TWI683881B - 切割片與半導體晶片之製造方法 - Google Patents

切割片與半導體晶片之製造方法 Download PDF

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Publication number
TWI683881B
TWI683881B TW105105220A TW105105220A TWI683881B TW I683881 B TWI683881 B TW I683881B TW 105105220 A TW105105220 A TW 105105220A TW 105105220 A TW105105220 A TW 105105220A TW I683881 B TWI683881 B TW I683881B
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TW
Taiwan
Prior art keywords
adhesive layer
dicing sheet
intermediate layer
item
adhesive
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TW105105220A
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English (en)
Chinese (zh)
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TW201638264A (zh
Inventor
坂本美紗季
西田卓生
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日商琳得科股份有限公司
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Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201638264A publication Critical patent/TW201638264A/zh
Application granted granted Critical
Publication of TWI683881B publication Critical patent/TWI683881B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW105105220A 2015-03-02 2016-02-23 切割片與半導體晶片之製造方法 TWI683881B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-039892 2015-03-02
JP2015039892 2015-03-02

Publications (2)

Publication Number Publication Date
TW201638264A TW201638264A (zh) 2016-11-01
TWI683881B true TWI683881B (zh) 2020-02-01

Family

ID=56848072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105105220A TWI683881B (zh) 2015-03-02 2016-02-23 切割片與半導體晶片之製造方法

Country Status (5)

Country Link
JP (1) JP6623210B2 (ja)
KR (1) KR102451856B1 (ja)
CN (1) CN107078037B (ja)
TW (1) TWI683881B (ja)
WO (1) WO2016139840A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6906402B2 (ja) * 2017-09-07 2021-07-21 日東電工株式会社 半導体ウエハ保護用粘着テープ
JP7125259B2 (ja) * 2017-11-30 2022-08-24 日東電工株式会社 粘着シート
JP6350845B1 (ja) * 2018-01-29 2018-07-04 サイデン化学株式会社 粘着剤組成物、粘着シート、及び粘着剤の製造方法
JP7404073B2 (ja) * 2018-02-07 2023-12-25 リンテック株式会社 半導体加工用粘着テープ
CN111466015B (zh) * 2018-03-23 2023-08-29 琳得科株式会社 固晶膜、切割固晶片及半导体芯片的制造方法
JPWO2019189070A1 (ja) * 2018-03-29 2021-04-01 リンテック株式会社 粘着性組成物および粘着テープ
US10464716B1 (en) * 2018-05-22 2019-11-05 The Procter & Gamble Company Container having an adhesively attached fitment
JP7285068B2 (ja) * 2018-12-20 2023-06-01 三井化学東セロ株式会社 電子装置の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201324605A (zh) * 2011-11-02 2013-06-16 Lintec Corp 切割片及半導體晶片之製造方法
TW201420714A (zh) * 2012-09-27 2014-06-01 Furukawa Electric Co Ltd 放射線硬化型晶圓切割用黏著膠帶
TW201500509A (zh) * 2013-03-11 2015-01-01 Lintec Corp 黏接片以及被加工的有關設備的部材之製作方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006165004A (ja) * 2004-12-02 2006-06-22 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着テープ
JP2006202926A (ja) 2005-01-19 2006-08-03 Sekisui Chem Co Ltd ダイシングテープ
JP4643360B2 (ja) * 2005-05-24 2011-03-02 株式会社イーテック 粘着性樹脂組成物、並びに粘着シートおよびその製造方法
JP5379459B2 (ja) 2008-12-03 2013-12-25 古河電気工業株式会社 ダイシングテープ
JP2012015340A (ja) * 2010-06-30 2012-01-19 Dainippon Printing Co Ltd セパレータレス型ダイシングテープ
JP5929004B2 (ja) * 2011-03-30 2016-06-01 住友ベークライト株式会社 半導体加工用粘着シート
JP2013197390A (ja) * 2012-03-21 2013-09-30 Lintec Corp ダイシングシートおよび半導体チップの製造方法
JP6006953B2 (ja) * 2012-03-23 2016-10-12 リンテック株式会社 電子部品加工用粘着シートおよび半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201324605A (zh) * 2011-11-02 2013-06-16 Lintec Corp 切割片及半導體晶片之製造方法
TW201420714A (zh) * 2012-09-27 2014-06-01 Furukawa Electric Co Ltd 放射線硬化型晶圓切割用黏著膠帶
TW201500509A (zh) * 2013-03-11 2015-01-01 Lintec Corp 黏接片以及被加工的有關設備的部材之製作方法

Also Published As

Publication number Publication date
KR102451856B1 (ko) 2022-10-06
CN107078037B (zh) 2020-08-14
TW201638264A (zh) 2016-11-01
WO2016139840A1 (ja) 2016-09-09
JP6623210B2 (ja) 2019-12-18
JPWO2016139840A1 (ja) 2017-12-14
KR20170121146A (ko) 2017-11-01
CN107078037A (zh) 2017-08-18

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