JP6872385B2 - 露光装置、基板処理装置、基板の露光方法および基板処理方法 - Google Patents

露光装置、基板処理装置、基板の露光方法および基板処理方法 Download PDF

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Publication number
JP6872385B2
JP6872385B2 JP2017038237A JP2017038237A JP6872385B2 JP 6872385 B2 JP6872385 B2 JP 6872385B2 JP 2017038237 A JP2017038237 A JP 2017038237A JP 2017038237 A JP2017038237 A JP 2017038237A JP 6872385 B2 JP6872385 B2 JP 6872385B2
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substrate
exposure
unit
processing chamber
mode
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JP2017038237A
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Japanese (ja)
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JP2018146617A (ja
JP2018146617A5 (https=
Inventor
友宏 松尾
友宏 松尾
靖博 福本
靖博 福本
孝文 大木
孝文 大木
正也 浅井
正也 浅井
将彦 春本
将彦 春本
田中　裕二
裕二 田中
知佐世 中山
知佐世 中山
幸司 金山
幸司 金山
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2017038237A priority Critical patent/JP6872385B2/ja
Priority to PCT/JP2017/036258 priority patent/WO2018159006A1/ja
Priority to TW106135709A priority patent/TWI682433B/zh
Publication of JP2018146617A publication Critical patent/JP2018146617A/ja
Publication of JP2018146617A5 publication Critical patent/JP2018146617A5/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2017038237A 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法 Active JP6872385B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017038237A JP6872385B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法
PCT/JP2017/036258 WO2018159006A1 (ja) 2017-03-01 2017-10-05 露光装置、基板処理装置、基板の露光方法および基板処理方法
TW106135709A TWI682433B (zh) 2017-03-01 2017-10-18 曝光裝置、基板處理裝置、基板曝光方法以及基板處理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017038237A JP6872385B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法

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JP2018146617A JP2018146617A (ja) 2018-09-20
JP2018146617A5 JP2018146617A5 (https=) 2020-04-23
JP6872385B2 true JP6872385B2 (ja) 2021-05-19

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JP2017038237A Active JP6872385B2 (ja) 2017-03-01 2017-03-01 露光装置、基板処理装置、基板の露光方法および基板処理方法

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JP (1) JP6872385B2 (https=)
TW (1) TWI682433B (https=)
WO (1) WO2018159006A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6985803B2 (ja) * 2017-03-01 2021-12-22 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法
CN120469170A (zh) 2019-09-19 2025-08-12 株式会社斯库林集团 曝光装置
TW202542654A (zh) * 2023-11-22 2025-11-01 日商東京威力科創股份有限公司 處理裝置及處理方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000091207A (ja) * 1998-09-14 2000-03-31 Nikon Corp 投影露光装置及び投影光学系の洗浄方法
JP2001284224A (ja) * 2000-03-30 2001-10-12 Nikon Corp 露光装置及び露光方法
JP2002164267A (ja) * 2000-11-22 2002-06-07 Nikon Corp 露光装置及びデバイスの製造方法
JP2003115433A (ja) * 2001-10-02 2003-04-18 Nikon Corp 露光方法及び露光装置
JP4677833B2 (ja) * 2004-06-21 2011-04-27 株式会社ニコン 露光装置、及びその部材の洗浄方法、露光装置のメンテナンス方法、メンテナンス機器、並びにデバイス製造方法
JP6197641B2 (ja) * 2013-12-26 2017-09-20 ウシオ電機株式会社 真空紫外光照射処理装置
JP6543064B2 (ja) * 2015-03-25 2019-07-10 株式会社Ｓｃｒｅｅｎホールディングス 露光装置、基板処理装置、基板の露光方法および基板処理方法

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Publication number Publication date
JP2018146617A (ja) 2018-09-20
TW201842543A (zh) 2018-12-01
WO2018159006A1 (ja) 2018-09-07
TWI682433B (zh) 2020-01-11

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