TWI664888B - 氣密結構 - Google Patents

氣密結構 Download PDF

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TWI664888B
TWI664888B TW106113425A TW106113425A TWI664888B TW I664888 B TWI664888 B TW I664888B TW 106113425 A TW106113425 A TW 106113425A TW 106113425 A TW106113425 A TW 106113425A TW I664888 B TWI664888 B TW I664888B
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趙曉宇
賴其淵
符猛
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全億大科技(佛山)有限公司
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    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
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    • F28—HEAT EXCHANGE IN GENERAL
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    • F28—HEAT EXCHANGE IN GENERAL
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Abstract

一種氣密結構，包括第一板體、設置在所述第一板體上的第二板體以及設置於所述第一板體和第二板體之間的毛細結構，所述第二板體中部相對其兩側內凹而形成一凹槽，所述凹槽與所述第一板體之間形成一密封的腔體，所述毛細結構設置於所述腔體內，所述第一板體一端向上凸伸形成一中空的第一延伸部，所述第二板體一端對應所述延伸部而開設形成貫穿其上下表面的通孔，所述第一延伸部穿設所述通孔後，所述通孔的內周緣與所述第一延伸部的外周緣接觸。

Description

氣密結構
本發明涉及一種氣密結構，特別涉及一種帶有螺絲孔的氣密結構。
習知地，氣密結構設置於電路板上，以對電路板進行散熱。
習知地氣密結構，通常包括上下兩層板體以及設置於兩層板體中的毛細結構。所述兩層板體上設置有相應的通孔，用於螺絲穿過以將氣密結構與電路板固定連接。對於大多數氣密結構來說，所述通孔中未攻設有螺紋，所述通孔與電路板之間通常設置有類似柱體的過渡連接部。當所述氣密結構與所述電路板連接時，螺絲穿過所述通孔後通過所述過渡連接部與電路板固定連接。然而，如此與電路板連接的氣密結構中螺絲在通孔中長時間容易鬆動，而且氣密結構兩層板體之間亦容易發生鬆動，從而導致氣密結構與電路板連接的穩定性。
有鑑於此，本發明提供一種與電路板配合連接穩定性高的氣密結構。
一種氣密結構，包括第一板體、設置在所述第一板體上的第二板體以及設置於所述第一板體和第二板體之間的毛細結構，所述第二板體中部相對其兩側內凹而形成一凹槽，所述凹槽與所述第一板體之間形成一密 封的腔體，所述毛細結構設置於所述腔體內，所述第一板體一端向上凸伸形成一中空的第一延伸部，所述第二板體一端對應所述第一延伸部而開設形成貫穿其上下表面的通孔，所述第一延伸部穿設所述通孔後，所述通孔的內周緣與所述第一延伸部的外周緣接觸，所述第二板體具有一下表面及與所述下表面相對的上表面，所述第二板體與所述通孔相對的一端形成一第二延伸部，所述第二延伸部為自所述下表面朝向所述上表面方向一體衝壓而形成的一的中空狀的凸起，所述第二延伸部的橫截面呈矩形，所述第二延伸部內壁攻設有螺紋。
進一步地，所述第一板體具有第一表面及與所述第一表面相對的第二表面，所述第一延伸部為自所述第一表面朝向第二表面方向通過一體衝壓而成的凸起，所述第一延伸部的內壁攻設有螺紋。
進一步地，所述第一延伸部具有一第一頂部，所述第一延伸部穿入所述通孔後，所述第一延伸部的第一頂部超出所述第二板體的凹槽的底部。
進一步地，所述凹槽的縱截面呈梯形，其口徑朝向遠離第一板體的方向逐漸減小。
進一步地，所述第二延伸部具有一第二頂部，且所述第二延伸部的第二頂部與所述第一延伸部的第一頂部共面設置。
進一步地，所述毛細結構包括一貼設於所述凹槽內壁的第一毛細部、貼設於所述第一板體的第二表面的第二毛細部以及連接所述第一毛細部和第二毛細部的多個連接部。
進一步地，所述連接部的縱截面呈矩形，所述連接部與所述第一毛細部和第二毛細部垂直設置，且所述多個連接部之間均等間隔設置。
進一步地，所述第一毛細結構和第二毛細結構的厚度相等，所述連接部的高度和寬度均大於所述第一毛細結構和第二毛細結構的厚度。
進一步地，所述第一板體和第二板體的厚度均勻且相等。
在本發明所述氣密結構中，所述第一板體上設置有中空的第一延伸部，第二板體上設置有中空的第二延伸部，而且所述第一延伸部和第二延伸部均一一體衝壓而成，使得所述氣密結構中第一板體和第二板體之間穩定性提高，而且所述第一延伸部和第二延伸部內壁均可攻設螺紋，通過螺絲直接與電路板固定，而免去了通過額外的過渡連接部，不但節約成本而且進一步增加了所述氣密結構與電路板之間連接的穩定性。
100‧‧‧氣密結構
10‧‧‧第一板體
101‧‧‧第一表面
102‧‧‧第二表面
20‧‧‧第二板體
11‧‧‧第一延伸部
110‧‧‧第一螺紋
111‧‧‧第一頂部
201‧‧‧下表面
202‧‧‧上表面
21‧‧‧凹槽
22‧‧‧通孔
23‧‧‧第二延伸部
230‧‧‧第二螺紋
231‧‧‧第二頂部
120‧‧‧腔體
31‧‧‧第一毛細部
32‧‧‧第二毛細部
33‧‧‧連接部
圖1所示係本發明一實施例中所述氣密結構的示意圖。
如圖1所示，本發明所述氣密結構100包括一第一板體10、第二板體20以及設置於所述第一板體10、第二板體20之間的毛細結構30。
所述第一板體10呈一水準的板體且厚度均勻。所述第一板體10具有一第一表面101以及與所述第一表面101相對的第二表面102。所述第一板體10一端自第一表面101朝向第二表面102方向向上凸伸形成第一延伸部11。所述第一延伸部11為自所述第一表面101朝向第二表面102方向一體衝壓而成。所述第一延伸部11超出且垂直所述第一板體10的第二表面102。
進一步地，所述第一延伸部11呈中空狀柱體，且所述第一延伸部11的內壁攻設有第一螺紋110。
所述第二板體20與所述第一板體厚度相等。所述第二板體20設置於所述第一板體10的第二表面102上。所述第二板體20具有下表面201以及與所述下表面201相對的上表面202。所述第二板體20的中部相對兩側內凹而形成一凹槽21。所述凹槽21的縱截面呈梯形，其口徑朝向遠離第一板體10的方向逐漸減小。所述凹槽21與所述第一板體10之間形成一密封的腔體120。
進一步地，所述第二板體20一端開設有貫穿其下表面201及上表面202的通孔22。所述通孔22與所述第一板體10的第一延伸部11對應設置，從而供所述第一延伸部11穿入所述通孔22。所述第一延伸部11穿入所述通孔22後，所述通孔22的內周緣與所述第一延伸部11的外周緣接觸，且所述第一延伸部11進一步超出所述凹槽21的底部。
進一步地，所述第二板體與所述通孔22相對的另一端形成一第二延伸部23。所述第二延伸部23自所述第二板體20的下表面201朝向上表面202方向衝壓而形成的一凸起。所述第二延伸部23具有一第二頂部231，所述第二頂部231與所述第一延伸部11的第一頂部111共面。所述第二延伸部23呈中空的柱狀，其內壁形成有第二螺紋230。
所述毛細結構30設置於所述腔體120內。所述毛細結構30包括一貼設所述凹槽21內壁的第一毛細部31、貼設於所述第一板體10的第二表面102的第二毛細部32以及連接所述第一毛細部31及第二毛細部32的多個連接部33。所述連接部33與所述第一毛細部31、第二毛細部32垂直，且所述多個連接部33之間均等間距設置。
所述第一毛細部31和第二毛細部32的厚度相等。所述連接部33的縱截面呈矩形，且所述連接部33的高度和寬度均大於所述第一毛細部31及第二毛細部32的厚度。
在本發明所述氣密結構100中，所述第一板體上設置有中空的第一延伸部11，第二板體上設置有中空的第二延伸部23，而且所述第一延伸部11和第二延伸部23均一一體衝壓而成，使得所述氣密結構100中第一板體10和第二板體20之間穩定性提高，而且所述第一延伸部11和第二延伸部23內壁均可攻設螺紋，通過螺絲直接與電路板固定，而免去了通過額外的過渡連接部，不但節約成本而且進一步增加了所述氣密結構100與電路板之間連接的穩定性。
可以理解的是，對於本領域的普通技術人員來說，可以根據本發明的技術構思做出其它各種相應的改變與變形，而所有這些改變與變形都應屬於本發明的權利要求的保護範圍。

