask in the second non-display area 102 has a transmittance of full light. Alternatively, the reduction of the partial ultraviolet transmittance may be achieved by using a semi-permeable film of a Tone Mask (Tone Mask) or diffraction of light so that the light transmission received by the second non-display region 102 is bright, and the black matrix layer 20 at the second non-display region 102 is cured more in the first direction due to the larger amount of light transmission at the second non-display region 102, so that the first protrusion portion 21 having a larger thickness in the first direction may be made.
And then developing and etching the black matrix layer 20 after exposure, and finally removing the photoresist to form the black matrix layer 20.
In step S30, a conductive layer 30 is formed on the surface of the black matrix layer 20 away from the base substrate 10, wherein the conductive layer 30 covers the first protruding portion 21 to form the second protruding portion 31. The conductive layer 30 may be formed on the surface of the black matrix layer 20 away from the substrate 10 by magnetron sputtering or evaporation.
When the first protruding portion 21 is disposed in the second non-display region 102 and the conductive layer 30 is lifted by the first protruding portion 21 to form the second protruding portion 31, the height of the second non-display region 102 is raised, so that the distance between the second non-display region 102 (the region directly facing the single-layer metal wiring region 304) and the array substrate 300 is reduced, and therefore, when the particle size of the gap supporting balls is calculated on the longitudinal section of the first non-display region 101 and the second non-display region 102, the height of the gap supporting balls can be relatively close, and uneven box thickness around the display panel 500 is prevented.
Referring to fig. 1 to 6, the present invention further provides a display panel 500, where the display panel 500 includes an array substrate 300 and a color filter substrate 100, the color filter substrate 100 has a display area and a non-display area surrounding the display area, the non-display area is defined to include a first non-display area 101 facing a double-layer metal wiring area 303 of the array substrate 300 and a second non-display area 102 facing a single-layer metal wiring area 304 of the array substrate 300, and the color filter substrate 100 further includes:
a base substrate 10;
the black matrix layer 20 is arranged on one surface of the substrate base plate 10, and a first protruding part 21 is formed on the surface, away from the substrate base plate 10, of the black matrix layer 20 in the second non-display area 102; and
and the conductive layer 30 is arranged on one side of the black matrix layer 20, which is far away from the substrate base plate 10, and is lifted by the first bulge part 21 to form a second bulge part 31. The color film substrate 100 is arranged opposite to the array substrate 300;
or, the display panel 500 includes an array substrate 300 and a color filter substrate 100, the array substrate 300 is disposed opposite to the color filter substrate 100, the color filter substrate 100 has a display area and a non-display area surrounding the display area, the non-display area includes a first non-display area 101 facing a double-layer metal wiring area 303 of the array substrate 300 and a second non-display area 102 facing a single-layer metal wiring area 304 of the array substrate 300, and the manufacturing method of the color filter substrate 100 includes the following steps:
providing a substrate 10, and forming a black matrix layer 20 on the substrate 10;
forming a first convex part 21 on the surface of the black matrix layer 20, which is far away from the substrate base plate 10, providing a photomask, and illuminating the raised layer through the photomask to form the black matrix layer 20 positioned in the display area and the first convex part 21 positioned in the second non-display area 102, wherein the light transmission amount of the photomask in the area for forming the first convex part 21 positioned in the second non-display area 102 is greater than that of the area for forming the black matrix layer 20 in the display area;
a conductive layer 30 is formed on the surface of the black matrix layer 20 away from the substrate 10, wherein the conductive layer 30 covers the first protruding portion 21 to form a second protruding portion 31.
Since the display panel 500 adopts all the technical solutions of all the embodiments, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area is defined to comprise a first non-display area facing a double-layer metal wiring area of an array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the color film substrate is characterized by further comprising:
a substrate base plate;
the black matrix layer is arranged on one surface of the substrate base plate, and a first bulge part is formed on the surface, away from the substrate base plate, of the black matrix layer in the second non-display area; and
the conducting layer is arranged on one side, away from the substrate base plate, of the black matrix layer and is jacked up by the first bulge part to form a second bulge part;
the color film substrate further comprises a frame sealing glue and a first gap supporting ball, the first gap supporting ball is arranged in the frame sealing glue, and the frame sealing glue is arranged on the surface of the second protruding portion, which deviates from the first protruding portion.
