TWI674173B - Grinding device and method for manufacturing the grinding product - Google Patents

Abstract

The present invention relates to a grinding device and a method for manufacturing a ground product. According to the present invention, the number of dressings of the grindstone is reduced. The grinding apparatus includes a grinding unit in which a grinding stone is arranged in a ring shape and is rotatable. The grinding stone is arranged so that a grinding area where the grinding object is ground during the grinding process of the grinding object and a non-grinding area where the grinding object is not ground. The grinding apparatus further includes a micro-bubble water generator configured to generate micro-bubble water, and a micro-bubble water supply unit configured to supply micro-bubble water to a grinding stone in a non-grinding area.

Description

Grinding device and method for manufacturing ground product

The present invention relates to a grinding device and a method for manufacturing a ground product.

For example, Japanese Patent Application Laid-Open No. 2014-165339 (Patent Document 1) discloses the following grinding method. First, a chuck table of a grinding device is used to suck and hold a semiconductor element wafer side of a laminated wafer to expose a sealing resin. Then, a grinding liquid containing no abrasive particles is supplied to the sealing resin surface of the laminated wafer. Next, the chuck table that sucks and holds the stacked wafers is rotated, while a grinding wheel having a plurality of grinding stones fixed to the lower end of the ring-shaped base is rotated, while the grinding stones and the sealing resin are rotated. Surface contact and grinding of sealing resin are performed.

However, in the grinding method described in Patent Document 1, as the sealing resin is ground, the grindability of the grindstone is reduced due to the clogging of the grindstone, etc., and it is necessary to dress the grindstone ( dressing). However, since the dressing of the grinding stone takes time and costs, it is desirable to reduce the number of dressing of the grinding stone.

According to the embodiment disclosed herein, it is possible to provide a grinding apparatus including a grinding unit in which a grinding stone is arranged in a ring shape and is rotatable, and the grinding stone is used for grinding during grinding of an object to be ground. The grinding area where the object is ground is arranged so as to coexist with the non-grinding area where the object is not ground. The grinding device also includes a fine bubble water generator to generate fine bubble water. And a micro-bubble water supply unit configured to supply micro-bubble water to the grindstone in the non-grinding area.

According to the embodiment disclosed herein, it is possible to provide a method for manufacturing a grinding article including a step of rotating a grinding unit in which a grinding stone is arranged in a ring shape to grind an object to be ground using the grinding stone, and grinding The stone is arranged in such a manner that the grinding area where the grinding object is ground during the grinding process of the grinding object and the non-grinding area where the grinding object is not ground are coexisted. The manufacturing method includes the steps of generating fine bubble water using a fine bubble water generator and supplying the fine bubble water to a fine bubble water supply unit; and supplying fine bubble water to a grindstone in a non-grinding area.

The above and other objects, features, aspects, and advantages of the present invention will be made clear from the following detailed description of the present invention which is understood in connection with the accompanying drawings.

Hereinafter, embodiments will be described. In the drawings for explaining the embodiments, the same reference numerals denote the same or corresponding parts.

FIG. 1 is a schematic side view of a grinding apparatus according to an embodiment as an example of the grinding apparatus of the present invention. A grinding device according to an embodiment includes a base 1, a pillar portion 10 extending from an end region of the base 1 in the Z direction (vertical upward direction), and a connecting portion 9 from an end of the pillar portion 10 to the base 1 side. The end on the opposite side extends in the X direction; the motor 8 is mounted on the X direction end of the connecting portion 9; the spindle 7 is mounted on the motor 8 at one end and extends in the Z direction (vertical downward direction); And the grinding part 11 is attached to the end part of the main shaft 7 opposite to the end part of the motor 8 side. The grinding section 11 is rotatable around an axis extending in the Z direction.

In addition, the grinding apparatus according to the embodiment includes a platform 2 which is arranged on the base 1 along the X direction (level direction) and spaced apart from the column portion 10 and is used to provide a grinding object 3; 4. It is comprised so that a grinding liquid may be supplied to the grinding surface of the grinding object 3. The configuration of the grinding liquid supply unit 4 is not particularly limited as long as it can supply the grinding liquid to the grinding surface of the grinding target 3.

