CN204347396U - A kind of display panels motherboard - Google Patents
A kind of display panels motherboard Download PDFInfo
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- CN204347396U CN204347396U CN201420735139.6U CN201420735139U CN204347396U CN 204347396 U CN204347396 U CN 204347396U CN 201420735139 U CN201420735139 U CN 201420735139U CN 204347396 U CN204347396 U CN 204347396U
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Abstract
The utility model provides a kind of display panels motherboard, comprises the display panels of multiple arrangement in matrix, comprises the array motherboard and color film motherboard that are oppositely arranged; Corresponding multiple described display panels, is provided with close-shaped main frame glue, at display panels to be outside equipped with auxiliary frame glue between described array motherboard and color film motherboard; In main frame glue region, be provided with laying in the first lower liner layer, first, the first stilt; In auxiliary frame glue region, be provided with laying on second, the second lower liner layer, the second stilt; On described first laying, the first stilt, the first lower liner layer height and with the height of laying, the second stilt, the second lower liner layer on described second and equal.
Description
Technical field
The utility model relates to field of liquid crystal display, particularly a kind of display panels motherboard.
Background technology
Liquid crystal display is due to thin and light and have and can use low voltage drive and the little advantage of power consumption and be widely used in various electronic equipment in recent years.General display panels for TV and personal computer is formed for enclosing liquid crystal between two oppositely disposed transparency carriers.In a substrate, pixel electrode and thin film transistor (TFT) (TFT) is formed in each pixel region, and formed on another substrate with pixel electrode in the face of ground color filter and the public electrode shared by each pixel, and Polarizer be adhered to each transparency carrier on the opposition side of side.
The making of display panels first forms the motherboard of liquid crystal display comprising multiple display panels, then forms single display panels by cutting technique.But in prior art, often there will be the problem that cutting is bad when cutting liquid LCD panel motherboard, comprise the rear display panels periphery color exception of cutting, collapse angle, collapse the problem such as limit, liquid crystal leakage.
Utility model content
As described above, in prior art, often there will be the problem that cutting is bad when cutting liquid LCD panel motherboard, comprise the rear display panels periphery color exception of cutting, collapse angle, collapse the problems such as limit.Inventor of the present utility model is found by test of many times, and to be that the height in main frame glue region and auxiliary frame glue region is inconsistent cause this problem Producing reason.
Fig. 1 is the vertical view of display panels motherboard in prior art, and Fig. 2 is the sectional view along AA' line in Fig. 1.In the manufacture process of display panels, first on a motherboard, such as on color film motherboard 100, be coated with main frame glue 104, described main frame glue 104 is coated with around display panels region 108, while the main frame glue 104 of coating, also can be coated with some auxiliary frame glue 102 in non-liquid crystal display panel areas.Then main frame glue 104 around display panels region 108 in drip solution crystal layer, afterwards by another motherboard, be such as array motherboard 101, fit opposed for array motherboard 101 with color film motherboard 100.In each display panels region 108, inside array motherboard 101, inside color film motherboard 100 and main frame glue 104 form confined space be filled with liquid crystal layer within it.In main frame glue 104, be provided with the first stilt 105, its effect is that the periphery box of support display panels is thick.The effect of auxiliary frame glue 102 is played a supporting role when cutting liquid LCD panel motherboard, and the height that its inside is provided with the second stilt 103, second stilt 103 is identical with the height of the first stilt 105.But in main frame glue 104 setting area, the inner side of its color film motherboard 100 facing arrays motherboard 101 is provided with liner 106, the inner side of the relatively color film motherboard 100 of array motherboard 101 is provided with lower liner 107, the stilt 105 of main frame glue 104 is arranged between liner 106 and lower liner 107, and liner and lower liner are not gone up in auxiliary frame glue 102 setting area, this just causes main frame glue 104 region and the inconsistent problem of auxiliary frame glue 102 region height.When cutting, when break bar 109 applies pressure to color film motherboard 100, auxiliary frame glue 102 region is under pressure, because of the insufficient height of the second stilt 103, color film motherboard 100 will be out of shape downwards in auxiliary frame glue 102 region, drive the color film motherboard 100 in main frame glue 104 region to upwarp, this just causes the color exception formed because of in uneven thickness simultaneously, also can be formed further collapse angle, to collapse limit, liquid crystal leakage etc. bad.
