TWI682433B - 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 - Google Patents

曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 Download PDF

Info

Publication number
TWI682433B
TWI682433B TW106135709A TW106135709A TWI682433B TW I682433 B TWI682433 B TW I682433B TW 106135709 A TW106135709 A TW 106135709A TW 106135709 A TW106135709 A TW 106135709A TW I682433 B TWI682433 B TW I682433B
Authority
TW
Taiwan
Prior art keywords
substrate
exposure
processing chamber
mode
light source
Prior art date
Application number
TW106135709A
Other languages
English (en)
Chinese (zh)
Other versions
TW201842543A (zh
Inventor
松尾友宏
福本靖博
大木孝文
淺井正也
春本將彥
田中裕二
中山知佐世
金山幸司
Original Assignee
日商斯庫林集團股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商斯庫林集團股份有限公司 filed Critical 日商斯庫林集團股份有限公司
Publication of TW201842543A publication Critical patent/TW201842543A/zh
Application granted granted Critical
Publication of TWI682433B publication Critical patent/TWI682433B/zh

Links

Images

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW106135709A 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法 TWI682433B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017038237A JP6872385B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP2017-038237 2017-03-01

Publications (2)

Publication Number Publication Date
TW201842543A TW201842543A (zh) 2018-12-01
TWI682433B true TWI682433B (zh) 2020-01-11

Family

ID=63369850

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106135709A TWI682433B (zh) 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法

Country Status (3)

Country Link
JP (1) JP6872385B2 (https=)
TW (1) TWI682433B (https=)
WO (1) WO2018159006A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6985803B2 (ja) * 2017-03-01 2021-12-22 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
CN120469170A (zh) 2019-09-19 2025-08-12 株式会社斯库林集团 曝光装置
TW202542654A (zh) * 2023-11-22 2025-11-01 日商東京威力科創股份有限公司 處理裝置及處理方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091207A (ja) * 1998-09-14 2000-03-31 Nikon Corp 投影露光装置及び投影光学系の洗浄方法
JP2002164267A (ja) * 2000-11-22 2002-06-07 Nikon Corp 露光装置及びデバイスの製造方法
JP2015126044A (ja) * 2013-12-26 2015-07-06 ウシオ電機株式会社 真空紫外光照射処理装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284224A (ja) * 2000-03-30 2001-10-12 Nikon Corp 露光装置及び露光方法
JP2003115433A (ja) * 2001-10-02 2003-04-18 Nikon Corp 露光方法及び露光装置
JP4677833B2 (ja) * 2004-06-21 2011-04-27 株式会社ニコン 露光装置、及びその部材の洗浄方法、露光装置のメンテナンス方法、メンテナンス機器、並びにデバイス製造方法
JP6543064B2 (ja) * 2015-03-25 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091207A (ja) * 1998-09-14 2000-03-31 Nikon Corp 投影露光装置及び投影光学系の洗浄方法
JP2002164267A (ja) * 2000-11-22 2002-06-07 Nikon Corp 露光装置及びデバイスの製造方法
JP2015126044A (ja) * 2013-12-26 2015-07-06 ウシオ電機株式会社 真空紫外光照射処理装置

Also Published As

Publication number Publication date
JP2018146617A (ja) 2018-09-20
TW201842543A (zh) 2018-12-01
WO2018159006A1 (ja) 2018-09-07
JP6872385B2 (ja) 2021-05-19

Similar Documents

Publication Publication Date Title
CN109541890B (zh) 曝光装置、基板处理装置、曝光方法以及基板处理方法
CN108535966B (zh) 曝光装置、基板处理装置、曝光方法及基板处理方法
TWI682433B (zh) 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法
CN108535965B (zh) 曝光装置、基板处理装置、曝光方法及基板处理方法
TWI661276B (zh) 曝光裝置、基板處理裝置、基板的曝光方法以及基板處理方法
TWI649642B (zh) 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法
JP6924661B2 (ja) 露光装置、基板処理装置、露光方法および基板処理方法
JP6894281B2 (ja) 露光装置、基板処理装置、基板の露光方法および基板処理方法
JP7002262B2 (ja) 露光装置、基板処理装置、露光方法および基板処理方法