TWI672356B - Thermal peeling adhesive sheet - Google Patents

Thermal peeling adhesive sheet Download PDF

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Publication number
TWI672356B
TWI672356B TW105105164A TW105105164A TWI672356B TW I672356 B TWI672356 B TW I672356B TW 105105164 A TW105105164 A TW 105105164A TW 105105164 A TW105105164 A TW 105105164A TW I672356 B TWI672356 B TW I672356B
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adhesive layer
meth
adhesive
weight
parts
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TW105105164A
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TW201638263A (en
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平山高正
下川大輔
西尾昭德
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日商日東電工股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/255Polyesters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00Presence of polyester
    • C09J2467/006Presence of polyester in the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

本發明提供一種具備藥液難以滲入之黏著劑層之加熱剝離型黏著片(熱剝離型黏著片)。 The present invention provides a heat-peelable pressure-sensitive adhesive sheet (heat-peelable pressure-sensitive adhesive sheet) having an adhesive layer which is difficult for a chemical solution to penetrate.

本發明之熱剝離型黏著片依序具備第一黏著劑層、基材、以及第二黏著劑層,該第一黏著劑層含有包含(甲基)丙烯酸系聚合物之丙烯酸系黏著劑及熱膨脹性微球,該(甲基)丙烯酸系聚合物包含源自具有碳數為2以上之烷基之(甲基)丙烯酸烷基酯之結構單元、以及源自具有OH基之(甲基)丙烯酸系單體之結構單元,該(甲基)丙烯酸系聚合物中,側鏈烷基之碳(C)與OH基之莫耳比(C/OH)為40~150。 The heat-peelable adhesive sheet of the present invention includes a first adhesive layer, a substrate, and a second adhesive layer in this order. The first adhesive layer contains an acrylic adhesive containing a (meth) acrylic polymer and thermal expansion. Microspheres, the (meth) acrylic polymer includes structural units derived from an alkyl (meth) acrylate having an alkyl group having a carbon number of 2 or more, and derived from (meth) acrylic acid having an OH group It is a structural unit of a monomer. In this (meth) acrylic polymer, the molar ratio (C / OH) of the carbon (C) of the side chain alkyl group to the OH group is 40 to 150.

Description

熱剝離型黏著片 Thermal release adhesive sheet

本發明係關於一種熱剝離型黏著片。 The present invention relates to a heat-peelable adhesive sheet.

先前以來,製造電子裝置所具備之基板時,為了進行保護而於基板材料上貼附黏著片(例如專利文獻1)。例如,對作為基板材料之銅箔進行蝕刻時,為了防止蝕刻液附著於銅箔之非處理面,而於銅箔上貼附黏著片。又,利用氫氟酸等酸對玻璃基板進行表面研磨時,亦於非處理面上貼附黏著片。對於此種用途之黏著片而言,若藥液滲入至黏著片之黏著劑層、黏著劑層與其他層之界面等,則所侵入之藥液成為於藥液處理後之後續步驟中釋氣之主要原因,或者成為黏著劑層中之添加材料發生變質之主要原因。例如,產生如專利文獻1中亦記載之問題:於包含為了表現出再剝離性而添加之熱膨脹性微球(發泡劑)之黏著劑層中,該發泡劑因酸性或鹼性之藥液而發生化學變質,導致發泡功能消失。 Conventionally, when manufacturing a substrate included in an electronic device, an adhesive sheet is attached to the substrate material for protection (for example, Patent Document 1). For example, when a copper foil is etched as a substrate material, an adhesive sheet is attached to the copper foil in order to prevent the etchant from adhering to the non-treated surface of the copper foil. When the glass substrate is surface-polished with an acid such as hydrofluoric acid, an adhesive sheet is also attached to the non-treated surface. For the adhesive sheet for this purpose, if the medicinal solution penetrates the adhesive layer of the adhesive sheet, the interface between the adhesive layer and other layers, etc., the invaded medicinal solution becomes outgassed in the subsequent steps after the medicinal solution is processed. This may be the main reason for the deterioration of the additive material in the adhesive layer. For example, as described in Patent Document 1, a problem arises in that an adhesive layer containing thermally expandable microspheres (foaming agents) added to exhibit re-peelability is an acidic or alkaline drug The liquid undergoes chemical deterioration, causing the foaming function to disappear.

[先前技術文獻] [Prior technical literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2001-019915號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2001-019915

本發明係為了解決上述先前之問題而成者,其主要目的在於提供一種具備藥液難以滲入之黏著劑層之加熱剝離型黏著片(熱剝離型 黏著片)。 The present invention has been made in order to solve the foregoing problems, and a main object thereof is to provide a heat-peelable pressure-sensitive adhesive sheet (heat-peelable type) having an adhesive layer that is difficult to penetrate into a medical solution. Adhesive sheet).

本發明之熱剝離型黏著片依序具備第一黏著劑層、基材、以及第二黏著劑層,該第一黏著劑層含有包含(甲基)丙烯酸系聚合物之丙烯酸系黏著劑及熱膨脹性微球,該(甲基)丙烯酸系聚合物包含源自具有碳數為2以上之烷基之(甲基)丙烯酸烷基酯之結構單元、以及源自具有OH基之(甲基)丙烯酸系單體之結構單元,該(甲基)丙烯酸系聚合物中,側鏈烷基之碳(C)與OH基之莫耳比(C/OH)為40~150。 The heat-peelable adhesive sheet of the present invention includes a first adhesive layer, a substrate, and a second adhesive layer in this order. The first adhesive layer contains an acrylic adhesive containing a (meth) acrylic polymer and thermal expansion. Microspheres, the (meth) acrylic polymer includes structural units derived from an alkyl (meth) acrylate having an alkyl group having a carbon number of 2 or more, and derived from (meth) acrylic acid having an OH group It is a structural unit of a monomer. In this (meth) acrylic polymer, the molar ratio (C / OH) of the carbon (C) of the side chain alkyl group to the OH group is 40 to 150.

於一實施形態中,上述第二黏著劑層包含上述熱膨脹性微球。 In one embodiment, the second adhesive layer includes the thermally expandable microspheres.

於一實施形態中,上述第一黏著劑層及/或第二黏著劑層之中心線平均表面粗糙度Ra為1μm以下。 In one embodiment, the center line average surface roughness Ra of the first adhesive layer and / or the second adhesive layer is 1 μm or less.

於一實施形態中,水對於上述第一黏著劑層及/或第二黏著劑層之接觸角為85°~115°。 In one embodiment, a contact angle of water with respect to the first adhesive layer and / or the second adhesive layer is 85 ° to 115 °.

於一實施形態中,上述第一黏著劑層包含黏著賦予劑,該黏著賦予劑之含有比率相對於該第一黏著劑層100重量份為40重量份以下。 In one embodiment, the first adhesive layer includes an adhesion-imparting agent, and a content ratio of the adhesion-imparting agent is 40 parts by weight or less based on 100 parts by weight of the first adhesive layer.

於一實施形態中,上述第二黏著劑層包含黏著賦予劑,該黏著賦予劑之含有比率相對於該第二黏著劑層100重量份為40重量份以下。 In one embodiment, the second adhesive layer includes an adhesion-imparting agent, and a content ratio of the adhesion-imparting agent is 40 parts by weight or less based on 100 parts by weight of the second adhesive layer.

於一實施形態中,上述第一黏著劑層及/或第二黏著劑層之凝膠分率為50%以上。 In one embodiment, the gel fraction of the first adhesive layer and / or the second adhesive layer is 50% or more.

於一實施形態中,將上述第一黏著劑層側貼合於聚對苯二甲酸乙二酯膜時於23℃下之黏著力為1N/20mm以上。 In one embodiment, the adhesive force at 23 ° C. when the first adhesive layer side is bonded to the polyethylene terephthalate film is 1 N / 20 mm or more.

根據本發明之另一態樣,提供一種電子零件。該電子零件係使用上述熱剝離型黏著片而製造。 According to another aspect of the present invention, an electronic component is provided. This electronic component is manufactured using the said thermal peeling-type adhesive sheet.

本發明中,藉由形成包含(甲基)丙烯酸系聚合物作為基礎聚合物之黏著劑層,上述(甲基)丙烯酸系聚合物包含源自具有碳數為2以上之烷基之(甲基)丙烯酸烷基酯之結構單元、以及源自具有OH基之(甲基)丙烯酸系單體之結構單元,並將該(甲基)丙烯酸系聚合物中之側鏈烷基之碳(C)與OH基之莫耳比(C/OH)設為特定範圍,能夠提供一種具備藥液難以滲入且黏著力優異之黏著劑層之熱剝離型黏著片。又,本發明之黏著片由於具備包含熱膨脹性微球之黏著劑層,因此藉由加熱而表現出優異之剝離性。進而,本發明中,由於藥液難以滲入至上述黏著劑層,因此能夠提供一種即使在暴露於酸性或鹼性之藥液之類之用途(例如蝕刻時之保護用途)中亦不損害熱膨脹性微球之功能而高度地兼顧黏著性及剝離性之熱剝離型黏著片。 In the present invention, by forming an adhesive layer containing a (meth) acrylic polymer as a base polymer, the (meth) acrylic polymer includes a (meth) group derived from an alkyl group having a carbon number of 2 or more. ) A structural unit of an alkyl acrylate, a structural unit derived from a (meth) acrylic monomer having an OH group, and a carbon (C) of a side chain alkyl group in the (meth) acrylic polymer Molar ratio (C / OH) with OH group is set to a specific range, and a heat-peelable pressure-sensitive adhesive sheet having an adhesive layer that is difficult to penetrate into a chemical solution and has excellent adhesion can be provided. Moreover, since the adhesive sheet of this invention is provided with the adhesive layer containing a heat-expandable microsphere, it shows the outstanding peelability by heating. Furthermore, in the present invention, since the chemical solution is difficult to penetrate into the adhesive layer, it is possible to provide a thermal expansion property without impairing the thermal expansion property even in applications such as exposure to acidic or alkaline chemical solutions (for example, protection during etching). A heat-peelable pressure-sensitive adhesive sheet having both functions of microspheres and a high degree of adhesiveness and releasability.

10‧‧‧第一黏著劑層 10‧‧‧ first adhesive layer

20‧‧‧基材 20‧‧‧ substrate

30‧‧‧第二黏著劑層 30‧‧‧Second adhesive layer

40‧‧‧彈性層 40‧‧‧ Elastic layer

100、200‧‧‧熱剝離型黏著片 100, 200‧‧‧ Thermal Peeling Adhesive Sheet

圖1係本發明之一實施形態之熱剝離型黏著片之概略剖視圖。 FIG. 1 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to an embodiment of the present invention.

圖2係本發明之另一實施形態之熱剝離型黏著片之概略剖視圖。 FIG. 2 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to another embodiment of the present invention.

A.熱剝離型黏著片之整體構成A. Overall composition of heat-peelable adhesive sheet

圖1係本發明之一實施形態之熱剝離型黏著片之概略剖視圖。熱剝離型黏著片100依序具備第一黏著劑層10、基材20、以及第二黏著劑層30。第一黏著劑層10包含熱膨脹性微球。熱膨脹性微球藉由加熱而膨脹或發泡,因此包含該熱膨脹性微球之黏著劑層藉由加熱而黏著力降低。本發明之熱剝離型黏著片藉由具備包含熱膨脹性微球之黏著劑層,從而即使於兩面貼合有被黏著體之情形時,亦可藉由進行加熱而容易剝離該被黏著體,能夠防止該被黏著體之破損。再者,熱膨脹性微球亦可包含於第二黏著劑層中。 FIG. 1 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to an embodiment of the present invention. The thermal peeling type adhesive sheet 100 includes a first adhesive layer 10, a substrate 20, and a second adhesive layer 30 in this order. The first adhesive layer 10 includes thermally expandable microspheres. The heat-expandable microspheres expand or foam by heating. Therefore, the adhesive layer containing the heat-expandable microspheres has a reduced adhesive force by heating. The heat-peelable pressure-sensitive adhesive sheet of the present invention is provided with an adhesive layer containing heat-expandable microspheres, so that even when an adherend is bonded on both sides, the adherend can be easily peeled off by heating, so that Prevent damage to the adherend. Furthermore, the thermally expandable microspheres may be contained in the second adhesive layer.

圖2係本發明之另一實施形態之熱剝離型黏著片之概略剖視圖。該熱剝離型黏著片200進而具備彈性層40。彈性層40可鄰接於第一黏 著劑層10或第二黏著劑層30而設置。較佳為彈性層40係鄰接於包含熱膨脹性微球之黏著劑層而設置。於一實施形態中,如圖示例般,將彈性層40設置於第一黏著劑層10與基材20之間。藉由具備彈性層,對於具有凹凸面之被黏著體之追隨性提高。又,若將彈性層鄰接於包含熱膨脹性微球之黏著劑層而設置,則於剝離時經加熱時之黏著劑層之面方向之變形(膨脹)受到約束,而優先發生厚度方向之變形。其結果,剝離性提高。 FIG. 2 is a schematic cross-sectional view of a heat-peelable pressure-sensitive adhesive sheet according to another embodiment of the present invention. The heat-peelable pressure-sensitive adhesive sheet 200 further includes an elastic layer 40. The elastic layer 40 may be adjacent to the first adhesive The adhesive layer 10 or the second adhesive layer 30 is provided. The elastic layer 40 is preferably provided adjacent to the adhesive layer containing the thermally expandable microspheres. In one embodiment, as shown in the example, the elastic layer 40 is disposed between the first adhesive layer 10 and the substrate 20. By having the elastic layer, the followability to an adherend having an uneven surface is improved. In addition, if the elastic layer is provided adjacent to the adhesive layer containing thermally expandable microspheres, deformation (expansion) in the surface direction of the adhesive layer when heated upon peeling is restricted, and deformation in the thickness direction is preferentially generated. As a result, peelability improves.

雖未圖示,但本發明之熱剝離型黏著片亦可在供於使用之前之期間以保護黏著面為目的而於黏著劑層之外側設置剝離襯墊。 Although not shown, a release liner may be provided on the outer side of the adhesive layer for the purpose of protecting the adhesive surface before the heat-peelable adhesive sheet of the present invention is used.

將本發明之熱剝離型黏著片之第一黏著劑層側貼合於聚對苯二甲酸乙二酯(PET)膜時於23℃下之黏著力較佳為1N/20mm以上、更佳為3N/20mm~20N/20mm、進而較佳為4N/20mm~10N/20mm。若為此種範圍,則能夠獲得作為暫時保護用黏著片而有用之熱剝離型黏著片。本說明書中,所謂黏著力,係指利用基於JIS Z 0237:2000之方法所測定之黏著力。具體之測定方法後面將進行敍述。再者,本發明之熱剝離型黏著片係藉由加熱而黏著力降低之黏著片,所謂上述「23℃下之黏著力」,係指使黏著力降低之前之黏著力。 When the first adhesive layer side of the heat-peelable pressure-sensitive adhesive sheet of the present invention is bonded to a polyethylene terephthalate (PET) film, the adhesive force at 23 ° C is preferably 1N / 20mm or more, more preferably 3N / 20mm to 20N / 20mm, and more preferably 4N / 20mm to 10N / 20mm. Within this range, a heat-peelable pressure-sensitive adhesive sheet useful as a temporary protection pressure-sensitive adhesive sheet can be obtained. In this specification, the adhesive force refers to an adhesive force measured by a method based on JIS Z 0237: 2000. The specific measurement method will be described later. Furthermore, the heat-peelable adhesive sheet of the present invention is an adhesive sheet whose adhesive force is reduced by heating. The so-called “adhesive force at 23 ° C.” refers to the adhesive force before the adhesive force is reduced.

B.第一黏著劑層B. First adhesive layer

上述第一黏著劑層含有包含作為基礎聚合物之(甲基)丙烯酸系聚合物之丙烯酸系黏著劑I及熱膨脹性微球。 The first adhesive layer contains an acrylic adhesive I containing a (meth) acrylic polymer as a base polymer and thermally expandable microspheres.

B-1.丙烯酸系黏著劑IB-1. Acrylic Adhesive I <(甲基)丙烯酸系聚合物> <(Meth) acrylic polymer>

作為上述丙烯酸系黏著劑I中包含之(甲基)丙烯酸系聚合物,可使用以具有碳數為2以上之烷基之(甲基)丙烯酸烷基酯(a)及具有OH基之(甲基)丙烯酸系單體(b)作為單體成分而獲得之聚合物。 As the (meth) acrylic polymer contained in the acrylic adhesive I, an (meth) acrylic acid alkyl ester (a) having an alkyl group having 2 or more carbon atoms and an (meth) acrylic acid having an OH group can be used. Group) A polymer obtained by using an acrylic monomer (b) as a monomer component.