For the problems referred to above, the utility model provides a kind of display panels motherboard, and comprise the display panels of multiple arrangement in matrix, described display panels motherboard comprises the array motherboard and color film motherboard that are oppositely arranged; Corresponding multiple described display panels, close-shaped main frame glue is provided with between described array motherboard and color film motherboard, in the region of each display panels, inside array motherboard, inside color film motherboard and main frame glue form confined space be filled with liquid crystal layer within it; In main frame glue setting area, the inner side of described array motherboard is provided with the first lower liner layer, and the inner side of described color film motherboard is provided with laying on first, and described first lower liner layer and first is provided with the first stilt between laying; At display panels with exterior domain, auxiliary frame glue is also provided with between described array motherboard and color film motherboard, in auxiliary frame glue setting area, the inner side of described array motherboard is provided with the second lower liner layer, the inner side of described color film motherboard is provided with laying on second, and described second lower liner layer and second is provided with the second stilt between laying; On described first laying, the first stilt, the first lower liner layer height and with the height of laying, the second stilt, the second lower liner layer on described second and equal.
Preferably, described color film motherboard is provided with black light shield layer and color blocking layer towards the inner side of described array motherboard, and on described second, on laying and first, laying comprises one or more layers in black light shield layer and color blocking layer respectively.
Preferably, in the forming process of color film motherboard, on described second, on laying and first, laying is formed in same process step simultaneously.
Preferably, described array motherboard is provided with pel array towards the inner side of described color film motherboard, described pel array comprises gate metal layer, gate insulator, source-drain electrode metal level, passivation layer, pixel electrode layer, described second lower liner layer and the first lower liner layer comprise in gate metal layer, gate insulator, source-drain electrode metal level, passivation layer, pixel electrode layer respectively one or more layers.
Preferably, in the forming process of array motherboard, described second lower liner layer and the first lower liner layer are formed in same process step simultaneously.
Preferably, on described second, liner or the second lower liner layer comprise photic zone, and on described second, the photic zone area of liner or the second lower liner is more than or equal to 30% of described auxiliary frame glue setting area area.
Preferably, on described second, the photic zone of liner or the second lower liner layer is hollow out figure, and described hollow out figure is circle, rectangle, rhombus, parallelogram or irregular figure.
Preferably, on described second, on laying and first, the height of laying is equal, and the height of described second lower liner layer and the first lower liner layer is equal, and the height of described first stilt and the second stilt is equal.
Preferably, described first stilt and the second stilt are spherical stilt, or described first stilt and the second stilt are photoetching stilt.
Preferably, multiple described display panels is divided into multiple cut zone, and each cut zone is provided with described auxiliary frame glue; The auxiliary frame glue of the every side of described cut zone is one or more of; Auxiliary frame glue around cut zone interconnects or is not interconnected.
Accompanying drawing explanation
Fig. 1 is the vertical view of display panels motherboard in prior art;
Fig. 2 is the sectional view along AA' line in Fig. 1;
The vertical view of the display panels motherboard that Fig. 3 provides for this use new embodiment one;
Fig. 4 is the sectional view along BB' line in Fig. 3;
Fig. 5 is the schematic diagram of the another kind of embodiment of stilt;
The schematic cross-section of the display panels motherboard that Fig. 6 provides for embodiment two;
Fig. 7 is the structural representation of the second lower liner layer in embodiment two.
Embodiment
Embodiment one
The utility model embodiment one provides a kind of display panels motherboard, please refer to accompanying drawing, the vertical view of the display panels motherboard that Fig. 3 provides for the utility model embodiment one, and Fig. 4 is the sectional view along BB' line in Fig. 3.
