TWI672203B - 基板吸附裝置及基板吸附方法 - Google Patents

基板吸附裝置及基板吸附方法 Download PDF

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Publication number
TWI672203B
TWI672203B TW105109445A TW105109445A TWI672203B TW I672203 B TWI672203 B TW I672203B TW 105109445 A TW105109445 A TW 105109445A TW 105109445 A TW105109445 A TW 105109445A TW I672203 B TWI672203 B TW I672203B
Authority
TW
Taiwan
Prior art keywords
plate
substrate
suction hole
adsorption
suction
Prior art date
Application number
TW105109445A
Other languages
English (en)
Chinese (zh)
Other versions
TW201643017A (zh
Inventor
新開昇
河田茂
高橋伸幸
Original Assignee
日商名幸電子股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商名幸電子股份有限公司 filed Critical 日商名幸電子股份有限公司
Publication of TW201643017A publication Critical patent/TW201643017A/zh
Application granted granted Critical
Publication of TWI672203B publication Critical patent/TWI672203B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
TW105109445A 2015-03-31 2016-03-25 基板吸附裝置及基板吸附方法 TWI672203B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2015/060170 WO2016157422A1 (ja) 2015-03-31 2015-03-31 基板吸着装置及び基板吸着方法
??PCT/JP2015/060170 2015-03-31

Publications (2)

Publication Number Publication Date
TW201643017A TW201643017A (zh) 2016-12-16
TWI672203B true TWI672203B (zh) 2019-09-21

Family

ID=55440597

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105109445A TWI672203B (zh) 2015-03-31 2016-03-25 基板吸附裝置及基板吸附方法

Country Status (3)

Country Link
JP (1) JP5878269B1 (ja)
TW (1) TWI672203B (ja)
WO (2) WO2016157422A1 (ja)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5878269B1 (ja) * 2015-03-31 2016-03-08 株式会社メイコー 基板吸着装置及び基板吸着方法
JP2017159411A (ja) * 2016-03-10 2017-09-14 住友重機械工業株式会社 吸着装置
JP7456399B2 (ja) * 2021-02-12 2024-03-27 株式会社村田製作所 シート搬送装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556376U (ja) * 1992-01-16 1993-07-27 茂男 広瀬 吸着装置
JP2004055707A (ja) * 2002-07-18 2004-02-19 Matsushita Electric Ind Co Ltd ワーク吸着ユニット
JP2010027726A (ja) * 2008-07-16 2010-02-04 Nikon Corp 基板接合装置
CN101712155A (zh) * 2008-09-29 2010-05-26 优志旺电机株式会社 基板输送臂

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06311597A (ja) * 1993-04-21 1994-11-04 Tadashi Itagaki 電気−機械振動変換器
JP2002350483A (ja) * 2001-05-29 2002-12-04 Hioki Ee Corp 回路基板吸着装置および回路基板検査装置
JP4429825B2 (ja) * 2004-06-30 2010-03-10 東京エレクトロン株式会社 基板処理装置
JP5289164B2 (ja) * 2009-04-24 2013-09-11 株式会社オプトニクス精密 面状ばね及びこれを用いた安全弁
JP5878269B1 (ja) * 2015-03-31 2016-03-08 株式会社メイコー 基板吸着装置及び基板吸着方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556376U (ja) * 1992-01-16 1993-07-27 茂男 広瀬 吸着装置
JP2004055707A (ja) * 2002-07-18 2004-02-19 Matsushita Electric Ind Co Ltd ワーク吸着ユニット
JP2010027726A (ja) * 2008-07-16 2010-02-04 Nikon Corp 基板接合装置
CN101712155A (zh) * 2008-09-29 2010-05-26 优志旺电机株式会社 基板输送臂

Also Published As

Publication number Publication date
WO2016157422A1 (ja) 2016-10-06
WO2016158301A1 (ja) 2016-10-06
JP5878269B1 (ja) 2016-03-08
JPWO2016157422A1 (ja) 2017-04-27
TW201643017A (zh) 2016-12-16

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