TWI671338B - 保護膜形成膜及保護膜形成用複合片 - Google Patents

保護膜形成膜及保護膜形成用複合片 Download PDF

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Publication number
TWI671338B
TWI671338B TW104135068A TW104135068A TWI671338B TW I671338 B TWI671338 B TW I671338B TW 104135068 A TW104135068 A TW 104135068A TW 104135068 A TW104135068 A TW 104135068A TW I671338 B TWI671338 B TW I671338B
Authority
TW
Taiwan
Prior art keywords
protective film
film
forming
sheet
ultraviolet
Prior art date
Application number
TW104135068A
Other languages
English (en)
Chinese (zh)
Other versions
TW201620963A (zh
Inventor
小橋力也
山本大輔
加太章生
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201620963A publication Critical patent/TW201620963A/zh
Application granted granted Critical
Publication of TWI671338B publication Critical patent/TWI671338B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/402—Coloured
    • B32B2307/4026—Coloured within the layer by addition of a colorant, e.g. pigments, dyes

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Paints Or Removers (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW104135068A 2014-10-29 2015-10-26 保護膜形成膜及保護膜形成用複合片 TWI671338B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014220295 2014-10-29
JP2014-220295 2014-10-29

Publications (2)

Publication Number Publication Date
TW201620963A TW201620963A (zh) 2016-06-16
TWI671338B true TWI671338B (zh) 2019-09-11

Family

ID=55857381

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104135068A TWI671338B (zh) 2014-10-29 2015-10-26 保護膜形成膜及保護膜形成用複合片

Country Status (6)

Country Link
JP (1) JP6585068B2 (ja)
KR (1) KR102467143B1 (ja)
CN (2) CN107112219A (ja)
SG (1) SG11201703250YA (ja)
TW (1) TWI671338B (ja)
WO (1) WO2016068042A1 (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI796297B (zh) * 2016-04-28 2023-03-21 日商琳得科股份有限公司 保護膜形成用複合片
TWI731964B (zh) * 2016-04-28 2021-07-01 日商琳得科股份有限公司 保護膜形成用複合片
TWI642544B (zh) * 2016-10-11 2018-12-01 武漢市三選科技有限公司 Sheet for forming cut-off substrate protective film, preparation method thereof, circuit board therewith and preparation method thereof
JP6388752B1 (ja) * 2017-02-09 2018-09-12 リンテック株式会社 硬化性樹脂フィルム及び第１保護膜形成用シート
WO2019058964A1 (ja) * 2017-09-25 2019-03-28 富士フイルム株式会社 硬化性組成物、膜、赤外線透過フィルタ、固体撮像素子および光センサ
TWI791650B (zh) * 2017-10-27 2023-02-11 日商琳得科股份有限公司 保護膜形成用膜、保護膜形成用複合片及半導體晶片的製造方法
JP7159186B2 (ja) * 2017-10-27 2022-10-24 リンテック株式会社 保護膜形成用複合シート、及び半導体チップの製造方法
CN111093986B (zh) 2017-10-27 2022-03-11 琳得科株式会社 保护膜形成用复合片及半导体芯片的制造方法
KR102560242B1 (ko) 2017-10-27 2023-07-26 린텍 가부시키가이샤 보호막 형성용 복합 시트 및 반도체 칩의 제조 방법
JP6979081B2 (ja) * 2017-10-27 2021-12-08 リンテック株式会社 保護膜形成用フィルム、保護膜形成用複合シート、及び半導体チップの製造方法
KR102175717B1 (ko) * 2017-12-14 2020-11-06 주식회사 엘지화학 다이싱 다이 본딩 필름
JP6916836B2 (ja) * 2019-05-14 2021-08-11 日東電工株式会社 積層体の製造方法
JP7333211B2 (ja) * 2019-06-21 2023-08-24 リンテック株式会社 保護膜形成用複合シート、及び保護膜付き半導体チップの製造方法
JP7520497B2 (ja) 2019-11-08 2024-07-23 リンテック株式会社 接着フィルム及び接着複合シート
JP7555758B2 (ja) 2020-08-12 2024-09-25 リンテック株式会社 保護膜形成用シートおよび保護膜形成用シートの加工方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004051736A (ja) * 2002-07-18 2004-02-19 Nitto Denko Corp 紫外線硬化型粘着シート
JP2009138026A (ja) * 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3511346B2 (ja) * 1996-12-05 2004-03-29 三井化学株式会社 半導体ウエハの裏面研削方法及び該方法に用いる粘着フィルム
JP3544362B2 (ja) * 2001-03-21 2004-07-21 リンテック株式会社 半導体チップの製造方法
JP2003305792A (ja) * 2002-04-15 2003-10-28 Toray Ind Inc 積層樹脂シート
JP5090695B2 (ja) 2006-09-08 2012-12-05 大倉工業株式会社 偏光板の製造方法
JP2009036797A (ja) * 2007-07-31 2009-02-19 Nitto Denko Corp 光学フィルム、偏光板、および画像表示装置
JP5640051B2 (ja) 2009-01-30 2014-12-10 日東電工株式会社 半導体装置の製造方法
JP5249290B2 (ja) 2010-07-20 2013-07-31 日東電工株式会社 フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、半導体装置の製造方法、及び、フリップチップ型半導体装置
CN102516889B (zh) * 2011-12-07 2013-09-25 深圳市鑫东邦科技有限公司 一种高透光率的可紫外线固化的胶粘剂

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004051736A (ja) * 2002-07-18 2004-02-19 Nitto Denko Corp 紫外線硬化型粘着シート
JP2009138026A (ja) * 2007-12-03 2009-06-25 Furukawa Electric Co Ltd:The エネルギー線硬化型チップ保護用フィルム

Also Published As

Publication number Publication date
TW201620963A (zh) 2016-06-16
KR102467143B1 (ko) 2022-11-14
KR20170078630A (ko) 2017-07-07
WO2016068042A1 (ja) 2016-05-06
SG11201703250YA (en) 2017-05-30
JP6585068B2 (ja) 2019-10-02
JPWO2016068042A1 (ja) 2017-08-10
CN113980535A (zh) 2022-01-28
CN107112219A (zh) 2017-08-29

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