Claims (9)

  1. 一種氣密結構，包括第一板體、設置在所述第一板體上的第二板體以及設置於所述第一板體和第二板體之間的毛細結構，所述第二板體中部相對其兩側內凹而形成一凹槽，所述凹槽與所述第一板體之間形成一密封的腔體，所述毛細結構設置於所述腔體內，其改良在於：所述第一板體一端向上凸伸形成一中空的第一延伸部，所述第二板體一端對應所述第一延伸部而開設形成貫穿其上下表面的通孔，所述第一延伸部穿設所述通孔後，所述通孔的內周緣與所述第一延伸部的外周緣接觸，所述第二板體具有一下表面及與所述下表面相對的上表面，所述第二板體與所述通孔相對的一端形成一第二延伸部，所述第二延伸部為自所述下表面朝向所述上表面方向一體衝壓而形成的一的中空狀的凸起，所述第二延伸部的橫截面呈矩形，所述第二延伸部內壁攻設有螺紋。
  2. 如申請專利範圍第1項所述氣密結構，其中：所述第一板體具有第一表面及與所述第一表面相對的第二表面，所述第一延伸部為自所述第一表面朝向第二表面方向通過一體衝壓而成的凸起，所述第一延伸部的內壁攻設有螺紋。
  3. 如申請專利範圍第1項所述氣密結構，其中：所述第一延伸部具有一第一頂部，所述第一延伸部穿入所述通孔後，所述第一延伸部的第一頂部超出所述第二板體的凹槽的底部。
  4. 如申請專利範圍第1項所述氣密結構，其中：所述凹槽的縱截面呈梯形，其口徑朝向遠離第一板體的方向逐漸減小。
  5. 如申請專利範圍第1項所述氣密結構，其中：所述第二延伸部具有一第二頂部，且所述第二延伸部的第二頂部與所述第一延伸部的第一頂部共面設置。
  6. 如申請專利範圍第1項所述氣密結構，其中：所述毛細結構包括一貼設於所述凹槽內壁的第一毛細部、貼設於所述第一板體的第二表面的第二毛細部以及連接所述第一毛細部和第二毛細部的多個連接部。
  7. 如申請專利範圍第6項所述氣密結構，其中：所述連接部的縱截面呈矩形，所述連接部與所述第一毛細部和第二毛細部垂直設置，且所述多個連接部之間均等間隔設置。
  8. 如申請專利範圍第6項所述氣密結構，其中：所述第一毛細結構和第二毛細結構的厚度相等，所述連接部的高度和寬度均大於所述第一毛細結構和第二毛細結構的厚度。
  9. 如申請專利範圍第1項所述氣密結構，其中：所述第一板體和第二板體的厚度均勻且相等。
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