The grinding unit 11 includes a wheel fixture 6 having a circular bottom surface 6 a and an annular grinding wheel 16 attached to the bottom surface 6 a of the wheel fixture 6. The grinding wheel 16 includes a ring-shaped ring base 15 and a plurality of grinding stones 5 arranged on the ring-shaped base 15 at a distance from each other. The grinding stone 5 is arranged so that a grinding area 41 that grinds the grinding object 3 and a non-grinding area 42 that does not grind the grinding object 3 coexist in the grinding process of the grinding object 3. . For example, the ring-shaped grinding wheel 16 can be mounted so that a plurality of grinding stones 5 are arranged at intervals on the periphery of the bottom surface 6 a of the wheel holder 6. The grinding device according to the embodiment also includes a cover (not shown) that surrounds the outer periphery of the grinding section 11.

In addition, the grinding apparatus according to the embodiment includes a micro-bubble water supply unit 12 mounted so as to sag from a part of the outer cover in the Z direction (vertical downward direction), and a micro-bubble water generator 14 for generating fine bubbles. Water; and a hose 13 for connecting the micro-bubble water supply unit 12 to the micro-bubble water generator 14 and supplying the micro-bubble water from the micro-bubble water generator 14 to the micro-bubble water supply unit 12. In addition, from the viewpoint of suppressing the drainage of the fine bubble water after cleaning from adhering to the grinding object 3, the fine bubble water discharge portion 12 c of the fine bubble water supply portion 12 is preferably located corresponding to the installation position of the grinding object 3. Above a region other than the region 22 (for example, the region 23).

The structure of the fine bubble water generator 14 is not particularly limited as long as it can generate fine bubble water and supply the fine bubble water to the fine bubble water supply unit 12. Micro-bubble water is water containing micro-bubbles, ie, bubbles having a diameter of 100 μm or less. The micro-bubbles include micro-bubbles having a diameter of 1 μm or more and 100 μm or less, and ultra-fine bubbles having a diameter of less than 1 μm, and also include bubbles called nano-bubbles and micro-nano bubbles.

A schematic plan view of the bottom surface 6 a of the wheel fixing member 6 shown in FIG. 1 is shown in FIG. 2. As shown in FIG. 2, the bottom surface 6 a of the wheel fixture 6 is circular, and the outer cover 21 is located at a position that surrounds the outer periphery of the bottom surface 6 a of the round-shaped wheel fixture 6.

A schematic plan view of the grinding wheel 16 shown in FIG. 1 is shown in FIG. 3. As shown in FIG. 3, the grinding wheel 16 includes an annular annular base 15 and a plurality of grinding stones 5 on the annular base 15. The plurality of millstones 5 are spaced apart from the adjacent millstones 5 and are arranged in a ring shape along the shape of the ring base 15.

FIG. 4 is a schematic side view illustrating an example of a method of attaching the grinding wheel 16 to the wheel holder 6. The grinding wheel 16 is, for example, a surface of the ring-shaped base 15 on the side where the grindstone 5 is not disposed, and is attached to the bottom surface 6 a of the wheel holder 6. The grinding wheel 16 is fixed to the bottom surface 6 a of the wheel holder 6 by, for example, a screwing method.

FIG. 5 is a schematic plan view of the fine bubble water supply unit 12 shown in FIG. 1. As shown in FIG. 5, the micro-bubble water supply unit 12 includes a micro-bubble water supply unit mounting portion 12a, a micro-bubble water storage unit 12b, and a connection connecting the micro-bubble water supply unit mounting portion 12a and the micro-bubble water storage unit 12b. 12g. The planar shape of the micro-bubble water supply unit 12 (the micro-bubble water supply unit mounting portion 12a, the micro-bubble water storage unit 12b, and the connection portion 12g in this embodiment) can be set to be curved into an arc shape as shown in FIG. 5, for example. However, it is not limited to this shape.

The micro-bubble water supply portion mounting portion 12 a is a wall-shaped member extending in the vertical upward direction, and is connected to the micro-bubble water storage portion 12 b by a connecting portion 12 g. Therefore, the fine bubble water supply part mounting part 12a and the fine bubble water storage part 12b are spaced apart only by the connection part 12g.

The micro-bubble water containing portion 12b includes a bottom portion 12e, a pair of wall portions 12f extending vertically from both ends of the bottom portion 12e, and a micro-bubble water supply configured to penetrate between the upper and lower surfaces of the bottom portion 12e.孔 31。 Hole 31. The height of the wall portion 12f can be, for example, a height at which the grindstone 5 of the grinding wheel 16 can be immersed in the fine bubble water when the fine bubble water is contained in the fine bubble water containing portion 12b. As shown in FIG. 5, the micro-bubble water supply holes 31 are, for example, provided in the bottom portion 12 e at a distance from each other. However, the number may be one, for example, and is not limited to the configuration.