The display panels motherboard that the utility model embodiment one provides comprises: the display panels 208 of multiple arrangement in matrix, and described multiple display panels 208 is pasted by the array motherboard 201 be oppositely arranged and color film motherboard 200 and formed.Particularly, corresponding multiple described display panels 208, close-shaped main frame glue 204 is provided with between described array motherboard 201 and color film motherboard 200, in the region of each display panels 208, inside array motherboard 201, inside color film motherboard 200 and main frame glue 204 form confined space be filled with liquid crystal layer within it.
In main frame glue 204 setting area, the inner side of described array motherboard 201 is provided with the first lower liner layer 207, the inner side of described color film motherboard 200 is provided with laying 206 on first, and described first lower liner layer 207 and first is provided with the first stilt 2051 between laying 207; At display panels 208 with exterior domain, auxiliary frame glue 202 is also provided with between described array motherboard 201 and color film motherboard 200, in auxiliary frame glue 202 setting area, the inner side of described array motherboard 201 is provided with the second lower liner layer 2021, the inner side of described color film motherboard 200 is provided with laying 2022 on second, and described second lower liner layer 2021 and second is provided with the second stilt 2031 between laying 2022.
On described first, the height of laying 206, first stilt 2051, first lower liner layer 207 is equal with H2 with the height of laying on described second 2022, second stilt 2031, second lower liner layer 2021 with H1.
In embodiment one, because between array motherboard 201 and color film motherboard 200, laying 206 on first, first stilt 2051, laying 2022 on the height of the first lower liner layer 207 and H1 and described second, second stilt 2031, the height of the second lower liner layer 2021 is equal with H2, therefore main frame glue 204 and auxiliary frame glue 202 can have identical bearing height, in cutting process, auxiliary frame glue 202 can well bear break bar applied pressure and can not cause the distortion of color film motherboard 200, therefore box thickness ununiformity of the prior art can be avoided even, color exception, collapse angle, collapse limit, the bad problem such as liquid crystal leakage.
The mode arranging the height of laying 206, first stilt 2051, first lower liner layer 207 on first equal with H2 with the height of laying on described second 2022, second stilt 2031, second lower liner layer 2021 with H1 has multiple, and the height that can arrange each unequal, the first lower liner layer 207 of the height of each unequal, the first stilt 2051 of the height of laying 2022 on laying on first 206 and second and the second stilt 2031 and the second lower liner layer 2021 is each unequal; Also can to arrange on first in laying 206, first stilt 2051, first lower liner layer 207, second section components height in laying 2022, second stilt 2031, second lower liner layer 2021 equal, section components height is unequal.Preferably, in embodiment one, on described second, on laying 2022 and first, the height of laying 206 is equal, and the height of described second lower liner layer 2021 and the first lower liner layer 207 is equal, and the height of described first stilt 2051 and the second stilt 2031 is equal.
Described multiple display panels 208 is divided into multiple cut zone, than cut zone A1 as shown in Figure 3, cut zone A2, cut zone A3 and cut zone A4, preferably, each cut section is provided with auxiliary frame glue 202.In cutting technique, first each cut section is needed mutually to cut open, because distant between the mutually adjacent display panels 208 of adjacent two cut sections, therefore need to arrange auxiliary frame glue 202 as strong point during cutting, otherwise motherboard easily breaks.Each cut section is provided with auxiliary frame glue 202, in auxiliary frame glue 202 setting area, be provided with laying and the second stilt in the second lower liner layer as above, second, the box thickness ununiformity caused when cut section can be avoided to cut is even, color exception, collapse angle, collapse the bad problem such as limit, liquid crystal leakage.In structure shown in Fig. 3, described auxiliary frame glue 202 is open loop structure, and the many auxiliary frame glue 202 namely around a cut section do not connect mutually.Alternatively, described auxiliary frame glue 202 can also be closed loop configuration, and is namely interconnected to form an airtight annular around many auxiliary frame glue of a cut section.Alternatively, the auxiliary frame glue of the every side of described cut zone can be one or more of.
