TWI681449B - 研磨方法及研磨裝置 - Google Patents

研磨方法及研磨裝置 Download PDF

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Publication number
TWI681449B
TWI681449B TW104125908A TW104125908A TWI681449B TW I681449 B TWI681449 B TW I681449B TW 104125908 A TW104125908 A TW 104125908A TW 104125908 A TW104125908 A TW 104125908A TW I681449 B TWI681449 B TW I681449B
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TW
Taiwan
Prior art keywords
polishing
substrate
wafer
cleaning
chemical
Prior art date
Application number
TW104125908A
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English (en)
Chinese (zh)
Other versions
TW201612967A (en
Inventor
吉田博
山口都章
深谷孝一
蓑島大介
Original Assignee
日商荏原製作所股份有限公司
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Application filed by 日商荏原製作所股份有限公司 filed Critical 日商荏原製作所股份有限公司
Publication of TW201612967A publication Critical patent/TW201612967A/zh
Application granted granted Critical
Publication of TWI681449B publication Critical patent/TWI681449B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW104125908A 2014-09-01 2015-08-10 研磨方法及研磨裝置 TWI681449B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014177468A JP6587379B2 (ja) 2014-09-01 2014-09-01 研磨装置
JP2014-177468 2014-09-01

Publications (2)

Publication Number Publication Date
TW201612967A TW201612967A (en) 2016-04-01
TWI681449B true TWI681449B (zh) 2020-01-01

Family

ID=55439567

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125908A TWI681449B (zh) 2014-09-01 2015-08-10 研磨方法及研磨裝置

Country Status (3)

Country Link
JP (1) JP6587379B2 (ja)
TW (1) TWI681449B (ja)
WO (1) WO2016035499A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6602720B2 (ja) * 2016-04-04 2019-11-06 グローバルウェーハズ・ジャパン株式会社 半導体基板の保護膜形成方法
JP6727044B2 (ja) * 2016-06-30 2020-07-22 株式会社荏原製作所 基板処理装置
WO2019131174A1 (ja) * 2017-12-27 2019-07-04 株式会社 荏原製作所 基板加工装置および基板加工方法
JP7349352B2 (ja) * 2019-12-27 2023-09-22 グローバルウェーハズ・ジャパン株式会社 シリコンウェーハの研磨方法
CN112864066B (zh) * 2020-12-31 2022-06-10 至微半导体(上海)有限公司 一种晶圆清洗设备推拉式晶圆盒装载输送系统
CN114147611B (zh) * 2021-09-07 2022-10-04 杭州众硅电子科技有限公司 一种晶圆抛光系统

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5830045A (en) * 1995-08-21 1998-11-03 Ebara Corporation Polishing apparatus
US20060012047A1 (en) * 2004-07-16 2006-01-19 Nobuyuki Kurashima Method of manufacturing semiconductor device
TW200723390A (en) * 2005-02-14 2007-06-16 Tokyo Electron Ltd Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device
TW201400239A (zh) * 2012-06-13 2014-01-01 Ebara Corp 研磨方法及研磨裝置
TW201420266A (zh) * 2012-10-26 2014-06-01 Ebara Corp 研磨裝置及研磨方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3362478B2 (ja) * 1993-11-05 2003-01-07 富士通株式会社 ウェハ研磨装置及びウェハ研磨方法
JPH08153695A (ja) * 1994-11-30 1996-06-11 Nkk Corp 研磨方法およびこれに用いる研磨装置並びに研磨仕上げ装置
EP0987084A4 (en) * 1998-03-09 2006-11-15 Ebara Corp SANDERS
JP4402106B2 (ja) * 1998-04-06 2010-01-20 株式会社荏原製作所 ポリッシング装置
JP2003179020A (ja) * 2001-12-12 2003-06-27 Sumitomo Mitsubishi Silicon Corp 研磨布テクスチャの転写防止方法
JP2004022855A (ja) * 2002-06-18 2004-01-22 Shibaura Mechatronics Corp 半導体装置の製造方法
JP2005277396A (ja) * 2004-02-27 2005-10-06 Ebara Corp 基板処理方法および装置
JP2009238896A (ja) * 2008-03-26 2009-10-15 Renesas Technology Corp 半導体集積回路装置の製造方法
JP2013089797A (ja) * 2011-10-19 2013-05-13 Ebara Corp 基板洗浄方法及び基板洗浄装置
JP2014130881A (ja) * 2012-12-28 2014-07-10 Ebara Corp 研磨装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5830045A (en) * 1995-08-21 1998-11-03 Ebara Corporation Polishing apparatus
US20060012047A1 (en) * 2004-07-16 2006-01-19 Nobuyuki Kurashima Method of manufacturing semiconductor device
TW200723390A (en) * 2005-02-14 2007-06-16 Tokyo Electron Ltd Method of processing substrate, post-chemical mechanical polishing cleaning method, and method of and program for manufacturing electronic device
TW201400239A (zh) * 2012-06-13 2014-01-01 Ebara Corp 研磨方法及研磨裝置
TW201420266A (zh) * 2012-10-26 2014-06-01 Ebara Corp 研磨裝置及研磨方法

Also Published As

Publication number Publication date
JP6587379B2 (ja) 2019-10-09
JP2016049612A (ja) 2016-04-11
WO2016035499A1 (ja) 2016-03-10
TW201612967A (en) 2016-04-01

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