FIG. 6 is a schematic plan view of an end surface of the fine bubble water supply unit 12 shown in FIG. 5. As shown in FIG. 6, the end face of the fine bubble water storage portion 12 b has a fine bubble water discharge portion 12 c. The fine bubble water discharge portion 12 c is an opening for discharging the fine bubble water contained in the fine bubble water storage portion 12 b to the outside of the fine bubble water supply portion 12. The end surface of the micro-bubble water storage portion 12b may include an end-face wall portion 12d that prevents the micro-bubble water from being discharged to the outside.

FIG. 7 is a schematic cross-sectional view illustrating a method of manufacturing a ground product according to an embodiment in which the method of manufacturing a ground product is a method of manufacturing a ground product using the grinding apparatus of the embodiment. An example. The manufacturing method of the grinding | polishing product which concerns on embodiment can be performed as follows, for example.

First, the micro-bubble water supply unit mounting portion 12 a of the micro-bubble water supply unit 12 is attached to an outer cover 21 that surrounds the periphery of the grinding unit 11. Then, the grinding target 3 is set on the stage 2.

As the grinding target 3, for example, a grinding target including a support member 3a and a sealing resin 3b on the support member 3a can be used. The support member 3a is a member that supports a wafer and / or a film, and includes, for example, a member selected from a lead frame, a substrate, an interposer, a semiconductor substrate (a silicon wafer, etc.), a metal substrate, At least one substrate in the group consisting of a glass substrate, a ceramic substrate, a resin substrate, and a wiring substrate may or may not be wired. The sealing resin 3b is a resin that seals at least one surface of a wafer, a film, or the like supported by the supporting member 3a.

Next, the fine bubble water generator 32 generates the fine bubble water 32 and supplies it to the fine bubble water supply unit 12. The micro-bubble water 32 is supplied to the micro-bubble water container 12b through a micro-bubble water supply hole 31 provided in the bottom 12e of the micro-bubble water container 12b.

Then, the grinding unit 11 is rotated in the first direction 45 with the shaft 43 as the center, and the stage 2 on which the grinding object 3 is provided is moved in the second direction 46 opposite to the first direction 45 with the shaft 44 as the center. Spin. At this time, the grinding stone 5 in the grinding area 41 grinds the object 3 to be grounded. On the other hand, the grinding stone 5 in the non-grinding area 42 does not grind the object 3 to be ground, but is immersed in The micro-bubble water storage portion 12b is contained in the micro-bubble water 32. Here, the grinding section 11 can also be rotated in the second direction 46 about the shaft 43 as the center, and the table 2 can be rotated in the first direction 45 about the shaft 44 as the center, or the rotation direction and the table of the grinding section 11 can be rotated. The rotation direction of 2 is set to the same direction as the first direction 45 or the second direction 46.

The grinding of the grinding target 3 can be performed, for example, by grinding at least a part of the sealing resin 3 b to reduce the thickness of the grinding target 3. Although not shown in FIG. 7, the grinding liquid can be supplied from the grinding liquid supply unit 4 to the grinding surface of the grinding object 3 while grinding the grinding object 3. Although the grindstone 5 in the non-grinding area 42 is immersed in the fine bubble water 32, it is also possible to grind the grinding target 3 from the area 23 other than the area 22 in which the grinding target 3 is arranged. The fine bubble water 32 is discharged through the fine bubble water discharge part 12c of the end surface of the fine bubble water supply part 12 above.

In this way, as shown in the schematic perspective view of FIG. 8 and the schematic plan view of FIG. 9, the grinding stone 5 of the grinding section 11 of the embodiment alternates, for example, grinding of the grinding target 3 in the grinding area 41, And the impregnation in the fine bubble water 32 in the non-grinding area 42. This makes it possible to reduce the frequency of occurrence of the sharpening of the grindstone 5 such as clogging of the grindstone 5 as compared to a case where the grindstone 5 of the grinding unit 11 of the embodiment is not immersed in the fine bubble water 32. Therefore, it is possible to reduce the number of times that the grinding device 5 is stopped and the grinding stone 5 is trimmed. In addition, the grinding object 3 is ground by the grindstone 5 immersed in the fine bubble water 32, and after the grinding of the grinding object 3, it is immersed in the fine bubble water 32 again, so it can be maintained High grinding performance of the grinding target 3.