2. The color filter substrate of claim 1, wherein the color filter substrate is defined to have a first direction, and the height of the first protrusion in the first direction is d 1;
defining the height difference of the double-layer metal wiring region and the single-layer metal wiring region of the array substrate in the first direction as d2, wherein the relation between d1 and d2 is as follows: d1/d2 is more than or equal to 0.9 and less than or equal to 1.1.
3. The color filter substrate according to claim 1, wherein the black matrix layer comprises a body layer, the body layer is disposed on a surface of the substrate, and the first protruding portion is convexly disposed on a surface of the body layer away from the substrate;
the longitudinal section profile of first bellying is formed with first linkage segment, second linkage segment and the third linkage segment that connects gradually, first linkage segment the third linkage segment connect in the body layer, and with be the contained angle setting between the body layer, the second linkage segment is on a parallel with the horizontal plane setting.
4. The color filter substrate of claim 1, wherein the conductive layer has an upper surface and a lower surface in the first direction, and the distances between the upper surface and the lower surface are the same.
5. The color filter substrate according to any one of claims 1 to 4, wherein the color filter substrate is defined to have a first direction, the color filter substrate is defined to have a second direction perpendicular to the first direction, the distances from the frame sealing adhesive to the outer edge of the second protrusion in the second direction are x1 and x2, respectively, and the ranges of the values of x1 and x2 are: x1 is more than or equal to 0, and x2 is more than or equal to 0.
6. The color filter substrate according to any one of claims 1 to 4, wherein the color filter substrate is defined to have a first direction, the color filter substrate is defined to have a second direction perpendicular to the first direction, the frame sealing glue is spaced from the outer edge of the second protrusion in the second direction by x1 and x2, respectively, and the relationship between x1 and x2 is as follows: x1= x 2.
7. The color filter substrate according to any one of claims 1 to 4, wherein the color filter substrate is defined to have a first direction, and a height of the first gap support balls in the first direction is equal to a height of the frame sealant in the first direction.
8. A manufacturing method of a color film substrate is provided, the color film substrate is provided with a display area and a non-display area surrounding the display area, the non-display area comprises a first non-display area facing a double-layer metal wiring area of an array substrate and a second non-display area facing a single-layer metal wiring area of the array substrate, and the manufacturing method of the color film substrate is characterized by comprising the following steps:
providing a substrate, forming a black matrix layer on the substrate, wherein the black matrix layer is positioned in a display area and a second non-display area, and forming a first bulge part on the surface of the black matrix layer of the second non-display area, which is deviated from the substrate; wherein, the light transmission amount of the photomask in the area for forming the first bulge part positioned in the second non-display area is larger than that of the area for forming the black matrix layer of the display area;
and forming a conductive layer on the surface of the black matrix layer, which is far away from the substrate base plate, wherein the conductive layer covers the first bulge part to form a second bulge part.
9. A display panel, comprising an array substrate and a color filter substrate, wherein the color filter substrate comprises the color filter substrate according to any one of claims 1 to 7, and the color filter substrate is disposed opposite to the array substrate;
or, the display panel includes an array substrate and a color filter substrate, the array substrate is disposed opposite to the color filter substrate, and the color filter substrate is manufactured according to the manufacturing method of the color filter substrate of claim 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011613754.6A CN112558350B (en) | 2020-12-29 | 2020-12-29 | Color film substrate, manufacturing method of color film substrate and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011613754.6A CN112558350B (en) | 2020-12-29 | 2020-12-29 | Color film substrate, manufacturing method of color film substrate and display panel |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112558350A CN112558350A (en) | 2021-03-26 |
| CN112558350B true CN112558350B (en) | 2021-11-30 |
Family
ID=75034699
