TWI672478B - 迴路式均溫板 - Google Patents

迴路式均溫板 Download PDF

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Publication number
TWI672478B
TWI672478B TW107115224A TW107115224A TWI672478B TW I672478 B TWI672478 B TW I672478B TW 107115224 A TW107115224 A TW 107115224A TW 107115224 A TW107115224 A TW 107115224A TW I672478 B TWI672478 B TW I672478B
Authority
TW
Taiwan
Prior art keywords
space
channel
passage
liquid
evaporation
Prior art date
Application number
TW107115224A
Other languages
English (en)
Chinese (zh)
Other versions
TW201947179A (zh
Inventor
曾惓祺
廖文靖
崔明全
Original Assignee
泰碩電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 泰碩電子股份有限公司 filed Critical 泰碩電子股份有限公司
Priority to TW107115224A priority Critical patent/TWI672478B/zh
Priority to JP2018132253A priority patent/JP2019194515A/ja
Priority to US16/051,916 priority patent/US20190339022A1/en
Application granted granted Critical
Publication of TWI672478B publication Critical patent/TWI672478B/zh
Publication of TW201947179A publication Critical patent/TW201947179A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/025—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having non-capillary condensate return means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW107115224A 2018-05-04 2018-05-04 迴路式均溫板 TWI672478B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW107115224A TWI672478B (zh) 2018-05-04 2018-05-04 迴路式均溫板
JP2018132253A JP2019194515A (ja) 2018-05-04 2018-07-12 還流型ベイパーチャンバー
US16/051,916 US20190339022A1 (en) 2018-05-04 2018-08-01 Loop vapor chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW107115224A TWI672478B (zh) 2018-05-04 2018-05-04 迴路式均溫板

Publications (2)

Publication Number Publication Date
TWI672478B true TWI672478B (zh) 2019-09-21
TW201947179A TW201947179A (zh) 2019-12-16

Family

ID=68383847

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107115224A TWI672478B (zh) 2018-05-04 2018-05-04 迴路式均溫板

Country Status (3)

Country Link
US (1) US20190339022A1 (ja)
JP (1) JP2019194515A (ja)
TW (1) TWI672478B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6560425B1 (ja) * 2018-11-09 2019-08-14 古河電気工業株式会社 ヒートパイプ

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203811001U (zh) * 2014-04-18 2014-09-03 双鸿科技股份有限公司 回路式均温板
CN205580271U (zh) * 2016-04-21 2016-09-14 广州华钻电子科技有限公司 一种气液分离式均温板
CN106998641A (zh) * 2016-01-25 2017-08-01 昆山巨仲电子有限公司 一种具有回路的均温板