作為上述(甲基)丙烯酸烷基酯(a)之具體例,可列舉:(甲基)丙烯 酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第二丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸庚酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸十一烷基酯、(甲基)丙烯酸十二烷基酯、(甲基)丙烯酸十三烷基酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十五烷基酯、(甲基)丙烯酸十六烷基酯、(甲基)丙烯酸十七烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸十九烷基酯、(甲基)丙烯酸二十烷基酯等。(甲基)丙烯酸烷基酯(a)可單獨使用或者組合2種以上使用。 Specific examples of the (meth) acrylic acid alkyl ester (a) include (meth) propylene Ethyl acetate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, second butyl (meth) acrylate, (formyl) Base) tert-butyl acrylate, amyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate Ester, isooctyl (meth) acrylate, nonyl (meth) acrylate, isononyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, (meth) acrylic acid Undecyl ester, dodecyl (meth) acrylate, tridecyl (meth) acrylate, tetradecyl (meth) acrylate, pentadecyl (meth) acrylate, Hexadecyl (meth) acrylate, Heptadecyl (meth) acrylate, Octadecyl (meth) acrylate, Undecyl (meth) acrylate, Dimethacrylate (di) Decadecyl esters and the like. The alkyl (meth) acrylate (a) can be used alone or in combination of two or more.

上述(甲基)丙烯酸烷基酯(a)所具有之烷基之碳數如上所述為2以上、較佳為4以上、更佳為4~20、進而較佳為6~18。藉由使用具有此種烷基之(甲基)丙烯酸烷基酯(a),能夠形成藥液(例如,酸性或鹼性之藥液)難以滲入之黏著劑層。 The carbon number of the alkyl group which the said (meth) acrylic-acid alkylester (a) has is 2 or more as mentioned above, Preferably it is 4 or more, More preferably, it is 4-20, More preferably, it is 6-18. By using an alkyl (meth) acrylate (a) having such an alkyl group, it is possible to form an adhesive layer that is difficult for a chemical solution (for example, an acidic or basic chemical solution) to penetrate.

作為具有OH基之(甲基)丙烯酸系單體(b)之具體例,可列舉:(甲基)丙烯酸羥基乙酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸羥基丁酯、(甲基)丙烯酸羥基己酯、(甲基)丙烯酸羥基辛酯、(甲基)丙烯酸羥基癸酯、(甲基)丙烯酸羥基月桂酯、甲基丙烯酸(4-羥基甲基環己基)甲酯等。作為(甲基)丙烯酸系單體(b),亦可使用丙烯酸、甲基丙烯酸、丙烯酸羧基乙酯、丙烯酸羧基戊酯、伊康酸、馬來酸、富馬酸、巴豆酸等含羧基之(甲基)丙烯酸系單體。(甲基)丙烯酸系單體(b)可單獨使用或者組合2種以上使用。 Specific examples of the (meth) acrylic monomer (b) having an OH group include hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, Hydroxyhexyl (meth) acrylate, hydroxyoctyl (meth) acrylate, hydroxydecyl (meth) acrylate, hydroxylauryl (meth) acrylate, (4-hydroxymethylcyclohexyl) methyl methacrylate Wait. As the (meth) acrylic monomer (b), carboxyl-containing compounds such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, iconic acid, maleic acid, fumaric acid, and crotonic acid can also be used. (Meth) acrylic monomer. The (meth) acrylic monomer (b) can be used alone or in combination of two or more.

上述丙烯酸系黏著劑I中包含之(甲基)丙烯酸系聚合物亦可以凝聚力、耐熱性、交聯性等之改質為目的而視需要包含能夠與上述(甲基)丙烯酸烷基酯(a)及/或(甲基)丙烯酸系單體(b)共聚之其他單體所對 應之結構單元。作為此種單體,可列舉例如:(甲基)丙烯酸甲酯;馬來酸酐、伊康酸酐等酸酐單體;苯乙烯磺酸、烯丙基磺酸、2-(甲基)丙烯醯胺-2-甲基丙磺酸、(甲基)丙烯醯胺丙磺酸、(甲基)丙烯酸磺丙酯、(甲基)丙烯醯氧基萘磺酸等含磺酸基之單體;(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N-丁基(甲基)丙烯醯胺、N-羥甲基(甲基)丙烯醯胺、N-羥甲基丙烷(甲基)丙烯醯胺等(N-取代)醯胺系單體;(甲基)丙烯酸胺基乙酯、(甲基)丙烯酸N,N-二甲胺基乙酯、(甲基)丙烯酸第三丁基胺基乙酯等(甲基)丙烯酸胺基烷基酯系單體;(甲基)丙烯酸甲氧基乙酯、(甲基)丙烯酸乙氧基乙酯等(甲基)丙烯酸烷氧基烷基酯系單體;N-環己基馬來醯亞胺、N-異丙基馬來醯亞胺、N-月桂基馬來醯亞胺、N-苯基馬來醯亞胺等馬來醯亞胺系單體;N-甲基伊康醯亞胺、N-乙基伊康醯亞胺、N-丁基伊康醯亞胺、N-辛基伊康醯亞胺、N-2-乙基己基伊康醯亞胺、N-環己基伊康醯亞胺、N-月桂基伊康醯亞胺等伊康醯亞胺系單體;N-(甲基)丙烯醯氧基亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-6-氧基六亞甲基琥珀醯亞胺、N-(甲基)丙烯醯基-8-氧基八亞甲基琥珀醯亞胺等琥珀醯亞胺系單體;乙酸乙烯酯、丙酸乙烯酯、N-乙烯基吡咯啶酮、甲基乙烯基吡咯啶酮、乙烯基吡啶、乙烯基哌啶酮、乙烯基嘧啶、乙烯基哌、乙烯基吡、乙烯基吡咯、乙烯基咪唑、乙烯基唑、乙烯基啉、N-乙烯基羧醯胺系、苯乙烯、α-甲基苯乙烯、N-乙烯基己內醯胺等乙烯基系單體;丙烯腈、甲基丙烯腈等氰基丙烯酸酯單體;(甲基)丙烯酸縮水甘油酯等含環氧基之丙烯酸系單體;聚乙二醇(甲基)丙烯酸酯、聚丙二醇(甲基)丙烯酸酯、甲氧基乙二醇(甲基)丙烯酸酯、甲氧基聚丙二醇(甲基)丙烯酸酯等二醇系丙烯酸酯單體;(甲基)丙烯酸四氫糠酯、氟(甲基)丙烯酸酯、聚矽氧(甲基)丙烯酸酯等具有雜環、鹵素原子、矽原子等之丙烯酸酯系單體;己二醇二(甲基)丙烯酸酯、(聚)乙二醇二(甲基)丙 烯酸酯、(聚)丙二醇二(甲基)丙烯酸酯、新戊二醇二(甲基)丙烯酸酯、季戊四醇二(甲基)丙烯酸酯、三羥甲基丙烷三(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、環氧丙烯酸酯、聚酯丙烯酸酯、丙烯酸胺基甲酸酯等多官能單體;異戊二烯、丁二烯、異丁烯等烯烴系單體;乙烯醚等乙烯醚系單體等。該等單體成分可單獨使用或者組合2種以上使用。 The (meth) acrylic polymer contained in the above-mentioned acrylic adhesive I may also be used for the purpose of improving cohesive force, heat resistance, crosslinkability, and the like, and if necessary, it may contain an alkyl (meth) acrylate (a ) And / or (meth) acrylic monomer (b) is a structural unit corresponding to other monomers copolymerized. Examples of such monomers include: methyl (meth) acrylate; anhydride monomers such as maleic anhydride and itaconic anhydride; styrene sulfonic acid, allyl sulfonic acid, and 2- (meth) acrylamide Sulfonic acid group-containing monomers such as 2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate, and (meth) acrylamidooxynaphthalenesulfonic acid; ( (Meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxymethyl (meth) acrylamide, N-hydroxyl (N-substituted) fluorenamine monomers such as methpropane (meth) acrylamide; amine ethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, (methyl (Meth) acrylic acid (meth) acrylic acid amino alkyl ester-based monomers such as tert-butylaminoethyl acrylate; methoxyethyl (meth) acrylate, ethoxyethyl (meth) acrylate, etc. Group) alkoxyalkyl acrylate monomer; N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, N-phenylmaleimide Maleimide-based monomers such as arsenim; N-methyl Ikonimide, N-ethyl Ikonimide, N-butyl Ikonimide, N- Ikonimine monomers such as octyl Ikonimide, N-2-ethylhexyl Ikonimide, N-cyclohexyl Ikonimide, N-Lauryl Ikonimide; N- (meth) acryloxymethylene succinimide, N- (meth) acrylfluorenyl-6-oxyhexamethylene succinimide, N- (meth) acrylfluorenyl -8-oxyoctamethylene succinimide and other succinimide-based monomers; vinyl acetate, vinyl propionate, N-vinyl pyrrolidone, methyl vinyl pyrrolidone, vinyl pyridine , Vinyl piperidone, vinyl pyrimidine, vinyl piperidine Vinylpyridine , Vinylpyrrole, vinylimidazole, vinyl Azole, vinyl Vinyl monomers such as phthaloline, N-vinylcarboxamide, styrene, α -methylstyrene, N-vinyl caprolactam; cyanoacrylate monomers, such as acrylonitrile and methacrylonitrile ; Epoxy-based acrylic monomers such as glycidyl (meth) acrylate; polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) Glycol acrylate monomers such as acrylate and methoxy polypropylene glycol (meth) acrylate; tetrahydrofurfuryl (meth) acrylate, fluorine (meth) acrylate, polysiloxane (meth) acrylate And other acrylate monomers with heterocycles, halogen atoms, silicon atoms, etc .; hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (methyl) Base) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol Polyfunctional monomers such as hexa (meth) acrylate, epoxy acrylate, polyester acrylate, urethane acrylate; isoprene Butadiene, isobutylene and other olefin-based monomers; vinyl ether, vinyl ether-based monomers. These monomer components can be used individually or in combination of 2 or more types.

上述丙烯酸系黏著劑I中包含之(甲基)丙烯酸系聚合物係利用任意適當之聚合方法使具有碳數為2以上之烷基之(甲基)丙烯酸烷基酯(a)、具有OH基之(甲基)丙烯酸系單體(b)、以及視需要使用之其他單體(c)聚合而獲得。如此獲得之(甲基)丙烯酸系聚合物包含源自具有碳數為2以上(較佳為4以上、更佳為4~20、進而較佳為6~18)之烷基之(甲基)丙烯酸烷基酯之結構單元A、以及源自具有OH基之(甲基)丙烯酸系單體之結構單元B。即,上述(甲基)丙烯酸系聚合物包含側鏈具有碳數為2以上之烷基之結構單元A、以及具有OH基之結構單元B。 The (meth) acrylic polymer contained in the above-mentioned acrylic adhesive I is an alkyl (meth) acrylate (a) having an alkyl group having 2 or more carbon atoms and an OH group by any appropriate polymerization method. It is obtained by polymerizing the (meth) acrylic monomer (b) and other monomers (c) used as necessary. The (meth) acrylic polymer thus obtained contains (meth) derived from an alkyl group having a carbon number of 2 or more (preferably 4 or more, more preferably 4 to 20, and still more preferably 6 to 18). A structural unit A of an alkyl acrylate and a structural unit B derived from a (meth) acrylic monomer having an OH group. That is, the (meth) acrylic polymer includes a structural unit A having an alkyl group having 2 or more carbon atoms in a side chain and a structural unit B having an OH group.

包含結構單元A及結構單元B之(甲基)丙烯酸系聚合物之含有比率相對於丙烯酸系黏著劑I中之固形物成分100重量份,較佳為50重量份~100重量份,更佳為60重量份~98重量份,進而較佳為65重量份~90重量份。 The content ratio of the (meth) acrylic polymer including the structural unit A and the structural unit B is 100 parts by weight, preferably 50 to 100 parts by weight, and more preferably 100 parts by weight relative to the solid content of the acrylic adhesive I. 60 to 98 parts by weight, and more preferably 65 to 90 parts by weight.

源自具有碳數為2以上之烷基之(甲基)丙烯酸烷基酯之結構單元A之含有比率相對於上述(甲基)丙烯酸系聚合物100重量份,較佳為70重量份~98重量份,更佳為80重量份~95重量份,進而較佳為85重量份~95重量份。 The content ratio of the structural unit A derived from the alkyl (meth) acrylate having an alkyl group having 2 or more carbon atoms is preferably 70 to 98 parts by weight relative to 100 parts by weight of the (meth) acrylic polymer. It is more preferably 80 parts by weight to 95 parts by weight, and still more preferably 85 parts by weight to 95 parts by weight.

源自具有OH基之(甲基)丙烯酸系單體之結構單元B之含有比率相對於上述(甲基)丙烯酸系聚合物100重量份,較佳為1重量份~30重量份,更佳為2重量份~20重量份,進而較佳為3重量份~10重量份。 The content ratio of the structural unit B derived from the (meth) acrylic monomer having an OH group is preferably 1 to 30 parts by weight relative to 100 parts by weight of the (meth) acrylic polymer, and more preferably 2 to 20 parts by weight, and more preferably 3 to 10 parts by weight.

於上述丙烯酸系黏著劑I所包含之(甲基)丙烯酸系聚合物中,側鏈 烷基之碳(C)與OH基之莫耳比(C/OH)較佳為40~150、更佳為42~120、進而較佳為50~100、尤佳為55~80、最佳為55~75。再者,上述莫耳比(C/OH)可由形成具有側鏈烷基之結構單元之單體(即,(甲基)丙烯酸烷基酯(a)、及任意使用之(甲基)丙烯酸甲酯)之調配量、分子量及側鏈烷基之數量、以及具有OH基之(甲基)丙烯酸系單體(b)之調配量、分子量及OH基之數量而求出。例如,於使用單體a1、單體a2及單體a3作為形成具有側鏈烷基之結構單元之單體,且使用單體b1、單體b2作為(甲基)丙烯酸系單體(b)之情形時,上述莫耳比(C/OH)可利用下述式(1)求出。 In the (meth) acrylic polymer included in the above-mentioned acrylic adhesive I, the molar ratio (C / OH) of the carbon (C) of the side chain alkyl group to the OH group is preferably 40 to 150, more preferably It is 42 to 120, more preferably 50 to 100, particularly preferably 55 to 80, and most preferably 55 to 75. In addition, the above-mentioned molar ratio (C / OH) may be formed from a monomer (i.e., (meth) acrylic acid alkyl ester (a), and optionally (meth) acrylic acid methyl ester) forming a structural unit having a side chain alkyl group. The amount of the ester), the molecular weight, and the number of side chain alkyl groups, and the amount of the (meth) acrylic monomer (b) having an OH group, the molecular weight, and the number of OH groups were determined. For example, a monomer a 1 , a monomer 2 and a monomer a 3 are used as a monomer forming a structural unit having a side chain alkyl group, and a monomer b 1 and a monomer b 2 are used as (meth) acrylic In the case of the monomer (b), the above-mentioned molar ratio (C / OH) can be obtained by the following formula (1).

[數1]{(單體a1中之烷基數量)×(單體a1之調配量(g))/(單體a1之分子量)}+{(單體a2中之烷基數量)×(單體a2之調配量(g))/(單體a2之分子量)}+{(單體a3中之烷基數量)×(單體a3之調配量(g))/(單體a3之分子量)}/{(單體b1中之羥基數量)×(單體b1之調配量(g))/(單體b1之分子量)}+{(單體b2中之羥基數量)×(單體b2之調配量(g))/(單體b2之分子量)}…(1) [Number 1] {(the number of alkyl group in the monomers a 1) × (a compounding amount of the monomer 1 (g)) / (molecular weight of monomer a 1)} + {(monomer of group a 2 number) × (the amount of monomer formulation of a 2 (g)) / (molecular weight of monomer a 2)} + {(the number of monomers of group a 3) × (the amount of monomer formulation of a 3 (g) ) / (molecular weight of monomer a 3)} / {(number of monomer b 1 of a hydroxyl group) × (the amount of monomer b formulations (g of 1)) / (molecular weight of monomer b 1)} + {(single The number of hydroxyl groups in the body b 2 ) × (the blending amount of the monomer b 2 (g)) / (the molecular weight of the monomer b 2 )} ... (1)

本發明中,藉由使作為基礎聚合物之(甲基)丙烯酸系聚合物中含有特定量之碳數為2以上之烷基,能夠降低黏著劑層之極性,防止藥液(例如,酸性或鹼性之藥液)之滲入。另一方面,若黏著劑層之極性過低,則無法獲得充分之黏著力,但本發明中,藉由使上述(甲基)丙烯酸系聚合物進而包含OH基,且使側鏈烷基之碳(C)與OH基之莫耳 比(C/OH)為上述範圍,能夠維持黏著性且防止藥液滲入至黏著劑層。具備藉由含有特定量之OH基而能夠表現出優異黏著性之上述黏著劑層的本發明之熱剝離型黏著片亦能夠有效地防止藥液侵入至該黏著片與被黏著體之界面。若防止藥液侵入,則能夠抑制黏著劑之劣化,因此能夠維持優異之黏著性。又,由於能夠抑制黏著劑層中之熱膨脹性微球因藥液而變質,因此即使於酸性或鹼性之藥液中使用之情形時,亦不會損害熱剝離性。進而,由上述(甲基)丙烯酸系聚合物構成之黏著劑不易阻礙熱膨脹性微球之膨脹或發泡。起到該等效果之上述熱剝離型黏著片能夠較佳地用作蝕刻處理步驟等使用酸性或鹼性之藥液之步驟中之保護片。 In the present invention, by making the (meth) acrylic polymer as a base polymer a specific amount of an alkyl group having a carbon number of 2 or more, the polarity of the adhesive layer can be reduced, and a chemical solution (for example, acidic or acidic or Infiltration of alkaline chemicals). On the other hand, if the polarity of the adhesive layer is too low, a sufficient adhesive force cannot be obtained. However, in the present invention, the (meth) acrylic polymer further contains an OH group and the side chain alkyl group is reduced. Mol of carbon (C) and OH group The ratio (C / OH) is within the above range, and it is possible to maintain the adhesiveness and prevent the chemical solution from penetrating into the adhesive layer. The heat-peelable pressure-sensitive adhesive sheet of the present invention having the above-mentioned pressure-sensitive adhesive layer that exhibits excellent adhesiveness by containing a specific amount of OH groups can also effectively prevent a chemical solution from entering the interface between the pressure-sensitive adhesive sheet and the adherend. By preventing the penetration of the chemical solution, deterioration of the adhesive can be suppressed, and thus excellent adhesion can be maintained. In addition, since the thermally expandable microspheres in the adhesive layer can be prevented from being deteriorated by the medicinal solution, even when used in an acidic or alkaline medicinal solution, the thermal peelability is not impaired. Furthermore, the adhesive composed of the (meth) acrylic polymer is less likely to hinder the expansion or foaming of the thermally expandable microspheres. The above-mentioned thermally peelable pressure-sensitive adhesive sheet having these effects can be preferably used as a protective sheet in a step using an acidic or alkaline chemical solution such as an etching process step.