Please refer to Fig. 4, in embodiment one, described first stilt 2051 and the second stilt 2031 are spherical stilt, by the spherical stilt that adulterates in frame glue in advance, then be respectively formed in the first lower liner layer 207, first between laying 206 when the main frame glue 204 of coating and auxiliary frame glue 202, and be formed in the second lower liner layer 2021, second between laying 2022.Then please refer to Fig. 5, is the schematic diagram of the another kind of embodiment of stilt, in another embodiment, other structures are identical with embodiment one, repeat no more, and embodiment one difference is, the first stilt 2052 and the second stilt 2032 are all photoetching stilt herein.First stilt 2052 and the second stilt 2032 are in the forming process of color film motherboard or array motherboard, are formed on color film motherboard or array motherboard by photoetching process.Compared to the spherical stilt that adulterates in frame glue, photoetching stilt possesses more uniform density, and position not easily changes, and possesses better support effect.
Embodiment two
The utility model embodiment two provides a kind of display panels motherboard, please refer to Fig. 6, is the schematic cross-section of the display panels motherboard that embodiment two provides.
The display panels motherboard that the utility model embodiment two provides comprises: the display panels 308 of multiple arrangement in matrix, and described multiple display panels 308 is pasted by the array motherboard 301 be oppositely arranged and color film motherboard 300 and formed.Particularly, corresponding multiple described display panels, close-shaped main frame glue 304 is provided with between described array motherboard 301 and color film motherboard 300, in the region of each display panels, inside array motherboard 301, inside color film motherboard 300 and main frame glue 304 form confined space be filled with liquid crystal layer within it.
In main frame glue 304 setting area, the inner side of described array motherboard 301 is provided with the first lower liner layer 307, the inner side of described color film motherboard 300 is provided with laying 306 on first, and described first lower liner layer 307 and first is provided with the first stilt 305 between laying 307; At display panels with exterior domain, auxiliary frame glue 302 is also provided with between described array motherboard 301 and color film motherboard 300, in auxiliary frame glue 302 setting area, the inner side of described array motherboard 301 is provided with the second lower liner layer 3021, the inner side of described color film motherboard 300 is provided with laying 3022 on second, and described second lower liner layer 3021 and second is provided with the second stilt 303 between laying 3022.On described first laying 306, first stilt 305, first lower liner layer 307 height and with the height of laying on described second 3022, second stilt 303, second lower liner layer 3021 and equal.
In display panels region, described array motherboard 301 is provided with pel array towards the inner side of described color film motherboard 300, each pixel comprises at least one thin film transistor (TFT), described thin film transistor (TFT) comprises the grid that gate metal layer 3091 is formed, cover the gate insulator 3092 of described gate metal layer 3091, be positioned at semiconductor layer 3093 on gate insulator 3092 and overlapping with gate metal layer 3091, be positioned at the source-drain electrode metal level 3094 above semiconductor layer 3093, cover the passivation layer 3095 of described source-drain electrode metal level 3094, there is in described passivation layer 3095 through hole exposed portion source-drain electrode metal level 3094, be positioned at the pixel electrode layer 3096 on passivation layer 3095, described pixel electrode layer 3096 is electrically connected by the through hole in passivation layer 3095 and source-drain electrode metal level 3094, both alignment layers 3097 is also possessed above pixel electrode layer 3096.At main frame glue 304 setting area and auxiliary frame glue 302, one or more layers in described gate metal layer 3091, gate insulator 3092, source-drain electrode metal level 3094, passivation layer 3095, pixel electrode layer 3096 is also for the formation of the second lower liner layer 3021 and the first lower liner layer 307.
