TWI677389B - 多點鑽石刀具 - Google Patents

多點鑽石刀具 Download PDF

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Publication number
TWI677389B
TWI677389B TW104142471A TW104142471A TWI677389B TW I677389 B TWI677389 B TW I677389B TW 104142471 A TW104142471 A TW 104142471A TW 104142471 A TW104142471 A TW 104142471A TW I677389 B TWI677389 B TW I677389B
Authority
TW
Taiwan
Prior art keywords
diamond cutter
base
inclined surface
sharp
point
Prior art date
Application number
TW104142471A
Other languages
English (en)
Chinese (zh)
Other versions
TW201634153A (zh
Inventor
曾山浩
Hiroshi Soyama
Original Assignee
日商三星鑽石工業股份有限公司
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司, Mitsuboshi Diamond Industrial Co., Ltd. filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201634153A publication Critical patent/TW201634153A/zh
Application granted granted Critical
Publication of TWI677389B publication Critical patent/TWI677389B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mining & Mineral Resources (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW104142471A 2015-01-16 2015-12-17 多點鑽石刀具 TWI677389B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP2015-006651 2015-01-16
JP2015006651A JP6476883B2 (ja) 2015-01-16 2015-01-16 マルチポイントダイヤモンドツール

Publications (2)

Publication Number Publication Date
TW201634153A TW201634153A (zh) 2016-10-01
TWI677389B true TWI677389B (zh) 2019-11-21

Family

ID=56437265

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104142471A TWI677389B (zh) 2015-01-16 2015-12-17 多點鑽石刀具

Country Status (4)

Country Link
JP (1) JP6476883B2 (ko)
KR (1) KR102469830B1 (ko)
CN (1) CN105799073B (ko)
TW (1) TWI677389B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6771207B2 (ja) * 2016-06-30 2020-10-21 三星ダイヤモンド工業株式会社 マルチポイントダイヤモンドツール及びその製造方法
JP2018015945A (ja) * 2016-07-26 2018-02-01 三星ダイヤモンド工業株式会社 ダイヤモンドツール及びそのスクライブ方法
CN107775825A (zh) * 2016-08-30 2018-03-09 三星钻石工业股份有限公司 金刚石刀具及其划线方法
JP2018034381A (ja) * 2016-08-30 2018-03-08 三星ダイヤモンド工業株式会社 ダイヤモンドツール
JP6955754B2 (ja) * 2017-07-25 2021-10-27 三星ダイヤモンド工業株式会社 ダイヤモンド刃先および基板分断方法
CN109203258A (zh) * 2018-11-13 2019-01-15 无锡温特金刚石科技有限公司 一种导体晶片单晶金刚石切割刀具
CN109626092A (zh) * 2018-12-28 2019-04-16 嘉兴泰晟电子有限公司 用于铝箔聚酯膜的切割装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954988A (ko) * 1972-09-28 1974-05-28
JP2002134437A (ja) * 2000-10-20 2002-05-10 Beldex Corp スクライブ用カッタ及びこのカッタを用いたスクライブ装置
JP2005302781A (ja) * 2004-04-06 2005-10-27 Tecdia Kk ダイヤモンドスクライバ及びそのポイント部作製方法
JP2005302782A (ja) * 2004-04-06 2005-10-27 Tecdia Kk ダイヤモンドスクライバ及びそのポイント部使用方法
US20070056171A1 (en) * 2005-09-12 2007-03-15 Jonathan Taryoto CVD diamond cutter wheel
US20090245945A1 (en) * 2007-09-22 2009-10-01 Bohle Ag Small glass cutting wheel

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09290304A (ja) * 1996-04-26 1997-11-11 Mitsubishi Materials Corp 突き加工カッタ用スローアウェイチップ
JP2003183040A (ja) 2001-12-18 2003-07-03 Oputo System:Kk ポイントカッター並びにその使用の方法及び装置
JP2005079529A (ja) 2003-09-03 2005-03-24 Murata Mfg Co Ltd セラミック電子部品の製造方法
JP2005088455A (ja) * 2003-09-19 2005-04-07 Namiki Precision Jewel Co Ltd ダイヤモンドスクライバー
JP4342354B2 (ja) * 2004-03-18 2009-10-14 パナソニック株式会社 研磨方法及び装置
JP4365251B2 (ja) * 2004-03-31 2009-11-18 旭ダイヤモンド工業株式会社 ダイヤモンドスクライバー及びダイヤモンドスクライバーの製造方法
CN101646517B (zh) * 2007-10-05 2012-06-13 Osg株式会社 金刚石切削构件及其制造方法
JP2010207945A (ja) * 2009-03-09 2010-09-24 Mitsuboshi Diamond Industrial Co Ltd 薄膜太陽電池用の溝加工ツール
JP4931964B2 (ja) * 2009-06-17 2012-05-16 学校法人福岡工業大学 高硬度材の加工装置及び加工方法
TWI498293B (zh) * 2011-05-31 2015-09-01 Mitsuboshi Diamond Ind Co Ltd 劃線方法、鑽石尖、劃線裝置
JP5966564B2 (ja) * 2011-06-08 2016-08-10 三星ダイヤモンド工業株式会社 スクライビングホイール及びスクライブ方法
JP2013043787A (ja) 2011-08-22 2013-03-04 Kosaka Laboratory Ltd ガラススクライブ方法及びガラススクライブ装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4954988A (ko) * 1972-09-28 1974-05-28
JP2002134437A (ja) * 2000-10-20 2002-05-10 Beldex Corp スクライブ用カッタ及びこのカッタを用いたスクライブ装置
JP2005302781A (ja) * 2004-04-06 2005-10-27 Tecdia Kk ダイヤモンドスクライバ及びそのポイント部作製方法
JP2005302782A (ja) * 2004-04-06 2005-10-27 Tecdia Kk ダイヤモンドスクライバ及びそのポイント部使用方法
US20070056171A1 (en) * 2005-09-12 2007-03-15 Jonathan Taryoto CVD diamond cutter wheel
US20090245945A1 (en) * 2007-09-22 2009-10-01 Bohle Ag Small glass cutting wheel

Also Published As

Publication number Publication date
JP2016132112A (ja) 2016-07-25
CN105799073A (zh) 2016-07-27
TW201634153A (zh) 2016-10-01
KR20160088793A (ko) 2016-07-26
KR102469830B1 (ko) 2022-11-23
JP6476883B2 (ja) 2019-03-06
CN105799073B (zh) 2019-08-02

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