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4492266A (en) * 1981-10-22 1985-01-08 Lockheed Missiles & Space Company, Inc. Manifolded evaporator for pump-assisted heat pipe
JPH063354B2 (ja) * 1987-06-23 1994-01-12 アクトロニクス株式会社 ル−プ型細管ヒ−トパイプ
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
KR100338810B1 (ko) * 1999-11-08 2002-05-31 윤종용 냉각장치
KR100438825B1 (ko) * 2001-10-29 2004-07-05 삼성전자주식회사 단열 수단을 구비하는 열 전달 장치
JP4032954B2 (ja) * 2002-07-05 2008-01-16 ソニー株式会社 冷却装置、電子機器装置、音響装置及び冷却装置の製造方法
JP2004353902A (ja) * 2003-05-27 2004-12-16 Sony Corp 冷却装置
US7184265B2 (en) * 2003-05-29 2007-02-27 Lg Electronics Inc. Cooling system for a portable computer
TWI274839B (en) * 2004-12-31 2007-03-01 Foxconn Tech Co Ltd Pulsating heat conveyance apparatus
US20060173344A1 (en) * 2005-01-19 2006-08-03 Siemens Medical Solutions Usa, Inc. Method for using a refrigeration system to remove waste heat from an ultrasound transducer
CN100590377C (zh) * 2005-02-18 2010-02-17 阳傑科技股份有限公司 热管冷却系统及其热传递连接器
TWM278218U (en) * 2005-05-19 2005-10-11 Cooler Master Co Ltd Improved water-cooling radiator structure
US7352580B2 (en) * 2006-02-14 2008-04-01 Hua-Hsin Tsai CPU cooler
TW200829852A (en) * 2007-01-09 2008-07-16 Univ Tamkang Loop heat pipe with a flat plate evaporator structure
JP2009059801A (ja) * 2007-08-30 2009-03-19 Toshiba Corp 電子機器
CN101762194B (zh) * 2008-12-24 2012-09-19 富准精密工业(深圳)有限公司 蒸发器及应用该蒸发器的回路式热管
TWI366656B (en) * 2009-06-05 2012-06-21 Young Green Energy Co Loop heat pipe and manufacturing method thereof
CN102042776A (zh) * 2009-10-16 2011-05-04 富准精密工业(深圳)有限公司 回路热管
CN102374807A (zh) * 2010-08-20 2012-03-14 富准精密工业(深圳)有限公司 回路热管
CN102374803A (zh) * 2010-08-20 2012-03-14 富准精密工业(深圳)有限公司 回路热管
JP5720338B2 (ja) * 2011-03-17 2015-05-20 富士通株式会社 ループ型ヒートパイプ
JPWO2013018667A1 (ja) * 2011-08-01 2015-03-05 日本電気株式会社 冷却装置及びそれを用いた電子機器
CN102984916B (zh) * 2011-09-07 2017-06-16 技嘉科技股份有限公司 循环式散热器
CN105814389B (zh) * 2013-12-13 2019-04-19 富士通株式会社 环型热管及其制造方法、以及电子设备
WO2015115028A1 (ja) * 2014-01-28 2015-08-06 パナソニックＩｐマネジメント株式会社 冷却装置とこれを備えたデータセンター
EP2985556B1 (en) * 2014-08-14 2017-03-15 Ibérica del Espacio, S.A. Advanced control two phase heat transfer loop
JP2016090080A (ja) * 2014-10-30 2016-05-23 富士通株式会社 冷却装置及び電子装置
JP6485075B2 (ja) * 2015-01-29 2019-03-20 富士通株式会社 ループヒートパイプ及びループヒートパイプの製造方法
WO2017037921A1 (ja) * 2015-09-03 2017-03-09 富士通株式会社 ループヒートパイプ及びその製造方法並びに電子機器
JPWO2017068677A1 (ja) * 2015-10-22 2018-08-09 株式会社丸三電機 配管部材、ヒートパイプ、及び冷却装置
JP6648824B2 (ja) * 2016-05-23 2020-02-14 富士通株式会社 ループヒートパイプ及びその製造方法並びに電子機器
TWM532046U (zh) * 2016-06-02 2016-11-11 Tai Sol Electronics Co Ltd 具有液汽分離結構的均溫板
CN107787156A (zh) * 2016-08-24 2018-03-09 台达电子工业股份有限公司 散热组件
US10012445B2 (en) * 2016-09-08 2018-07-03 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure
US10288356B2 (en) * 2016-10-14 2019-05-14 Taiwan Microloops Corp. Vapor chamber and heat pipe combined structure and combining method thereof
US10345049B2 (en) * 2017-04-11 2019-07-09 Cooler Master Co., Ltd. Communication-type thermal conduction device
CN107702574A (zh) * 2017-09-25 2018-02-16 华中科技大学 一种纵向供液蒸发器
CN107764117A (zh) * 2017-10-27 2018-03-06 南京航空航天大学 一种基于碳纳米管阵列的吸液芯支撑柱一体结构平板热管
JP6951267B2 (ja) * 2018-01-22 2021-10-20 新光電気工業株式会社 ヒートパイプ及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203811001U (zh) * 2014-04-18 2014-09-03 双鸿科技股份有限公司 回路式均温板
CN106998641A (zh) * 2016-01-25 2017-08-01 昆山巨仲电子有限公司 一种具有回路的均温板
CN205580271U (zh) * 2016-04-21 2016-09-14 广州华钻电子科技有限公司 一种气液分离式均温板

Also Published As

Publication number Publication date
JP2019194515A (ja) 2019-11-07
TW201947179A (zh) 2019-12-16
US20190339022A1 (en) 2019-11-07

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