In display panels region, described color film motherboard 300 is provided with black light shield layer 3013, color blocking layer 3014, common electrode layer 3012, both alignment layers 3011 towards the inner side of array motherboard 301.In main frame glue 304 setting area and auxiliary frame glue 302 setting area, the one deck in described black light shield layer 3013, color blocking layer 3014, common electrode layer 3012, both alignment layers 3011 or multilayer are also for the formation of laying 3022 on laying on first 306 and second.
Particularly, in enforcement two, described second lower liner layer 3021 is identical with the Rotating fields of the first lower liner layer 307, comprises gate metal layer 3091, gate insulator 3092 and passivation layer 3095 respectively.On described first, laying 306 is identical with the Rotating fields of laying on second 3022, comprises black light shield layer 3013 and common electrode layer 3012 respectively.
In embodiment two, in the forming process of array motherboard 301, formed while grid, gate metal layer 3091 also in main frame glue 304 and auxiliary frame glue 302 setting area film forming, respectively as the ground floor structure of the second lower liner layer 3021 and the first lower liner layer 307; In gate insulator 3092 forming process, gate insulator 3092 also covers main frame glue 304 and auxiliary frame glue 302 setting area, respectively as the second layer structure of the second lower liner layer 3021 and the first lower liner layer 307; When passivation layer 3095 film forming, passivation layer 3095 also covers main frame glue 304 and auxiliary frame glue 302 setting area, respectively as the third layer structure of the second lower liner layer 3021 and the first lower liner layer 307.Namely, in enforcement two, in the forming process of array motherboard 301, described second lower liner layer 3021 and the first lower liner layer 307 are formed in same process step simultaneously, do not increase processing step, can not increase manufacturing cost and manufacturing time.
In the forming process of color film motherboard 300, while formation black light shield layer 3013, black light shield layer 3013 also in main frame glue 304 and auxiliary frame glue 302 setting area film forming, respectively as the ground floor structure of laying 306 on laying on second 3022 and first; While formation common electrode layer 3012, common electrode layer 3012 also in main frame glue 304 and auxiliary frame glue 302 setting area film forming, respectively as the second layer structure of laying 306 on laying on second 3022 and first.Namely, in the forming process of color film motherboard 300, on described second, on laying 3022 and first, laying 306 is formed in same process step simultaneously, does not increase processing step, can not increase manufacturing cost and manufacturing time.
It should be noted that, in embodiment two, be with the twisted nematic liquid crystals display structure of bottom gate for row are described, but the utility model is not limited thereto, the utility model is also applicable to the top liquid crystal display structure of grid or the liquid crystal display structure of in-plane field.Such as when liquid crystal display structure for in-plane field, array motherboard also comprises common electrode layer, and described common electrode layer can as the composition structure of the second lower liner layer and the first lower liner layer.
In embodiment two, second lower liner layer is identical with the Rotating fields of the first lower liner layer, on second, laying is also identical with the Rotating fields of laying on first, but the utility model is not limited thereto, second lower liner layer can not be identical with the Rotating fields of the first lower liner layer, on second, laying also can not be identical with the Rotating fields of laying on first, if on first laying, the first stilt, the first lower liner layer height and with the height of laying, the second stilt, the second lower liner layer on second and equal.
In embodiment two, the first stilt and the second stilt are spherical stilt, but the utility model is not limited thereto, and described first stilt and the second stilt can also be photoetching stilt.