In addition, for example, when the grinding target 3 is a semiconductor package, unlike conventional silicon wafer grinding, a process of simultaneously grinding different materials such as semiconductors, metals, and resins may be required. However, when grinding different materials at the same time using the grindstone 5, the grindstone 5 is prone to blockage. Therefore, it can be considered that for grinding of the grinding object 3 such as a semiconductor package that requires a process of grinding different materials simultaneously In particular, the grinding apparatus and the method for manufacturing a ground product according to the embodiment are particularly effective.

In addition, the density of the fine bubbles in the fine bubble water 32 is preferably 1000 cells / ml (ml) or more. In this case, the cleaning effect of the grindstone 5 can be improved. In addition, the density of the fine bubbles in the fine bubble water 32 may be set to be 1 million pieces / ml or more, and may also be set to be 1 billion pieces / ml or more. The fine bubble density can be measured using, for example, a freezing transmission electron microscope of an ice embedding method.

In addition, as shown in a schematic enlarged cross-sectional view of FIG. 10, the millstone 5 can be immersed in the fine bubble water 32 while the fine bubble water is ejected from the fine bubble water supply hole 31 in the direction of the arrow 51.

In addition, as shown in the schematic plan view of FIG. 11, the ejection of the fine bubble water from the fine bubble water supply hole 31 can also be directed to the second direction 46 that is opposite to the first direction 45 that is the rotation direction of the grinding unit 11. get on. In this case, it is conceivable that the pressure when the fine bubble water 32 hits the grindstone 5 can be increased, so that the cleaning effect of the fine bubble water 32 on the grindstone 5 by immersion can be improved.

[Example] <Example 1> First, as shown in FIG. 7, the fine bubble water supply portion mounting portion 12 a of the fine bubble water supply portion 12 of the grinding device is fixed to an outer cover surrounding the grinding portion 11. 21. A grinding object 3 is set on the platform 2. Here, as the grinding target 3, a grinding target provided with a sealing resin 3b including a resin mixed with silicon dioxide as a filler on the support member 3a is used.

Then, the micro-bubble water generator 32 generates micro-bubble water 32, and supplies the micro-bubble water container 12b to the micro-bubble water container 12b through the micro-bubble water supply hole 31 provided in the bottom 12e of the micro-bubble water container 12b. As the micro-bubble water generator 14, a water supply device equipped with a micro-bubble generating nozzle (product name: OKE-MB04FJA) manufactured by OK Engineering Co., Ltd. was used.

Next, as shown in FIG. 4, a grinding wheel 16 in which a plurality of grinding stones 5 are arranged at intervals on the annular base 15 as shown in FIG. 3 is attached to the wheel fixture shown in FIG. 2 by screwing. The bottom surface 6 a of 6 constitutes a grinding section 11.

Then, as shown in FIG. 7, while supplying pure water as the grinding liquid from the grinding liquid supply unit 4 to the grinding surface of the grinding object 3, the grinding unit 11 is oriented in the first direction with the shaft 43 as the center. 45, and the stage 2 on which the grinding target 3 is provided is rotated around the axis 44 in the second direction 46 which is opposite to the first direction 45. As a result, the grinding stone 5 of the grinding wheel 16 alternates between the grinding of the grinding object 3 in the grinding area 41 and the fine bubble water 32 in the fine bubble water container 12 b in the non-grinding area 42. Of impregnation. The grinding of the grinding target 3 is performed by grinding at least a part of the sealing resin 3 b to reduce the thickness of the grinding target 3. In addition, during the grinding process of the grinding object 3, the fine bubble water is discharged from above the area 23 other than the area 22 where the grinding object 3 is arranged to pass through the fine bubble water discharge portion 12c of the end face of the fine bubble water supply portion 12 32.

The grinding conditions are as described in Table 1 below. The column of “Feeding Speed [μm / min]” in Table 1 refers to the distance per minute during which the grinding section 11 advances the grinding section 11 to the platform 2 side in the vertical direction during the grinding of the grinding target 3. The “Feed Amount [μm]” column in Table 1 refers to the total distance that the grinding section 11 advances in the vertical direction toward the platform 2 side during the grinding of the grinding target 3. The "spark out [second]" column in Table 1 refers to stopping the movement of the grinding part 11 in the vertical direction toward the platform 2 side during the grinding of the grinding object 3, Time [sec] for maintaining the rotating state of the grinding section 11 and the table 2. The "n number" column in Table 1 refers to the number of samples. The "n number" in Table 1 is "4", which means that four samples are ground under the same conditions, and the average value of the measurement data of the four samples is the value shown in Table 2 described later.