上述(甲基)丙烯酸系聚合物之重量平均分子量(利用凝膠滲透層析法(溶劑:THF),使用標準聚苯乙烯之校準曲線所測定之值)以聚苯乙烯換算,較佳為10萬~300萬、更佳為20萬~250萬、進而較佳為30萬~200萬。 The weight average molecular weight of the above (meth) acrylic polymer (value measured by gel permeation chromatography (solvent: THF) using a calibration curve of standard polystyrene) in terms of polystyrene, preferably 10 10,000 to 3 million, more preferably 200,000 to 2.5 million, and even more preferably 300,000 to 2 million.

<添加劑> <Additives>

上述丙烯酸系黏著劑I視需要可包含任意適當之添加劑。作為該添加劑,可列舉例如:交聯劑、黏著賦予劑、塑化劑(例如,偏苯三甲酸酯系塑化劑、均苯四甲酸酯系塑化劑)、顏料、染料、填充劑、防老化劑、導電材料、抗靜電劑、紫外線吸收劑、光穩定劑、剝離調整劑、軟化劑、界面活性劑、阻燃劑、抗氧化劑等。 The above-mentioned acrylic pressure-sensitive adhesive I may contain any appropriate additives as necessary. Examples of the additives include a crosslinking agent, an adhesion-imparting agent, a plasticizer (for example, a trimellitate-based plasticizer, a pyromellitic-based plasticizer), a pigment, a dye, and a filler. , Anti-aging agent, conductive material, antistatic agent, ultraviolet absorber, light stabilizer, peeling adjuster, softener, surfactant, flame retardant, antioxidant, etc.

作為上述黏著賦予劑,可使用任意適當之黏著賦予劑。作為黏著賦予劑,可使用例如黏著賦予樹脂。作為黏著賦予樹脂之具體例,可列舉:松香系黏著賦予樹脂(例如,未改性松香、改性松香、松香酚系樹脂、松香酯系樹脂等)、萜烯系黏著賦予樹脂(例如,萜烯系樹脂、萜烯酚系樹脂、苯乙烯改性萜烯系樹脂、芳香族改性萜烯系樹脂、氫化萜烯系樹脂)、烴系黏著賦予樹脂(例如,脂肪族系烴樹脂、 脂肪族系環狀烴樹脂、芳香族系烴樹脂(例如,苯乙烯系樹脂、二甲苯系樹脂等)、脂肪族.芳香族系石油樹脂、脂肪族.脂環族系石油樹脂、氫化烴樹脂、香豆酮系樹脂、香豆酮茚系樹脂等)、酚系黏著賦予樹脂(例如,烷基酚系樹脂、二甲苯甲醛系樹脂、可溶酚醛樹脂、酚醛清漆等)、酮系黏著賦予樹脂、聚醯胺系黏著賦予樹脂、環氧系黏著賦予樹脂、彈性體系黏著賦予樹脂等。其中,較佳為松香系黏著賦予樹脂、萜烯系黏著賦予樹脂或烴系黏著賦予樹脂(苯乙烯系樹脂等)。黏著賦予劑可單獨使用或者組合2種以上使用。 As the adhesion imparting agent, any appropriate adhesion imparting agent can be used. As the adhesion-imparting agent, for example, an adhesion-imparting resin can be used. Specific examples of the adhesion-imparting resin include rosin-based adhesion-imparting resin (for example, unmodified rosin, modified rosin, rosin phenol-based resin, rosin ester-based resin, etc.), and terpene-based adhesion-imparting resin (for example, terpene Ethylene resins, terpene phenol resins, styrene-modified terpene resins, aromatic modified terpene resins, hydrogenated terpene resins, hydrocarbon-based adhesion-imparting resins (for example, aliphatic hydrocarbon resins, Aliphatic cyclic hydrocarbon resin, aromatic hydrocarbon resin (for example, styrene resin, xylene resin, etc.), aliphatic. Aromatic petroleum resin, aliphatic. Alicyclic petroleum resins, hydrogenated hydrocarbon resins, coumarone resins, coumarone indene resins, etc., phenol-based adhesion-imparting resins (for example, alkylphenol resins, xylene formaldehyde resins, soluble phenol resins , Novolac, etc.), ketone-based adhesion-imparting resins, polyamide-based adhesion-imparting resins, epoxy-based adhesion-imparting resins, elastic-system adhesion-imparting resins, and the like. Among them, a rosin-based adhesion-imparting resin, a terpene-based adhesion-imparting resin, or a hydrocarbon-based adhesion-imparting resin (such as a styrene-based resin) is preferred. The adhesion-imparting agent can be used alone or in combination of two or more.

上述黏著賦予劑亦可使用市售品。作為市售品之黏著賦予劑之具體例,可列舉:YASUHARA CHEMICAL公司製造之商品名「YS POLYSTAR S145」、「Mighty Ace K140」、荒川化學公司製造之商品名「TAMANOL 901」等萜烯酚樹脂;Sumitomo Bakelite公司製造之商品名「SUMILITE RESIN PR-12603」、荒川化學公司製造之商品名「TAMANOL 361」等松香酚樹脂;荒川化學公司製造之商品名「TAMANOL 1010R」、「TAMANOL 200N」等烷基酚樹脂;荒川化學公司製造之商品名「ARKON P-140」等脂環族系飽和烴樹脂等。 A commercial item can also be used for the said adhesion-imparting agent. Specific examples of the adhesion-imparting agent for commercially available products include terpene phenol resins such as "YS POLYSTAR S145", "Mighty Ace K140" manufactured by YASUHARA Chemical Company, and "TAMANOL 901" manufactured by Arakawa Chemical Company. ; Rosin phenol resins such as "SUMILITE RESIN PR-12603" manufactured by Sumitomo Bakelite, and "TAMANOL 361" manufactured by Arakawa Chemical; alkane resins such as "TAMANOL 1010R" and "TAMANOL 200N" manufactured by Arakawa Chemical Phenol resin; alicyclic saturated hydrocarbon resins such as "ARKON P-140" manufactured by Arakawa Chemical Co., Ltd.

上述黏著賦予劑之添加量相對於黏著劑層100重量份,較佳為40重量份以下、更佳為30重量份以下、進而較佳為25重量份以下、進而較佳為15重量份~25重量份。若為此種範圍,則能夠形成黏著力及凹凸追隨性優異之黏著劑層。若形成凹凸追隨性優異之黏著劑層,則可顯著防止藥液侵入至黏著劑層與被黏著體之間。 The added amount of the adhesion imparting agent is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, still more preferably 25 parts by weight or less, and still more preferably 15 parts by weight to 25 parts by weight based on 100 parts by weight of the adhesive layer. Parts by weight. Within this range, an adhesive layer having excellent adhesion and unevenness followability can be formed. If an adhesive layer having excellent unevenness followability is formed, it is possible to significantly prevent a chemical solution from entering between the adhesive layer and the adherend.

上述黏著賦予劑之羥值較佳為10mgKOH/g以上、更佳為40mgKOH/g~400mgKOH/g。若為此種範圍,則兼顧黏著性及藥液侵入之防止,本發明之效果變得顯著。 The hydroxyl value of the adhesion-imparting agent is preferably 10 mgKOH / g or more, and more preferably 40 mgKOH / g to 400 mgKOH / g. With such a range, the adhesiveness and the prevention of the invasion of the medicinal solution are taken into consideration, and the effect of the present invention becomes remarkable.

作為上述交聯劑,可列舉例如:異氰酸酯系交聯劑、環氧系交聯劑、三聚氰胺系交聯劑、過氧化物系交聯劑、以及脲系交聯劑、金 屬烷氧化物系交聯劑、金屬螯合物系交聯劑、金屬鹽系交聯劑、碳二亞胺系交聯劑、唑啉系交聯劑、氮丙啶系交聯劑、胺系交聯劑等。其中,較佳為異氰酸酯系交聯劑或環氧系交聯劑。 Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, and metal alkoxide-based crosslinking agents. Crosslinking agent, metal chelate crosslinking agent, metal salt crosslinking agent, carbodiimide crosslinking agent, An oxazoline-based crosslinking agent, an aziridine-based crosslinking agent, an amine-based crosslinking agent, and the like. Among these, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferred.

作為上述異氰酸酯系交聯劑之具體例,可列舉:伸丁基二異氰酸酯、六亞甲基二異氰酸酯等低級脂肪族多異氰酸酯類;伸環戊基二異氰酸酯、伸環己基二異氰酸酯、異佛爾酮二異氰酸酯等脂環族異氰酸酯類;2,4-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯、苯二甲基二異氰酸酯等芳香族異氰酸酯類;三羥甲基丙烷/甲苯二異氰酸酯三聚體加成物(Nippon Polyurethane Industry公司製造,商品名「CORONATE L」)、三羥甲基丙烷/六亞甲基二異氰酸酯三聚體加成物(Nippon Polyurethane Industry公司製造,商品名「CORONATE HL」)、六亞甲基二異氰酸酯之異氰脲酸酯體(Nippon Polyurethane Industry公司製造,商品名「CORONATE HX」)等異氰酸酯加成物等。異氰酸酯系交聯劑之含量可根據所期望之黏著力而設定為任意適當之量,相對於丙烯酸系黏著劑I中之基礎聚合物(即,(甲基)丙烯酸系聚合物)100重量份,代表性地為0.1重量份~20重量份、更佳為0.5重量份~10重量份。 Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; cyclopentyl diisocyanate, cyclohexyl diisocyanate, isophor Alicyclic isocyanates such as keto diisocyanate; aromatic isocyanates such as 2,4-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylolpropane / toluene diisocyanate Isocyanate trimer adduct (manufactured by Nippon Polyurethane Industry, trade name "CORONATE L"), trimethylolpropane / hexamethylene diisocyanate trimer adduct (manufactured by Nippon Polyurethane Industry, trade name " CORONATE HL "), isocyanurate bodies of hexamethylene diisocyanate (manufactured by Nippon Polyurethane Industry, trade name" CORONATE HX "), and the like. The content of the isocyanate-based cross-linking agent can be set to any appropriate amount according to the desired adhesive force, and it is relative to 100 parts by weight of the base polymer (that is, the (meth) acrylic polymer) in the acrylic adhesive I, It is typically 0.1 to 20 parts by weight, and more preferably 0.5 to 10 parts by weight.

作為上述環氧系交聯劑,可列舉例如:N,N,N',N'-四縮水甘油基間苯二甲胺、二縮水甘油基苯胺、1,3-雙(N,N-縮水甘油基胺基甲基)環己烷(三菱瓦斯化學公司製造,商品名「TETRAD C」)、1,6-己二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1600」)、新戊二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 1500NP」)、乙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 40E」)、丙二醇二縮水甘油醚(共榮社化學公司製造,商品名「Epolight 70P」)、聚乙二醇二縮水甘油醚(日本油脂公司製造,商品名「EPIOL E-400」)、聚丙二醇二縮水甘油醚(日本油脂公司製 造,商品名「EPIOL P-200」)、山梨糖醇聚縮水甘油醚(Nagase ChemteX公司製造,商品名「Denacol EX-611」)、甘油聚縮水甘油醚(Nagase ChemteX公司製造,商品名「Denacol EX-314」)、季戊四醇聚縮水甘油醚、聚甘油聚縮水甘油醚(Nagase ChemteX公司製造,商品名「Denacol EX-512」)、山梨糖醇酐聚縮水甘油醚、三羥甲基丙烷聚縮水甘油醚、己二酸二縮水甘油酯、鄰苯二甲酸二縮水甘油酯、三(2-羥基乙基)異氰脲酸三縮水甘油酯、間苯二酚二縮水甘油醚、雙酚S-二縮水甘油醚、分子內具有2個以上環氧基之環氧系樹脂等。環氧系交聯劑之含量可根據所期望之黏著力而設定為任意適當之量,相對於基礎聚合物100重量份,代表性地為0.01重量份~10重量份、更佳為0.03重量份~5重量份。 Examples of the epoxy-based crosslinking agent include N, N, N ', N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, and 1,3-bis (N, N-glycidyl). Glycerylaminomethyl) cyclohexane (manufactured by Mitsubishi Gas Chemical Company, trade name "TETRAD C"), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Company, trade name "Epolight 1600" ), Neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 1500NP"), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 40E"), propylene glycol Diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolight 70P"), polyethylene glycol diglycidyl ether (manufactured by Nippon Oil and Fat Co., trade name "EPIOL E-400"), polypropylene glycol diglycidyl ether (Manufactured by Japan Oil & Fats Co., Ltd. (Product name "EPIOL P-200"), sorbitol polyglycidyl ether (manufactured by Nagase ChemteX company, trade name "Denacol EX-611"), glycerol polyglycidyl ether (manufactured by Nagase ChemteX company, trade name "Denacol EX-314 "), pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase ChemteX, trade name" Denacol EX-512 "), sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl Glyceryl ether, diglycidyl adipate, diglycidyl phthalate, triglycidyl tris (2-hydroxyethyl) isocyanurate, resorcinol diglycidyl ether, bisphenol S- Diglycidyl ether, epoxy resin having two or more epoxy groups in the molecule, and the like. The content of the epoxy-based crosslinking agent can be set to any appropriate amount according to the desired adhesive force, and is typically 0.01 to 10 parts by weight, and more preferably 0.03 parts by weight relative to 100 parts by weight of the base polymer. ~ 5 parts by weight.

B-2.熱膨脹性微球B-2. Thermal expansion microspheres

所謂熱膨脹性微球,係指藉由加熱而能夠膨脹或發泡之微球。具有包含該熱膨脹性微球之黏著劑層之熱剝離型黏著片藉由加熱而於貼合面產生凹凸,從而黏著力降低,因此於需要黏著力之情況下具有充分之黏著力,且於需要剝離之情況下之剝離性優異。如上所述,本發明中,即使暴露於酸性或鹼性之藥液,熱膨脹性微球亦不易變質,能夠充分地表現出作為熱膨脹性微球之上述功能。 The so-called thermally expandable microspheres are microspheres that can expand or foam by heating. A heat-peelable pressure-sensitive adhesive sheet having an adhesive layer containing the heat-expandable microspheres generates unevenness on the bonding surface by heating, thereby reducing the adhesive force. Therefore, when an adhesive force is required, it has sufficient adhesive force, and In the case of peeling, the peelability is excellent. As described above, in the present invention, even when exposed to an acidic or alkaline chemical solution, the thermally expandable microspheres are not easily deteriorated, and the above functions as thermally expandable microspheres can be fully exhibited.

上述熱膨脹性微球之含有比率可根據所期望之黏著力之降低性等而適當設定。熱膨脹性微球之含有比率相對於丙烯酸系黏著劑I中之上述(甲基)丙烯酸系聚合物100重量份,例如為1重量份~150重量份、較佳為10重量份~130重量份、進而較佳為25重量份~100重量份。 The content ratio of the thermally expandable microspheres can be appropriately set depending on the desired reduction of the adhesive force and the like. The content ratio of the thermally expandable microspheres is 100 parts by weight of the (meth) acrylic polymer in the acrylic adhesive I, and is, for example, 1 to 150 parts by weight, preferably 10 to 130 parts by weight, It is more preferably 25 parts by weight to 100 parts by weight.