Preferably, on described second, laying or described second lower liner layer comprise photic zone, and on described second, the photic zone area of liner or the second lower liner is more than or equal to 30% of described auxiliary frame glue setting area area.Then please refer to Fig. 7, Fig. 7 is the structural representation of the second lower liner layer in embodiment two, wherein schemes several different implementation that a, b, c are respectively the second lower liner layer.Main frame glue 304 in display panels motherboard and auxiliary frame glue 302 need to carry out UV-irradiation to be cured effect after coating, generally irradiate from array motherboard 301 side, in order to enable ultraviolet light be irradiated on auxiliary frame glue 302, the photic zone area that embodiment two arranges the second lower liner layer is more than or equal to 30% of described auxiliary frame glue 302 setting area area.Particularly, described photic zone is in the gate metal layer 3091 of auxiliary frame glue 302 setting area, arrange hollow out figure 309a, as shown in Figure 7, described hollow out figure 309a can be circle, rectangle or irregular figure, described hollow out figure 309a can also be other figures such as rhombus, parallelogram, does not limit to structure shown in accompanying drawing.Because gate metal layer 3091 is that metal is light tight, therefore at least need to arrange hollow out figure in gate metal layer 3091, alternatively, if in order to improve ultraviolet transmitance further, can also also increase hollow out figure in the gate insulator 3092 of printing opacity and passivation layer 3095.
Usually, UV radiation curing is irradiate from array motherboard side, but when UV radiation curing be irradiate from color film motherboard side time, also hollow out figure can be set on second in liner, particularly in lighttight black light shield layer, arrange hollow out figure, described hollow out figure can be circle, rectangle, rhombus, parallelogram or irregular figure etc.Alternatively, if in order to improve ultraviolet transmitance further, hollow out figure can also also be increased in the common electrode layer of printing opacity.
The display panels motherboard that the utility model provides, in auxiliary frame glue setting area, be provided with laying and the second stilt in the second lower liner layer as above, second, the box thickness ununiformity that causes even, color exception when can avoid cutting, collapse angle, collapse the bad problem such as limit, liquid crystal leakage.Meanwhile, the display panels motherboard that the utility model provides does not increase manufacturing cost and manufacturing time yet, has good effect and implementation.
Obviously, those skilled in the art can carry out various change and modification to utility model and not depart from spirit and scope of the present utility model.Like this, if these amendments of the present utility model and modification belong within the scope of the utility model claim and equivalent technologies thereof, then the utility model also comprises these change and modification.
Claims (10)
1. a display panels motherboard, comprise the display panels of multiple arrangement in matrix, it is characterized in that, described display panels motherboard comprises the array motherboard and color film motherboard that are oppositely arranged;
Corresponding multiple described display panels, close-shaped main frame glue is provided with between described array motherboard and color film motherboard, in the region of each display panels, inside array motherboard, inside color film motherboard and main frame glue form confined space be filled with liquid crystal layer within it;
In main frame glue setting area, the inner side of described array motherboard is provided with the first lower liner layer, and the inner side of described color film motherboard is provided with laying on first, and described first lower liner layer and first is provided with the first stilt between laying;
At display panels with exterior domain, auxiliary frame glue is also provided with between described array motherboard and color film motherboard, in auxiliary frame glue setting area, the inner side of described array motherboard is provided with the second lower liner layer, the inner side of described color film motherboard is provided with laying on second, and described second lower liner layer and second is provided with the second stilt between laying;
On described first laying, the first stilt, the first lower liner layer height and with the height of laying, the second stilt, the second lower liner layer on described second and equal.
2. display panels motherboard as claimed in claim 2, it is characterized in that, described color film motherboard is provided with black light shield layer and color blocking layer towards the inner side of described array motherboard, and on described second, on laying and first, laying comprises one or more layers in black light shield layer and color blocking layer respectively.
3. display panels motherboard as claimed in claim 3, it is characterized in that, in the forming process of color film motherboard, on described second, on laying and first, laying is formed in same process step simultaneously.
4. display panels motherboard as claimed in claim 2, it is characterized in that, described array motherboard is provided with pel array towards the inner side of described color film motherboard, described pel array comprises gate metal layer, gate insulator, source-drain electrode metal level, passivation layer, pixel electrode layer, described second lower liner layer and the first lower liner layer comprise in gate metal layer, gate insulator, source-drain electrode metal level, passivation layer, pixel electrode layer respectively one or more layers.
