TWI682475B - 晶圓測試組件 - Google Patents

晶圓測試組件 Download PDF

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Publication number
TWI682475B
TWI682475B TW108113108A TW108113108A TWI682475B TW I682475 B TWI682475 B TW I682475B TW 108113108 A TW108113108 A TW 108113108A TW 108113108 A TW108113108 A TW 108113108A TW I682475 B TWI682475 B TW I682475B
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TW
Taiwan
Prior art keywords
board
signal transmission
electrical connection
connection module
elastic
Prior art date
Application number
TW108113108A
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English (en)
Chinese (zh)
Other versions
TW202040711A (zh
Inventor
李文聰
謝開傑
鄧群姿
呂名凱
陳彥辰
Original Assignee
中華精測科技股份有限公司
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Application filed by 中華精測科技股份有限公司 filed Critical 中華精測科技股份有限公司
Priority to TW108113108A priority Critical patent/TWI682475B/zh
Priority to JP2019135275A priority patent/JP2020177008A/ja
Application granted granted Critical
Publication of TWI682475B publication Critical patent/TWI682475B/zh
Publication of TW202040711A publication Critical patent/TW202040711A/zh

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TW108113108A 2019-04-15 2019-04-15 晶圓測試組件 TWI682475B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW108113108A TWI682475B (zh) 2019-04-15 2019-04-15 晶圓測試組件
JP2019135275A JP2020177008A (ja) 2019-04-15 2019-07-23 ウェハ検出組立体及びその電気接続モジュール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108113108A TWI682475B (zh) 2019-04-15 2019-04-15 晶圓測試組件

Publications (2)

Publication Number Publication Date
TWI682475B true TWI682475B (zh) 2020-01-11
TW202040711A TW202040711A (zh) 2020-11-01

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ID=69942425

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TW108113108A TWI682475B (zh) 2019-04-15 2019-04-15 晶圓測試組件

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JP (1) JP2020177008A (ja)
TW (1) TWI682475B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752709B (zh) * 2020-11-03 2022-01-11 中華精測科技股份有限公司 板狀連接器與其雙臂式串接件、及晶圓測試組件
CN115542054A (zh) * 2022-10-19 2022-12-30 度亘激光技术（苏州）有限公司 激光器老化测试装置
CN115542054B (zh) * 2022-10-19 2024-05-14 度亘激光技术（苏州）有限公司 激光器老化测试装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI755919B (zh) * 2020-11-03 2022-02-21 中華精測科技股份有限公司 板狀連接器與其雙環式串接件、及晶圓測試組件
CN112485565B (zh) * 2020-11-17 2022-05-03 乐凯特科技铜陵有限公司 一种pcb板功能测试装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060035485A1 (en) * 2004-08-11 2006-02-16 K&S Interconnect, Inc. Interconnect assembly for a probe card
US20150309074A1 (en) * 2014-04-29 2015-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Probe card

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011129792A (ja) * 2009-12-19 2011-06-30 Advanced Systems Japan Inc アダプタブルチャックトップおよびその周辺構造

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060035485A1 (en) * 2004-08-11 2006-02-16 K&S Interconnect, Inc. Interconnect assembly for a probe card
US20150309074A1 (en) * 2014-04-29 2015-10-29 Taiwan Semiconductor Manufacturing Company Ltd. Probe card

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI752709B (zh) * 2020-11-03 2022-01-11 中華精測科技股份有限公司 板狀連接器與其雙臂式串接件、及晶圓測試組件
CN115542054A (zh) * 2022-10-19 2022-12-30 度亘激光技术（苏州）有限公司 激光器老化测试装置
CN115542054B (zh) * 2022-10-19 2024-05-14 度亘激光技术（苏州）有限公司 激光器老化测试装置

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Publication number Publication date
JP2020177008A (ja) 2020-10-29
TW202040711A (zh) 2020-11-01

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