作為上述熱膨脹性微球,可使用任意適當之熱膨脹性微球。作為上述熱膨脹性微球,例如可使用使藉由加熱而容易膨脹之物質內含於具有彈性之殼內而獲得之微球。此種熱膨脹性微球可利用任意適當 之方法、例如凝聚法、界面聚合法等而製造。 As the thermally expandable microsphere, any appropriate thermally expandable microsphere can be used. As the heat-expandable microsphere, for example, a microsphere obtained by containing a substance that is easily expanded by heating in a shell having elasticity can be used. Such thermally expandable microspheres can be used as appropriate By a method such as a coacervation method or an interfacial polymerization method.

作為藉由加熱而容易膨脹之物質,可列舉例如:丙烷、丙烯、丁烯、正丁烷、異丁烷、異戊烷、新戊烷、正戊烷、正己烷、異己烷、庚烷、辛烷、石油醚、甲烷之鹵化物、四烷基矽烷等低沸點液體;藉由熱分解而氣化之偶氮二甲醯胺(azodicarbonamide)等。 Examples of the substance that swells easily by heating include propane, propylene, butene, n-butane, isobutane, isopentane, neopentane, n-pentane, n-hexane, isohexane, heptane, Low boiling point liquids such as octane, petroleum ether, halides of methane, and tetraalkylsilane; azodicarbonamide, etc., which is gasified by thermal decomposition.

作為構成上述殼之物質,可列舉例如由下述單體構成之聚合物,上述單體為:丙烯腈、甲基丙烯腈、α-氯丙烯腈、α-乙氧基丙烯腈、富馬腈(fumaronitrile)等腈單體;丙烯酸、甲基丙烯酸、伊康酸、馬來酸、富馬酸、檸康酸等羧酸單體;偏二氯乙烯;乙酸乙烯酯;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸異丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸异酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸苄酯、丙烯酸β-羧基乙酯等(甲基)丙烯酸酯;苯乙烯、α-甲基苯乙烯、氯苯乙烯等苯乙烯單體;丙烯醯胺、取代丙烯醯胺、甲基丙烯醯胺、取代甲基丙烯醯胺等醯胺單體等。由該等單體構成之聚合物可為均聚物,亦可為共聚物。作為該共聚物,可列舉例如:偏二氯乙烯-甲基丙烯酸甲酯-丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈-甲基丙烯腈共聚物、甲基丙烯酸甲酯-丙烯腈共聚物、丙烯腈-甲基丙烯腈-伊康酸共聚物等。 Examples of the substance constituting the shell include a polymer composed of the following monomers: acrylonitrile, methacrylonitrile, α -chloroacrylonitrile, α -ethoxyacrylonitrile, and fumaronitrile (fumaronitrile) and other nitrile monomers; acrylic acid, methacrylic acid, itaconic acid, maleic acid, fumaric acid, citraconic acid and other carboxylic acid monomers; vinylidene chloride; vinyl acetate; (meth) acrylic acid methyl ester Ester, ethyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, tertiary butyl (meth) acrylate, isobutyl (meth) acrylate (Meth) acrylates such as esters, cyclohexyl (meth) acrylate, benzyl (meth) acrylate, and β -carboxyethyl acrylate; styrene monomers such as styrene, α -methylstyrene, and chlorostyrene Body; acrylamide monomers such as acrylamide, substituted acrylamide, methacrylamide, and substituted methacrylamide. The polymer composed of these monomers may be a homopolymer or a copolymer. Examples of the copolymer include vinylidene chloride-methyl methacrylate-acrylonitrile copolymer, methyl methacrylate-acrylonitrile-methacrylonitrile copolymer, and methyl methacrylate-acrylonitrile copolymer Compounds, acrylonitrile-methacrylonitrile-Iconic acid copolymers, and the like.

作為上述熱膨脹性微球,亦可使用無機系發泡劑或有機系發泡劑。作為無機系發泡劑,可列舉例如:碳酸銨、碳酸氫銨、碳酸氫鈉、亞硝酸銨、硼氫化鈉、各種疊氮化物類等。又,作為有機系發泡劑,可列舉例如:三氯單氟甲烷、二氯單氟甲烷等氯氟化烷烴系化合物;偶氮二異丁腈、偶氮二甲醯胺、偶氮二羧酸鋇等偶氮系化合物;對甲苯磺醯肼、二苯基碸-3,3'-二磺醯肼、4,4'-氧基雙(苯磺醯肼)、烯丙基雙(磺醯肼)等肼系化合物;對甲苯磺醯基胺基脲、4,4'-氧基雙(苯磺醯基胺基脲)等胺基脲系化合物;5-啉基-1,2,3,4-噻三唑等三唑系 化合物;N,N'-二亞硝基五亞甲基四胺、N,N'-二甲基-N,N'-二亞硝基對苯二甲醯胺等N-亞硝基系化合物等。 As the thermally expandable microspheres, an inorganic foaming agent or an organic foaming agent may be used. Examples of the inorganic foaming agent include ammonium carbonate, ammonium bicarbonate, sodium bicarbonate, ammonium nitrite, sodium borohydride, and various azides. Examples of the organic blowing agent include chlorofluorinated alkane compounds such as trichloromonofluoromethane and dichloromonofluoromethane; azobisisobutyronitrile, azodimethylformamide, and azodicarboxylate. Azo compounds such as barium acid; p-toluenesulfonylhydrazine, diphenylsulfonium-3,3'-disulfonylhydrazine, 4,4'-oxybis (benzenesulfonylhydrazine), allylbis (sulfonium Hydrazine) and other hydrazine-based compounds; p-toluenesulfonylaminourea, 4,4'-oxybis (benzenesulfonylaminourea) and other aminourea-based compounds; 5- Triazole compounds such as phosphono-1,2,3,4-thiatriazole; N, N'-dinitrosopentamethylenetetramine, N, N'-dimethyl-N, N'- N-nitroso compounds such as dinitroso p-xylylenediamine and the like.

上述熱膨脹性微球亦可使用市售品。作為市售品之熱膨脹性微球之具體例,可列舉:松本油脂製藥公司製造之商品名「Matsumoto Microsphere」(等級:F-30、F-30D、F-36D、F-36LV、F-50、F-50D、F-65、F-65D、FN-100SS、FN-100SSD、FN-180SS、FN-180SSD、F-190D、F-260D、F-2800D)、Japan Fillite公司製造之商品名「Expancel」(等級:053-40、031-40、920-40、909-80、930-120)、吳羽化學工業公司製造之「DAIFOAM」(等級:H750、H850、H1100、S2320D、S2640D、M330、M430、M520)、積水化學工業公司製造之「ADVANCELL」(等級:EML101、EMH204、EHM301、EHM302、EHM303、EM304、EHM401、EM403、EM501)等。 As the thermally expandable microspheres, a commercially available product may be used. Specific examples of commercially available thermally expandable microspheres include the product name "Matsumoto Microsphere" (grades: F-30, F-30D, F-36D, F-36LV, F-50) manufactured by Matsumoto Oil & Fats Pharmaceutical Co., Ltd. , F-50D, F-65, F-65D, FN-100SS, FN-100SSD, FN-180SS, FN-180SSD, F-190D, F-260D, F-2800D), trade names made by Japan Fillite Expancel "(grades: 053-40, 031-40, 920-40, 909-80, 930-120)," DAIFOAM "(grades: H750, H850, H1100, S2320D, S2640D, M330) manufactured by Wu Yu Chemical Industry Co., Ltd. , M430, M520), "ADVANCELL" (level: EML101, EMH204, EHM301, EHM302, EHM303, EM304, EHM401, EM403, EM501) manufactured by Sekisui Chemical Industry Co., Ltd., etc.

上述熱膨脹性微球之加熱前之粒徑較佳為0.5μm~80μm、更佳為5μm~45μm、進而較佳為10μm~20μm、尤佳為10μm~15μm。因此,若以平均粒徑來描述上述熱膨脹性微球之加熱前之粒子尺寸,則較佳為6μm~45μm、更佳為15μm~35μm。上述粒徑及平均粒徑係利用鐳射散射法中之粒度分佈測定法所求出之值。 The particle diameter of the thermally expandable microspheres before heating is preferably 0.5 μm to 80 μm, more preferably 5 μm to 45 μm, still more preferably 10 μm to 20 μm, and even more preferably 10 μm to 15 μm. Therefore, if the particle size before heating of the thermally expandable microspheres is described by an average particle diameter, it is preferably 6 μm to 45 μm, and more preferably 15 μm to 35 μm. The particle diameter and the average particle diameter are values obtained by a particle size distribution measurement method in a laser scattering method.

上述熱膨脹性微球較佳為具有直至體積膨脹率達到較佳為5倍以上、更佳為7倍以上、進而較佳為10倍以上為止亦不會破裂之適當之強度。於使用此種熱膨脹性微球之情形時,能夠藉由加熱處理而高效率地降低黏著力。 The thermally expandable microspheres preferably have an appropriate strength that will not break until the volume expansion ratio reaches 5 times or more, more preferably 7 times or more, and even more preferably 10 times or more. When such a thermally expandable microsphere is used, the adhesive force can be efficiently reduced by heat treatment.

B-3.第一黏著劑層之特性等B-3. Characteristics of the first adhesive layer

上述第一黏著劑層之厚度較佳為1μm~100μm、更佳為5μm~80μm、尤佳為10μm~50μm。如上所述,第一黏著劑層係包含熱膨脹性微球之層。因此,第一黏著劑層之厚度係指觀察第一黏著劑層之厚度方向剖面時的自第一黏著劑層之外側面(與基材相反側之面)至最 接近基材之熱膨脹性微球之最內側端為止之距離。 The thickness of the first adhesive layer is preferably 1 μm to 100 μm, more preferably 5 μm to 80 μm, and even more preferably 10 μm to 50 μm. As described above, the first adhesive layer is a layer containing thermally expandable microspheres. Therefore, the thickness of the first adhesive layer refers to the distance from the outer surface of the first adhesive layer (the surface opposite to the substrate) to the maximum when observing the thickness direction section of the first adhesive layer. The distance to the innermost end of the thermally expandable microspheres of the substrate.

上述第一黏著劑層之厚度與該第一黏著劑層中包含之熱膨脹性微球之平均粒徑之差(厚度-平均粒徑)較佳為8μm以上、更佳為10μm以上、進而較佳為15μm以上、尤佳為20μm以上、最佳為25μm~100μm。若為此種範圍,則能夠獲得第一黏著劑層具有適當之表面粗糙度,而藥液難以滲入至第一黏著劑層與被黏著體之界面之熱剝離型黏著片。 The difference (thickness-average particle diameter) between the thickness of the first adhesive layer and the average particle diameter of the thermally expandable microspheres contained in the first adhesive layer is preferably 8 μm or more, more preferably 10 μm or more, and even more preferably It is 15 μm or more, particularly preferably 20 μm or more, and most preferably 25 μm to 100 μm. Within this range, a heat-peelable pressure-sensitive adhesive sheet having an appropriate surface roughness of the first adhesive layer and a drug solution difficult to penetrate into the interface between the first adhesive layer and the adherend can be obtained.

上述第一黏著劑層於25℃下利用奈米壓痕法測得之彈性模數較佳為0.01MPa~50MPa、更佳為0.1MPa~10MPa、尤佳為0.5MPa~5MPa。若黏著劑層之彈性模數為上述範圍,則能夠獲得黏著性、切斷性及階差追隨性優異之熱剝離型黏著片。所謂利用奈米壓痕法測得之彈性模數,係指遍及負載時、卸載時連續地測定將壓頭壓入試樣時之對壓頭之負載荷重及壓入深度,由所得之負載荷重-壓入深度曲線所求出之彈性模數。本說明書中,所謂利用奈米壓痕法測得之彈性模數,係指將測定條件設為荷重:1mN、負載.卸載速度:0.1mN/s、保持時間:1s,並如上所述般進行測定而獲得之彈性模數。 The elastic modulus of the first adhesive layer measured by the nanoindentation method at 25 ° C is preferably 0.01 MPa to 50 MPa, more preferably 0.1 MPa to 10 MPa, and even more preferably 0.5 MPa to 5 MPa. When the elastic modulus of the adhesive layer is in the above range, a heat-peelable pressure-sensitive adhesive sheet excellent in adhesiveness, cutting properties, and step followability can be obtained. The so-called elastic modulus measured by the nano-indentation method refers to the continuous measurement of the load on the indenter and the indentation depth when the indenter is pressed into the sample during the load and unloading. From the obtained load load- The modulus of elasticity obtained by pressing the depth curve. In this specification, the so-called elastic modulus measured by the nanoindentation method means that the measurement conditions are set to load: 1mN, load. Unloading speed: 0.1 mN / s, holding time: 1 s, and elastic modulus obtained by measuring as described above.

上述第一黏著劑層之彈性模數可藉由該黏著劑層中之構成黏著劑之基礎聚合物之組成等而調整。又,亦可向第一黏著劑層中添加添加劑而調整彈性模數。例如,若使第一黏著劑層中含有珠粒,則能夠提高該黏著劑層之彈性模數。作為珠粒,可列舉例如玻璃珠粒、樹脂珠粒等。珠粒之平均粒徑例如為0.01μm~50μm。珠粒之添加量相對於黏著劑層整體100重量份,例如為10重量份~200重量份、較佳為20重量份~100重量份。 The elastic modulus of the first adhesive layer can be adjusted by the composition of the base polymer constituting the adhesive in the adhesive layer and the like. Further, an additive may be added to the first adhesive layer to adjust the elastic modulus. For example, if beads are contained in the first adhesive layer, the elastic modulus of the adhesive layer can be increased. Examples of the beads include glass beads and resin beads. The average particle diameter of the beads is, for example, 0.01 μm to 50 μm. The added amount of the beads is, for example, 10 to 200 parts by weight, and preferably 20 to 100 parts by weight with respect to 100 parts by weight of the entire adhesive layer.

上述第一黏著劑層之貼合面之中心線平均表面粗糙度Ra較佳為1μm以下、更佳為0.01μm~1μm、進而較佳為0.03μm~0.8μm、尤佳為0.06μm~0.6μm。若為此種範圍,則能夠獲得藥液難以滲入至第 一黏著劑層與被黏著體之界面之熱剝離型黏著片。表面粗糙度Ra係基於JIS B 0601而測定。 The centerline average surface roughness Ra of the bonding surface of the first adhesive layer is preferably 1 μm or less, more preferably 0.01 μm to 1 μm, still more preferably 0.03 μm to 0.8 μm, and even more preferably 0.06 μm to 0.6 μm. . If it is in this range, it is possible to obtain a chemical solution which is difficult to penetrate to the first stage. A heat-peelable adhesive sheet at the interface between an adhesive layer and an adherend. The surface roughness Ra is measured based on JIS B 0601.

水對於上述第一黏著劑層之接觸角較佳為85°~115°、更佳為87°~115°、尤佳為90°~115°。於水之接觸角大於115°之情形時、即黏著劑層之疏水性較高之情形時,存在無法獲得充分之黏著特性之虞。另一方面,於水之接觸角小於85°之情形時、即黏著劑層之疏水性過低之情形時,存在藥液滲入至黏著劑層與被黏著體之界面之虞。 The contact angle of water with respect to the first adhesive layer is preferably 85 ° to 115 °, more preferably 87 ° to 115 °, and even more preferably 90 ° to 115 °. When the contact angle of water is greater than 115 °, that is, when the hydrophobicity of the adhesive layer is high, there is a possibility that sufficient adhesive properties cannot be obtained. On the other hand, when the contact angle of water is less than 85 °, that is, when the hydrophobicity of the adhesive layer is too low, there is a possibility that the medicinal solution penetrates into the interface between the adhesive layer and the adherend.

上述第一黏著劑層之凝膠分率較佳為50%以上、更佳為52%~99%、進而較佳為55%~99%。若為此種範圍,則能夠防止藥液侵入至黏著劑層。黏著劑層之凝膠分率可控制構成黏著劑之基礎聚合物之組成、交聯劑之種類及含量、黏著賦予劑之種類及含量等而調整。凝膠分率之測定方法後面將進行敍述。 The gel fraction of the first adhesive layer is preferably 50% or more, more preferably 52% to 99%, and still more preferably 55% to 99%. Within this range, it is possible to prevent the chemical solution from entering the adhesive layer. The gel fraction of the adhesive layer can be adjusted by controlling the composition of the base polymer constituting the adhesive, the type and content of the crosslinking agent, and the type and content of the adhesion-imparting agent. The method for measuring the gel fraction will be described later.