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011613754.6A Active CN112558350B (en) | 2020-12-29 | 2020-12-29 | Color film substrate, manufacturing method of color film substrate and display panel |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112558350B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113467142B (en) * | 2021-06-16 | 2023-10-31 | Tcl华星光电技术有限公司 | Display panel and display terminal |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376800A (en) * | 2019-06-11 | 2019-10-25 | 重庆惠科金渝光电科技有限公司 | Array substrate, the production method of array substrate and display panel |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4362250B2 (en) * | 2001-10-16 | 2009-11-11 | Ｎｅｃ液晶テクノロジー株式会社 | Liquid crystal display device and manufacturing method thereof |
| CN101762910B (en) * | 2005-09-29 | 2012-06-13 | 京瓷株式会社 | Liquid crystal display panel, liquid crystal display device provided with same, and bonding substrate for liquid crystal display panel |
| CN101251698B (en) * | 2008-04-07 | 2011-09-21 | 友达光电股份有限公司 | Liquid crystal display panel and method for making the same |
| US20110205473A1 (en) * | 2009-01-09 | 2011-08-25 | Tomoshige Oda | Liquid crystal display panel |
| CN101697043A (en) * | 2009-06-24 | 2010-04-21 | 深超光电（深圳）有限公司 | Liquid crystal display panel |
| TWI477851B (en) * | 2012-05-22 | 2015-03-21 | Au Optronics Corp | Touch sensing display panel and touch sensing liquid crystal display panel |
| CN103293736B (en) * | 2012-09-05 | 2015-12-16 | 上海天马微电子有限公司 | Embedded liquid crystal touch panel |
| CN203287657U (en) * | 2013-05-30 | 2013-11-13 | 上海天马微电子有限公司 | Embedded-type touch color-film substrate and liquid crystal display |
| CN104216189B (en) * | 2014-09-26 | 2017-04-19 | 南京中电熊猫液晶显示科技有限公司 | Liquid crystal display panel and manufacturing method thereof |
| CN204347396U (en) * | 2014-11-28 | 2015-05-20 | 成都天马微电子有限公司 | A kind of display panels motherboard |
| US20180307071A1 (en) * | 2017-04-24 | 2018-10-25 | HKC Corporation Limited | Liquid crystal display panel, manufacturing method thereof, and display device applied thereto |
| CN108153013B (en) * | 2018-01-29 | 2020-11-03 | 深圳市华星光电半导体显示技术有限公司 | Liquid crystal box |
| CN110109275B (en) * | 2019-06-10 | 2021-10-01 | 北海惠科光电技术有限公司 | Array substrate and display panel |
| CN110967877A (en) * | 2019-12-20 | 2020-04-07 | Tcl华星光电技术有限公司 | Display panel |
-
2020
- 2020-12-29 CN CN202011613754.6A patent/CN112558350B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376800A (en) * | 2019-06-11 | 2019-10-25 | 重庆惠科金渝光电科技有限公司 | Array substrate, the production method of array substrate and display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112558350A (en) | 2021-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4473238B2 (en) | Liquid crystal display device and manufacturing method thereof | |
| TWI391733B (en) | Lcd panel and array substrate thereof | |
| US8004620B2 (en) | Display device | |
| CN108919579B (en) | Liquid crystal display panel and preparation method thereof | |
| US7580092B2 (en) | Liquid crystal display device and method for fabricating the same | |
| US8525963B2 (en) | Liquid crystal display and method of manufacturing the same | |
| US20160011445A1 (en) | Display panel | |
| US20120094413A1 (en) | Liquid crystal display apparatus and method of manufacturing the same | |
| US9104057B2 (en) | Liquid-crystal display (LCD) panel capable of achieving low-temperature display | |
| US10353253B2 (en) | Mounting substrate and display device | |
| CN106990594B (en) | Liquid crystal display panel, manufacturing method thereof and display device applied to liquid crystal display panel | |
| US9933646B2 (en) | Display device and manufacturing method thereof | |
| CN111367128B (en) | Low-temperature polycrystalline silicon display panel, manufacturing method thereof and liquid crystal display device | |
| US9360728B2 (en) | Liquid crystal display panel and method of manufacturing the same | |
| CN117631381A (en) | Display panel | |
| CN112558350B (en) | Color film substrate, manufacturing method of color film substrate and display panel | |
| JP4410776B2 (en) | Manufacturing method of liquid crystal display device | |
| CN112558348B (en) | Color film substrate, manufacturing method of color film substrate and display panel | |
| US8040474B2 (en) | Mold and method of manufacturing display device | |
| CN112596295A (en) | Color film substrate, manufacturing method of color film substrate and display panel | |
| TWI379131B (en) | System for displaying images and manufacturing method of the same | |
| CN212540969U (en) | Micron narrow-frame display device | |
| KR20070047609A (en) | Mold and manufacturing method of dsplay device using thereof | |
| CN207611222U (en) | A kind of display panel and display device | |
| CN113341606A (en) | Color film substrate, manufacturing method of color film substrate and display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |