TWI680207B - 鈀之電鍍浴組合物及無電電鍍方法 - Google Patents

鈀之電鍍浴組合物及無電電鍍方法 Download PDF

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Publication number
TWI680207B
TWI680207B TW104142555A TW104142555A TWI680207B TW I680207 B TWI680207 B TW I680207B TW 104142555 A TW104142555 A TW 104142555A TW 104142555 A TW104142555 A TW 104142555A TW I680207 B TWI680207 B TW I680207B
Authority
TW
Taiwan
Prior art keywords
palladium
electroless
bath composition
aqueous
deposition
Prior art date
Application number
TW104142555A
Other languages
English (en)
Chinese (zh)
Other versions
TW201627531A (zh
Inventor
湯瑪士 貝克
Thomas Beck
吉哈德 史坦伯格
Gerhard Steinberger
安德瑞絲 華特
Andreas Walter
Original Assignee
德商德國艾托特克公司
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 德商德國艾托特克公司, Atotech Deutschland Gmbh filed Critical 德商德國艾托特克公司
Publication of TW201627531A publication Critical patent/TW201627531A/zh
Application granted granted Critical
Publication of TWI680207B publication Critical patent/TWI680207B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1617—Purification and regeneration of coating baths
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1651—Two or more layers only obtained by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
TW104142555A 2014-12-17 2015-12-17 鈀之電鍍浴組合物及無電電鍍方法 TWI680207B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP14198656 2014-12-17
EP14198656.2 2014-12-17

Publications (2)

Publication Number Publication Date
TW201627531A TW201627531A (zh) 2016-08-01
TWI680207B true TWI680207B (zh) 2019-12-21

Family

ID=52133927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142555A TWI680207B (zh) 2014-12-17 2015-12-17 鈀之電鍍浴組合物及無電電鍍方法

Country Status (8)

Country Link
US (1) US20170321327A1 (ja)
EP (1) EP3234219B1 (ja)
JP (1) JP6664400B2 (ja)
KR (1) KR102459744B1 (ja)
CN (1) CN107109653B (ja)
MY (1) MY181601A (ja)
TW (1) TWI680207B (ja)
WO (1) WO2016097084A1 (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107002242B (zh) * 2014-12-17 2020-02-11 埃托特克德国有限公司 用于化学镀钯的镀浴组合物和方法
CN108027976B (zh) * 2015-09-11 2021-10-29 富士胶片株式会社 行驶支援装置以及基于行驶支援装置的行驶支援方法
TWI707061B (zh) * 2015-11-27 2020-10-11 德商德國艾托特克公司 鈀之電鍍浴組合物及無電電鍍方法
EP3504355A1 (en) * 2016-08-23 2019-07-03 ATOTECH Deutschland GmbH Method for directly depositing palladium onto a non-activated surface of a gallium nitride semiconductor
WO2019163665A1 (ja) * 2018-02-20 2019-08-29 上村工業株式会社 無電解パラジウムめっき液、およびパラジウム皮膜

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424241A (en) * 1982-09-27 1984-01-03 Bell Telephone Laboratories, Incorporated Electroless palladium process

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CA968908A (en) * 1971-07-29 1975-06-10 Photocircuits Division Of Kollmorgen Corporation Sensitized substrates for chemical metallization
JPH02205388A (ja) * 1989-02-03 1990-08-15 Hitachi Chem Co Ltd 半導体光触媒を用いた無電解めっきによるプリント回路の製造法
JP2538461B2 (ja) * 1991-02-22 1996-09-25 奥野製薬工業株式会社 無電解金めっき方法
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
DE4415211A1 (de) * 1993-05-13 1994-12-08 Atotech Deutschland Gmbh Verfahren zur Abscheidung von Palladiumschichten
US6207128B1 (en) * 1997-05-05 2001-03-27 Akzo Nobel N.V. Method of producing a catalyst
JPH1161425A (ja) * 1997-08-27 1999-03-05 Ebara Yuujiraito Kk パラジウム−スズ被膜の導電性向上方法
JP3972158B2 (ja) * 1998-03-24 2007-09-05 石原薬品株式会社 無電解パラジウムメッキ液
JP3437980B2 (ja) * 2000-04-10 2003-08-18 有限会社関東学院大学表面工学研究所 無電解パラジウム−ニッケルめっき浴およびこれを用いるめっき方法ならびにこの方法により得られるめっき製品
US6645567B2 (en) * 2001-12-19 2003-11-11 Intel Corporation Electroless plating bath composition and method of using
JP2006083446A (ja) * 2004-09-17 2006-03-30 Okuno Chem Ind Co Ltd 無電解パラジウム−銀合金めっき液
JP4351736B2 (ja) * 2008-02-04 2009-10-28 積水化学工業株式会社 メッキ構造体
JP4511623B1 (ja) * 2009-05-08 2010-07-28 小島化学薬品株式会社 無電解パラジウムめっき液
JP5253369B2 (ja) * 2009-12-18 2013-07-31 公益財団法人地球環境産業技術研究機構 複合体の製造方法
DE102010012204B4 (de) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
US8236999B2 (en) * 2010-12-16 2012-08-07 Energia Technologies, Inc. Methods of deoxygenation and systems for fuel production
EP2581470B1 (en) * 2011-10-12 2016-09-28 ATOTECH Deutschland GmbH Electroless palladium plating bath composition
US20140072706A1 (en) * 2012-09-11 2014-03-13 Ernest Long Direct Electroless Palladium Plating on Copper
KR101469683B1 (ko) * 2013-05-31 2014-12-05 주식회사 불스원신소재 무전해 및 전해 연속 공정에 의해 제조된 구리 및 니켈 도금 탄소 섬유를 이용한 전자파 차폐 복합재의 제조 방법 및 전자파 차폐 복합재

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4424241A (en) * 1982-09-27 1984-01-03 Bell Telephone Laboratories, Incorporated Electroless palladium process

Also Published As

Publication number Publication date
WO2016097084A1 (en) 2016-06-23
TW201627531A (zh) 2016-08-01
CN107109653A (zh) 2017-08-29
EP3234219B1 (en) 2019-03-27
US20170321327A1 (en) 2017-11-09
KR102459744B1 (ko) 2022-10-26
MY181601A (en) 2020-12-29
JP6664400B2 (ja) 2020-03-13
EP3234219A1 (en) 2017-10-25
KR20170093845A (ko) 2017-08-16
CN107109653B (zh) 2020-02-07
JP2017538867A (ja) 2017-12-28

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