C.第二黏著劑層C. Second adhesive layer C-1.黏著劑C-1. Adhesive

上述第二黏著劑層包含任意適當之黏著劑。作為第二黏著劑層中包含之黏著劑,就密接性之觀點而言,又,於第二黏著劑層包含熱膨脹微球之情形時,就加熱時不會約束熱膨脹性微球之膨脹或發泡之觀點而言,可列舉例如:丙烯酸系黏著劑、橡膠系黏著劑、乙烯基烷基醚系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、聚醯胺系黏著劑、胺基甲酸酯系黏著劑、苯乙烯-二烯嵌段共聚物系黏著劑、活性能量線硬化型黏著劑等。又,上述黏著劑亦可為調配有熔點約為200℃以下之熱熔融性樹脂之蠕變特性改良型黏著劑。蠕變特性改良型黏著劑之詳細內容記載於日本專利特開昭56-61468號公報、日本專利特開昭63-17981號公報等中。上述黏著劑之中,可較佳地使用丙烯酸系黏著劑或橡膠系黏著劑。再者,上述黏著劑可單獨使用或者組合2種以上使用。 The second adhesive layer includes any appropriate adhesive. As the adhesive contained in the second adhesive layer, from the standpoint of adhesion, when the second adhesive layer contains thermally expandable microspheres, the expansion or development of the thermally expandable microspheres is not restricted during heating. From the viewpoint of foaming, for example, acrylic adhesives, rubber adhesives, vinyl alkyl ether adhesives, silicone adhesives, polyester adhesives, polyamide adhesives, and amines can be cited. Carbamate-based adhesives, styrene-diene block copolymer-based adhesives, active energy ray-curable adhesives, and the like. Moreover, the said adhesive agent can also be an adhesive agent with improved creep characteristics which mixes the hot-melt resin with a melting point of about 200 degrees C or less. Details of the creep property-improving adhesive are described in Japanese Patent Laid-Open No. 56-61468, Japanese Patent Laid-Open No. 63-17981, and the like. Among the above-mentioned adhesives, an acrylic adhesive or a rubber-based adhesive can be preferably used. In addition, the said adhesive can be used individually or in combination of 2 or more types.

作為第二黏著劑層中包含之丙烯酸系黏著劑,可使用任意適當之丙烯酸系黏著劑。可列舉例如以使用1種或2種以上之(甲基)丙烯酸烷基酯作為單體成分之丙烯酸系聚合物(均聚物或共聚物)作為基礎聚合物之丙烯酸系黏著劑等。於一實施形態中,可使用上述B項中說明之丙烯酸系黏著劑I。 As the acrylic pressure-sensitive adhesive contained in the second pressure-sensitive adhesive layer, any appropriate acrylic pressure-sensitive adhesive can be used. Examples of the acrylic adhesive include an acrylic polymer (homopolymer or copolymer) using one or two or more (meth) acrylic acid alkyl esters as monomer components as a base polymer. In one embodiment, the acrylic adhesive I described in the above item B can be used.

作為上述橡膠系黏著劑,可列舉例如以下述橡膠作為基礎聚合物之橡膠系黏著劑,上述橡膠為:天然橡膠;聚異戊二烯橡膠、苯乙烯-丁二烯(SB)橡膠、苯乙烯-異戊二烯(SI)橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(SIS)橡膠、苯乙烯-丁二烯-苯乙烯嵌段共聚物(SBS)橡膠、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物(SEBS)橡膠、苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物(SEPS)橡膠、苯乙烯-乙烯-丙烯嵌段共聚物(SEP)橡膠、再生橡膠、丁基橡膠、聚異丁烯、該等之改性體等合成橡膠等。 Examples of the rubber-based adhesive include rubber-based adhesives using the following rubber as a base polymer. The rubbers are: natural rubber; polyisoprene rubber, styrene-butadiene (SB) rubber, and styrene. -Isoprene (SI) rubber, styrene-isoprene-styrene block copolymer (SIS) rubber, styrene-butadiene-styrene block copolymer (SBS) rubber, styrene- Ethylene-butene-styrene block copolymer (SEBS) rubber, styrene-ethylene-propylene-styrene block copolymer (SEPS) rubber, styrene-ethylene-propylene block copolymer (SEP) rubber, recycled Synthetic rubbers such as rubber, butyl rubber, polyisobutylene, and modified products thereof.

作為上述第二黏著劑層中包含之黏著劑,亦可使用藉由照射活性能量線而能夠硬化(高彈性模數化)之活性能量線硬化型黏著劑。若使用活性能量線硬化型黏著劑,則能夠獲得如下熱剝離型黏著片,其於貼附時彈性低且柔軟性高、處理性優異,於需要剝離之情況下,藉由照射活性能量線而能夠降低黏著力。作為活性能量線,可列舉例如:γ射線、紫外線、可見光線、紅外線(熱射線)、射頻波(radiofrequency wave)、α射線、β射線、電子束、電漿流、電離射線、粒子束等。 As the adhesive contained in the second adhesive layer, an active energy ray-curable adhesive that can be cured (high elastic modulus) by irradiating the active energy ray can also be used. When an active energy ray hardening type adhesive is used, a heat-peelable pressure-sensitive adhesive sheet can be obtained which has low elasticity, high flexibility, and excellent handling properties when attached. When peeling is required, the active energy ray is irradiated to Can reduce adhesion. Examples of active energy rays include gamma rays, ultraviolet rays, visible rays, infrared rays (heat rays), radiofrequency waves, alpha rays, beta rays, electron beams, plasma flows, ionizing rays, and particle beams.

作為構成上述活性能量線硬化型黏著劑之樹脂材料,可列舉例如紫外線硬化系統(加藤清視著,綜合技術中心發行,(1989))、光硬化技術(技術資訊協會編(2000))、日本專利特開2003-292916號公報、日本專利4151850號等中記載之樹脂材料。更具體而言,可列舉包含成為母劑之聚合物及活性能量線反應性化合物(單體或低聚物)之樹脂 材料(R1)、包含活性能量線反應性聚合物之樹脂材料(R2)等。 Examples of the resin material constituting the active energy ray-curable adhesive include ultraviolet curing systems (see Kato Kiyoshi, issued by the Comprehensive Technology Center, (1989)), light curing technology (Technical Information Association (2000)), Japan Resin materials described in Patent Publication No. 2003-292916, Japanese Patent No. 4151850, and the like. More specifically, a resin containing a polymer serving as a mother agent and an active energy ray-reactive compound (monomer or oligomer) may be mentioned. Material (R1), resin material (R2) containing an active energy ray reactive polymer, and the like.

作為上述成為母劑之聚合物,可列舉例如:天然橡膠、聚異丁烯橡膠、苯乙烯-丁二烯橡膠、苯乙烯-異戊二烯-苯乙烯嵌段共聚物橡膠、再生橡膠、丁基橡膠、聚異丁烯橡膠、腈橡膠(NBR)等橡膠系聚合物;聚矽氧系聚合物;丙烯酸系聚合物等。該等聚合物可單獨使用或者組合2種以上使用。 Examples of the polymer used as the mother agent include natural rubber, polyisobutylene rubber, styrene-butadiene rubber, styrene-isoprene-styrene block copolymer rubber, recycled rubber, and butyl rubber. , Polyisobutylene rubber, nitrile rubber (NBR) and other rubber-based polymers; silicone polymers; acrylic polymers. These polymers can be used alone or in combination of two or more.

作為上述活性能量線反應性化合物,可列舉例如具有丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、乙炔基等具有碳-碳多重鍵之官能基之光反應性單體或低聚物。作為該光反應性單體或低聚物之具體例,可列舉:三羥甲基丙烷三(甲基)丙烯酸酯、四羥甲基甲烷四(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊四醇四(甲基)丙烯酸酯、二季戊四醇單羥基五(甲基)丙烯酸酯、二季戊四醇六(甲基)丙烯酸酯、1,4-丁二醇二(甲基)丙烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、聚乙二醇二(甲基)丙烯酸酯等含(甲基)丙烯醯基之化合物;該含(甲基)丙烯醯基之化合物之2~5聚體等。 Examples of the active energy ray-reactive compound include a photoreactive monomer having a functional group having a carbon-carbon multiple bond such as an acryl group, a methacryl group, a vinyl group, an allyl group, or an ethynyl group, or a low-reactive monomer. Polymer. Specific examples of the photoreactive monomer or oligomer include trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, and pentaerythritol tri (methyl). Acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1 2,6-hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate and other compounds containing (meth) acrylfluorenyl group; 2 of the (meth) acrylfluorene-containing compound ~ 5-mers, etc.

又,作為上述活性能量線反應性化合物,亦可使用:環氧化丁二烯、甲基丙烯酸縮水甘油酯、丙烯醯胺、乙烯基矽氧烷等單體;或者由該單體構成之低聚物。包含該等化合物之樹脂材料(R1)可利用紫外線、電子束等高能量線進行硬化。 In addition, as the active energy ray-reactive compound, monomers such as epoxidized butadiene, glycidyl methacrylate, acrylamide, and vinyl siloxane; or oligomers composed of the monomers can also be used. Thing. The resin material (R1) containing these compounds can be hardened by high energy rays such as ultraviolet rays and electron beams.

進而,作為上述活性能量線反應性化合物,亦可使用鎓鹽等有機鹽類與分子內具有複數個雜環之化合物之混合物。該混合物藉由照射活性能量線(例如紫外線、電子束)而有機鹽裂解並生成離子,該離子成為起始種而引起雜環之開環反應,從而能夠形成三維網狀結構。作為上述有機鹽類,可列舉例如錪鹽、鏻鹽、銻鹽、鋶鹽、硼酸鹽等。作為上述分子內具有複數個雜環之化合物中之雜環,可列舉氧雜環丙烷、氧雜環丁烷、氧雜環戊烷、環硫乙烷、氮丙啶等。 Further, as the active energy ray-reactive compound, a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocycles in the molecule may be used. The mixture is irradiated with active energy rays (for example, ultraviolet rays, electron beams) to split the organic salt and generate ions. The ions become the starting species and cause a ring-opening reaction of the heterocyclic ring, thereby forming a three-dimensional network structure. Examples of the organic salts include sulfonium salts, sulfonium salts, antimony salts, sulfonium salts, and borate salts. Examples of the heterocyclic ring in the compound having a plurality of heterocyclic rings in the molecule include oxetan, oxetane, oxetane, episulfide, and aziridine.

進而,作為上述活性能量線反應性化合物,亦可使用鎓鹽等有機鹽類與分子內具有複數個雜環之化合物之混合物。該混合物藉由照射活性能量線(例如紫外線、電子束)而有機鹽裂解並生成離子,該離子成為起始種而引起雜環之開環反應,從而能夠形成三維網狀結構。作為上述有機鹽類,可列舉例如錪鹽、鏻鹽、銻鹽、鋶鹽、硼酸鹽等。作為上述分子內具有複數個雜環之化合物中之雜環,可列舉氧雜環丙烷、氧雜環丁烷、氧雜環戊烷、環硫乙烷、氮丙啶等。 Further, as the active energy ray-reactive compound, a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocycles in the molecule may be used. The mixture is irradiated with active energy rays (for example, ultraviolet rays, electron beams) to split the organic salt and generate ions. The ions become the starting species and cause a ring-opening reaction of the heterocyclic ring, thereby forming a three-dimensional network structure. Examples of the organic salts include sulfonium salts, sulfonium salts, antimony salts, sulfonium salts, and borate salts. Examples of the heterocyclic ring in the compound having a plurality of heterocyclic rings in the molecule include oxetan, oxetane, oxetane, episulfide, and aziridine.

上述包含成為母劑之聚合物及活性能量線反應性化合物之樹脂材料(R1)中,活性能量線反應性化合物之含有比率相對於成為母劑之聚合物100重量份,較佳為0.1重量份~500重量份、更佳為1重量份~300重量份、進而較佳為10重量份~200重量份。 In the above-mentioned resin material (R1) containing the polymer serving as the mother agent and the active energy ray reactive compound, the content ratio of the active energy ray reactive compound is preferably 0.1 part by weight relative to 100 parts by weight of the polymer serving as the mother agent ~ 500 parts by weight, more preferably 1 to 300 parts by weight, and still more preferably 10 to 200 parts by weight.

上述包含成為母劑之聚合物及活性能量線反應性化合物之樹脂材料(R1)視需要可包含任意適當之添加劑。作為添加劑,可列舉例如:活性能量線聚合起始劑、活性能量線聚合促進劑、交聯劑、塑化劑、硫化劑等。作為活性能量線聚合起始劑,可根據所使用之活性能量線之種類,使用任意適當之起始劑。活性能量線聚合起始劑可單獨使用或者組合2種以上使用。包含成為母劑之聚合物及活性能量線反應性化合物之樹脂材料(R1)中,活性能量線聚合起始劑之含有比率相對於成為母劑之聚合物100重量份,較佳為0.1重量份~10重量份、更佳為1重量份~5重量份。 The above-mentioned resin material (R1) containing a polymer serving as a base agent and an active energy ray-reactive compound may contain any appropriate additives as necessary. Examples of the additives include an active energy ray polymerization initiator, an active energy ray polymerization accelerator, a crosslinking agent, a plasticizer, and a vulcanizing agent. As the active energy ray polymerization initiator, any appropriate initiator can be used according to the kind of active energy ray used. The active energy ray polymerization initiator can be used alone or in combination of two or more. In the resin material (R1) containing the polymer serving as the mother agent and the active energy ray reactive compound, the content ratio of the active energy ray polymerization initiator is preferably 0.1 part by weight relative to 100 parts by weight of the polymer serving as the mother agent. ~ 10 parts by weight, more preferably 1 to 5 parts by weight.

作為上述活性能量線反應性聚合物,可列舉例如具有丙烯醯基、甲基丙烯醯基、乙烯基、烯丙基、乙炔基等具有碳-碳多重鍵之官能基之聚合物。作為具有活性能量線反應性官能基之聚合物之具體例,可列舉:由多官能(甲基)丙烯酸酯構成之聚合物;光陽離子聚合型聚合物;聚肉桂酸乙烯酯等含有肉桂醯基之聚合物;經重氮化之胺基酚醛清漆樹脂;聚丙烯醯胺等。又,作為包含活性能量線反應性聚 合物之樹脂材料(R2),亦可使用具有烯丙基之活性能量線反應性聚合物與具有硫醇基之化合物之混合物。再者,只要能夠於藉由照射活性能量線進行硬化之前(例如,貼附熱剝離型黏著片時)形成具有可實用之硬度(黏度)之黏著劑層前體,則除了具有活性能量線反應性官能基之聚合物之外,亦可使用具有活性能量線反應性官能基之低聚物。 Examples of the active energy ray-reactive polymer include polymers having a functional group having a carbon-carbon multiple bond such as acrylfluorenyl, methacrylfluorenyl, vinyl, allyl, and ethynyl. Specific examples of the polymer having an active energy ray-reactive functional group include a polymer composed of a polyfunctional (meth) acrylate; a photocationically polymerizable polymer; a polyvinyl cinnamate containing a cinnamate group Polymers; diazotized amino novolac resins; polypropylene amidamine and the like. Reactive polymer As the resin material (R2) of the compound, a mixture of an active energy ray reactive polymer having an allyl group and a compound having a thiol group can also be used. Furthermore, as long as an adhesive layer precursor having a practical hardness (viscosity) can be formed before hardening by irradiating an active energy ray (for example, when attaching a heat-peelable adhesive sheet), it has an active energy ray reaction. In addition to the polymer having a functional group, an oligomer having an active energy ray-reactive functional group may be used.

上述包含活性能量線反應性聚合物之樹脂材料(R2)亦可進而包含上述活性能量線反應性化合物(單體或低聚物)。又,上述包含活性能量線反應性聚合物之樹脂材料(R2)視需要可包含任意適當之添加劑。添加劑之具體例係與包含成為母劑之聚合物及活性能量線反應性化合物之樹脂材料(R1)中可包含之添加劑相同。包含活性能量線反應性聚合物之樹脂材料(R2)中,活性能量線聚合起始劑之含有比率相對於活性能量線反應性聚合物100重量份,較佳為0.1重量份~10重量份、更佳為1重量份~5重量份。 The resin material (R2) containing the active energy ray reactive polymer may further contain the active energy ray reactive compound (monomer or oligomer). The resin material (R2) containing the active energy ray-reactive polymer may contain any appropriate additives as necessary. Specific examples of the additives are the same as the additives that can be contained in the resin material (R1) containing the polymer serving as the mother agent and the active energy ray reactive compound. In the resin material (R2) containing the active energy ray reactive polymer, the content ratio of the active energy ray polymerization initiator is preferably 0.1 to 10 parts by weight relative to 100 parts by weight of the active energy ray reactive polymer. More preferably, it is 1 to 5 parts by weight.

上述第二黏著劑層中包含之黏著劑視需要可包含任意適當之添加劑。作為所使用之添加劑之例,可列舉上述B-1項中說明之添加劑。又,添加劑(黏著賦予劑、交聯劑等)之添加量亦較佳為B-1項中說明之添加量。因此,於一實施形態中,第二黏著劑層可包含黏著賦予劑,該黏著賦予劑之含有比率相對於黏著劑層100重量份,較佳為40重量份以下、更佳為30重量份以下、進而較佳為25重量份以下、進而較佳為3重量份~25重量份。 The adhesive contained in the second adhesive layer may include any appropriate additives as needed. Examples of the additives used include the additives described in the above item B-1. The amount of the additives (adhesion imparting agent, cross-linking agent, etc.) is also preferably the amount described in item B-1. Therefore, in one embodiment, the second adhesive layer may include an adhesion-imparting agent, and the content ratio of the adhesion-imparting agent is preferably 40 parts by weight or less, and more preferably 30 parts by weight or less with respect to 100 parts by weight of the adhesive layer. It is more preferably 25 parts by weight or less, and still more preferably 3 to 25 parts by weight.

C-2.熱膨脹性微球C-2. Thermal expansion microspheres

於一實施形態中,上述第二黏著劑層進而包含B-2項中說明之熱膨脹性微球。第二黏著劑層中,熱膨脹性微球之含有比率相對於形成第二黏著劑層之黏著劑中之基礎聚合物100重量份,亦例如為1重量份~150重量份、較佳為10重量份~130重量份、進而較佳為25重量份~100重量份。 In one embodiment, the second adhesive layer further includes the thermally expandable microspheres described in item B-2. The content ratio of the heat-expandable microspheres in the second adhesive layer is 100 parts by weight with respect to the base polymer in the adhesive forming the second adhesive layer, for example, 1 to 150 parts by weight, and preferably 10 parts by weight. Parts to 130 parts by weight, and more preferably 25 parts by weight to 100 parts by weight.

C-3.第二黏著劑層之特性等C-3. Characteristics of the second adhesive layer

上述第二黏著劑層之厚度較佳為1μm~100μm、更佳為5μm~80μm、尤佳為10μm~50μm。於第二黏著劑層包含熱膨脹性微球之情形時,第二黏著劑層之厚度係與第一黏著劑層之厚度同樣地設為:觀察第二黏著劑層之厚度方向剖面時的自第二黏著劑層之外側面(與基材相反側之面)至最接近基材之熱膨脹性微球之最內側端為止之距離。 The thickness of the second adhesive layer is preferably 1 μm to 100 μm, more preferably 5 μm to 80 μm, and even more preferably 10 μm to 50 μm. When the second adhesive layer includes thermally expandable microspheres, the thickness of the second adhesive layer is the same as the thickness of the first adhesive layer. The thickness of the second adhesive layer is set as follows: The distance from the outer surface of the two adhesive layers (the surface opposite to the substrate) to the innermost end of the thermally expandable microsphere closest to the substrate.

於第二黏著劑層包含熱膨脹性微球之情形時,第二黏著劑層之厚度與該第二黏著劑層中包含之熱膨脹性微球之平均粒徑之差(厚度-平均粒徑)較佳為8μm以上、更佳為10μm以上、進而較佳為15μm以上、尤佳為25μm以上、最佳為25μm~100μm。 When the second adhesive layer includes thermally expandable microspheres, the difference between the thickness of the second adhesive layer and the average particle diameter of the thermally expandable microspheres included in the second adhesive layer (thickness-average particle diameter) It is preferably 8 μm or more, more preferably 10 μm or more, even more preferably 15 μm or more, particularly preferably 25 μm or more, and most preferably 25 μm to 100 μm.

上述第二黏著劑層於25℃下利用奈米壓痕法測得之彈性模數較佳為0.01MPa~50MPa、更佳為0.1MPa~10MPa、尤佳為0.5MPa~5MPa。 The elastic modulus of the second adhesive layer measured by the nanoindentation method at 25 ° C. is preferably 0.01 MPa to 50 MPa, more preferably 0.1 MPa to 10 MPa, and even more preferably 0.5 MPa to 5 MPa.

上述第二黏著劑層之貼合面之中心線平均表面粗糙度Ra較佳為1μm以下、更佳為0.01μm~1μm、進而較佳為0.03μm~0.8μm、尤佳為0.06μm~0.6μm。 The centerline average surface roughness Ra of the bonding surface of the second adhesive layer is preferably 1 μm or less, more preferably 0.01 μm to 1 μm, still more preferably 0.03 μm to 0.8 μm, and even more preferably 0.06 μm to 0.6 μm. .

水對於上述第二黏著劑層之接觸角較佳為85°~115°、更佳為87°~115°、尤佳為90°~115°。 The contact angle of water to the second adhesive layer is preferably 85 ° to 115 °, more preferably 87 ° to 115 °, and even more preferably 90 ° to 115 °.

上述第二黏著劑層之凝膠分率較佳為50%以上、更佳為52%~99%、進而較佳為55%~99%。若為此種範圍,則能夠防止藥液侵入至黏著劑層。 The gel fraction of the second adhesive layer is preferably 50% or more, more preferably 52% to 99%, and still more preferably 55% to 99%. Within this range, it is possible to prevent the chemical solution from entering the adhesive layer.

D.基材D. Substrate

作為上述基材,可列舉例如樹脂片、不織布、紙、金屬箔、織布、橡膠片、發泡片等。又,亦可使用由該等之積層體(尤其是包含樹脂片之積層體)構成之基材、或者以該等複數種材料作為原料之複 合基材。作為構成樹脂片之樹脂,可列舉例如:聚對苯二甲酸乙二酯(PET)、聚萘二甲酸乙二酯(PEN)、聚對苯二甲酸丁二酯(PBT)、聚乙烯(PE)、聚丙烯(PP)、乙烯-丙烯共聚物、乙烯-乙酸乙烯酯共聚物(EVA)、聚醯胺(尼龍)、全芳香族聚醯胺(芳族聚醯胺)、聚醯亞胺(PI)、聚氯乙烯(PVC)、聚苯硫醚(PPS)、氟系樹脂、聚醚醚酮(PEEK)、丙烯酸胺基甲酸酯、丙烯酸系樹脂(較佳為UV硬化型之丙烯酸系樹脂)等。其中,就耐酸性之觀點而言,可較佳地使用PET、PEN、PE或PP。作為不織布,可列舉:包含馬尼拉麻(Manila hemp)之不織布等由具有耐熱性之天然纖維形成之不織布;聚丙烯樹脂不織布、聚乙烯樹脂不織布、酯系樹脂不織布等合成樹脂不織布等。 Examples of the substrate include resin sheets, nonwoven fabrics, paper, metal foils, woven fabrics, rubber sheets, and foamed sheets. In addition, a base material composed of such a laminated body (especially a laminated body including a resin sheet) or a composite material using these plural kinds of materials as raw materials may be used. 合 Substrate. Examples of the resin constituting the resin sheet include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and polyethylene (PE). ), Polypropylene (PP), ethylene-propylene copolymer, ethylene-vinyl acetate copolymer (EVA), polyamide (nylon), fully aromatic polyamide (aromatic polyamide), polyimide (PI), polyvinyl chloride (PVC), polyphenylene sulfide (PPS), fluororesin, polyetheretherketone (PEEK), acrylic urethane, acrylic resin (preferably UV-curing acrylic acid) Based resin) and so on. Among these, PET, PEN, PE, or PP can be preferably used from the viewpoint of acid resistance. Examples of the nonwoven fabric include nonwoven fabrics made of natural fibers having heat resistance such as nonwoven fabrics including Manila hemp; synthetic resin nonwoven fabrics such as polypropylene resin nonwoven fabric, polyethylene resin nonwoven fabric, and ester resin nonwoven fabric.

上述基材於25℃下利用奈米壓痕法測得之彈性模數較佳為10MPa~10GPa。基材於25℃下利用奈米壓痕法測得之彈性模數更佳為100MPa~5GPa、尤佳為500MPa~5GPa。若為此種範圍,則能夠獲得切斷性及貼合時之處理性優異之熱剝離型黏著片。 The elastic modulus of the substrate measured at 25 ° C by the nanoindentation method is preferably 10 MPa to 10 GPa. The elastic modulus of the substrate measured by the nanoindentation method at 25 ° C is more preferably 100 MPa to 5 GPa, and even more preferably 500 MPa to 5 GPa. Within this range, a heat-peelable pressure-sensitive adhesive sheet having excellent cutting properties and rationality at the time of bonding can be obtained.

上述基材之厚度較佳為1μm~1000μm、更佳為2μm~250μm、尤佳為10μm~100μm。若為此種範圍,則能夠獲得切斷性及貼合時之處理性優異之熱剝離型黏著片。 The thickness of the substrate is preferably 1 μm to 1000 μm, more preferably 2 μm to 250 μm, and even more preferably 10 μm to 100 μm. Within this range, a heat-peelable pressure-sensitive adhesive sheet having excellent cutting properties and rationality at the time of bonding can be obtained.

上述基材亦可實施表面處理。作為表面處理,可列舉例如:電暈處理、鉻酸處理、臭氧暴露、火焰暴露、高壓電擊暴露、離子化放射線處理、利用有機塗佈材料進行之塗佈處理等。若進行此種表面處理,則能夠提高黏著劑層與基材之密接性,抑制藥液侵入至黏著劑層與基材之界面。尤其是,利用有機塗佈材料進行之塗佈處理於加熱剝離時能夠抑制黏著劑層之抓固破壞,故而較佳。 The substrate may be subjected to a surface treatment. Examples of the surface treatment include corona treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage electric shock exposure, ionizing radiation treatment, and coating treatment using an organic coating material. If such a surface treatment is performed, the adhesion between the adhesive layer and the substrate can be improved, and the penetration of the chemical solution into the interface between the adhesive layer and the substrate can be suppressed. In particular, a coating treatment using an organic coating material is preferred because it can suppress the grabbing damage of the adhesive layer during thermal peeling.

作為上述有機塗佈材料,可列舉例如塑膠硬塗材料II(CMC出版,(2004))中記載之材料。較佳為使用胺基甲酸酯系聚合物,更佳為使用聚丙烯酸胺基甲酸酯、聚酯胺基甲酸酯或該等之前體。其原因在 於:對基材之塗覆簡便,且工業上可選擇多種者並能夠廉價地獲得。該胺基甲酸酯系聚合物例如為包含異氰酸酯單體與含醇性羥基之單體(例如含羥基之丙烯酸系化合物或含羥基之酯化合物)之反應混合物之聚合物。有機塗佈材料亦可包含聚胺等鏈延長劑、防老化劑、氧化穩定劑等作為任意之添加劑。有機塗佈層之厚度並無特別限定,例如適合為0.1μm~10μm左右、較佳為0.1μm~5μm左右、更佳為0.5μm~5μm左右。作為有機塗佈材料,亦可使用荒川化學工業公司製造之ARACOAT系列(例如,商品名「AP2500E」與作為硬化劑之商品名「CL2500」之組合)、大日精化公司製造之商品名「NB300」、商品名「HR Color」等市售品。 Examples of the organic coating material include those described in Plastic Hard Coating Material II (CMC Publication, (2004)). It is preferable to use a urethane-based polymer, and it is more preferable to use a polyacrylate urethane, a polyester urethane, or these precursors. The reason is Yu: The coating of the substrate is simple, and various ones can be industrially selected and can be obtained at low cost. The urethane-based polymer is, for example, a polymer containing a reaction mixture of an isocyanate monomer and an alcoholic hydroxyl-containing monomer (for example, a hydroxyl-containing acrylic compound or a hydroxyl-containing ester compound). The organic coating material may contain a chain extender such as a polyamine, an aging inhibitor, an oxidation stabilizer, and the like as optional additives. The thickness of the organic coating layer is not particularly limited. For example, the thickness is preferably about 0.1 μm to 10 μm, preferably about 0.1 μm to 5 μm, and more preferably about 0.5 μm to 5 μm. As the organic coating material, the ARACOAT series (for example, a combination of the trade name "AP2500E" and the hardener name "CL2500") manufactured by Arakawa Chemical Industry Co., Ltd., and the trade name "NB300" manufactured by Daihichi Chemical Co., Ltd. can also be used. , Commercial products such as "HR Color".

E.彈性層E. Elastic layer

如上所述,本發明之熱剝離型黏著片亦可進而具備彈性層。 As described above, the heat-peelable pressure-sensitive adhesive sheet of the present invention may further include an elastic layer.

上述彈性層包含基礎聚合物,作為該基礎聚合物,可使用黏著性之聚合物。作為構成彈性層之基礎聚合物,可列舉例如:(甲基)丙烯酸系聚合物;天然橡膠、合成橡膠(例如腈系、二烯系、丙烯酸系)等橡膠系聚合物;聚烯烴系、聚酯系等熱塑性彈性體;乙烯基烷基醚系聚合物;聚矽氧系聚合物;聚酯系聚合物;聚醯胺系聚合物;胺基甲酸酯系聚合物;苯乙烯-二烯嵌段共聚物;乙烯-乙酸乙烯酯共聚物;聚胺基甲酸酯系聚合物;聚丁二烯;軟質聚氯乙烯;放射線硬化型聚合物等。上述構成彈性層之基礎聚合物可與形成上述黏著劑層(第一黏著劑層及/或第二黏著劑層)之基礎聚合物相同,亦可不同。上述彈性層亦可為由上述基礎聚合物形成之發泡膜。該發泡膜可利用任意適當之方法獲得。再者,彈性層與第一黏著劑層(及包含熱膨脹性微球之第二黏著劑層)可藉由有無熱膨脹性微球(彈性層不含熱膨脹性微球)進行區別。 The elastic layer includes a base polymer. As the base polymer, an adhesive polymer can be used. Examples of the base polymer constituting the elastic layer include (meth) acrylic polymers; rubber polymers such as natural rubber and synthetic rubbers (such as nitrile, diene, and acrylic); polyolefins, and polymers Thermoplastic elastomers such as esters; vinyl alkyl ether polymers; silicone polymers; polyester polymers; polyamide polymers; urethane polymers; styrene-diene Block copolymers; ethylene-vinyl acetate copolymers; polyurethane-based polymers; polybutadiene; soft polyvinyl chloride; radiation-curable polymers and the like. The base polymer constituting the elastic layer may be the same as or different from the base polymer forming the adhesive layer (the first adhesive layer and / or the second adhesive layer). The elastic layer may be a foamed film formed of the base polymer. The foamed film can be obtained by any appropriate method. Furthermore, the elastic layer and the first adhesive layer (and the second adhesive layer containing thermally expandable microspheres) can be distinguished by the presence or absence of thermally expandable microspheres (the elastic layer does not contain thermally expandable microspheres).

作為構成彈性層之基礎聚合物之(甲基)丙烯酸系聚合物例如為使 用1種或2種以上之(甲基)丙烯酸烷基酯作為單體成分之丙烯酸系聚合物(均聚物或共聚物)。作為該(甲基)丙烯酸烷基酯之具體例,可列舉具有碳數為20以下之直鏈狀或支鏈狀之烷基之(甲基)丙烯酸烷基酯。又,上述丙烯酸系聚合物亦可包含能夠與(甲基)丙烯酸烷基酯共聚之其他單體成分所對應之單元。作為此種單體成分,可列舉例如:丙烯酸、甲基丙烯酸、伊康酸、丙烯酸羥基乙酯、甲基丙烯酸羥基乙酯、丙烯酸羥基丙酯、甲基丙烯酸羥基丙酯、N-羥甲基丙烯醯胺、丙烯腈、甲基丙烯腈、丙烯酸縮水甘油酯、甲基丙烯酸縮水甘油酯、乙酸乙烯酯、苯乙烯、異戊二烯、丁二烯、異丁烯、乙烯醚等。 The (meth) acrylic polymer as a base polymer constituting the elastic layer is, for example, An acrylic polymer (homopolymer or copolymer) using one or more alkyl (meth) acrylates as monomer components. Specific examples of the alkyl (meth) acrylate include alkyl (meth) acrylates having a linear or branched alkyl group having a carbon number of 20 or less. The acrylic polymer may include units corresponding to other monomer components that can be copolymerized with the alkyl (meth) acrylate. Examples of such monomer components include acrylic acid, methacrylic acid, itaconic acid, hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, and N-methylol. Acrylamide, acrylonitrile, methacrylonitrile, glycidyl acrylate, glycidyl methacrylate, vinyl acetate, styrene, isoprene, butadiene, isobutylene, vinyl ether, and the like.

上述彈性層視需要可包含任意適當之添加劑。作為該添加劑,可列舉例如:交聯劑、硫化劑、黏著賦予劑、塑化劑、柔軟劑、填充劑、防老化劑等。於使用聚氯乙烯等硬質樹脂作為基礎聚合物之情形時,較佳為併用塑化劑及/或柔軟劑而形成具有所期望之彈性之彈性層。 The above-mentioned elastic layer may contain any appropriate additives as necessary. Examples of the additive include a crosslinking agent, a vulcanizing agent, an adhesion-imparting agent, a plasticizer, a softening agent, a filler, an anti-aging agent, and the like. When a hard resin such as polyvinyl chloride is used as the base polymer, it is preferable to use a plasticizer and / or a softener in combination to form an elastic layer having desired elasticity.