[Table 1]

As described above, the grinding stone wear rate [%] of the grinding stone 5 of Example 1 after grinding the grinding target 3 under the conditions described in Table 1 and the surface of the grinding surface of the grinding target 3 Roughness Ra [μm] was measured. As a result, the abrasive stone wear rate of Example 1 was 19.4 [%], and the surface roughness Ra was 0.188 [μm].

The grinding stone wear rate is calculated by the following formula (I).

Grindstone wear rate [%] = {100 × (wear amount of grindstone 5)} / (feed amount) ... (I)

The surface roughness Ra is calculated by a method described in Japanese Industrial Standards (JIS) B0601: 2013 (International Organization for Standardization (ISO) 4287: 1997).

<Example 2>

In Example 2, instead of a water supply device equipped with a fine bubble generating nozzle manufactured by OK Engineering Co., Ltd., a fine bubble generating nozzle (product name: Grindel Bix) manufactured by Okamoto Work Machinery Co., Ltd. was used. (GRIND-BIX)), except that the micro-bubble water generator 14 is used, and the grinding target 3 is ground by the same method of manufacturing a ground product and the same grinding conditions as in Example 1.

Then, the grinding stone wear rate [%] of the grinding stone 5 of Example 2 after grinding the grinding target 3 by the same method as in Example 1 and the surface roughness of the grinding surface of the grinding target 3 Ra [μm] was measured. As a result, the abrasive stone wear rate of Example 2 was 15.2 [%], and the surface roughness Ra was 0.147 [μm].

<Comparative example 1>

In Comparative Example 1, fine bubbles were not generated using the fine bubble water generator 14, except for Other than that, the object 3 to be ground was ground in the same method and under the same conditions as those in the first and second embodiments.

Then, the grinding stone wear rate [%] of the grinding stone 5 of Comparative Example 1 after grinding the grinding target 3 in the same manner as in Examples 1 and 2 and the grinding surface of the grinding target 3 The surface roughness Ra [μm] was measured. As a result, the abrasive stone wear rate of Comparative Example 1 was 20.7 [%], and the surface roughness Ra was 0.228 [μm].

<Summary>

In Table 2 below, the grinding stone abrasion rate [%] of the grinding stone 5 of Example 1, Example 2 and Comparative Example 1 and the surface roughness Ra [μm] of the grinding surface of the grinding object 3 and fine The presence or absence of air bubbles, the type of the micro-bubble water generator 14, the feed amount [μm], and the feed speed [μm / min] are shown together.

From the results shown in Table 2, it can be seen that the grinding of the grinding target 3 in the grinding area 41 and the non-grinding area 42 were performed alternately with the grinding stone 5 of Comparative Example 1 without immersion in fine bubble water. The grinding stone 5 of Examples 1 and 2 impregnated with the fine bubble water 32 in the water can greatly reduce the grinding stone wear rate [%], and can also reduce the surface roughness of the grinding surface of the grinding object 3. Ra [μm].

The embodiments and examples have been described as above, but it is expected that the configurations of the embodiments and examples will be appropriately combined initially.

Although the embodiment of the present invention has been described, it should be understood that the embodiment disclosed this time is illustrative and non-restrictive in every respect. The scope of the present invention is shown by the scope of patent application, and it means all changes within the meaning and scope equivalent to the scope of patent application.

[Industrial Applicability] The embodiments disclosed herein can be used for a grinding device and a method for manufacturing a ground article, and can be particularly effectively used for grinding objects such as semiconductor packages that need to simultaneously process different materials. Grinding.