5. display panels motherboard as claimed in claim 4, it is characterized in that, in the forming process of array motherboard, described second lower liner layer and the first lower liner layer are formed in same process step simultaneously.
6. display panels motherboard as claimed in claim 1, it is characterized in that, on described second, liner or the second lower liner layer comprise photic zone, and on described second, the photic zone area of liner or the second lower liner is more than or equal to 30% of described auxiliary frame glue setting area area.
7. display panels motherboard as claimed in claim 6, it is characterized in that, on described second, the photic zone of liner or the second lower liner layer is hollow out figure, and described hollow out figure is circle, rectangle, rhombus, parallelogram or irregular figure.
8. display panels motherboard as claimed in claim 1, it is characterized in that, on described second, on laying and first, the height of laying is equal, and the height of described second lower liner layer and the first lower liner layer is equal, and the height of described first stilt and the second stilt is equal.
9. display panels motherboard as claimed in claim 1, it is characterized in that, described first stilt and the second stilt are spherical stilt, or described first stilt and the second stilt are photoetching stilt.
10. display panels motherboard as claimed in claim 1, it is characterized in that, multiple described display panels is divided into multiple cut zone, and each cut zone is provided with described auxiliary frame glue; The auxiliary frame glue of the every side of described cut zone is one or more of; Auxiliary frame glue around cut zone interconnects or is not interconnected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420735139.6U CN204347396U (en) | 2014-11-28 | 2014-11-28 | A kind of display panels motherboard |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420735139.6U CN204347396U (en) | 2014-11-28 | 2014-11-28 | A kind of display panels motherboard |
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| CN204347396U true CN204347396U (en) | 2015-05-20 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106597760A (en) * | 2017-03-02 | 2017-04-26 | 合肥京东方光电科技有限公司 | Display panel mother board and preparation method thereof |
| CN109683373A (en) * | 2019-02-26 | 2019-04-26 | 深圳市华星光电技术有限公司 | Liquid crystal display panel motherboard |
| CN109856863A (en) * | 2019-03-13 | 2019-06-07 | 武汉华星光电技术有限公司 | Display master blank and display panel |
| CN112558350A (en) * | 2020-12-29 | 2021-03-26 | 惠科股份有限公司 | Color film substrate, manufacturing method of color film substrate and display panel |
| CN112558348A (en) * | 2020-12-29 | 2021-03-26 | 惠科股份有限公司 | Color film substrate, manufacturing method of color film substrate and display panel |
| CN114609834A (en) * | 2022-03-15 | 2022-06-10 | Tcl华星光电技术有限公司 | Display mother board, display panel and preparation method of display panel |
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2014
- 2014-11-28 CN CN201420735139.6U patent/CN204347396U/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106597760A (en) * | 2017-03-02 | 2017-04-26 | 合肥京东方光电科技有限公司 | Display panel mother board and preparation method thereof |
| WO2018157600A1 (en) * | 2017-03-02 | 2018-09-07 | 京东方科技集团股份有限公司 | Display panel motherboard and manufacturing method therefor |
| CN109683373A (en) * | 2019-02-26 | 2019-04-26 | 深圳市华星光电技术有限公司 | Liquid crystal display panel motherboard |
| CN109856863A (en) * | 2019-03-13 | 2019-06-07 | 武汉华星光电技术有限公司 | Display master blank and display panel |
| CN112558350A (en) * | 2020-12-29 | 2021-03-26 | 惠科股份有限公司 | Color film substrate, manufacturing method of color film substrate and display panel |
| CN112558348A (en) * | 2020-12-29 | 2021-03-26 | 惠科股份有限公司 | Color film substrate, manufacturing method of color film substrate and display panel |
| CN114609834A (en) * | 2022-03-15 | 2022-06-10 | Tcl华星光电技术有限公司 | Display mother board, display panel and preparation method of display panel |
| CN114609834B (en) * | 2022-03-15 | 2023-10-03 | Tcl华星光电技术有限公司 | Display mother board, display panel and preparation method of display panel |
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