上述彈性層之厚度較佳為3μm~200μm、更佳為5μm~100μm。若為此種範圍,則能夠充分地發揮出彈性層之上述功能。 The thickness of the elastic layer is preferably 3 μm to 200 μm, and more preferably 5 μm to 100 μm. If it is this range, the said function of an elastic layer can fully be exhibited.

上述彈性層於25℃下之拉伸彈性模數較佳為未達100MPa、更佳為0.1MPa~50MPa、進而較佳為0.1MPa~10MPa。若為此種範圍,則能夠充分地發揮出彈性層之上述功能。 The tensile elastic modulus of the elastic layer at 25 ° C. is preferably less than 100 MPa, more preferably 0.1 MPa to 50 MPa, and still more preferably 0.1 MPa to 10 MPa. If it is this range, the said function of an elastic layer can fully be exhibited.

F.熱剝離型黏著片之製造方法F. Manufacturing method of thermal release type adhesive sheet

本發明之熱剝離型黏著片可利用任意適當之方法而製造。關於本發明之熱剝離型黏著片,例如可列舉如下方法:於基材之一個面上直接塗覆第一黏著劑層形成用組合物,並於基材之另一個面上塗覆第二黏著劑層形成用組合物之方法;將塗覆於任意適當之基體上而形成之塗覆層轉印至基材,而形成第一黏著劑層及第二黏著劑層之方法等。又,包含熱膨脹性微球之黏著劑層亦可於利用包含黏著劑之組合 物形成黏著劑塗覆層後,將熱膨脹性微球撒於該黏著劑塗覆層上,然後使用層壓機等將該熱膨脹性微球嵌入至該塗覆層中而形成。 The heat-peelable pressure-sensitive adhesive sheet of the present invention can be produced by any appropriate method. Regarding the heat-peelable pressure-sensitive adhesive sheet of the present invention, for example, the following method can be cited: directly coating the first adhesive layer-forming composition on one surface of the substrate, and coating the second adhesive on the other surface of the substrate. A method for forming a layer composition; a method for transferring a coating layer formed by coating on any appropriate substrate to a substrate to form a first adhesive layer and a second adhesive layer, and the like. In addition, an adhesive layer containing thermally expandable microspheres can also be used in combination with an adhesive After forming an adhesive coating layer, the thermally expandable microspheres are sprinkled on the adhesive coating layer, and then the thermally expandable microspheres are embedded in the coating layer using a laminator or the like.

上述第一黏著劑層形成用組合物包含上述丙烯酸系黏著劑I及上述熱膨脹性微球,視需要包含任意適當之溶劑。上述第二黏著劑層形成用組合物包含任意適當之黏著劑,視需要包含上述熱膨脹性微球及/或任意適當之溶劑。 The composition for forming the first adhesive layer includes the acrylic adhesive I and the thermally expandable microspheres, and optionally contains any appropriate solvent. The composition for forming the second adhesive layer includes any appropriate adhesive, and optionally includes the above-mentioned thermally expandable microspheres and / or any appropriate solvent.

於上述熱剝離型黏著片具有上述彈性層之情形時,該彈性層及與該彈性層鄰接之黏著劑層例如可於基材上塗覆彈性層形成用組合物,繼而塗覆黏著劑層形成用組合物而形成。例如,於基材上塗覆含有形成彈性層之材料(基礎聚合物、添加劑等)之彈性層形成用組合物,繼而於彈性層形成用組合物之塗覆層上塗覆第一黏著劑形成用組合物,藉此能夠自基材側起依序形成彈性層及第一黏著劑層。 In the case where the heat-peelable pressure-sensitive adhesive sheet has the above-mentioned elastic layer, the elastic layer and the adhesive layer adjacent to the elastic layer may, for example, apply a composition for forming an elastic layer on a substrate, and then apply an adhesive layer for Composition. For example, an elastic layer-forming composition containing a material for forming an elastic layer (a base polymer, an additive, etc.) is coated on a substrate, and then a first adhesive-forming composition is coated on a coating layer of the composition for forming an elastic layer. Thus, the elastic layer and the first adhesive layer can be sequentially formed from the substrate side.

作為上述各組合物之塗覆方法,可採用任意適當之塗覆方法。例如,可於塗佈後進行乾燥而形成各層。作為塗佈方法,例如可列舉使用例如多功能塗佈機(Multi-coater)、模嘴塗佈機、凹版塗佈機、敷料器(applicator)等之塗佈方法。作為乾燥方法,可列舉例如自然乾燥、加熱乾燥等。進行加熱乾燥之情形時之加熱溫度可根據成為乾燥對象之物質之特性而設定為任意適當之溫度。 As a coating method of each of the above-mentioned compositions, any appropriate coating method can be adopted. For example, each layer can be formed by drying after coating. Examples of the coating method include a coating method using, for example, a multi-coater, a die coater, a gravure coater, an applicator, and the like. Examples of the drying method include natural drying and heat drying. In the case of heating and drying, the heating temperature can be set to any appropriate temperature according to the characteristics of the substance to be dried.

G.用途G. Uses

本發明之熱剝離型黏著片可較佳地用作製造電子零件時之保護片。尤其是於使用酸性或鹼性之藥液對電子零件進行處理(例如蝕刻處理)時,可較佳地用作用以保護該電子零件之保護片。 The heat-peelable pressure-sensitive adhesive sheet of the present invention can be preferably used as a protective sheet when manufacturing electronic parts. In particular, when an electronic part is processed (for example, an etching process) using an acidic or alkaline chemical solution, it can be preferably used as a protective sheet for protecting the electronic part.

本發明之熱剝離型黏著片係雙面黏著片,藉由於該黏著片之兩面貼合作為被處理物之電子零件,並將該電子零件供於處理步驟,而能夠防止該電子零件之翹曲。又,藉由以上述方式進行處理步驟,能夠實現生產效率之提高。 The heat-peeling type adhesive sheet of the present invention is a double-sided adhesive sheet. The electronic parts can be prevented from warping due to the two parts of the adhesive sheet sticking together as an electronic part to be processed, and the electronic part is provided in a processing step. . Further, by performing the processing steps in the above-mentioned manner, it is possible to improve production efficiency.

[實施例] [Example]

以下,藉由實施例具體地說明本發明,但本發明不受該等實施例限定。又,實施例中,只要無特別說明,則「份」及「%」係重量基準。 Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited by these examples. In the examples, "parts" and "%" are based on weight unless otherwise specified.

[製造例1]丙烯酸系黏著劑I(i)之製備 [Production Example 1] Preparation of acrylic adhesive I (i)

將(甲基)丙烯酸系聚合物(丙烯酸丁酯(BA)與丙烯酸(AA)之共聚物,源自BA之結構單元:源自AA之結構單元(重量比)=95:5)100重量份、環氧系交聯劑(三菱瓦斯化學公司製造,商品名「TETRAD C」)0.6重量份、及萜烯酚系黏著賦予樹脂(YASUHARA CHEMICAL公司製造,商品名「YS POLYSTAR T130」)30重量份進行混合,從而製備丙烯酸系黏著劑I(i)。 100 parts by weight of (meth) acrylic polymer (copolymer of butyl acrylate (BA) and acrylic acid (AA), structural unit derived from BA: structural unit derived from AA (weight ratio) = 95: 5) 0.6 parts by weight of an epoxy-based crosslinking agent (manufactured by Mitsubishi Gas Chemical Co., Ltd. under the trade name "TETRAD C") and 30 parts by weight of terpene phenol-based adhesion-imparting resin (manufactured by YASUHARA Chemical Co., Ltd. under the trade name "YS POLYSTAR T130") The mixture was mixed to prepare an acrylic adhesive I (i).

[製造例2~9]丙烯酸系黏著劑I(ii)~(ix)之製備 [Manufacturing Examples 2 to 9] Preparation of acrylic adhesives I (ii) to (ix)

將表1所示之(甲基)丙烯酸系聚合物、交聯劑及黏著賦予樹脂以表1所示之調配量進行混合,從而製備丙烯酸系黏著劑I(ii)~(ix)。 The (meth) acrylic polymer, cross-linking agent, and adhesion-imparting resin shown in Table 1 were mixed at the compounding amounts shown in Table 1 to prepare acrylic adhesives I (ii) to (ix).

TETRAD X:環氧系交聯劑;三菱瓦斯化學公司製造,商品名「TETRAD X」 TETRAD X: Epoxy-based crosslinking agent; manufactured by Mitsubishi Gas Chemical Co., Ltd. under the trade name "TETRAD X"

CORONATE L:異氰酸酯系交聯劑;Nippon Polyurethane Industry公司製造,商品名「CORONATE L」 CORONATE L: an isocyanate-based crosslinking agent; manufactured by Nippon Polyurethane Industry, under the trade name "CORONATE L"

SUPER ESTER A-75:松香系黏著賦予樹脂;荒川化學工業公司製造,商品名「SUPER ESTER A-75」 SUPER ESTER A-75: Rosin-based adhesion-imparting resin; manufactured by Arakawa Chemical Industries, Ltd., trade name "SUPER ESTER A-75"

TAMANOL 200:烷基酚系黏著賦予樹脂;荒川化學工業公司製造,商品名「TAMANOL 200」 TAMANOL 200: Alkylphenol-based adhesion-imparting resin; manufactured by Arakawa Chemical Industries, Ltd., under the trade name "TAMANOL 200"

[實施例1] [Example 1]

將製造例1中獲得之丙烯酸系黏著劑I(i)130.6重量份、熱膨脹性微球(松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-50D」)25重量份、以及甲苯210重量份進行混合,從而製備黏著劑層 形成用組合物(i)。 130.6 parts by weight of the acrylic adhesive I (i) obtained in Production Example 1, 25 parts by weight of thermally expandable microspheres (manufactured by Matsumoto Oil and Fat Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50D"), and 210 parts by weight of toluene were performed. Mixed to prepare an adhesive layer Formation composition (i).

將該黏著劑層形成用組合物(i)塗覆於作為基材之PET膜(東麗公司製造,商品名「Lumirror S10」,厚度:100μm)之兩面,形成厚度40μm之第一黏著劑層及第二黏著劑層。 This adhesive layer-forming composition (i) was coated on both sides of a PET film (manufactured by Toray Co., Ltd., trade name "Lumirror S10", thickness: 100 μm) to form a first adhesive layer having a thickness of 40 μm And a second adhesive layer.

藉由上述操作,獲得依序具備第一黏著劑層(40μm)、基材(100μm)、以及第二黏著劑層(40μm)之熱剝離型黏著片。 Through the above operations, a heat-peelable pressure-sensitive adhesive sheet having a first adhesive layer (40 μm), a substrate (100 μm), and a second adhesive layer (40 μm) in this order was obtained.

[實施例2] [Example 2]

將製造例1中獲得之丙烯酸系黏著劑I(i)130.6重量份、熱膨脹性微球(松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-48D」)30重量份、以及甲苯210重量份進行混合,從而製備黏著劑層形成用組合物(ii)。 130.6 parts by weight of the acrylic adhesive I (i) obtained in Production Example 1, 30 parts by weight of thermally expandable microspheres (manufactured by Matsumoto Oil and Fat Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-48D"), and 210 parts by weight of toluene were performed. They were mixed to prepare a composition (ii) for forming an adhesive layer.

又,作為彈性層形成用組合物(i),準備丙烯酸系黏著劑I(i)130.6重量份與甲苯210重量份之混合物。又,作為彈性層形成用組合物(ii),準備製造例2中獲得之丙烯酸系黏著劑I(ii)130.1重量份與甲苯210重量份之混合物。 Further, as a composition (i) for forming an elastic layer, a mixture of 130.6 parts by weight of an acrylic adhesive I (i) and 210 parts by weight of toluene was prepared. In addition, as a composition (ii) for forming an elastic layer, a mixture of 130.1 parts by weight of the acrylic adhesive I (ii) obtained in Production Example 2 and 210 parts by weight of toluene was prepared.

於作為基材之聚酯膜(三菱樹脂公司製造,商品名「DIAFOIL」,厚度:50μm)之單面上依序塗覆彈性層形成用組合物(i)及黏著劑層形成組合物(ii),從而形成彈性層(厚度:20μm)及第一黏著劑層(厚度:40μm)。進而,於該基材之另一個面上依序塗覆彈性層形成用組合物(ii)及黏著劑層形成組合物(ii),從而形成彈性層(厚度:20μm)及第二黏著劑層(20μm)。 A polyester film (manufactured by Mitsubishi Resin Co., Ltd., trade name "DIAFOIL", thickness: 50 µm) was sequentially coated on one side with a composition for forming an elastic layer (i) and a composition for forming an adhesive layer (ii) on one side. ) To form an elastic layer (thickness: 20 μm) and a first adhesive layer (thickness: 40 μm). Furthermore, the elastic layer forming composition (ii) and the adhesive layer forming composition (ii) were sequentially coated on the other surface of the substrate to form an elastic layer (thickness: 20 μm) and a second adhesive layer. (20 μm).

藉由上述操作,獲得依序具備第一黏著劑層(40μm)、彈性層(20μm)、基材(50μm)、彈性層(20μm)、以及第二黏著劑層(20μm)之熱剝離型黏著片。 Through the above operations, a heat-peeling type adhesive having a first adhesive layer (40 μm), an elastic layer (20 μm), a substrate (50 μm), an elastic layer (20 μm), and a second adhesive layer (20 μm) in this order was obtained. sheet.

[實施例3] [Example 3]

將製造例3中獲得之丙烯酸系黏著劑(iii)151重量份、熱膨脹性微 球(松本油脂製藥公司製造,商品名「Matsumoto Microsphere FN-100SD」)40重量份、以及甲苯210重量份進行混合,從而製備黏著劑層形成用組合物(iii)。 151 parts by weight of the acrylic pressure-sensitive adhesive (iii) obtained in Production Example 3, and a slight thermal expansion property 40 parts by weight of a ball (manufactured by Matsumoto Grease Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere FN-100SD") and 210 parts by weight of toluene were mixed to prepare a composition (iii) for forming an adhesive layer.

又,作為彈性層形成用組合物(iii),準備製造例4中獲得之丙烯酸系黏著劑I(iv)101重量份與甲苯210重量份之混合物。 Further, as the composition (iii) for forming an elastic layer, a mixture of 101 parts by weight of the acrylic adhesive I (iv) obtained in Production Example 4 and 210 parts by weight of toluene was prepared.

於作為基材之PET膜(東麗公司製造,商品名「Lumirror S10」,厚度:100μm)之單面上依序塗覆彈性層形成用組合物(iii)及黏著劑層形成組合物(iii),從而形成彈性層(厚度:30μm)及第一黏著劑層(厚度:30μm)。進而,於該基材之另一個面上依序塗覆彈性層形成用組合物(iii)及黏著劑層形成組合物(iii),從而形成彈性層(厚度:15μm)及第二黏著劑層(厚度:20μm)。 On one side of a PET film (manufactured by Toray Co., Ltd., trade name "Lumirror S10", thickness: 100 µm), a composition for forming an elastic layer (iii) and an adhesive layer forming composition (iii) were sequentially coated on one side of the substrate. ) To form an elastic layer (thickness: 30 μm) and a first adhesive layer (thickness: 30 μm). Furthermore, the composition (iii) for forming an elastic layer and the composition (iii) for forming an adhesive layer were sequentially coated on the other surface of the substrate to form an elastic layer (thickness: 15 μm) and a second adhesive layer. (Thickness: 20 μm).

藉由上述操作,獲得依序具備第一黏著劑層(30μm)、彈性層(30μm)、基材(100μm)、彈性層(15μm)、以及第二黏著劑層(20μm)之熱剝離型黏著片。 Through the above operations, a heat-peeling type adhesive having a first adhesive layer (30 μm), an elastic layer (30 μm), a substrate (100 μm), an elastic layer (15 μm), and a second adhesive layer (20 μm) in this order was obtained. sheet.

[實施例4] [Example 4]

將製造例5中獲得之丙烯酸系黏著劑(v)122重量份、熱膨脹性微球(Japan Fillite公司製造,商品名「Expancel 909-DU80」)30重量份、以及甲苯210重量份進行混合,從而製備黏著劑層形成用組合物(iv)。 122 parts by weight of the acrylic adhesive (v) obtained in Production Example 5, 30 parts by weight of thermally expandable microspheres (manufactured by Japan Fillite, trade name "Expancel 909-DU80"), and 210 parts by weight of toluene were mixed to thereby mix A composition (iv) for forming an adhesive layer was prepared.

又,作為彈性層形成用組合物(iv),準備製造例6中獲得之丙烯酸系黏著劑I(vi)112重量份與甲苯210重量份之混合物。 Further, as the composition (iv) for forming an elastic layer, a mixture of 112 parts by weight of the acrylic adhesive I (vi) obtained in Production Example 6 and 210 parts by weight of toluene was prepared.