1‧‧‧ base

2‧‧‧ platform

3‧‧‧ Grinding object

3a‧‧‧ supporting components

3b‧‧‧sealing resin

4‧‧‧Grinding fluid supply department

5‧‧‧ millstone

6‧‧‧ wheel fixings

6a‧‧‧underside

7‧‧‧ Spindle

8‧‧‧ Motor

9‧‧‧ Connection Department

10‧‧‧ pillar

11‧‧‧Grinding Department

12‧‧‧Fine Bubble Water Supply Department

12a‧‧‧Fine bubble water supply part mounting part

12b‧‧‧Fine bubble water container

12c‧‧‧Fine bubble water discharge part

12d‧‧‧End wall

12e‧‧‧ bottom

12f‧‧‧Wall

12g‧‧‧Connection Department

13‧‧‧hose

14‧‧‧Fine Bubble Water Generator

15‧‧‧ ring abutment

16‧‧‧Grinding wheel

21‧‧‧ Cover

22, 23‧‧‧ area

31‧‧‧Fine bubble water supply hole

32‧‧‧Fine Bubble Water

41‧‧‧Grinding area

42‧‧‧Non-grinding area

43, 44‧‧‧ axis

45‧‧‧ first direction

46‧‧‧ second direction

51‧‧‧arrow

FIG. 1 is a schematic side view of a grinding apparatus according to the embodiment. FIG. 2 is a schematic plan view of a bottom surface of the wheel fixing member shown in FIG. 1. FIG. 3 is a schematic plan view of the grinding wheel shown in FIG. 1. FIG. 4 is a schematic side view illustrating an example of a method of mounting a grinding wheel on a wheel fixture. FIG. 5 is a schematic plan view of the fine bubble water supply section shown in FIG. 1. FIG. 6 is a schematic plan view of an end surface of the fine bubble water supply section shown in FIG. 5. FIG. 7 is a schematic cross-sectional view illustrating a method for manufacturing a ground product according to the embodiment. FIG. 8 is a schematic perspective view illustrating a method for manufacturing a ground product according to the embodiment. FIG. 9 is a schematic plan view illustrating a method for manufacturing a ground product according to the embodiment. FIG. 10 is a schematic enlarged cross-sectional view illustrating an example of a method for cleaning a grindstone in the embodiment. FIG. 11 is a schematic plan view illustrating an example of the relationship between the discharge direction of the fine bubble water and the rotation direction of the grinding unit in the embodiment.

Claims (8)

A grinding device includes a grinding unit in which a grindstone is arranged in a ring shape and is rotatable, and the grinding device is characterized in that the grindstone is configured to grind the object during grinding. The grinding area where the grinding object is ground and the non-grinding area where the grinding object is not ground are co-existed. The grinding device further includes a micro-bubble water generator to generate micro-bubbles. And a micro-bubble water supply unit configured to supply the micro-bubble water to the grinding stone in the non-grinding area, the micro-bubble water supply unit is configured to receive the micro-bubble water The fine bubble water supplied from the bubble water generator is configured to soak the millstone in the non-grinding area. The grinding device according to item 1 of the patent application scope, wherein the grinding device further comprises: a base; and a platform provided on the base, and the grinding object is set during grinding, and the fine The bubble water supply unit includes a fine bubble water discharge unit configured to discharge the fine bubble water, and the fine bubble water discharge unit is located in a region other than a region corresponding to the installation position of the grinding object. Above the base. The grinding device according to item 1 of the scope of patent application, further comprising: a grinding fluid supply unit configured to supply the grinding fluid to the grinding surface of the object to be ground. Way composition. The grinding device according to any one of claims 1 to 3, wherein the object to be ground includes a support member and a sealing resin on the support member, and the grinding device is configured to grind at least A part of the sealing resin is configured to reduce the thickness of the object to be ground. A method for manufacturing an abrasive article, comprising the steps of rotating a grinding unit in which a grinding stone is arranged in a ring shape to grind an object to be ground with the grinding stone, and a method for producing the abrasive article The grinding stone is a grinding area where the grinding object is ground during the grinding process of the grinding object and a non-grinding area where the grinding object is not ground. It is arranged in a coexisting manner, and the method for manufacturing the abrasive article includes the steps of: generating micro-bubble water using a micro-bubble water generator, and supplying the micro-bubble water supply unit; and A grindstone supplies the fine bubble water, wherein the step of supplying the fine bubble water includes a step of immersing the grindstone in the non-grinding area in the fine bubble water. The manufacturing method of the abrasive article according to item 5 of the patent application scope further includes a step of discharging the fine bubble water from above a region other than a region corresponding to the installation location of the object to be ground. The manufacturing method of the abrasive article according to item 5 of the patent application scope further includes: A step of supplying a grinding liquid to a grinding surface of the grinding object. The method for manufacturing a ground article according to any one of claims 5 to 7, wherein the object to be ground includes a supporting member and a sealing resin on the supporting member, and the manufacturing of the ground article The method includes the step of grinding the object to be ground, including the step of grinding at least a part of the sealing resin to reduce the thickness of the object to be ground.