於作為基材之PET膜(東麗公司製造,商品名「Lumirror S10」,厚度:50μm)之單面上依序塗覆彈性層形成用組合物(iv)及黏著劑層形成組合物(iv),從而形成彈性層(厚度:25μm)及第一黏著劑層(厚度:50μm)。進而,於該基材之另一個面上依序塗覆彈性層形成用組合物(iv)及黏著劑層形成組合物(iv),從而形成彈性層(厚度:20μm)及第二黏著劑層(厚度:30μm)。 On one side of a PET film (manufactured by Toray Co., Ltd., trade name "Lumirror S10", thickness: 50 µm) as a substrate, an elastic layer forming composition (iv) and an adhesive layer forming composition (iv) were sequentially applied. ) To form an elastic layer (thickness: 25 μm) and a first adhesive layer (thickness: 50 μm). Furthermore, the composition (iv) for forming an elastic layer and the composition (iv) for forming an adhesive layer were sequentially coated on the other surface of the substrate to form an elastic layer (thickness: 20 μm) and a second adhesive layer. (Thickness: 30 μm).

藉由上述操作,獲得依序具備第一黏著劑層(50μm)、彈性層(25μm)、基材(50μm)、彈性層(20μm)、以及第二黏著劑層(30μm)之熱剝離型黏著片。 Through the above operations, a heat-peeling type adhesive having a first adhesive layer (50 μm), an elastic layer (25 μm), a substrate (50 μm), an elastic layer (20 μm), and a second adhesive layer (30 μm) in this order is obtained sheet.

[比較例1] [Comparative Example 1]

將製造例7中獲得之丙烯酸系黏著劑I(vii)140.7重量份、熱膨脹性微球(松本油脂製藥公司製造,商品名「Matsumoto Microsphere F-50D」)25重量份、以及甲苯210重量份進行混合,從而製備黏著劑層形成用組合物(v)。 140.7 parts by weight of the acrylic adhesive I (vii) obtained in Production Example 7, 25 parts by weight of thermally expandable microspheres (manufactured by Matsumoto Oil and Fat Pharmaceutical Co., Ltd., trade name "Matsumoto Microsphere F-50D"), and 210 parts by weight of toluene were performed. They were mixed to prepare a composition (v) for forming an adhesive layer.

將該黏著劑層形成用組合物(v)塗覆於作為基材之PET膜(東麗公司製造,商品名「Lumirror S10」,厚度:100μm)之兩面,從而形成厚度45μm之第一黏著劑層及第二黏著劑層。 This adhesive layer-forming composition (v) was coated on both sides of a PET film (manufactured by Toray Co., Ltd., trade name "Lumirror S10", thickness: 100 μm) to form a first adhesive having a thickness of 45 μm. Layer and a second adhesive layer.

藉由上述操作,獲得依序具備第一黏著劑層(45μm)、基材(100μm)、以及第二黏著劑層(45μm)之熱剝離型黏著片。 Through the above operations, a heat-peelable pressure-sensitive adhesive sheet having a first adhesive layer (45 μm), a substrate (100 μm), and a second adhesive layer (45 μm) in this order was obtained.

[比較例2] [Comparative Example 2]

將製造例8中獲得之丙烯酸系黏著劑I(viii)127重量份、熱膨脹性微球(Japan Fillite公司製造,商品名「Expancel 909-DU80」)30重量份、以及甲苯210重量份進行混合,從而製備黏著劑層形成用組合物(vi)。 127 parts by weight of the acrylic adhesive I (viii) obtained in Production Example 8, 30 parts by weight of thermally expandable microspheres (manufactured by Japan Fillite, trade name "Expancel 909-DU80"), and 210 parts by weight of toluene were mixed, Thus, a composition (vi) for forming an adhesive layer was prepared.

又,作為彈性層形成用組合物(vi),準備製造例9中獲得之丙烯酸系黏著劑I(ix)117重量份與甲苯210重量份之混合物。 Further, as the composition (vi) for forming an elastic layer, a mixture of 117 parts by weight of the acrylic adhesive I (ix) obtained in Production Example 9 and 210 parts by weight of toluene was prepared.

於作為基材之PET膜(東麗公司製造,商品名「Lumirror S10」,厚度:100μm)之單面上依序塗覆彈性層形成用組合物(vi)及黏著劑層形成組合物(vi),從而形成彈性層(厚度:20μm)及第一黏著劑層(厚度:40μm)。進而,於該基材之另一個面上塗覆黏著劑層形成組合物(vi),從而形成第二黏著劑層(40μm)。 A PET film (manufactured by Toray Co., Ltd., trade name “Lumirror S10”, thickness: 100 μm) was sequentially coated on one side of the PET film as a base material with an elastic layer forming composition (vi) and an adhesive layer forming composition (vi ) To form an elastic layer (thickness: 20 μm) and a first adhesive layer (thickness: 40 μm). Further, an adhesive layer-forming composition (vi) was coated on the other surface of the substrate to form a second adhesive layer (40 μm).

藉由上述操作,獲得依序具備第一黏著劑層(40μm)、彈性層(20 μm)、基材(100μm)、以及第二黏著劑層(40μm)之熱剝離型黏著片。 Through the above operations, a first adhesive layer (40 μm) and an elastic layer (20 μm), a substrate (100 μm), and a heat-peelable adhesive sheet of a second adhesive layer (40 μm).

[評價] [Evaluation]

將實施例及比較例中獲得之熱剝離型黏著片供於下述評價。將結果示於表2。 The heat-peelable pressure-sensitive adhesive sheets obtained in the examples and comparative examples were subjected to the following evaluations. The results are shown in Table 2.

(1)中心線平均表面粗糙度Ra (1) Centerline average surface roughness Ra

基於JIS B 0601測定第一黏著劑層側之中心線平均表面粗糙度Ra。具體而言,使用光學式表面粗糙度計(Veeco Metrogy Group公司製造,商品名「Wyko NT9100」),將測定條件設定為如下而測定。將縱、橫分別測定5次而獲得之測定值之平均值示於表2。 The center line average surface roughness Ra of the first adhesive layer side was measured based on JIS B 0601. Specifically, an optical surface roughness meter (manufactured by Veeco Metrogy Group, trade name "Wyko NT9100") was used, and the measurement conditions were set as follows and measured. Table 2 shows the average values of the measured values obtained by measuring the vertical and horizontal directions five times.

(評價條件) (Evaluation conditions)

樣品尺寸:50mm×50mm Sample size: 50mm × 50mm

測定範圍:2.534mm×1.901mm Measurement range: 2.534mm × 1.901mm

測定模式:VSL Measurement mode: VSL

物鏡:2.5倍 Objective lens: 2.5 times

內部透鏡:1.0倍 Internal lens: 1.0x

(2)接觸角 (2) Contact angle

使用接觸角計(協和界面公司製造,商品名「CX-A型」),於23℃/50%RH之環境下,將2μl純水滴加至第一黏著劑層之表面,滴加5秒後測定液滴之接觸角。將測定5次而獲得之測定值之平均值示於表2。 Using a contact angle meter (manufactured by Kyowa Interface Co., Ltd. under the trade name "CX-A"), add 2 μl of pure water droplets to the surface of the first adhesive layer at 23 ° C / 50% RH, and add 5 drops The contact angle of the droplet was measured after seconds. The average value of the measured values obtained by measuring 5 times is shown in Table 2.

(3)凝膠分率 (3) Gel fraction

利用網狀片包裹自第一樹脂層取樣之評價用樣品0.1g,於室溫下於甲苯50ml中靜置1星期,使甲苯浸漬至該樣品。其後,取出甲苯不溶成分,以70℃歷時2小時使其乾燥後,稱量乾燥後之甲苯不溶成分。 0.1 g of an evaluation sample sampled from the first resin layer was wrapped with a mesh sheet, and was left to stand in 50 ml of toluene at room temperature for one week, and the sample was impregnated with toluene. Thereafter, the toluene-insoluble component was taken out, and dried at 70 ° C for 2 hours, and then the toluene-insoluble component after drying was weighed.

利用下式,由浸漬甲苯前之樣品重量及甲苯不溶成分之重量算 出樹脂層之凝膠分率。 Use the following formula to calculate the weight of the sample before dipping in toluene and the weight of toluene-insoluble components The gel fraction of the resin layer was obtained.

凝膠分率(%)=[(甲苯不溶成分之重量)/(浸漬甲苯前之樣品重量)]×100 Gel fraction (%) = [(weight of toluene-insoluble component) / (weight of sample before dipping toluene)] × 100

(4)黏著力測定方法 (4) Method for measuring adhesion

將熱剝離型黏著片切斷成寬度:20mm、長度:140mm之尺寸,基於JIS Z 0237(2000年),於溫度:23±2℃及濕度:65±5%RH之氛圍下,使2kg之輥往返1次而將作為被黏著體之聚對苯二甲酸乙二酯膜(商品名「Lumirror S-10」,東麗公司製造;厚度:25μm、寬度:20mm)壓接而貼合於第一黏著劑層上。繼而,將附帶被黏著體之熱剝離型黏著片設置於附帶設定為23℃之恆溫槽之拉伸試驗機(島津製作所公司製造,商品名「島津AUTOGRAPH AG-120kN」),放置30分鐘。放置後,於23℃之溫度下測定於剝離角度:180°、剝離速度(拉伸速度):300mm/min之條件下自熱剝離型黏著片剝離被黏著體時之荷重,求出此時之最大荷重(除了測定初期之峰頂之外之荷重最大值),將該最大荷重作為第一黏著劑層之黏著力(N/20mm)。 The heat-peelable pressure-sensitive adhesive sheet was cut into a width: 20 mm and a length: 140 mm. Based on JIS Z 0237 (2000), the temperature was 23 ± 2 ° C and humidity: 65 ± 5% RH. The roller was reciprocated once, and a polyethylene terephthalate film (trade name "Lumirror S-10", manufactured by Toray Co., Ltd .; thickness: 25 μm, width: 20 mm), which is an adherend, was bonded to the first On an adhesive layer. Next, a heat-peeling type adhesive sheet with an adherend was set in a tensile tester (made by Shimadzu Corporation, trade name "Shimadzu AUTOGRAPH AG-120kN") with a thermostat set at 23 ° C, and left for 30 minutes. After standing, the load at the time of peeling the adherend from the heat-peeling type adhesive sheet under the conditions of peeling angle: 180 °, peeling speed (tensile speed): 300 mm / min was measured at a temperature of 23 ° C. The maximum load (the maximum value of the load other than the peak at the beginning of the measurement), and the maximum load was used as the adhesive force (N / 20mm) of the first adhesive layer.

(5)藥液侵入評價 (5) Evaluation of medicinal solution invasion

將熱剝離型黏著片切斷成50mm×50mm之尺寸,於第一黏著劑層側配置矽晶圓,於第二黏著劑層側配置玻璃板(厚度:1mm),於溫度60℃、壓力0.5MPa、時間3分鐘之條件下,對該等進行壓接而製作評價用樣品。其後,將該評價用樣品於溫度40℃、濃度60重量%之硝酸溶液中浸漬10分鐘。浸漬後,根據自黏著片端部起之液體侵入距離而評價第一黏著劑層側之藥液侵入量。 The thermally peelable adhesive sheet was cut into a size of 50 mm × 50 mm, a silicon wafer was placed on the first adhesive layer side, and a glass plate (thickness: 1 mm) was placed on the second adhesive layer side. The temperature was 60 ° C. and the pressure was 0.5. These were compression-bonded under conditions of MPa and time of 3 minutes to prepare a sample for evaluation. Thereafter, the sample for evaluation was immersed in a nitric acid solution having a temperature of 40 ° C and a concentration of 60% by weight for 10 minutes. After immersion, the amount of invasion of the medicinal solution on the side of the first adhesive layer was evaluated based on the invasion distance of the liquid from the end of the adhesive sheet.

(6)加熱剝離性 (6) Heat release

與上述(5)藥液侵入評價同樣地製作評價用樣品。將該評價用樣品以130℃加熱1分鐘。目視確認加熱後之矽晶圓之剝離狀況。表2中,將黏著劑層喪失黏著力而矽晶圓發生剝離之情形記作○、將黏著 劑層具有黏著力而矽晶圓未發生剝離之情形記作×。 A sample for evaluation was prepared in the same manner as in the evaluation of the chemical liquid invasion (5) above. The sample for evaluation was heated at 130 ° C for 1 minute. Visually confirm the peeling condition of the heated silicon wafer. In Table 2, the case where the adhesive layer loses the adhesive force and the silicon wafer is peeled off is marked as ○. The case where the adhesive layer has adhesive force and the silicon wafer does not peel off is referred to as ×.

[產業上之可利用性] [Industrial availability]

本發明之熱剝離型黏著片可較佳地用作被供於蝕刻液等處理液之電子零件之保護帶。 The heat-peelable pressure-sensitive adhesive sheet of the present invention can be preferably used as a protective tape for electronic parts to be used in a processing solution such as an etching solution.

Claims (9)

一種熱剝離型黏著片,其依序具備第一黏著劑層、基材、以及第二黏著劑層,該第一黏著劑層含有包含(甲基)丙烯酸系聚合物之丙烯酸系黏著劑及熱膨脹性微球,該(甲基)丙烯酸系聚合物包含源自具有碳數為2以上之烷基之(甲基)丙烯酸烷基酯之結構單元、以及源自具有OH基之(甲基)丙烯酸系單體之結構單元,該(甲基)丙烯酸系聚合物中,側鏈烷基之碳(C)與OH基之莫耳比(C/OH)為40~75,該(甲基)丙烯酸系聚合物之重量平均分子量為10萬~300萬。 A thermal peel-off type adhesive sheet, which includes a first adhesive layer, a substrate, and a second adhesive layer in this order. The first adhesive layer contains an acrylic adhesive containing a (meth) acrylic polymer and thermal expansion. Microspheres, the (meth) acrylic polymer includes structural units derived from an alkyl (meth) acrylate having an alkyl group having a carbon number of 2 or more, and derived from (meth) acrylic acid having an OH group Is a structural unit of a monomer. In the (meth) acrylic polymer, the molar ratio (C / OH) of the carbon (C) of the side chain alkyl group to the OH group is 40 to 75. The (meth) acrylic acid The weight average molecular weight of the polymer is 100,000 to 3 million. 如請求項1之熱剝離型黏著片,其中上述第二黏著劑層包含上述熱膨脹性微球。 The heat-peelable pressure-sensitive adhesive sheet according to claim 1, wherein the second adhesive layer includes the thermally expandable microspheres. 如請求項1之熱剝離型黏著片,其中上述第一黏著劑層及/或第二黏著劑層之中心線平均表面粗糙度Ra為1μm以下。 For example, the heat-peelable pressure-sensitive adhesive sheet of claim 1, wherein the center line average surface roughness Ra of the first adhesive layer and / or the second adhesive layer is 1 μm or less. 如請求項1之熱剝離型黏著片,其中水對於上述第一黏著劑層及/或第二黏著劑層之接觸角為85°~115°。 For example, the thermally peelable pressure-sensitive adhesive sheet of claim 1, wherein the contact angle of water with respect to the first adhesive layer and / or the second adhesive layer is 85 ° to 115 °. 如請求項1之熱剝離型黏著片,其中上述第一黏著劑層包含黏著賦予劑,該黏著賦予劑之含有比率相對於該第一黏著劑層100重量份為40重量份以下。 The heat-peelable pressure-sensitive adhesive sheet according to claim 1, wherein the first adhesive layer includes an adhesion-imparting agent, and a content ratio of the adhesion-imparting agent is 40 parts by weight or less relative to 100 parts by weight of the first adhesive layer. 如請求項1之熱剝離型黏著片,其中上述第二黏著劑層包含黏著賦予劑,該黏著賦予劑之含有比率相對於該第二黏著劑層100重量份為40重量份以下。 The heat-peelable pressure-sensitive adhesive sheet according to claim 1, wherein the second adhesive layer includes an adhesion-imparting agent, and a content ratio of the adhesion-imparting agent is 40 parts by weight or less relative to 100 parts by weight of the second adhesive layer. 如請求項1之熱剝離型黏著片,其中上述第一黏著劑層及/或第二黏著劑層之凝膠分率為50%以上。 For example, the heat-peelable pressure-sensitive adhesive sheet of claim 1, wherein the gel fraction of the first adhesive layer and / or the second adhesive layer is 50% or more. 如請求項1之熱剝離型黏著片,其中將上述第一黏著劑層側貼合於聚對苯二甲酸乙二酯膜時於23℃下之黏著力為1N/20mm以上。 For example, the heat-peelable pressure-sensitive adhesive sheet according to claim 1, wherein the adhesive force at 23 ° C when the first adhesive layer side is bonded to a polyethylene terephthalate film is 1N / 20mm or more. 一種電子零件,其係使用如請求項1之熱剝離型黏著片而製造。 An electronic component manufactured using a heat-peelable pressure-sensitive adhesive sheet according to claim 1.
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